Heatable vacuum objective table

Abstract

The utility model discloses a heatable vacuum objective table, which comprises an objective table, a protective baffle plate, a heating sheet, a pressing plate, a spacing plate and an objective table mounting substrate, the objective table is connected to the objective table mounting substrate, the upper surface of the objective table is provided with a groove and a vacuum air path hole which are annularly distributed, and the objective table realizes vacuum adsorption through the groove and the vacuum air path hole; a heating sheet is arranged below the objective table, and the heating sheet and the objective table are pressed and fixed by the pressing plate; a partition plate is arranged below the pressing plate and installed in a groove in the top face of the objective table installation base plate. And the protection plate is mounted on the outermost side of the objective table mounting base plate. The objective table disclosed by the utility model has the functions of vacuum adsorption and disc surface heating, is firm in vacuum adsorption, uniform in disc surface heating and accurate in temperature data acquisition, and also has a certain protection function.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor wafer processing and relates to a heatable vacuum stage, in particular to a vacuum stage used for hot-melt bonding wax and substrate removal after wafer or material thinning and polishing. Background Art

[0002] During the processing of semiconductor wafers, the wafers or materials need to be thinned and polished. After grinding and thinning, the substrate material of the wafer or material needs to be removed to facilitate quality inspection and subsequent processing, including slip, epitaxy, packaging, etc.

[0003] In the process of separating wafers or materials from substrate materials, the stage is not only required to have a uniformly distributed vacuum adsorption substrate to firmly adsorb the substrate material to be separated, but also to have a heating function to melt the bonding wax for subsequent operations. The current equipment has a low degree of vacuum adsorption and an inaccurate heating temperature, which makes operation difficult. At the same time, accidental injuries such as burns often occur during the operation. Utility Model Content

[0004] Purpose of the utility model: The purpose of the utility model is to solve the above-mentioned problems and provide a heatable vacuum stage with vacuum adsorption, uniform heating, accurate temperature data collection, and certain protective functions.

[0005] Technical solution: The utility model provides a heatable vacuum stage, comprising a stage, a protective baffle, a heating plate, a pressure plate, a spacer and a stage mounting substrate; the stage is connected to the stage mounting substrate, the upper surface of the stage is provided with annularly distributed grooves and vacuum air passage holes, and the stage achieves vacuum adsorption through the grooves and vacuum air passage holes; a heating plate is provided under the stage, and the pressure plate presses and fixes the heating plate and the stage; a spacer is provided under the pressure plate, and the spacer is installed in the groove on the top surface of the stage mounting substrate; the protective baffle is installed on the outermost side of the stage mounting substrate.

[0006] Furthermore, a temperature sensor is provided at the center of the stage mounting substrate, and the temperature sensor passes through the stage mounting substrate, the spacer plate, the pressure plate, and the heating plate in sequence and then abuts against the bottom surface of the stage.

[0007] Furthermore, a concave cavity is upwardly arranged on the bottom surface of the stage, and the heating plate is placed in the concave cavity.

[0008] Furthermore, the heating plate is a mica heating plate.

[0009] Furthermore, the partition plate is made of phenolic resin material.

[0010] Furthermore, the protective baffle is made of heat-resistant polymer material.

[0011] Furthermore, the stage mounting base plate is fixedly connected to the stage via threaded holes, and a connecting support column is disposed on the periphery of the stage mounting base plate.

[0012] Furthermore, the bottom end of the connecting support column is provided with a threaded hole for connecting to other equipment substrates.

[0013] Beneficial effects: Compared with the prior art, the utility model has the following advantages: 1. The loading platform of the present invention has both vacuum adsorption and disk surface heating functions, and the polymer protective baffle outside the loading platform is used to prevent accidental scalding during operation, and has a certain protective function;

[0014] The circular grooves and vacuum air holes on the stage surface make the stage have a higher vacuum adsorption firmness;

[0015] There is a temperature sensor inside the stage for collecting data, so that the disk surface is heated evenly and the temperature data is collected accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model.

[0017] Among them: the stage 101, the protective baffle 102, the heating plate 103, the pressing plate 104, the spacer 105, the stage mounting base plate 106, the connecting support column 107, the temperature sensor 108, the groove 1101, and the vacuum air hole 1102. DETAILED DESCRIPTION

[0018] The technical solution of the utility model is further described below in conjunction with the accompanying drawings.

