Wafer polishing machine water tank and wafer polishing machine

Abstract

The utility model provides a wafer polishing machine water tank and a wafer polishing machine, and relates to the technical field of polishing. The utility model provides a water tank of a wafer polishing machine. The water tank comprises a tank body, a partition plate and a sound wave generator. The partition plate is detachably connected to the inner wall of the groove body and divides the groove body into a feeding groove and a discharging groove which are arranged in parallel, the feeding groove is connected with the discharging groove, the feeding groove is used for storing wafers before polishing, and the discharging groove is used for storing the wafers after polishing. The sound wave generator is installed on the discharging groove and used for sending ultrasonic waves or megasonic waves to the discharging groove. According to the water tank of the wafer polishing machine and the wafer polishing machine, the tank body is divided into the feeding tank and the discharging tank which are arranged in parallel through the partition plate, the sound wave generator is installed in the discharging tank, the sound wave generator can emit ultrasonic waves or megasonic waves to the discharging tank, and the cleaning effect of wafers in the discharging tank can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing, in particular to a wafer polishing machine water tank and a wafer polishing machine. Background Art

[0002] Silicon carbide (SiC), as an emerging third-generation semiconductor core material, has excellent properties such as wide bandgap, high critical breakdown electric field strength, high electron mobility, good radiation resistance and chemical stability. This makes it an important substrate wafer material with wide applications, showing good application prospects in the fields of aviation devices, new energy vehicles, rail transportation and household appliances.

[0003] At present, the polishing machine of silicon carbide wafer is usually equipped with a water tank with pure water inside for storing and cleaning the wafers before and after polishing. However, the cleaning effect of the water tank of the conventional silicon carbide wafer polishing machine is average. Utility Model Content

[0004] The utility model aims to provide a wafer polishing machine water tank and a wafer polishing machine, which can improve the cleaning effect of the wafer after polishing.

[0005] The embodiment of the utility model is achieved as follows:

[0006] In a first aspect, the utility model provides a water tank for a wafer polishing machine, comprising:

[0007] Tank body;

[0008] a partition, the partition being detachably connected to the inner wall of the trough body and dividing the trough body into an upper trough and a lower trough arranged in parallel, wherein the upper trough is connected to the lower trough, the upper trough is used to store wafers before polishing, and the lower trough is used to store wafers after polishing; and

[0009] A sound wave generator is installed on the feeding trough and is used to emit ultrasonic waves or megasonic waves to the feeding trough.

[0010] In an optional embodiment, a slot is provided in the middle area of ​​the inner wall of the trough body, and the partition is plugged into and fits with the slot to separate the trough body into the upper material trough and the lower material trough.

[0011] In an optional embodiment, a sealing strip is further included;

[0012] The sealing strip is arranged in the slot, and the partition is sealed with the slot body through the sealing strip.

[0013] In an optional embodiment, the slot includes a first slot, a second slot and a third slot;

[0014] The trough body comprises a first side wall and a second side wall which are arranged opposite to each other, and a bottom wall connected between the first side wall and the second side wall, the first slot is recessed on the first side wall and extends along the height direction of the first side wall, the second slot is recessed on the second side wall and extends along the height direction of the second side wall, the third slot is recessed on the bottom wall, and two ends of the third slot are respectively connected with the bottom end of the first slot and the bottom end of the second slot;

[0015] The sealing strip includes a first sealing strip, a second sealing strip and a third sealing strip, the first sealing strip is arranged in the first slot and is located between the first slot and one side of the partition, the second sealing strip is arranged in the second slot and is located between the second slot and the other side of the partition, and the third sealing strip is arranged in the third slot and is located between the third slot and the bottom side of the partition.

