Wind noise resistant microphone

Abstract

The utility model provides a wind noise resistant microphone, which comprises an MEMS diaphragm, a semiconductor amplifier ASIC, a substrate and a metal support member, and sound holes are arranged at positions where the metal support member and the substrate are close to each other. The sound inlet hole is arranged below the side of the metal support piece or at the corresponding position of the substrate, and the shielding effect of the product body is utilized to reduce the air flow intensity at the sound hole, thereby achieving the purpose of wind noise resistance.

Description

Technical Field

[0001] The utility model relates to the field of microphones, in particular to a wind noise resistant microphone. Background Art

[0002] In outdoor products such as outdoor cameras, sports headphones, sports watches, sports helmets, etc., the microphone's sound reception effect will be disturbed by wind noise, so anti-wind noise processing is required on these outdoor products.

[0003] Currently, anti-wind noise processing is mainly carried out from two aspects: the first is software processing, and the second is system structure optimization.

[0004] Among them, software processing requires the target product to have software processing capabilities, and if the original recording is seriously distorted by wind noise, the software will not be able to achieve a good processing effect.

[0005] System structure optimization usually requires the addition of windproof cotton, windproof baffles and other structures. Such structures are large in size and cannot be applied to small products. Utility Model Content

[0006] The purpose of the utility model is to overcome the shortcomings of the above-mentioned traditional technology and provide an anti-wind noise microphone which is independent of any external software and large structure and has strong versatility and can solve the above-mentioned problems.

[0007] The purpose of the utility model is achieved through the following technical measures: an anti-wind noise microphone, characterized in that it includes a MEMS diaphragm, a semiconductor amplifier ASIC, a substrate, a metal support and a sound hole, the MEMS diaphragm plays a role of sound-to-electricity conversion, the semiconductor amplifier ASIC plays a role of signal adjustment, the substrate plays a role of support and circuit connection, the metal support plays a role of support and signal shielding, the MEMS diaphragm and the semiconductor amplifier ASIC are fixedly mounted on the substrate, the MEMS diaphragm and the semiconductor amplifier ASIC are electrically connected, the metal support is fixedly mounted on the substrate, an installation cavity is formed between the substrate and the metal support, the MEMS diaphragm and the semiconductor amplifier ASIC are arranged in the installation cavity, and the sound hole is arranged on the metal support or the substrate at the junction of the metal support and the substrate.

[0008] As a preferred solution: the opening area of ​​the sound hole is designed in coordination with the product volume, so that when there is wind noise impact in the positive direction, the sound hole is located in the product shielding area, thereby reducing the impact of the wind noise.

[0009] As a preferred solution: the metal support member includes a top cover and a support wall, the top cover and the support wall are integrated, the sound hole is opened on the support wall, and the sound hole is opened at a position close to the support wall and the base plate.

[0010] As a preferred solution: the sound hole is opened on the substrate.

[0011] As a preferred solution: the MEMS membrane is connected to the substrate by glue, and the semiconductor amplifier ASIC is connected to the substrate by glue.

[0012] As a preferred solution: the MEMS diaphragm and the semiconductor amplifier ASIC are connected by gold wires.

[0013] As a preferred solution: the metal support member is connected to the substrate by using solder paste.

[0014] Due to the adoption of the above technical solution, compared with the prior art, the advantages of the utility model are:

[0015] 1. Anti-wind noise treatment is performed on the micro microphone body;

[0016] 2. Not dependent on software and machine structure;

[0017] 3. Meet the application requirements of small outdoor products;

[0018] 4. Based on mature silicon microphone production technology, it is easy to achieve mass production.

[0019] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Attached Figure 1 It is a structural schematic diagram of the first embodiment of the utility model.

[0021] Attached Figure 2 It is a schematic diagram of the position of the sound hole in the first embodiment of the utility model.

[0022] Attached Figure 3 It is a structural schematic diagram of the second embodiment of the present utility model.

[0023] Attached Figure 4 It is a schematic diagram of the position of the sound hole in the second embodiment of the present utility model. DETAILED DESCRIPTION

[0024] Embodiment 1, as attached Figure 1 and attached Figure 2As shown, an anti-wind noise microphone includes a MEMS diaphragm 1, a semiconductor amplifier ASIC2, a substrate 3, a metal support 4 and a sound hole 5, wherein the MEMS diaphragm 1 plays a role of sound-to-electricity conversion, the semiconductor amplifier ASIC2 plays a role of signal adjustment, the substrate 3 plays a role of support and circuit connection, the metal support 4 plays a role of support and signal shielding, the MEMS diaphragm 1 and the semiconductor amplifier ASIC2 are fixedly mounted on the substrate 3, the MEMS diaphragm 1 and the semiconductor amplifier ASIC2 are electrically connected, the metal support 4 is fixedly mounted on the substrate 3, an installation cavity is formed between the substrate 3 and the metal support 4, the MEMS diaphragm 1 and the semiconductor amplifier ASIC2 are arranged in the installation cavity, and the sound hole 5 is arranged on the metal support 4 at the junction of the metal support 4 and the substrate 3.

[0025] The opening area of ​​the sound hole 5 is designed in coordination with the product volume, so that when there is wind noise impact in the positive direction, the sound hole 5 is located in the product shielding area, thereby reducing the impact of the wind noise.

