Drop point calibration device and wafer grinding device

Abstract

The utility model provides a drop point calibration device and a wafer grinding device, and the drop point calibration device is arranged at a base of a slurry conveying swing arm in the wafer grinding device and is used for calibrating a slurry drop point provided by the slurry conveying swing arm. The drop point calibration device comprises a substrate, a position scale strip arranged at the first end of the substrate, an adsorption structure arranged on the first side of the substrate and a plurality of calibration positioning holes, wherein the calibration positioning holes penetrate through the substrate; the position scale strip is used for contrasting the position of a serous fluid drop point; the adsorption structure is used for enabling the drop point calibration device to be movably arranged on the surface of the base. The calibration device capable of moving in a surrounding mode is arranged on the base of the slurry conveying swing arm, under the condition that a calibration initial value is set, calibration, checking and adjustment of the position of a drop point of grinding slurry can be achieved in a mode of rotating the calibration device, repeated setting and using of an existing drop point tool structure are not needed, calibration can be conveniently achieved, and the calibration efficiency is improved. The popularization value is realized.

Description

Technical Field

[0001] The utility model relates to the technical field related to wafer grinding, and in particular to a landing point calibration device and a wafer grinding device. Background Art

[0002] During the wafer grinding process, the grinding liquid needs to be dripped onto the designated area of ​​the grinding disc, and cooperates with the grinding pad, grinding head, dresser and other components to achieve chemical mechanical grinding of the wafer to be processed. Figure 1a A schematic diagram of the structure of a wafer grinding device is shown. Figure 1b A side view of a base of a slurry transfer swing arm in a wafer polishing apparatus is shown, Figure 1a and Figure 1b As shown, the wafer grinding device includes a grinding disc 002, a lifting retaining ring 003 surrounding the edge of the grinding disc, a polishing head (not shown in the figure), and a slurry delivery swing arm 001 for providing grinding liquid to a preset area of ​​the grinding disc 002, wherein the slurry delivery swing arm 001 includes a swing arm 001b with a slurry nozzle and a base 001a; a surface of the base 001a of the slurry delivery swing arm is provided with a plurality of locking screw holes 001c, and precise control of the slurry landing point can be achieved by locking screws in the plurality of locking screw holes 001c.

[0003] During the process of calibrating the slurry drop point, firstly, the first end of the drop point fixture 004 is inserted into the gap between the grinding disc 002 and the lifting retaining ring 003, and the drop point fixture 004 is rotated so that the first end thereof is close to the grinding disc 002; during adjustment, firstly, the screw in the locking screw hole 001c of the base 001a is loosened, and a small liquid flow rate, such as 100 ml / min, is given to the slurry nozzle, and then the drop point position of the slurry on the drop point fixture 004 is checked, and after the slurry drop point is moved to the preset designated area by rotating the swing arm 001b, the screw is locked in the locking screw hole 001c; during verification, the drop point fixture 004 needs to be transferred to the bottom of the swing arm 001b, and a small liquid flow rate, such as 100 ml / min, is given to the slurry nozzle, and then the current drop point position of the slurry on the drop point fixture 004 is checked, and at the same time, it is determined whether the current drop point position is the same as the historical drop point position of the previous verification, and if different, it indicates that the wafer grinding device needs to be recalibrated.

[0004] It is understandable that in the process of using the landing point fixture 004 to calibrate and verify the landing of the slurry, it is necessary to frequently insert one end of the landing point fixture 004 into the gap between the lifting retaining ring 003 and the grinding disc 002. Since the gap between the lifting retaining ring 003 and the grinding disc 002 is small, during the insertion and removal process, it is often necessary for personnel to manually pull the lifting retaining ring 003 outwards to achieve this. Frequent insertion and removal of the landing point fixture 004 is not only easy to damage the lifting retaining ring 003 and the grinding disc 002, but also reduces the convenience of calibrating, checking and adjusting the landing point position of the grinding slurry, and there are difficulties in inconvenience in implementation. Utility Model Content

[0005] In view of the problems in the prior art, the purpose of the present utility model is to provide a landing point calibration device and a wafer grinding device. By providing a circumferentially movable calibration device at the base of the slurry conveying swing arm, the calibration, verification and adjustment of the landing point position of the grinding slurry can be more conveniently achieved.