[0016] In an optional embodiment, the slot includes a first slot, a second slot and a third slot;

[0017] The trough body comprises a first side wall and a second side wall which are arranged opposite to each other, and a bottom wall connected between the first side wall and the second side wall, the first side wall is provided with a first convex strip protruding along the height direction, the second side wall is provided with a second convex strip protruding along the height direction, and the bottom wall is provided with a third convex strip protruding, and two ends of the third convex strip are respectively connected to the bottom end of the first convex strip and the bottom end of the second convex strip;

[0018] The first slot is recessed on the first convex strip and extends along the height direction of the first convex strip, the second slot is recessed on the second convex strip and extends along the height direction of the second convex strip, the third slot is recessed on the third convex strip, and two ends of the third slot are respectively connected to the bottom end of the first slot and the bottom end of the second slot;

[0019] The sealing strip includes a first sealing strip, a second sealing strip and a third sealing strip, the first sealing strip is arranged in the first slot and is located between the first slot and one side of the partition, the second sealing strip is arranged in the second slot and is located between the second slot and the other side of the partition, and the third sealing strip is arranged in the third slot and is located between the third slot and the bottom side of the partition.

[0020] In an optional embodiment, the sound wave generator is installed on the outer side of the bottom of the discharge chute.

[0021] In an optional embodiment, a mounting base is protruding from the outer side of the bottom of the discharge chute, and the sound wave generator is provided with a connecting seat, and the mounting base is detachably connected to the connecting seat.

[0022] In an optional embodiment, it also includes connecting bolts and gaskets;

[0023] The mounting base is provided with a threaded hole, and the connecting base is provided with a through hole;

[0024] The connecting bolt passes through the through hole and is threadedly matched with the threaded hole, and the gasket is arranged between the connecting seat and the nut of the connecting bolt.

[0025] In an optional embodiment, a receiving cavity is provided inside the mounting base;

[0026] The sound wave generator is partially embedded in the accommodating cavity and fits with the outer side of the bottom of the feeding chute.

[0027] In a second aspect, the utility model provides a wafer polishing machine, comprising a polishing machine body and a wafer polishing machine water tank as described in any one of the aforementioned embodiments, wherein the tank body is arranged on the polishing machine body.

[0028] The beneficial effects of the wafer polishing machine water tank and wafer polishing machine provided by the embodiment of the utility model include: the tank body is divided into an upper tank and a lower tank arranged in parallel by a partition, wherein the upper tank is used to store wafers before polishing, and the lower tank is used to store wafers after polishing, so that it can be avoided that the wafers before and after polishing are placed in the same water tank, causing impurities in the water to contaminate the polished wafers, thereby reducing the cleaning effect of the polished wafers. On the other hand, by installing a sound wave generator in the lower tank, the sound wave generator can emit ultrasonic waves or megasonic waves to the lower tank, thereby further improving the cleaning effect of the wafers in the lower tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic structural diagram of a wafer polishing machine water tank provided for an optional embodiment of the utility model;

[0031] Figure 2 A schematic structural diagram of a partition plate of a wafer polishing machine water tank provided in an optional embodiment of the utility model;

[0032] Figure 3 A schematic diagram of the exploded structure of a sealing strip and a slot of a water tank of a wafer polisher provided in an optional embodiment of the utility model;

[0033] Figure 4 for Figure 3 A schematic diagram of the top view of the wafer polishing machine water tank at the slot;

[0034] Figure 5 Schematic diagram of the exploded structure of the sealing strip and the slot of the water tank of the wafer polisher provided by other optional embodiments of the utility model;

[0035] Figure 6 for Figure 5 A schematic diagram of the top view of the wafer polishing machine water tank at the slot;

[0036] Figure 7 A schematic diagram of the structure of a wafer polishing machine water tank provided in some alternative embodiments of the utility model;

[0037] Figure 8 for Figure 7 Schematic diagram of the local enlarged structure at position VIII in the figure.

[0038] icon:

[0039] 10- Wafer polishing machine sink;

[0040] 100-trough body; 101-upper material trough; 102-lower material trough; 1021-mounting base; 1022-threaded hole; 110-slot; 111-first slot; 112-second slot; 113-third slot; 121-first side wall; 122-second side wall; 123-bottom wall; 131-first convex strip; 132-second convex strip; 133-third convex strip;

[0041] 200-partition;

[0042] 300-sound wave generator; 310-connection seat; 311-through hole;

[0043] 400- sealing strip; 410- first sealing strip; 420- second sealing strip; 430- third sealing strip;

[0044] 500-connecting bolts;

[0045] 600-Shims. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0049] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0050] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0051] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] As described in the background technology, the polishing machine of silicon carbide wafers is usually provided with a water tank with pure water inside, which is used to store and clean the wafers before and after polishing. However, the cleaning effect of the water tank of the conventional silicon carbide wafer polishing machine is average. After research by the designer of the utility model, it was found that if the wafers before and after polishing are stored in the same water tank, the polished wafers are easily affected by impurities in the water tank, thereby reducing the cleaning effect of the polished wafers, and further affecting the subsequent process steps.

