Self-cleaning type die bonding equipment

Abstract

The utility model relates to the technical field of die bonding equipment, and particularly discloses self-cleaning die bonding equipment. Comprising a demolding and crystal jacking mechanism used for providing a chip, a crystal fixing workbench used for placing a support, a bonding mechanism used for transferring the chip to the support of the crystal fixing workbench, and a cleaning mechanism used for cleaning the bonding mechanism and installed on the demolding and crystal jacking mechanism. The self-cleaning die bonding equipment provided by the utility model can effectively solve the problem that the suction nozzle of the existing die bonding equipment is easy to smudge.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding equipment, in particular to a self-cleaning crystal bonding equipment. Background Art

[0002] The state of the incoming wafers is as follows: a thin film is stretched tightly on the wafer ring, and several chips are attached to the film.

[0003] When a die bonding operation is required, a nozzle is used to transfer the chip to the holder. After multiple die bonding operations, the nozzle is prone to dirtiness, resulting in unstable die retrieval or die loss. The current treatment method is to manually clean the nozzle regularly, which not only increases labor costs, but also requires the line to be stopped for cleaning, which greatly reduces production capacity.

[0004] Therefore, it is necessary to improve the existing crystal bonding equipment to solve the problem that its suction nozzle is easily dirty.

[0005] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Utility Model Content

[0006] One purpose of the utility model is to provide a self-cleaning crystal bonding device, which can effectively solve the problem that the suction nozzle of the existing crystal bonding device is easily dirty.

[0007] To achieve the above purpose, the utility model provides a self-cleaning crystal bonding equipment, including a demolding and crystal topping mechanism for providing a chip, a crystal bonding workbench for placing a bracket, a bonding mechanism for transferring the chip to the bracket of the crystal bonding workbench, and a cleaning mechanism for cleaning the bonding mechanism and installing it on the demolding and crystal topping mechanism.

[0008] Optionally, the film removal and wafer lifting mechanism includes a wafer ring carrying platform for placing a wafer ring and a pin assembly for lifting the chip upward to separate from the film on the wafer ring.

[0009] Optionally, the crystal ring supporting platform includes:

[0010] A crystal frame carrier plate, wherein the crystal frame carrier plate is provided with an air-avoiding space for inserting the ejector pin assembly;

[0011] A rotating crystal frame, which is rotatably mounted above the air-avoiding space of the crystal frame carrier plate and is used to place a crystal ring;

[0012] A crystal frame rotation driving mechanism is installed on the crystal frame carrier and is drivingly connected to the rotating crystal frame to drive the rotating crystal frame to rotate relative to the crystal frame carrier.

[0013] Optionally, the crystal ring supporting platform further includes:

[0014] The wafer side XY bidirectional slide, the crystal frame carrier is installed on the top of the wafer side XY bidirectional slide, and is driven by the wafer side XY bidirectional slide to move in a horizontal direction.

[0015] Optionally, the ejector assembly includes an ejector body and an ejector linear drive mechanism for driving the ejector body to move up and down.

[0016] Optionally, the cleaning mechanism includes:

[0017] Clean the base;

[0018] A cleaning rotary drive mechanism, wherein the cleaning rotary drive mechanism is installed in the cleaning base;

[0019] A wiping head is connected to the driving end of the cleaning rotation driving mechanism.

[0020] Optionally, the cleaning mechanism further comprises:

[0021] A limit gland, which is mounted on the cleaning base and is used to limit the relative displacement between the wiping head and the cleaning base along the axial direction of the wiping head, and a gland hole is provided in the middle of the limit gland for the wiping surface of the wiping head to pass through;

[0022] A cleaning cover is installed on the cleaning base and is used to limit the relative displacement of the limiting cover and the cleaning base along the axial direction of the wiping head. A cover hole is provided in the middle of the cleaning cover for the top surface of the limiting cover to pass through.

[0023] Optionally, the crystal bonding workbench includes a support platform for placing a support and a support side XY bidirectional slide table for driving the support platform to translate in a horizontal direction.

[0024] Optionally, the bonding mechanism includes a crystal retrieval camera located above the demolding and crystal top mechanism, a crystal bonding camera located above the crystal bonding workbench, a crystal bonding swing arm located between the demolding and crystal top mechanism and the crystal bonding workbench, a crystal bonding linear drive mechanism that is transmission-connected to one end of the crystal bonding swing arm and drives the crystal bonding swing arm to move up and down, a crystal bonding rotation drive mechanism that is connected to the crystal bonding linear drive mechanism and drives the crystal bonding linear drive mechanism to move up and down, and a suction nozzle installed at the other end of the crystal bonding swing arm.

[0025] Optionally, there are two crystal-bonding swing arms, and the two crystal-bonding swing arms are arranged at 180°.