[0006] Specifically, the first aspect of the utility model provides a landing point calibration device, which is arranged at the base of a slurry delivery swing arm in a wafer grinding device, and is used to calibrate the slurry landing point provided by the slurry delivery swing arm;

[0007] The landing point calibration device includes a substrate, a position scale bar arranged at a first end of the substrate, an adsorption structure arranged at a first side of the substrate, and a plurality of calibration positioning holes, wherein the calibration positioning holes penetrate the substrate;

[0008] The position scale bar is used to compare the position of the slurry landing point;

[0009] The adsorption structure is used to enable the landing point calibration device to be movably arranged on the surface of the base.

[0010] In a possible implementation of the first aspect above, the base of the slurry conveying swing arm is cylindrical;

[0011] The base plate is in the form of an arc surface that fits the cylindrical side surface, and can be movably fitted to the side surface of the base through an adsorption structure.

[0012] In a possible implementation of the first aspect above, the base of the slurry conveying swing arm is made of ferromagnetic material;

[0013] The adsorption structure comprises a plurality of magnets embedded on one side of the substrate close to the base.

[0014] In a possible implementation of the first aspect, a plurality of locking screw holes are provided on the base surface of the slurry conveying swing arm, and the slurry landing point is fixed by tightening screws in the locking screw holes;

[0015] When the landing point calibration device is movably arranged on the surface of the base, the position of the calibration positioning hole coincides with the positions of several adjacent locking screw holes.

[0016] In a possible implementation of the first aspect above, the number of the calibration positioning holes is 3.

[0017] In a possible implementation of the first aspect, the landing point calibration device further includes a landing point reference mark, the landing point reference mark including an arrow portion aligned with the position scale bar and movable along an extension direction of the position scale bar;

[0018] The landing point reference mark is arranged on the surface of the base.

[0019] In a possible implementation of the first aspect above, the landing point reference mark includes a positioning fixture, which is used to limit the movement of the arrow portion in the extension direction of the position scale bar.

[0020] The second aspect of the utility model provides a wafer grinding device, characterized in that it comprises a grinding disc, a lifting retaining ring surrounding the edge of the grinding disc, a polishing head, a slurry delivery swing arm for providing grinding liquid to a preset area of ​​the grinding disc, and the landing point calibration device provided in the first aspect above;

[0021] The drop point calibration device is used to calibrate the slurry conveying swing arm so that the slurry drop point provided by the slurry conveying swing arm is located in a preset area.

[0022] In a possible implementation of the second aspect, the slurry delivery swing arm includes a swing arm with a slurry nozzle and a base, and the swing arm can rotate around the base to adjust the position of the slurry landing point;

[0023] The base surface of the slurry conveying swing arm is provided with a plurality of locking screw holes, and the relative positions of the swing arm and the base are fixed by locking screws in the plurality of locking screw holes.

[0024] In a possible implementation of the second aspect, a landing point tool is further included, the landing point tool is close to the outer edge of the grinding disc and corresponds to the position of the slurry nozzle of the slurry delivery swing arm, and is used to obtain the precise position of the slurry landing point relative to the landing point tool;

[0025] The scale positions in the position scale bar correspond one-to-one to the precise positions.

[0026] Compared with the prior art, the utility model has the following beneficial effects:

[0027] The technical solution provided by the utility model is to set a circumferentially movable calibration device at the base of the slurry conveying swing arm. When the initial calibration value is set, the landing point position of the grinding slurry can be calibrated, checked and adjusted by rotating the calibration device. There is no need to repeatedly set up and use the existing landing point tooling structure, which can be conveniently achieved and has popularizable value. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Other features, objectives and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings.

[0029] Figure 1a According to the prior art, a schematic structural diagram of a wafer grinding device is provided.

[0030] Figure 1b According to the prior art, a side view of a base of a slurry transfer swing arm in a wafer grinding apparatus is provided.

[0031] Figure 2a to Figure 2c According to an embodiment of the utility model, a schematic diagram of the structure of a landing point calibration device in a main viewing direction, a side viewing direction and a top viewing direction is provided respectively.