[0053] In order to improve the above technical problems, the embodiment of the utility model provides a wafer polishing machine water tank and a wafer polishing machine, which are used to improve the cleaning effect of the wafer after polishing.

[0054] See also Figure 1 The wafer polishing machine water tank 10 provided by the embodiment of the utility model is applied to a wafer polishing machine (not shown in the figure), which includes a polishing machine body and the above-mentioned wafer polishing machine water tank 10, wherein the wafer polishing machine water tank 10 is arranged on the polishing machine body (not shown in the figure).

[0055] The wafer polishing machine water tank 10 comprises a tank body 100, a partition 200 and an acoustic wave generator 300. The tank body 100 is arranged on the polishing machine body. The partition 200 is detachably connected to the inner wall of the tank body 100, and divides the tank body 100 into an upper material tank 101 and a lower material tank 102 arranged in parallel, wherein the upper material tank 101 is connected to the lower material tank 102, the upper material tank 101 is used to store wafers before polishing, and the lower material tank 102 is used to store wafers after polishing. The acoustic wave generator 300 is installed on the lower material tank 102, and is used to emit ultrasonic waves or megasonic waves to the lower material tank 102.

[0056] The wafer polishing machine water tank 10 provided by the utility model embodiment divides the tank body 100 into a parallel upper tank 101 and a lower tank 102 by a partition 200, wherein the upper tank 101 is used to store the wafers before polishing, and the lower tank 102 is used to store the wafers after polishing, so that it can avoid the wafers before and after polishing being placed in the same tank and causing impurities in the water to contaminate the wafers after polishing, thereby reducing the cleaning effect of the wafers after polishing. On the other hand, by installing an acoustic wave generator 300 to the lower tank 102, the acoustic wave generator 300 can emit ultrasonic waves or megasonic waves to the lower tank 102, thereby further improving the cleaning effect of the wafers in the lower tank 102, so as to facilitate the processing of the subsequent process steps of the wafers. In addition, since the partition 200 is a detachable connection, the upper tank 101 and the lower tank 102 can be separated by the partition 200 according to actual needs. In some application scenarios, the partition 200 can also be removed to obtain a larger tank body 100 to store more wafers, expanding the application scenario. Furthermore, the partition 200 is detachable, which also facilitates maintenance of the partition 200 .

[0057] It should be noted that, optionally, the trough body 100 is a rectangular trough structure with an open top as a whole. The partition 200 is roughly rectangular. After the partition 200 is vertically installed on the trough body 100, the trough body 100 can be divided into an upper trough 101 and a lower trough 102. The upper trough 101 and the lower trough 102 are both rectangular trough structures with an open top. In addition, the sound wave generator 300 can emit ultrasonic waves or megasonic waves to the lower trough 102, that is, the sound wave generator 300 can be an ultrasonic generator, or it can also be a megasonic generator.

[0058] Please refer to 2~ Figure 4 In some optional embodiments, a slot 110 is provided in the middle area of ​​the inner wall of the tank body 100, and the partition 200 is plugged into the slot 110 to separate the tank body 100 into an upper material tank 101 and a lower material tank 102. By providing the slot 110, the partition 200 can be easily plugged into the slot 110, and the partition 200 can be easily disassembled.

[0059] Optionally, a handle (not shown) may be provided on the top of the partition 200 to facilitate a technician in inserting the partition 200 into or removing the partition 200 from the slot 110 .

[0060] In some optional embodiments, the wafer polisher water tank 10 may further include a sealing strip 400. The sealing strip 400 is disposed in the slot 110, and the partition plate 200 is sealed with the tank body 100 through the sealing strip 400.