[0026] The beneficial effect of the utility model is that it provides a self-cleaning crystal bonding equipment. Under normal circumstances, after the demolding and crystal top mechanism pushes the chip upward, the bonding mechanism directly transfers the chip to the bracket of the crystal bonding workbench; when the bonding mechanism becomes dirty, it first moves to the cleaning mechanism for cleaning and wiping, and then transfers the chip to the bracket of the crystal bonding workbench.

[0027] Therefore, the self-cleaning crystal bonding equipment provided by the utility model can effectively solve the problem that the suction nozzle of the existing crystal bonding equipment is easily dirty. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 A schematic diagram of the structure of a self-cleaning die bonding device provided in an embodiment;

[0030] Figure 2 A schematic diagram of the structure of a cleaning mechanism provided in an embodiment;

[0031] Figure 3 An exploded schematic diagram of a cleaning mechanism provided in an embodiment.

[0032] In the figure:

[0033] 1. Demolding and top crystal mechanism;

[0034] 101, crystal ring carrying platform; 1011, crystal frame carrier; 1011a, air-avoiding space; 1012, rotating crystal frame; 1013, crystal frame rotating driving mechanism; 1014, wafer side XY bidirectional slide;

[0035] 102, ejector assembly; 1021, ejector body; 1022, ejector linear drive mechanism;

[0036] 2. Crystal bonding workbench; 201. Bracket platform; 202. Bracket side XY bidirectional slide;

[0037] 3. Bonding mechanism; 301. Crystal taking camera; 302. Crystal fixing camera; 303. Crystal fixing swing arm; 304. Crystal fixing linear drive mechanism; 305. Crystal fixing rotary drive mechanism; 306. Suction nozzle;

[0038] 4. Cleaning mechanism; 401. Cleaning base; 402. Cleaning rotation drive mechanism; 403. Wiping head; 4031. Wiping surface; 404. Position limiting pressure cover; 4041. Pressure cover hole; 405. Cleaning outer cover; 4051. Outer cover hole. DETAILED DESCRIPTION

[0039] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the embodiment described below is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] In the description of the present utility model, it is to be understood that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a centrally arranged component at the same time.

[0041] In addition, terms such as "long", "short", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are only used to facilitate the description of the present invention. They do not indicate or imply that the device or component referred to must have this specific direction or operate with a specific direction structure, and should not be understood as a limitation of the present invention.

[0042] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0043] The utility model provides a self-cleaning crystal bonding device, which is suitable for a crystal bonding operation application scenario of transferring a chip from a film to a bracket, and can effectively solve the problem that the suction nozzle of the existing crystal bonding device is easily dirty.

[0044] See also Figure 1 The self-cleaning crystal bonding equipment provided in this embodiment includes a demolding and crystal bonding mechanism 1 for providing a chip, a crystal bonding workbench 2 for placing a bracket, a bonding mechanism 3 for transferring the chip to the bracket of the crystal bonding workbench 2, and a cleaning mechanism 4 for cleaning the bonding mechanism 3 and installing it on the demolding and crystal bonding mechanism 1.

[0045] Generally, after the demolding and top crystal mechanism 1 pushes the chip upward, the bonding mechanism 3 directly transfers the chip to the bracket of the crystal bonding workbench 2; when the bonding mechanism 3 is dirty, it first moves to the cleaning mechanism 4 for cleaning and wiping, and then transfers the chip to the bracket of the crystal bonding workbench 2.

[0046] Therefore, the self-cleaning die bonding equipment provided by the present invention can effectively solve the problem that the suction nozzle 306 of the existing die bonding equipment is easily dirty.

[0047] In this embodiment, the film stripping and wafer lifting mechanism 1 comprises a wafer ring carrying platform 101 for placing a wafer ring and a pin assembly 102 for lifting the chip upward to separate from the film on the wafer ring.

[0048] The wafer ring carrying platform 101 includes a crystal frame carrier plate 1011 , a rotating crystal frame 1012 , a crystal frame rotation driving mechanism 1013 , and a wafer side XY bidirectional slide 1014 .

[0049] The crystal frame carrier 1011 is provided with an air-avoiding space 1011a for inserting the ejector assembly 102. The rotating crystal frame 1012 is rotatably mounted above the air-avoiding space 1011a of the crystal frame carrier 1011 for placing a crystal ring. The crystal frame rotation drive mechanism 1013 is mounted on the crystal frame carrier 1011 and is transmission-connected with the rotating crystal frame 1012 to drive the rotating crystal frame 1012 to rotate relative to the crystal frame carrier 1011. Optionally, the rotation drive mechanism is transmission-connected with the rotating crystal frame 1012 via a belt. The crystal frame carrier 1011 is mounted on the top of the wafer-side XY bidirectional slide 1014 and is driven by the wafer-side XY bidirectional slide 1014 to translate in the horizontal direction.

