Dehumidification device and power transformation cabinet

Abstract

The utility model relates to electrical control equipment, and provides a dehumidification device which comprises a shell, an air inlet mechanism used for sucking external wet gas into the shell and an air outlet mechanism used for outputting dry gas in the shell out of the shell, and a condensation part located in the shell is used for condensing and dehumidifying the wet gas entering the shell. According to the dehumidification device, active dehumidification can be achieved, the gas is sucked into the device, the response speed is high, the humidity of the gas in the power transformation cabinet can be rapidly reduced, meanwhile, energy consumption is low, and the operation cost can be controlled easily.

Description

Technical Field

[0001] The present disclosure relates to electrical control equipment, in particular to a dehumidification device and also to a transformer cabinet including the dehumidification device. Background Art

[0002] In the power system, the high-voltage cabinet is a key power equipment, and the temperature and humidity control of its internal environment is crucial to ensure the stable operation of the power system. The dehumidification method in the traditional high-voltage cabinet mainly relies on heating dehumidification, that is, the temperature in the cabinet is increased by heating elements to promote the evaporation of water in the gas, and then the water vapor is condensed and dripped by natural cooling, ultimately achieving the purpose of reducing humidity.

[0003] However, existing dehumidification methods have obvious limitations and shortcomings. They are difficult to respond quickly. Heating dehumidification takes a long time to achieve the desired dehumidification effect. Continuous heating to maintain low humidity not only consumes a lot of electricity, but also generates additional heat. At the same time, there are safety risks in heating elements in high temperature environments. Therefore, heating dehumidifiers are frequently inspected and maintained to ensure the normal operation of the heating elements, which increases operating costs. Utility Model Content

[0004] The technical problem to be solved by the present disclosure is, on the one hand, to provide a dehumidification device to solve the problems of slow response, high energy consumption and high operating cost of the dehumidifier in the existing transformer cabinet.

[0005] On the other hand, the technical problem to be solved by the present disclosure is to provide a substation cabinet to solve the problem that the dehumidification device in the existing substation cabinet dries the water vapor by heating, has a slow response, consumes a lot of energy, and has high operating costs.

[0006] In order to solve the above technical problems, the present invention provides a dehumidification device, including: a shell; an air inlet mechanism, the air inlet mechanism is used to suck external humid gas into the shell; an air outlet mechanism, the air outlet mechanism is used to output dry gas in the shell to the outside of the shell; a condensation part, the condensation part is located in the shell, and is used to condense and dehumidify the humid gas entering the shell; a heat dissipation part, the heat dissipation part is located in the shell, and is used to dissipate heat from the condensation part; a water outlet, the water outlet is located on the shell, and is used to discharge liquid generated by condensation of the condensation part out of the shell.

[0007] In some embodiments, a dehumidification substrate is provided in the shell, and the dehumidification substrate includes a substrate body, a mounting hole provided on the substrate body, and a semiconductor sheet installed in the mounting hole. The condensation part contacts the cold surface of the semiconductor sheet, and the heat dissipation part contacts the hot surface of the semiconductor sheet.

[0008] In some embodiments, the substrate body is an aluminum alloy plate or a conductive ceramic plate.

[0009] In some embodiments, a gap is provided between the dehumidification substrate and the top and / or bottom of the housing to form a ventilation duct.

[0010] In some embodiments, the condensation part includes a condensation plate in contact with the cold surface of the semiconductor chip and a condensation tower located on the condensation plate; the heat dissipation part includes a heat dissipation plate in contact with the hot surface of the semiconductor chip and a heat dissipation tower located on the heat dissipation plate.

[0011] In some embodiments, a heat conducting layer is arranged between the cold surface of the semiconductor chip and the condensation plate and / or between the hot surface of the semiconductor chip and the heat dissipation plate.

[0012] In some embodiments, the thermally conductive layer is a thermally conductive silicone layer.