[0026] The metal support member 4 includes a top cover 41 and a support wall 42 . The top cover 41 and the support wall 42 are integrally arranged. The sound hole 5 is provided on the support wall 42 . The sound hole 5 is provided at a position where the support wall 42 is close to the base plate 3 .

[0027] The MEMS membrane 1 is connected to the substrate 3 by glue, and the semiconductor amplifier ASIC 2 is connected to the substrate 3 by glue.

[0028] The MEMS diaphragm 1 and the semiconductor amplifier ASIC 2 are connected by gold wires.

[0029] The metal support 4 is connected to the substrate 3 by using solder paste.

[0030] Embodiment 2, as attached Figure 3 and attached Figure 4 As shown, an anti-wind noise microphone includes a MEMS diaphragm 1, a semiconductor amplifier ASIC2, a substrate 3 and a metal support 4, wherein the MEMS diaphragm 1 plays a role of sound-to-electricity conversion, the semiconductor amplifier ASIC2 plays a role of signal adjustment, the substrate 3 plays a role of support and circuit connection, the metal support 4 plays a role of support and signal shielding, the MEMS diaphragm 1 and the semiconductor amplifier ASIC2 are fixedly mounted on the substrate 3, the MEMS diaphragm 1 and the semiconductor amplifier ASIC2 are electrically connected, the metal support 4 is fixedly mounted on the substrate 3, an installation cavity is formed between the substrate 3 and the metal support 4, the MEMS diaphragm 1 and the semiconductor amplifier ASIC2 are arranged in the installation cavity, and sound holes 5 are opened at positions close to each other of the metal support 4 and the substrate 3.

[0031] The opening area of ​​the sound hole 5 is designed in coordination with the product volume, so that when there is wind noise impact in the positive direction, the sound hole 5 is located in the product shielding area, thereby reducing the impact of the wind noise.

[0032] The sound hole 5 is disposed on the base plate 3 at the junction of the metal support 4 and the base plate 3 .

[0033] The MEMS membrane 1 is connected to the substrate 3 by glue, and the semiconductor amplifier ASIC 2 is connected to the substrate 3 by glue.

[0034] The MEMS diaphragm 1 and the semiconductor amplifier ASIC 2 are connected by gold wires.

[0035] The metal support 4 is connected to the substrate 3 by using solder paste.

[0036] The MEMS diaphragm 1 and the semiconductor amplifier ASIC 2 in the present application are both manufactured based on semiconductor technology; the substrate 3 is selected to be an epoxy resin board or a ceramic board. A sound hole 5 is opened at the lower side of the metal support 4 or at the corresponding position of the substrate 3, and the masking effect of the product body is used to reduce the airflow intensity at the sound hole to achieve the purpose of resisting wind noise.

[0037] The bonding between all components in this application is achieved by using adhesives such as metal wires, glue, and solder paste.

[0038] It should be particularly noted that in the first and second embodiments, the sound hole 5 can be provided on a side close to the semiconductor amplifier ASIC 2 or on a side close to the MEMS diaphragm 1 .

Claims

1. A wind noise resistant microphone, characterized in that: The invention comprises a MEMS diaphragm (1), a semiconductor amplifier ASIC (2), a substrate (3), a metal support (4) and a sound hole (5), wherein the MEMS diaphragm (1) performs an acoustic-electric conversion function, the semiconductor amplifier ASIC (2) performs a signal adjustment function, the substrate (3) performs a supporting and circuit connection function, the metal support (4) performs a supporting and signal shielding function, the MEMS diaphragm (1) and the semiconductor amplifier ASIC (2) are fixedly mounted on the substrate (3), the MEMS diaphragm (1) and the semiconductor amplifier ASIC (2) are electrically connected, the metal support (4) is fixedly mounted on the substrate (3), an installation cavity is formed between the substrate (3) and the metal support (4), the MEMS diaphragm (1) and the semiconductor amplifier ASIC (2) are arranged in the installation cavity, and the sound hole (5) is arranged on the metal support (4) or the substrate (3) at the junction of the metal support (4) and the substrate (3).

2. The wind noise reduction microphone according to claim 1, characterized in that: The opening area of ​​the sound hole (5) is designed in coordination with the volume of the product, so that when there is wind noise impact in the positive direction, the sound hole (5) is located in the product shielding area, thereby reducing the impact of the wind noise.

3. The wind noise reduction microphone according to claim 2, characterized in that: The metal support member (4) comprises a top cover (41) and a support wall (42); the top cover (41) and the support wall (42) are integrally arranged; the sound hole (5) is provided on the support wall (42); and the sound hole (5) is provided at a position where the support wall (42) is close to the base plate (3).

4. The wind noise reduction microphone according to claim 1 or 2, characterized in that: The sound hole (5) is provided on the base plate (3).

5. The wind noise reduction microphone according to any one of claims 1 to 3, characterized in that: The MEMS diaphragm (1) and the substrate (3) are connected by glue, and the semiconductor amplifier ASIC (2) and the substrate (3) are connected by glue.

6. The wind noise reduction microphone according to claim 5, characterized in that: The MEMS diaphragm (1) and the semiconductor amplifier ASIC (2) are connected by gold wire.

7. The wind noise reduction microphone according to any one of claims 1 to 3, characterized in that: The metal support (4) and the base plate (3) are connected using solder paste.

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