[0050] The ejector assembly 102 includes an ejector body 1021 and an ejector linear drive mechanism 1022 for driving the ejector body 1021 to move up and down.

[0051] See also Figure 2 and Figure 3 The cleaning mechanism 4 includes a cleaning base 401 mounted on the crystal frame carrier 1011, a cleaning rotation drive mechanism 402, a wiping head 403, a limit pressure cover 404, and a cleaning cover 405. The cleaning rotation drive mechanism 402 is mounted in the cleaning base 401; the wiping head 403 is connected to the driving end of the cleaning rotation drive mechanism 402.

[0052] The limiting gland 404 is mounted on the cleaning base 401, and is used to limit the relative displacement of the wiping head 403 and the cleaning base 401 along the axial direction of the wiping head 403, and a gland hole 4041 is provided in the middle of the limiting gland 404 for the wiping surface 4031 of the wiping head 403 to pass through. The cleaning cover 405 is mounted on the cleaning base 401, and is used to limit the relative displacement of the limiting gland 404 and the cleaning base 401 along the axial direction of the wiping head 403, and a cover hole 4051 is provided in the middle of the cleaning cover 405 for the top surface of the limiting gland 404 to pass through.

[0053] The die-bonding workbench 2 includes a support platform 201 for placing a support and a support-side XY bidirectional slide 202 for driving the support platform 201 to translate in a horizontal direction.

[0054] The bonding mechanism 3 includes a crystal retrieval camera 301 located above the demolding and top crystal mechanism 1, a crystal bonding camera 302 located above the crystal bonding workbench 2, a crystal bonding swing arm 303 located between the demolding and top crystal mechanism 1 and the crystal bonding workbench 2, a crystal bonding linear drive mechanism 304 that is transmission-connected to one end of the crystal bonding swing arm 303 and drives the crystal bonding swing arm 303 to move up and down, a crystal bonding rotation drive mechanism 305 that is connected to the crystal bonding linear drive mechanism 304 and drives the crystal bonding linear drive mechanism 304 to move up and down, and a suction nozzle 306 installed at the other end of the crystal bonding swing arm 303.

[0055] The self-cleaning die bonding equipment provided in this embodiment has a detailed working process as follows:

[0056] S10: The upstream equipment on the support side places the support on the support platform 201, and the upstream equipment on the wafer side places the wafer ring on the rotating wafer frame 1012;

[0057] S20: On the one hand, the XY bidirectional slide 202 on the bracket side adjusts the position of the bracket platform 201 forward, backward, left and right, so that the die-bonding camera 302 can complete the precise positioning of the bracket;

[0058] On the other hand, the crystal frame rotation driving mechanism 1013 drives the rotating crystal frame 1012 to drive the crystal ring to rotate, and synchronously cooperates with the wafer side XY bidirectional slide 1014 to adjust the position of the chip on the crystal ring forward, backward, left and right, so that the crystal retrieval camera 301 can complete the precise positioning of the chip and make the chip to be retrieved be located directly above the ejector assembly 102;

[0059] S30: The ejector linear drive mechanism 1022 drives the ejector body 1021 to move upward, thereby ejecting the chip directly above the ejector body 1021 upward to separate from the film;

[0060] S40: the crystal bonding rotary drive mechanism 305 drives the crystal bonding swing arm 303 to rotate, so that the suction nozzle 306 rotates to above the wiping head 403, the crystal bonding linear drive mechanism 304 drives the suction nozzle 306 to move downward to fit with the wiping head 403, and the cleaning rotary drive mechanism 402 drives the wiping head 403 to rotate, so that the wiping head 403 wipes the suction nozzle 306;

[0061] S50: After wiping is completed, the solid crystal linear drive mechanism 304 drives the suction nozzle 306 to move upward to separate from the wiping head 403, and the solid crystal rotation drive mechanism 305 drives the solid crystal swing arm 303 to continue rotating to the top of the lifted chip;

[0062] S60: the die-bonding linear drive mechanism 304 drives the suction nozzle 306 to suck the chip downward and then reset upward;

[0063] S70: The crystal bonding rotation drive mechanism 305 drives the crystal bonding swing arm 303 to rotate, so that the chip sucked by the cup moves to the top of the bracket;

[0064] S80: The die-bonding linear drive mechanism 304 drives the suction nozzle 306 downward to place the chip on the support and then resets it upward, thereby completing the die-bonding operation.

[0065] Optionally, there are two crystal-bonding swing arms 303, and the two crystal-bonding swing arms 303 are arranged at 180 degrees. When one of the crystal-bonding swing arms 303 is performing crystal retrieval, the other crystal-bonding swing arm 303 is performing crystal bonding, which effectively improves production efficiency.