[0013] In some embodiments, the air inlet mechanism includes an air inlet located on the side wall of the shell and an air inlet fan installed at the air inlet, and a dust filter is installed on one side of the air inlet fan; the air outlet mechanism includes an air outlet located on the side wall of the shell and an air outlet fan installed at the air outlet, and a filter is installed on one side of the air outlet fan.

[0014] In some embodiments, the water outlet is located below the condensation portion, and a funnel-shaped structure connected to a drain pipe is provided at the water outlet.

[0015] On the other hand, the present disclosure further provides a substation cabinet, comprising a cabinet body and the above-mentioned dehumidification device, wherein an air inlet mechanism is connected to the cabinet body.

[0016] Through the above technical scheme, the dehumidification device provided by the present invention sucks the humid gas in the dehumidification body such as the transformer cabinet into the shell through the air inlet mechanism, and the condensation part condenses and dehumidifies the humid gas to reduce the humidity of the gas. The liquid produced by the condensation is discharged from the shell through the water outlet, and the dehumidified gas flows to the air outlet mechanism and is discharged from the shell, thereby reducing the humidity of the gas in the dehumidification body. The dehumidification device can realize active dehumidification, and the gas suction device has a fast response speed, can quickly reduce the humidity of the gas in the dehumidification body, and at the same time has low energy consumption, which is conducive to controlling operating costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 is a schematic structural diagram of a dehumidification device disclosed in an embodiment of the present disclosure;

[0019] Figure 2 is a schematic structural diagram of a heat dissipation unit disclosed in an embodiment of the present disclosure;

[0020] Figure 3 It is a schematic diagram of the structure of the condensation unit disclosed in the embodiment of the present disclosure;

[0021] Figure 4 It is a partial circuit diagram disclosed in an embodiment of the present disclosure.

[0022] Description of reference numerals:

[0023] 1. Shell; 2. Air outlet mechanism; 3. Air inlet mechanism; 4. Water outlet; 5. Semiconductor chip; 6. Dehumidification substrate; 601. Substrate body; 7. Condensation tower; 8. Heat dissipation tower. DETAILED DESCRIPTION

[0024] The following is a further detailed description of the embodiments of the present disclosure in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0025] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0026] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0027] In addition, the words "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0028] It should also be noted that in the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0029] All terms used in the present disclosure have the same meanings as those understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, for example, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0030] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0031] The present disclosure provides a dehumidification device, see Figure 1 , including: a shell 1; an air inlet mechanism 3, the air inlet mechanism 3 is used to suck external humid gas into the shell 1; an air outlet mechanism 2, the air outlet mechanism 2 is used to output the dry gas in the shell 1 to the outside of the shell 1; a condensation part, the condensation part is located in the shell 1, and is used to condense and dehumidify the humid gas entering the shell 1; a heat dissipation part, the heat dissipation part is located in the shell 1, and is used to dissipate heat from the condensation part; a water outlet 4, the water outlet 4 is located on the shell 1, and is used to discharge liquid generated by condensation of the condensation part out of the shell 1.

[0032] Dehumidifiers are widely used in many fields. Their core function is to regulate and control the humidity in the air to meet the needs of specific environments. In industrial production, such as electronic manufacturing and food processing, dehumidifiers maintain a low humidity environment to prevent products from getting damp, oxidizing or breeding microorganisms, ensuring product quality and production safety. In the medical and health field, dehumidifiers are used in pharmaceutical warehouses and medical facilities to protect drugs and medical equipment from moisture damage and extend their effective service life. In addition, dehumidifiers also play an important role in residential and commercial buildings. They can not only improve indoor air quality and reduce mold growth, but also improve living comfort and prevent respiratory diseases. In cultural preservation institutions such as archives and museums, precise humidity control is the key to protecting precious cultural relics and materials from destruction. In short, the application of dehumidifiers covers all aspects from industrial production to daily life, from cultural relics protection to health care, and its importance is self-evident.