[0032] Figure 3 According to an embodiment of the utility model, a schematic diagram of a landing point calibration device being arranged on a base of a slurry conveying swing arm is provided. DETAILED DESCRIPTION

[0033] The following describes the implementation of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed by the present invention. The present invention can also be implemented or applied through other different specific implementations, and the details in the present invention can also be modified or changed according to different viewpoints and application systems without departing from the spirit of the present invention. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0034] The following is a detailed description of the embodiments of the present invention with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be embodied in a variety of different forms and is not limited to the embodiments described herein.

[0035] In the description of the present invention, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. Moreover, the specific features, structures, materials or characteristics represented may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples represented in the present invention and the features of different embodiments or examples, unless they are contradictory.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the representation of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In order to clearly describe the present invention, components irrelevant to the description are omitted, and the same or similar components throughout the specification are given the same reference symbols.

[0038] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a device is said to "include" a certain component, unless otherwise stated, it does not exclude other components, but means that other components may be included.

[0039] When a device is said to be "on" another device, it may be directly on the other device, but there may also be other devices between it. In contrast, when a device is said to be "directly" on another device, there are no other devices between it.

[0040] Although the terms first, second, etc. are used to represent various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface, etc. are represented. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate the existence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0041] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present invention. The singular form used herein also includes the plural form as long as the sentence does not clearly indicate the opposite meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.

[0042] Although not defined differently, all terms, including technical and scientific terms used herein, have the same meaning as those generally understood by those skilled in the art to which the present invention belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with the content of relevant technical literature and current prompts, and as long as they are not defined, they shall not be overly interpreted as ideal or very formal meanings.

[0043] Based on the background technology, Figure 1a and Figure 1b It can be understood from the relevant description that in the process of using the landing fixture 004 to calibrate and verify the landing of the slurry, it is necessary to frequently insert one end of the landing fixture 004 into the gap between the lifting retaining ring 003 and the grinding disc 002, which causes the inconvenience of frequent insertion and removal, easy damage to the structure of the wafer grinding device, and difficulty in implementing calibration and verification. In order to overcome the above problems, the utility model provides a landing point calibration device and a wafer grinding device. Specifically, Figure 2a to Figure 2c According to the embodiment of the utility model, schematic diagrams of the structure of a landing point calibration device in the main viewing direction, the side viewing direction and the top viewing direction are shown respectively. Figure 2a to Figure 2cIt can be seen that the landing point calibration device can specifically include a substrate 100, a position scale bar 200 arranged at the first end of the substrate, an adsorption structure 300 arranged on the first side of the substrate, and a plurality of calibration positioning holes 400, and the calibration positioning holes 400 pass through the substrate 100.

[0044] In the specific application process, such as Figure 2a to Figure 2c The drop point calibration device shown is used for Figure 1a The base 001a of the slurry delivery swing arm in the wafer grinding device shown is used to calibrate the slurry drop point provided by the slurry delivery swing arm 001; specifically, Figure 3 A schematic diagram showing a drop point calibration device arranged on the base 001a of the slurry conveying swing arm is shown, combined with Figures 2a to 3 It can be understood that the position scale bar 200 is used to compare and characterize the corresponding position of the slurry landing point; the adsorption structure 300 is used to enable the landing point calibration device to be movably arranged on the surface of the base 001a. The specific structural setting of the landing point calibration device will be further described in detail in conjunction with specific embodiments below:

[0045] In the above embodiment, if Figure 1a As shown, the base 001a of the slurry conveying swing arm is cylindrical; adaptable, such as Figure 2c As shown, the substrate 100 is an arc surface that fits the cylindrical side surface, and can be movably fitted to the side surface of the base 001a through the adsorption structure 300. Further, the base 001a of the slurry conveying swing arm can be made of ferromagnetic material; adaptively, the adsorption structure 300 can be configured to include a plurality of magnets embedded in the side of the substrate 100 close to the base 001a. Figure 3 As shown, the adsorption structure 300 includes three embedded magnets, and the embedded magnets are evenly arranged in the horizontal direction, so that the landing point calibration device can be adsorbed on the side surface of the base 001a and can rotate around the side surface of the base 001a.