[0066] To sum up, the self-cleaning die bonding equipment provided in this embodiment has the following advantages: when the bonding mechanism 3 becomes dirty, it can first move to the cleaning mechanism 4 for cleaning and wiping, and then transfer the chip to the bracket of the die bonding workbench 2, thereby solving the problem that the suction nozzle 306 of the existing die bonding equipment is easily dirty, thereby reducing labor costs and improving production efficiency.

[0067] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0068] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A self-cleaning die bonding device, characterized in that: It comprises a demolding and crystal-topping mechanism (1) for providing a chip, a crystal-topping workbench (2) for placing a bracket, a bonding mechanism (3) for transferring the chip to the bracket of the crystal-topping workbench (2), and a cleaning mechanism (4) for cleaning the bonding mechanism (3) and installed on the demolding and crystal-topping mechanism (1); The film removal and crystal lifting mechanism (1) comprises a crystal ring carrying platform (101) for placing a crystal ring and a pin assembly (102) for lifting the chip upward to separate the chip from the film on the crystal ring.

2. The self-cleaning die bonding equipment according to claim 1, characterized in that: The crystal ring carrying platform (101) comprises: A crystal frame carrier plate (1011), wherein the crystal frame carrier plate (1011) is provided with an airtight space (1011a) for inserting the ejector pin assembly (102); A rotating crystal frame (1012), the rotating crystal frame (1012) is rotatably mounted above the air-avoiding space (1011a) of the crystal frame carrier plate (1011) and is used for placing a crystal ring; A crystal frame rotation driving mechanism (1013), wherein the crystal frame rotation driving mechanism (1013) is mounted on the crystal frame carrier (1011) and is drivingly connected to the rotating crystal frame (1012) to drive the rotating crystal frame (1012) to rotate relative to the crystal frame carrier (1011).

3. The self-cleaning die bonding equipment according to claim 2, characterized in that: The crystal ring carrying platform (101) further comprises: The wafer side XY bidirectional slide (1014), the crystal frame carrier (1011) is installed on the top of the wafer side XY bidirectional slide (1014), and is driven by the wafer side XY bidirectional slide (1014) to move in a horizontal direction.

4. The self-cleaning die bonding equipment according to claim 1, characterized in that: The ejector assembly (102) comprises an ejector body (1021) and an ejector linear drive mechanism (1022) for driving the ejector body (1021) to move up and down.

5. The self-cleaning die bonding equipment according to claim 1, characterized in that: The cleaning mechanism (4) comprises: Clean the base (401); A cleaning rotation drive mechanism (402), wherein the cleaning rotation drive mechanism (402) is installed in the cleaning base (401); A wiping head (403), wherein the wiping head (403) is connected to the driving end of the cleaning rotation driving mechanism (402).

6. The self-cleaning die bonding equipment according to claim 5, characterized in that: The cleaning mechanism (4) further comprises: a limiting gland (404), the limiting gland (404) being mounted on the cleaning base (401) and used for limiting the relative displacement of the wiping head (403) and the cleaning base (401) along the axial direction of the wiping head (403), and a gland hole (4041) for the wiping surface (4031) of the wiping head (403) to pass through is provided at a middle position of the limiting gland (404); A cleaning outer cover (405) is installed on the cleaning base (401) and is used to limit the relative displacement of the limiting pressure cover (404) and the cleaning base (401) along the axial direction of the wiping head (403), and a cover hole (4051) is provided in the middle position of the cleaning outer cover (405) for the top surface of the limiting pressure cover (404) to pass through.

7. The self-cleaning die bonding equipment according to claim 1, characterized in that: The crystal bonding workbench (2) comprises a support platform (201) for placing a support and a support-side XY bidirectional slide table (202) for driving the support platform (201) to move in a horizontal direction.

8. The self-cleaning die bonding equipment according to claim 1, characterized in that: The bonding mechanism (3) includes a crystal retrieval camera (301) located above the demolding and crystal top mechanism (1), a crystal solidifying camera (302) located above the crystal solidifying workbench (2), a crystal solidifying swing arm (303) located between the demolding and crystal top mechanism (1) and the crystal solidifying workbench (2), a crystal solidifying linear drive mechanism (304) which is transmission-connected to one end of the crystal solidifying swing arm (303) and drives the crystal solidifying swing arm (303) to move up and down, a crystal solidifying rotary drive mechanism (305) which is connected to the crystal solidifying linear drive mechanism (304) and drives the crystal solidifying linear drive mechanism (304) to move up and down, and a suction nozzle (306) installed at the other end of the crystal solidifying swing arm (303).

9. The self-cleaning die bonding equipment according to claim 8, characterized in that: The number of the crystal-fixing swing arms (303) is two, and the two crystal-fixing swing arms (303) are arranged at 180 degrees.

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