Wafer double-sided grinding assembly and double-sided grinding machine

Abstract

According to the wafer double-face grinding assembly and the double-face grinding machine, a protective cover is connected to a lifting part, the protective cover can be driven by the lifting part to ascend and descend, and when an upper grinding disc is located at a suspended position, the protective cover is located above a lower grinding disc, so that a silicon carbide wafer to be machined is conveniently placed on the lower grinding disc; after placing is completed, the upper grinding disc is driven by the lifting piece to reach the working position, when the upper grinding disc is located at the working position, due to the fact that the protective cover surrounds the upper grinding disc and the lower grinding disc, when the upper grinding disc and the lower grinding disc rotate to grind and polish the silicon carbide wafer, the protective cover plays a role in protection, and the silicon carbide wafer can be ground and polished. Workers are effectively prevented from accidentally touching the running upper grinding disc and the running lower grinding disc, and the injury risk and potential safety hazards are reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a double-sided wafer grinding assembly and a double-sided grinding machine. Background Art

[0002] Silicon carbide (SiC), as an emerging third-generation semiconductor core material, has excellent properties such as wide bandgap, high critical breakdown electric field strength, high electron mobility, good radiation resistance and chemical stability. This makes it an important substrate wafer material with wide applications, showing good application prospects in the fields of aviation devices, new energy vehicles, rail transportation and household appliances.

[0003] Silicon carbide wafers need to be ground by a double-sided grinder, which can grind or polish both surfaces of the silicon carbide wafer at the same time in one operation to achieve very high flatness and parallelism requirements.

[0004] However, with current double-sided grinders, workers may be injured due to accidental contact of their body parts with the upper and lower grinding discs while they are working, posing a safety hazard. Utility Model Content

[0005] The purpose of the present application is to provide a wafer double-sided grinding assembly and a double-sided grinding machine, which can effectively prevent workers from accidentally touching the running upper grinding disc and lower grinding disc, thereby reducing the risk of injury and safety hazards.

[0006] The embodiments of the present application can be implemented as follows:

[0007] In a first aspect, the utility model provides a wafer double-side grinding assembly, comprising:

[0008] A lower grinding disc and an upper grinding disc arranged opposite to each other;

[0009] A lifting member connected to the upper grinding disc and used to drive the upper grinding disc to move up and down between a working position and a suspended high position;

[0010] A protective cover connected to the lifting member and capable of being lifted and lowered under the drive of the lifting member;

[0011] Wherein, when the upper grinding disc is located at the working position, the protective cover surrounds the upper grinding disc and the lower grinding disc; when the upper grinding disc is located at the suspended position, the protective cover is located above the lower grinding disc.

[0012] In an optional embodiment, the protective cover is connected to a dust suction pump via a connecting pipe.

[0013] In an optional embodiment, the protective cover is connected to a gas source via a gas pipe.

[0014] In an optional embodiment, the air supply pipe is connected to the side wall of the protective cover.

[0015] In an optional embodiment, the connecting pipe is connected to a side wall of the protective cover.

[0016] In an optional embodiment, the protective cover is used to rise and fall synchronously with the upper grinding disc.

[0017] In an optional embodiment, the protective cover is detachably connected to the lifting member.

[0018] In an optional embodiment, the shape of the protective cover is adapted to the shapes of the upper grinding disc and the lower grinding disc;

[0019] The protective cover comprises a plate portion and a side wall connected to the outer periphery of the plate portion, and the plate portion is connected to the lifting member.

[0020] In an optional embodiment, the lifting member is a cylinder.

[0021] In a second aspect, the utility model provides a double-sided grinding machine, comprising the double-sided wafer grinding assembly described in any one of the aforementioned embodiments.

[0022] Compared with the prior art, the beneficial effects of the embodiments of the present application include, for example:

[0023] A protective cover is connected to the lifting member. Since the protective cover can be raised and lowered under the drive of the lifting member, when the upper grinding disc is in a suspended position, the protective cover is located above the lower grinding disc, so that the silicon carbide wafer to be processed can be placed on the lower grinding disc. After placement, the upper grinding disc is driven to the working position by the lifting member. When the upper grinding disc is in the working position, since the protective cover surrounds the upper grinding disc and the lower grinding disc, when the upper grinding disc and the lower grinding disc rotate to grind and polish the silicon carbide wafer, the protective cover plays a protective role, effectively preventing staff from accidentally touching the running upper grinding disc and lower grinding disc, thereby reducing the risk of injury and safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 Schematic diagram of a double-sided grinding assembly according to an embodiment of the present application.