[0061] By providing the sealing strip 400 , a sealing effect can be achieved between the partition plate 200 and the tank body 100 , so that the water in the upper tank 101 and the lower tank 102 do not affect each other, thereby improving the cleaning effect of the polished wafers in the lower tank 102 .

[0062] In order to ensure the sealing effect, in some optional embodiments, the slot 110 may include a first slot 111, a second slot 112 and a third slot 113. The slot body 100 has a first side wall 121 and a second side wall 122 that are arranged opposite to each other and a bottom wall 123 connected between the first side wall 121 and the second side wall 122. The first slot 111 is recessed on the first side wall 121 and extends along the height direction of the first side wall 121. The second slot 112 is recessed on the second side wall 122 and extends along the height direction of the second side wall 122. The third slot 113 is recessed on the bottom wall 123, and both ends of the third slot 113 are connected to the bottom end of the first slot 111 and the bottom end of the second slot 112, respectively.

[0063] In addition, the sealing strip 400 may include a first sealing strip 410, a second sealing strip 420 and a third sealing strip 430. The first sealing strip 410 is arranged in the first slot 111 and is located between the first slot 111 and one side of the partition 200. The second sealing strip 420 is arranged in the second slot 112 and is located between the second slot 112 and the other side of the partition 200. The third sealing strip 430 is arranged in the third slot 113 and is located between the third slot 113 and the bottom side of the partition 200.

[0064] In this way, the opposite sides of the partition 200 can be sealed with the first side wall 121 and the second side wall 122 respectively through the first sealing strip 410 and the second sealing strip 420, and the bottom side of the partition 200 can be sealed with the bottom wall 123 of the trough body 100 through the third sealing strip 430, thereby improving the sealing effect between the partition 200 and the trough body 100, and further preventing the water in the upper trough 101 and the lower trough 102 from affecting each other, thereby improving the cleaning effect of the polished wafers in the lower trough 102.

[0065] See also Figure 5 and Figure 6 In addition, in order to ensure the sealing effect and facilitate the assembly and disassembly of the partition 200, in some other optional embodiments, the slot 110 includes a first slot 111, a second slot 112 and a third slot 113. The slot body 100 has a first side wall 121 and a second side wall 122 that are oppositely arranged, and a bottom wall 123 connected between the first side wall 121 and the second side wall 122. The first side wall 121 is provided with a first convex strip 131 along the height direction, the second side wall 122 is provided with a second convex strip 132 along the height direction, and the bottom wall 123 is provided with a third convex strip 133. The two ends of the third convex strip 133 are respectively connected to the bottom end of the first convex strip 131 and the bottom end of the second convex strip 132.

[0066] The first slot 111 is recessed on the first ridge 131 and extends along the height direction of the first ridge 131. The second slot 112 is recessed on the second ridge 132 and extends along the height direction of the second ridge 132. The third slot 113 is recessed on the third ridge 133. Both ends of the third slot 113 are respectively connected to the bottom end of the first slot 111 and the bottom end of the second slot 112.

[0067] In addition, the sealing strip 400 includes a first sealing strip 410, a second sealing strip 420 and a third sealing strip 430. The first sealing strip 410 is arranged in the first slot 111 and is located between the first slot 111 and one side of the partition 200. The second sealing strip 420 is arranged in the second slot 112 and is located between the second slot 112 and the other side of the partition 200. The third sealing strip 430 is arranged in the third slot 113 and is located between the third slot 113 and the bottom side of the partition 200.

[0068] In this way, the partition 200 can be sealed with the tank body 100 through the first sealing strip 410, the second sealing strip 420 and the third sealing strip 430, thereby improving the sealing effect between the partition 200 and the tank body 100, and further preventing the water in the upper trough 101 and the lower trough 102 from affecting each other, thereby improving the cleaning effect of the polished wafers in the lower trough 102. In addition, since the first slot 111 is recessed on the first convex strip 131, the second slot 112 is recessed on the second convex strip 132, and the third slot 113 is recessed on the third convex strip 133, the groove bottom thickness at the first slot 111, the second slot 112 and the third slot 113 is larger, which can make the structural strength higher and make it easier for the partition 200 to be inserted into the slot 110.