[0019] like Figure 1As shown, the heatable vacuum stage of this embodiment is mainly composed of 8 parts. The main body of the stage is, from top to bottom, a stage 101, a heating plate 103, a pressing plate 104, a spacer 105, a stage mounting base plate 106, and a connecting support column 107. A protective baffle 102 is provided on the outside of the stage, and a temperature sensor 108 is provided inside the stage. Wafers / materials are adsorbed on the stage 101, and the upper surface of the stage 101 is provided with annular grooves 1101 and vacuum air holes 1102, so that the stage 101 has the function of vacuum adsorption. The bottom surface of the stage 101 is provided with a heating plate 103, and the pressing plate 104 presses and fixes the heating plate 103 and the stage 101. In a specific embodiment, a concave cavity is provided upward on the bottom surface of the stage 101, and the heating plate 103 is arranged in the concave cavity, which can further improve the heating efficiency. The heating plate 103 is a mica heating plate, and the pressing plate 104 is connected to the stage 101 through a thread. A spacer 105 is closely attached to the lower side of the pressing plate 104. In a specific embodiment, the spacer 105 is a phenolic resin spacer, and the spacer 105 is installed in a groove on the top surface of the stage mounting substrate 106. The stage mounting substrate 106 is connected to the stage 101 through a thread. The spacer 105 has a heat insulation function, which can prevent the temperature of the heating plate 103 from being transmitted to the stage mounting substrate 106.

[0020] In a specific embodiment, the temperature sensor 108 is installed at the center of the stage mounting substrate 106. The temperature sensor 108 passes through the stage mounting substrate 106, the spacer plate 105, the pressure plate 104, and the heating plate 103 in sequence and then abuts against the bottom surface of the stage 101. That is, the top surface of the temperature sensor 108 is tangent to the stage 101 and is used to collect temperature data. The temperature sensor 108 disposed at the bottom is convenient for installation and maintenance.

[0021] In a specific embodiment, the protective baffle 102 is located on the outer side of the stage mounting substrate 106, is made of heat-resistant polymer material, and is installed facing the operator to shield the side wall of the stage 101 to prevent accidental burns during operation. The mounting substrate 106 is provided with a mounting boss, and the protective baffle 102 is an arc-shaped structure, with both ends connected to the mounting boss.

[0022] In a specific embodiment, a connecting support column 107 is installed on the periphery of the stage mounting substrate 106. One end of the connecting support column 107 is threadedly connected to the stage mounting substrate 106, and the threaded hole at the other end is used to provide a fixing position for connection with other device substrates.

Claims

1. A heatable vacuum stage, characterized in that: The present invention comprises an object carrier (101), a protective baffle (102), a heating plate (103), a pressing plate (104), a spacer plate (105) and an object carrier mounting substrate (106); the object carrier (101) is connected to the object carrier mounting substrate (106); the upper surface of the object carrier (101) is provided with annularly distributed grooves (1101) and vacuum air passage holes (1102); the object carrier is provided with a vacuum air passage hole (1102) and a vacuum air passage hole (1101) disposed on the object carrier; 2) achieving vacuum adsorption; a heating plate (103) is arranged below the stage (101), and the pressing plate (104) presses and fixes the heating plate (103) and the stage (101); a spacer plate (105) is arranged below the pressing plate (104), and the spacer plate (105) is installed in a groove on the top surface of the stage mounting substrate (106); the protective baffle (102) is installed on the outermost side of the stage mounting substrate (106).

2. The heatable vacuum stage according to claim 1, characterized in that: A temperature sensor (108) is provided at the center of the stage mounting substrate (106); the temperature sensor (108) passes through the stage mounting substrate (106), the spacer plate (105), the pressure plate (104), and the heating plate (103) in sequence and then contacts the bottom surface of the stage (101).

3. The heatable vacuum stage according to claim 1, characterized in that: The bottom surface of the object carrier (101) is provided with a concave cavity upwards, and the heating plate (103) is placed in the concave cavity.

4. The heatable vacuum stage according to claim 1, characterized in that: The heating plate (103) is a mica heating plate.

5. The heatable vacuum stage according to claim 1, characterized in that: The partition plate (105) is made of phenolic resin material.

6. The heatable vacuum stage according to claim 1, characterized in that: The protective baffle (102) is made of heat-resistant polymer material.

7. The heatable vacuum stage according to claim 1, characterized in that: The stage mounting substrate (106) is fixedly connected to the stage (101) via a threaded hole, and a connecting support column (107) is provided on the periphery of the stage mounting substrate (106).

8. The heatable vacuum stage according to claim 7, characterized in that: The bottom end of the connecting support column (107) is provided with a threaded hole for connecting to other equipment baseboards.

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