[0026] Icons: 10-lifting part; 20-upper grinding disc; 30-lower grinding disc; 40-protective cover; 41-plate; 42-side wall; 50-connecting pipe; 51-dust suction pump; 60-air pipe; 61-air source. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0030] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0031] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] Combine the following Figure 1 , some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0034] The embodiment of the present application discloses a double-sided grinding machine, which includes a frame and a wafer double-sided grinding assembly arranged on the frame. The wafer double-sided grinding assembly includes an upper grinding plate 20, a lower grinding plate 30, a lifting member 10 and a protective cover 40.

[0035] The lower grinding disc 30 and the upper grinding disc 20 are arranged opposite to each other. Of course, the upper grinding disc 20 is located above the lower grinding disc 30, and usually the upper grinding disc 20 and the lower grinding disc 30 rotate in opposite directions when working. For example, when the upper grinding disc 20 rotates clockwise (or counterclockwise), the lower grinding disc 30 rotates counterclockwise (or clockwise). In this way, after the silicon carbide wafer to be processed is placed on the lower grinding disc 30, the upper and lower surfaces of the silicon carbide wafer are ground by the upper grinding disc 20 and the lower grinding disc 30 respectively, thereby achieving the effect of simultaneous double-sided polishing.

[0036] The upper end of the lifting member 10 is connected to the frame, and the lower end is connected to the upper grinding disc 20, so that the upper grinding disc 20 is driven to rise and fall between the working position and the suspended position by the lifting member 10, so that when the upper grinding disc 20 is in the suspended position, the silicon carbide wafer to be processed can be placed on the lower grinding disc 30, and when the upper grinding disc 20 is in the working position, the upper and lower grinding discs 30 and the lower grinding disc 30 can both operate and rotate in opposite directions to each other, thereby grinding the silicon carbide wafer.

[0037] The protective cover 40 is connected to the lifting member 10 and cannot rotate relative to the frame, but can be raised and lowered under the drive of the lifting member 10 .

[0038] When the upper grinding disc 20 is located at the working position, the protective cover 40 surrounds the upper grinding disc 20 and the lower grinding disc 30 . When the upper grinding disc 20 is located at the suspended position, the protective cover 40 is located above the lower grinding disc 30 .

[0039] Based on the above, a protective cover 40 is connected to the lifting member 10. Since the protective cover 40 can be lifted and lowered under the drive of the lifting member 10, when the upper grinding disc 20 is in a suspended position, the protective cover 40 is located above the lower grinding disc 30, so that the silicon carbide wafer to be processed can be placed on the lower grinding disc 30. After the placement is completed, the upper grinding disc 20 is driven by the lifting member 10 to reach the working position. When the upper grinding disc 20 is in the working position, since the protective cover 40 surrounds the upper grinding disc 20 and the lower grinding disc 30, when the upper grinding disc 20 and the lower grinding disc 30 rotate to grind and polish the silicon carbide wafer, the protective cover 40 plays a protective role, effectively preventing the staff from accidentally touching the running upper grinding disc 20 and the lower grinding disc 30, thereby reducing the risk of injury and safety hazards.

[0040] Specifically, usually the upper grinding disc 20 and the lower grinding disc 30 are both circular, and the shape of the protective cover 40 is adapted to the shapes of the upper grinding disc 20 and the lower grinding disc 30 and is also circular.

[0041] The protective cover 40 includes a plate portion 41 and a side wall 42 vertically connected to the plate portion 41. The plate portion 41 is connected to the lifting member 10. Specifically, it is detachably mounted on the outside of the lifting member 10. For example, it can be screwed to a connecting ear provided on the lifting member 10 to facilitate the removal of the protective cover 40 for machine maintenance. The side wall 42 always surrounds the outer peripheral side of the upper grinding disc 20, and also surrounds the outer peripheral side of the lower grinding disc 30 when the upper grinding disc 20 is in the working position.

[0042] The protective cover 40 is used to be raised and lowered synchronously with the upper grinding disc 20. In addition, the protective cover 40 can also be raised and lowered independently, that is, the protective cover 40 can also be raised and lowered relative to the upper grinding disc 20 under the drive of the lifting member 10, so that the protective cover 40 can be raised to expose the upper grinding disc 20, which is convenient for the independent inspection of the upper grinding disc 20.