[0069] See also Figure 7 and Figure 8 In addition, in an optional embodiment of the present invention, the acoustic wave generator 300 is installed on the outer side of the bottom of the feed trough 102. Further, the acoustic wave generator 300 can be installed in the middle area of ​​the outer side of the bottom of the feed trough 102. By setting the installation position of the acoustic wave generator 300 in the feed trough 102, the cleaning effect of the acoustic wave generator 300 on the wafers in the feed trough 102 can be effectively improved.

[0070] In some optional embodiments, a mounting base 1021 is convexly provided on the outer side of the bottom of the feed chute 102, and the sound wave generator 300 is provided with a connecting seat 310, and the mounting base 1021 is detachably connected to the connecting seat 310. In this way, the sound wave generator 300 can be disassembled from the feed chute 102, which is convenient for replacement and maintenance of the sound wave generator 300.

[0071] In some optional embodiments, the wafer polisher water tank 10 may further include a connecting bolt 500 and a gasket 600. The mounting base 1021 is provided with a threaded hole 1022, and the connecting seat 310 is provided with a through hole 311. The connecting bolt 500 passes through the through hole 311 and is threadedly matched with the threaded hole 1022, and the gasket 600 is provided between the connecting seat 310 and the nut of the connecting bolt 500.

[0072] By passing the connecting bolt 500 through the through hole 311 and cooperating with the threaded hole 1022 , the mounting base 1021 and the connecting base 310 can be detachably connected, thereby facilitating the disassembly and assembly of the sound wave generator 300 .

[0073] In some optional embodiments, a receiving cavity is provided inside the mounting base 1021 , and the acoustic wave generator 300 is partially embedded in the receiving cavity and fits against the outer side of the bottom of the feed chute 102 .

[0074] In this way, the sound wave generator 300 can be partially embedded in the accommodating cavity during installation to play a certain role in limiting the position, and then the mounting base 1021 and the connecting base 310 are fixed together. After the sound wave generator 300 is installed, the mounting base 1021 can also play a certain role in limiting the periphery of the sound wave generator 300 to prevent the sound wave generator 300 from deflecting.

[0075] In summary, the wafer polishing machine water tank 10 and the wafer polishing machine provided by the embodiment of the utility model, the tank body 100 is divided into a parallel upper tank 101 and a lower tank 102 by a partition 200, wherein the upper tank 101 is used to store the wafers before polishing, and the lower tank 102 is used to store the wafers after polishing, so that it can avoid the wafers before and after polishing being placed in the same tank and causing impurities in the water to contaminate the polished wafers, thereby reducing the cleaning effect of the wafers after polishing. On the other hand, by installing an acoustic wave generator 300 to the lower tank 102, the acoustic wave generator 300 can emit ultrasonic waves or megasonic waves to the lower tank 102, thereby further improving the cleaning effect of the wafers in the lower tank 102, so as to facilitate the processing of the subsequent process steps of the wafers. In addition, since the partition 200 is a detachable connection, the upper tank 101 and the lower tank 102 can be separated by the partition 200 according to actual needs. In some application scenarios, the partition 200 can also be removed to obtain a larger tank body 100 to store more wafers, expanding the application scenario. Furthermore, the partition 200 is detachable, which also facilitates maintenance of the partition 200 .

[0076] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A water tank for a wafer polisher, characterized in that: include: Tank body (100); a partition (200), wherein the partition (200) is detachably connected to the inner wall of the trough body (100) and divides the trough body (100) into an upper trough (101) and a lower trough (102) arranged in parallel, wherein the upper trough (101) is connected to the lower trough (102), the upper trough (101) is used to store wafers before polishing, and the lower trough (102) is used to store wafers after polishing; and A sound wave generator (300) is installed on the feed chute (102) and is used to emit ultrasonic waves or megasonic waves to the feed chute (102).

2. The wafer polishing machine water tank according to claim 1, characterized in that: A slot (110) is provided in the middle area of ​​the inner wall of the trough body (100), and the partition plate (200) is plugged into and matched with the slot (110) to separate the trough body (100) into the upper material trough (101) and the lower material trough (102).