[0033] The following will take the transformer cabinet as an example to illustrate the operation process of the dehumidification device disclosed in the present invention. The humid gas in the transformer cabinet is sucked into the dehumidification device through the air inlet mechanism 3, and the condensation part condenses and dehumidifies the humid gas to reduce the humidity of the gas. The liquid produced by the condensation is discharged from the dehumidification device through the water outlet 4. The dehumidified gas is circulated to the air outlet mechanism 2 and discharged from the dehumidification device, thereby reducing the humidity of the gas in the transformer cabinet. The dehumidification device can actively dehumidify the gas and the gas inhalation device has a fast response speed, which can quickly reduce the humidity of the gas in the transformer cabinet. At the same time, the energy consumption is low, which is conducive to controlling operating costs.

[0034] In some embodiments, see Figure 1 , Figure 2 and Figure 3 A dehumidification substrate 6 is provided in the shell 1, and the dehumidification substrate 6 includes a substrate body 601, a mounting hole provided on the substrate body 601, and a semiconductor chip 5 installed in the mounting hole. The condensation part contacts the cold surface of the semiconductor chip 5, and the heat dissipation part contacts the hot surface of the semiconductor chip 5. The shell 1 is provided with a card slot for installing the dehumidification substrate 6, which is convenient for installation and later maintenance work. The shell 1 can be a rectangular closed aluminum alloy box. The long substrate body 601 mainly plays a conductive role, such as: aluminum alloy substrate, copper substrate, and secondly plays a heat dissipation role.

[0035] In the present disclosure, one side of the semiconductor chip 5 is a cold surface, which can quickly cool the gas by contacting the humid gas with the cold surface, so that the water vapor in the gas condenses into water droplets and is discharged from the water outlet 4. The other side is a hot surface, which dissipates heat, maintains the working temperature of the semiconductor chip 5, avoids overheating and causes the performance of the semiconductor chip 5 to decline or be damaged, and ensures the continuity and efficiency of the dehumidification process. In addition, the hot surface can also heat the gas after dehumidification to prevent the gas with a lower temperature from being discharged into the transformer cabinet to produce condensed water. The temperature of the semiconductor chip 5 can be adjusted by the current size, and the semiconductor chip 5 is directly installed in the installation hole of the substrate body 601, which reduces the volume of the entire dehumidification device, and is convenient for adding components to the cold and hot surfaces of the semiconductor chip 5 to achieve better effects. In this way, the humidity of the gas in the transformer cabinet is reduced. The dehumidification device can actively inhale the gas into the device, and condense the moisture in the gas into liquid by using the semiconductor chip dehumidification method to reduce the humidity, which is different from the existing heating dehumidification device that reduces the humidity by drying.

[0036] It should be noted that the dehumidification of semiconductor wafers is mainly based on the "Peltier effect", which is a thermoelectric phenomenon. The semiconductor wafer is composed of alternating N-type and P-type semiconductor materials. When current passes through these materials, heat is generated on one side of the semiconductor wafer as the hot end, and heat is absorbed on the other side as the cold end. By controlling the direction of the current, it can be determined which side becomes the cold end and which side becomes the hot end. When the humid gas flows over the surface of the cold end, the water vapor in the gas condenses into liquid water due to the sudden drop in temperature, that is, condensation occurs. This condensed water is then collected and discharged, thereby reducing the humidity in the gas.

[0037] In some embodiments, the substrate body 601 is an aluminum alloy plate or a conductive ceramic plate. The substrate body 601 mainly plays the role of conducting electricity. Secondly, it has good thermal conductivity and can quickly conduct the heat generated by the semiconductor chip to the condensation plate and the heat dissipation plate, thereby improving the heat exchange efficiency and making the semiconductor chip 5 work within a suitable temperature range, which is crucial for the efficient operation of the dehumidification device. Aluminum alloy materials have high strength and good rigidity. At the same time, aluminum alloy has low density, which is conducive to controlling the weight of the dehumidification device and realizing its lightweight design. Conductive ceramic materials have high chemical stability, are not easily corroded, and are suitable for use in harsh environments. In addition, electromagnetic shielding can reduce the influence of external electromagnetics on the dehumidification device, thereby improving its applicability.