[0043] The lifting member 10 can be a cylinder, a hydraulic cylinder, an electric telescopic rod or other components, as long as it can carry the protective cover 40 and the upper grinding disc 20 for lifting.

[0044] In addition, the protective cover 40 is connected to the dust suction pump 51 through the connecting pipe 50, so that when the dust suction pump 51 is running, negative pressure can be generated in the protective cover 40 to suck away dust and the like generated during the grinding and polishing process.

[0045] The connecting pipe 50 is connected to the side wall 42 of the protective cover 40, so that the distance between the dust between the upper grinding disc 20 and the lower grinding disc 30 and the connecting pipe 50 is closer, and a better dust collection and removal effect is achieved.

[0046] Optionally, the protective cover 40 is connected to the air source 61 through the air pipe 60, so that the air source 61 can blow out high-pressure gas to lift the dust between the upper grinding disc 20 and the lower grinding disc 30, making it easier for the dust suction pump 51 to suck away the dust.

[0047] The air supply pipe 60 is connected to the side wall 42 of the protective cover 40, so that the high-pressure gas can have a smaller flow resistance between the upper grinding disc 20 and the lower grinding disc 30, thereby raising more dust and further improving the dust collection and removal effect.

[0048] In summary, the embodiment of the present application discloses a wafer double-sided grinding assembly and a double-sided grinding machine, in which a protective cover 40 is connected to the lifting member 10. Since the protective cover 40 can be lifted and lowered under the drive of the lifting member 10, when the upper grinding disc 20 is in a suspended high position, the protective cover 40 is located above the lower grinding disc 30, so that the silicon carbide wafer to be processed can be placed on the lower grinding disc 30. After the placement is completed, the upper grinding disc 20 is driven by the lifting member 10 to reach the working position. When the upper grinding disc 20 is in the working position, since the protective cover 40 surrounds the upper grinding disc 20 and the lower grinding disc 30, when the upper grinding disc 20 and the lower grinding disc 30 rotate to grind and polish the silicon carbide wafer, the protective cover 40 plays a protective role, effectively preventing the staff from accidentally touching the running upper grinding disc 20 and the lower grinding disc 30, thereby reducing the risk of injury and safety hazards.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer double-side grinding assembly, characterized in that: include: A lower grinding disc (30) and an upper grinding disc (20) arranged opposite to each other; A lifting member (10) connected to the upper grinding disc (20) and used for driving the upper grinding disc (20) to be lifted and lowered between a working position and a suspended high position; A protective cover (40) is connected to the lifting member (10) and can be lifted and lowered under the drive of the lifting member (10); Wherein, when the upper grinding disc (20) is located in the working position, the protective cover (40) surrounds the upper grinding disc (20) and the lower grinding disc (30); when the upper grinding disc (20) is located in the suspended position, the protective cover (40) is located above the lower grinding disc (30).

2. The wafer double-side grinding assembly according to claim 1, characterized in that: The protective cover (40) is connected to a dust suction pump (51) via a connecting pipe (50).

3. The wafer double-side grinding assembly according to claim 2, characterized in that: The protective cover (40) is connected to a gas source (61) via a gas supply pipe (60).

4. The wafer double-side grinding assembly according to claim 3, characterized in that: The air delivery pipe (60) is connected to the side wall (42) of the protective cover (40).

5. The wafer double-side grinding assembly according to claim 2, characterized in that: The connecting pipe (50) is connected to the side wall (42) of the protective cover (40).

6. The wafer double-side grinding assembly according to claim 1, characterized in that: The protective cover (40) is used to be raised and lowered synchronously with the upper grinding disc (20).

7. The wafer double-side grinding assembly according to claim 1, characterized in that: The protective cover (40) is detachably connected to the lifting member (10).

8. The wafer double-side grinding assembly according to claim 1, characterized in that: The shape of the protective cover (40) is adapted to the shapes of the upper grinding disc (20) and the lower grinding disc (30); The protective cover (40) comprises a plate portion (41) and a side wall (42) connected to the outer periphery of the plate portion (41); the plate portion (41) is connected to the lifting member (10).

9. The wafer double-side grinding assembly according to claim 1, characterized in that: The lifting member (10) is a cylinder.

10. A double-sided grinding machine, characterized in that: A double-sided wafer grinding assembly comprising any one of claims 1 to 9.

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