3. The wafer polishing machine water tank according to claim 2, characterized in that: Also includes a sealing strip (400); The sealing strip (400) is arranged in the slot (110), and the partition plate (200) is sealed with the slot body (100) via the sealing strip (400).

4. The wafer polishing machine water tank according to claim 3, characterized in that: The slot (110) comprises a first slot (111), a second slot (112) and a third slot (113); The trough body (100) comprises a first side wall (121) and a second side wall (122) which are arranged opposite to each other, and a bottom wall (123) connected between the first side wall (121) and the second side wall (122); the first slot (111) is recessed on the first side wall (121) and extends along the height direction of the first side wall (121); the second slot (112) is recessed on the second side wall (122) and extends along the height direction of the second side wall (122); the third slot (113) is recessed on the bottom wall (123); two ends of the third slot (113) are respectively connected to the bottom end of the first slot (111) and the bottom end of the second slot (112); The sealing strip (400) includes a first sealing strip (410), a second sealing strip (420) and a third sealing strip (430), wherein the first sealing strip (410) is arranged in the first slot (111) and is located between the first slot (111) and one side of the partition (200), the second sealing strip (420) is arranged in the second slot (112) and is located between the second slot (112) and the other side of the partition (200), and the third sealing strip (430) is arranged in the third slot (113) and is located between the third slot (113) and the bottom side of the partition (200).

5. The wafer polishing machine water tank according to claim 3, characterized in that: The slot (110) comprises a first slot (111), a second slot (112) and a third slot (113); The trough body (100) comprises a first side wall (121) and a second side wall (122) which are arranged opposite to each other, and a bottom wall (123) connected between the first side wall (121) and the second side wall (122); the first side wall (121) is provided with a first convex strip (131) protruding along the height direction; the second side wall (122) is provided with a second convex strip (132) protruding along the height direction; the bottom wall (123) is provided with a third convex strip (133) protruding; two ends of the third convex strip (133) are respectively connected to the bottom end of the first convex strip (131) and the bottom end of the second convex strip (132); The first slot (111) is recessed on the first convex strip (131) and extends along the height direction of the first convex strip (131); the second slot (112) is recessed on the second convex strip (132) and extends along the height direction of the second convex strip (132); the third slot (113) is recessed on the third convex strip (133); two ends of the third slot (113) are respectively connected to the bottom end of the first slot (111) and the bottom end of the second slot (112); The sealing strip (400) includes a first sealing strip (410), a second sealing strip (420) and a third sealing strip (430), wherein the first sealing strip (410) is arranged in the first slot (111) and is located between the first slot (111) and one side of the partition (200), the second sealing strip (420) is arranged in the second slot (112) and is located between the second slot (112) and the other side of the partition (200), and the third sealing strip (430) is arranged in the third slot (113) and is located between the third slot (113) and the bottom side of the partition (200).

6. The wafer polishing machine water tank according to claim 1, characterized in that: The sound wave generator (300) is installed on the outer side of the bottom of the feed chute (102).

7. The wafer polishing machine water tank according to claim 6, characterized in that: A mounting base (1021) is protrudingly provided on the outer side of the bottom of the feed chute (102), and the sound wave generator (300) is provided with a connecting seat (310), and the mounting base (1021) is detachably connected to the connecting seat (310).

8. The wafer polishing machine water tank according to claim 7, characterized in that: Also includes connecting bolts (500) and gaskets (600); The mounting base (1021) is provided with a threaded hole (1022), and the connecting base (310) is provided with a through hole (311); The connecting bolt (500) passes through the through hole (311) and is threadedly engaged with the threaded hole (1022), and the gasket (600) is arranged between the connecting seat (310) and the nut of the connecting bolt (500).

9. The wafer polishing machine water tank according to claim 7, characterized in that: The installation base (1021) is provided with an accommodating cavity inside; The sound wave generator (300) is partially embedded in the accommodating cavity and fits against the outer side of the bottom of the feed chute (102).

10. A wafer polishing machine, characterized in that: It comprises a polishing machine body and a wafer polishing machine water tank (10) as claimed in any one of claims 1 to 9, wherein the tank body (100) is arranged on the polishing machine body.

Images