[0038] In some embodiments, see Figure 1 A gap is provided between the dehumidification substrate 6 and the top and / or bottom of the shell 1 to form a ventilation duct, through which the gas is ensured to flow evenly around the dehumidification substrate 6, so that the gas enters from the air inlet mechanism 3 and exits from the air outlet mechanism 2, so that the gas can flow in the dehumidification device.

[0039] In some embodiments, see Figure 2 and Figure 3 The condensation part includes a condensation plate in contact with the cold surface of the semiconductor chip 5 and a condensation tower 7 located on the condensation plate; the heat dissipation part includes a heat dissipation plate in contact with the hot surface of the semiconductor chip 5 and a heat dissipation tower 8 located on the heat dissipation plate. The condensation tower 7, condensation plate, heat dissipation plate and heat dissipation tower 8 are installed on both sides of the semiconductor chip 5 to further enhance the condensation and heat dissipation effects. The condensation tower 7 increases the contact area between the condensation plate and the humid gas, which helps to cool the gas more quickly and promote the condensation of more water vapor. The heat dissipation tower 8 increases the contact area between the heat dissipation plate and the surrounding environment, accelerates the heat dissipation of the hot surface, ensures that the semiconductor chip 3 works in the optimal temperature range, and at the same time increases the surface area to have a greater heat exchange rate, which is conducive to improving the dehumidification rate.

[0040] In some embodiments, a heat-conducting layer is arranged between the cold surface of the semiconductor sheet 5 and the condensation plate and / or between the hot surface of the semiconductor sheet 5 and the heat sink. The heat-conducting layer usually has a high thermal conductivity, and quickly transfers heat from the semiconductor sheet 5 to the condensation plate or the heat sink, which helps to evenly distribute the temperature of the semiconductor sheet 4 and improve the heat conduction efficiency between the semiconductor sheet 5 and the condensation plate or the heat sink. At the same time, the heat-conducting layer can fill the tiny uneven gaps at the connection, ensure close contact between the semiconductor sheet 5 and the condensation plate or the heat sink, and reduce the contact thermal resistance. In addition, the heat-conducting layer can also play a role in reducing vibration and noise, reducing noise caused by vibration, and improving the quiet performance of the dehumidification device.

[0041] In some embodiments, the thermal conductive layer is a thermal conductive silicone layer. The silicone material has stable chemical properties, is not easy to age, can maintain its physical and thermal properties for a long time, and is suitable for long-term use. The thermal conductive silicone can maintain its performance in a wide temperature range and is suitable for a variety of working environments. Whether it is low temperature or high temperature conditions, it can maintain good heat conduction effects. The silicone material is non-toxic and non-corrosive and meets environmental protection requirements. Compared with other high-performance thermal conductive materials, the cost of thermal conductive silicone is relatively low, which can balance performance and cost and improve the market competitiveness of the product.

[0042] In some embodiments, see Figure 1 The air inlet mechanism 3 includes an air inlet located on the side wall of the shell 1 and an air inlet fan installed at the air inlet. A dust filter is installed on one side of the air inlet fan, which is installed on the outside or inside of the fan, or both the inside and the outside of the fan; the air outlet mechanism 2 includes an air outlet located on the side wall of the shell 1 and an air outlet fan installed at the air outlet. A filter is installed on one side of the air inlet fan. The air inlet fan and the air outlet fan are fixed to the side wall of the shell 1 by screws. For easy installation, mounting holes can be reserved in the side wall in advance or holes can be drilled through the equipment. The arrangement of the air inlet fan and the air outlet fan can ensure that the gas forms a good circulation inside the equipment and improve the dehumidification efficiency. The dust filter at the air inlet can intercept impurities such as dust and particulate matter in the gas, reduce their entry into the dehumidification device, stick to the condensation tower 7 to affect the condensation effect or accumulate at the water outlet 4, which is conducive to ensuring the normal operation of the dehumidification device.

[0043] In addition, in some embodiments, see Figure 4The dehumidification device includes a power supply (the voltage can be 12V), a semiconductor chip 5, an air inlet fan, and an air outlet fan. Among them, the semiconductor chip 5 is connected in parallel with the air inlet fan and the air outlet fan in the circuit to ensure that the two can work independently without affecting each other. A manual control switch is installed on the positive line to control the start and stop of the entire circuit. When the switch is turned on, the circuit is connected, and the semiconductor chip 5, the air inlet fan, and the air outlet fan start working; when the switch is turned off, the circuit is disconnected and both stop working. A fuse is added to the circuit, located near the power supply in the positive line, to prevent the circuit from overloading or short circuiting, and to protect the semiconductor chip 5 and other components from damage. A voltage regulation module is used to ensure that even if the input voltage fluctuates, a stable power supply can be provided to the semiconductor chip 5 and the fan to ensure their normal operation and extend their service life. For the semiconductor chip 5, an adjustable resistor is connected in series to achieve current limitation to avoid overheating and performance degradation caused by excessive current. A microcontroller is introduced, combined with a humidity sensor, to achieve automatic control function. When the ambient humidity is detected to be higher than the preset threshold, the microcontroller automatically turns on the semiconductor chip and fan for dehumidification; when the humidity drops to a safe level, it automatically turns off to achieve energy-saving operation. The device is equipped with an LED indicator to display the current working status, such as operation, standby or fault, so that users can monitor the status of the device. The device is equipped with an emergency stop switch, which can immediately cut off the power supply in case of abnormal conditions to ensure personnel safety.

[0044] In some embodiments, the water outlet 4 is located below the condensation part, and a funnel-shaped structure connected to the drain pipe is provided at the water outlet 4. The funnel-shaped water outlet 4 is conducive to the gathering of condensed water and improves the drainage efficiency. The dehumidification device can also discharge a large amount of condensed water in a high humidity environment in time.

[0045] In order to better understand the technical solution of the present disclosure, the following is an explanation in combination with relatively preferred technical features.

[0046] See also Figure 1The present disclosure provides a dehumidification device, including a dehumidification substrate 6 provided in a shell 1, the dehumidification substrate 6 includes a substrate body 601, a mounting hole provided on the substrate body 601 and a semiconductor chip 5 installed in the mounting hole, a condensation part contacts the cold surface of the semiconductor chip 5, a heat dissipation part contacts the hot surface of the semiconductor chip 5, the substrate body 601 is an aluminum alloy plate, a gap is provided between the dehumidification substrate 6 and the top and bottom of the shell 1 to form a ventilation duct, an air inlet mechanism 3 is used to suck external humid gas into the shell 1, the air inlet mechanism 3 includes an air inlet located on the side wall of the shell 1 and an air inlet fan installed at the air inlet, a dust filter is installed on one side of the air inlet fan, and an air outlet mechanism 2 is used to The dry gas in the shell 1 is output to the outside of the shell 1. The air outlet mechanism 2 includes an air outlet located on the side wall of the shell 1 and an air outlet fan installed at the air outlet. A filter is installed on one side of the air inlet fan. The condensation part is located in the shell 1, which is used to condense and dehumidify the humid gas entering the shell 1. The condensation part includes a condensation plate in contact with the cold surface of the semiconductor chip 5 and a condensation tower 7 located on the condensation plate. The heat dissipation part is located in the shell 1, which is used to dissipate the heat of the condensation part. The heat dissipation part includes a heat dissipation plate in contact with the hot surface of the semiconductor chip 5 and a heat dissipation tower 8 located on the heat dissipation plate. A heat conductive layer is arranged between the cold surface of the semiconductor chip 5 and the condensation plate and between the hot surface of the semiconductor chip 5 and the heat dissipation plate. The heat conductive layer is a heat conductive silica gel layer. The water outlet 4 is located on the shell 1, which is used to discharge the liquid generated by the condensation of the condensation part out of the shell 1. The water outlet 4 is located below the condensation part, and a funnel-shaped structure connected to the drain pipe is provided at the water outlet 4. The above-mentioned relatively preferred dehumidification device, when the power is turned on, the air inlet fan sucks the humid gas in the transformer cabinet into the shell 1 through the dust filter, and the gas will condense when it contacts the condensation tower or condensation plate. The liquid produced by the condensation is discharged from the shell 1 through the water outlet 4. The dehumidified gas passes through the air duct, and the heat dissipation tower 8 will adjust the temperature of the discharged gas. The air outlet fan discharges the gas from the shell 1, thereby reducing the humidity of the gas in the transformer cabinet. The dehumidification device can actively dehumidify the gas, and the gas intake device has a fast response speed, can quickly reduce the humidity in the transformer cabinet, and at the same time has low energy consumption, which is conducive to controlling operating costs.

[0047] The present disclosure also provides a substation cabinet, comprising a cabinet body and any one of the above-mentioned dehumidification devices, wherein the air inlet mechanism is connected to the cabinet body. Therefore, the substation cabinet has all the beneficial effects of the above-mentioned dehumidification devices, which will not be described in detail here.

[0048] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0049] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. A dehumidification device, characterized in that: include: Housing (1); An air inlet mechanism (3), the air inlet mechanism (3) being used to draw external humid air into the housing (1); An air outlet mechanism (2), the air outlet mechanism (2) being used to output the dry gas in the shell (1) to the outside of the shell (1); A condensation unit, the condensation unit is located in the shell (1) and is used to condense and dehumidify the humid gas entering the shell (1); A heat dissipation unit, the heat dissipation unit is located in the housing (1) and is used to dissipate heat from the condensation unit; A water outlet (4), the water outlet (4) being located on the shell (1) and being used to discharge liquid generated by condensation in the condensation part out of the shell (1).

2. The dehumidification device according to claim 1, characterized in that: A dehumidification substrate (6) is provided in the shell (1), and the dehumidification substrate (6) includes a substrate body (601), a mounting hole provided on the substrate body (601), and a semiconductor chip (5) installed in the mounting hole, the condensation part is in contact with the cold surface of the semiconductor chip (5), and the heat dissipation part is in contact with the hot surface of the semiconductor chip (5).

3. The dehumidification device according to claim 2, characterized in that: The substrate body (601) is an aluminum alloy plate or a conductive ceramic plate.

4. The dehumidification device according to claim 2, characterized in that: A gap is provided between the dehumidification substrate (6) and the top and / or bottom of the shell (1) to form a ventilation duct.

5. The dehumidification device according to claim 2, characterized in that: The condensation section comprises a condensation plate in contact with the cold surface of the semiconductor chip (5) and a condensation tower (7) located on the condensation plate; The heat dissipation part comprises a heat dissipation plate in contact with the hot surface of the semiconductor chip (5) and a heat dissipation tower (8) located on the heat dissipation plate.

6. The dehumidification device according to claim 5, characterized in that: A heat conducting layer is arranged between the cold surface of the semiconductor chip (5) and the condensation plate and / or between the hot surface of the semiconductor chip (5) and the heat dissipation plate.

7. The dehumidification device according to claim 6, characterized in that: The heat-conducting layer is a heat-conducting silica gel layer.

8. The dehumidification device according to any one of claims 1 to 7, characterized in that: The air inlet mechanism (3) comprises an air inlet located on the side wall of the housing (1) and an air inlet fan installed at the air inlet, and a dust filter is installed on one side of the air inlet fan; The air outlet mechanism (2) comprises an air outlet located on the side wall of the shell (1) and an air outlet fan installed at the air outlet, and a filter screen is installed on one side of the air outlet fan.

9. The dehumidification device according to any one of claims 1 to 7, characterized in that: The water outlet (4) is located below the condensation portion, and a funnel-shaped structure connected to a drain pipe is provided at the water outlet (4).

10. A transformer cabinet, characterized in that: It comprises a cabinet body and a dehumidification device according to any one of claims 1 to 9, wherein the air inlet mechanism (3) is connected to the cabinet body.

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