[0046] In the above embodiment, if Figure 1a Right now Figure 1b As shown, it can be seen that a plurality of locking screw holes 001c are provided on the surface of the base 001a of the slurry conveying swing arm, and the slurry landing position can be controlled by locking the screws in the locking screw holes 001c. Correspondingly, in a case where the landing point calibration device is movably provided on the surface of the base 001a, the position of the calibration positioning hole 400 coincides with the positions of a plurality of adjacent locking screw holes 001c. It can be understood that the landing point of the slurry can be controlled by locking the screws in the locking screw holes 001c. The adjacent spacing of the calibration positioning holes 400 provided in the landing point calibration device is the same as the spacing of the locking screw holes 001c, and can guide the user to select the locking screw hole 001c corresponding to the calibration positioning hole 400 to perform the locking screw operation during the calibration and positioning process. Figure 3 As shown in the figure, in an alternative specific implementation, the number of calibration positioning holes can be configured to be 3, which is not limited here.

[0047] In the above embodiment, the landing point calibration device provided by the present invention also includes a landing point reference mark 500, such as Figure 3 As shown, the drop point reference mark 500 includes an arrow portion 501 that is aligned with the position scale bar 200 and can move along the extension direction of the position scale bar 200; the drop point reference mark 500 and the drop point calibration device are also arranged on the surface of the base 001a of the slurry conveying swing arm. It can be understood that the position scale 200 in the drop point calibration device is used to characterize the corresponding position of the slurry drop point. The drop point reference mark 500 can realize the marking of the standard drop point position on the position scale 200, and the standard drop point mark corresponding to the position scale 200 is given. The determination of the initial calibration position of the position scale 200 and the drop point reference mark 500 will be specifically described later, and will not be repeated here.

[0048] In the above embodiment, further, the landing point reference mark 500 may also include a positioning fixture 502, and the positioning fixture 502 is used to limit the movement of the arrow portion 501 in the extension direction of the position scale bar 200. It can be understood that the arrow portion 501 on the landing point reference mark 500 can be movably set on the side surface of the base 001a, and can reciprocate along the extension direction of the position scale bar 200. After the initial calibration position is determined, it is necessary to fix the position of the arrow portion 501 relative to the base 001a. In the subsequent calibration and adjustment process, the position of the arrow portion 501 can be used as a reference standard position, so the positioning fixture 502 is required to limit the movement of the arrow portion 501. In an optional implementation, the positioning fixture 502 includes two positioning screws, and the relative position of the arrow portion 501 and the base 001a is fixed and does not move by locking the positioning screws, so as to determine the precise initial calibration position.

[0049] In other embodiments of the utility model, the assembly between the drop point calibration device and the base 001a of the slurry conveying swing arm is not limited to being realized by the adsorption structure 300. In a replaceable specific implementation, the base 001a of the slurry conveying swing arm can be modified, and the position scale bar 200 can be directly fixed on the surface of the base 001a by engraving or the like, which can also realize the function of the drop point calibration device provided in the aforementioned embodiment, which is not limited here.

[0050] In some embodiments of the present invention, a wafer grinding device is further provided. Based on the above embodiments and the related descriptions in the background technology section, it can be understood that, Figures 1a to 3As shown, the wafer grinding device includes a grinding disc 002, a lifting retaining ring 003 surrounding the edge of the grinding disc, a polishing head (not shown in the figure), a slurry delivery swing arm 001 that provides grinding liquid to a preset area of ​​the grinding disc 002, and a landing point calibration device provided in the aforementioned embodiment. The landing point calibration device is used to calibrate the slurry delivery swing arm 001 so that the slurry landing point provided by the slurry delivery swing arm 001 is located in the preset area. The following will further explain and illustrate the specific use of the wafer grinding device in terms of initial calibration of the wafer grinding device, slurry landing point verification, and landing point position adjustment:

[0051] In a specific implementation of the above embodiment, it also includes the following Figure 1a The drop point fixture 004 shown. During the initial calibration process, the drop point fixture 004 is set close to the outer edge of the grinding disc 002 and corresponds to the position of the slurry delivery swing arm 001. By default, the slurry delivery swing arm 001 is in a preset standard position during the initial calibration process, and the slurry drop point provided by the slurry nozzle is located in a preset established position. At this time, a small liquid flow rate, such as 100 ml / min, is given to the slurry nozzle. Observe and record the precise position of the slurry drop point relative to the drop point fixture. Then the precise position of the slurry drop point in the drop point fixture 004 is converted into a specific scale position on the position scale bar 200. Afterwards, by adjusting the left and right positions of the arrow portion 501 in the drop point control mark 500, the arrow portion 501 is aligned with the specific scale position corresponding to the precise position, and then the arrow portion 501 is fixed relative to the base by a positioning fixture 502, such as a fixing screw, so as to achieve the standard position mark for the slurry delivery swing arm 001. During subsequent use, the position of the arrow portion 501 relative to the base 001a remains unchanged, and the subsequent slurry landing point can be verified and calibrated by moving the landing point calibration device on the side surface of the base 001a.

[0052] In a specific implementation of the above embodiment, it can be understood based on the relevant description of the above embodiment that, Figure 1a to Figure 1b As shown, the slurry delivery swing arm 001 of the wafer grinding device includes a swing arm 001b with a slurry nozzle and a base 001a; the surface of the base 001a of the slurry delivery swing arm is provided with a plurality of locking screw holes 001c, and the precise control of the slurry landing point can be achieved by locking screws in the plurality of locking screw holes 001c. It is understandable that in the process of checking the slurry landing point, such as Figure 3As shown, the landing point calibration device provided in the aforementioned embodiment is adsorbed on the base 001a of the slurry conveying swing arm in the current state, and the calibration positioning hole 400 in the landing point calibration device corresponds to three consecutive adjacent locking screw holes 001c. At this time, observe whether the specific scale position pointed to by the arrow part 501 in the landing point reference mark 500 is offset from the specific scale position corresponding to the initial calibration. If no offset occurs, it means that the landing point position is checked correctly, and the position calibration of the slurry conveying swing arm 001 meets the requirements; if offset occurs, the slurry conveying swing arm 001 needs to be re-calibrated.

[0053] In a specific implementation of the above embodiment, during the process of adjusting the slurry landing position, if it is necessary to calibrate the rotation position of the slurry conveying swing arm 001, the landing point calibration device provided by the above embodiment can also be used: the landing point calibration device provided by the above embodiment is adsorbed on the base 001a of the slurry conveying swing arm in the current state, and the arrow portion 501 in the landing point reference mark 500 points to the specific scale position in the position scale bar 200 corresponding to the initial calibration. At this time, the calibration positioning hole 400 corresponds to three consecutive adjacent locking screw holes 001c on the side of the base. The three locking screw holes 001c are fixed by locking screws to achieve the position offset calibration of the slurry conveying swing arm 001.

[0054] To sum up, the technical solution provided by the utility model is to set a rotatable calibration device at the base of the slurry conveying swing arm. When the initial calibration value is set, the landing point position of the grinding slurry can be calibrated, checked and adjusted by rotating the calibration device. There is no need to repeatedly set up and use the existing landing point tooling structure, which can be easily achieved and has popularizable value.

[0055] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A landing point calibration device, characterized in that: It is arranged at the base of the slurry delivery swing arm in the wafer grinding device and is used to calibrate the slurry landing point provided by the slurry delivery swing arm; The landing point calibration device comprises a substrate, a position scale bar arranged at a first end of the substrate, an adsorption structure arranged at a first side of the substrate, and a plurality of calibration positioning holes, wherein the calibration positioning holes penetrate the substrate; The position scale bar is used to compare the position of the slurry landing point; The adsorption structure is used to enable the landing point calibration device to be movably arranged on the surface of the base.

2. The landing point calibration device according to claim 1, characterized in that: The base of the slurry conveying swing arm is cylindrical; The substrate is in the form of an arc surface that fits the cylindrical side surface, and can be movably fitted to the side surface of the base through the adsorption structure.

3. The landing point calibration device according to claim 1, characterized in that: The base of the slurry conveying swing arm is made of ferromagnetic material; The adsorption structure includes a plurality of magnets embedded in a side of the substrate close to the base.

4. The landing point calibration device according to claim 1, characterized in that: The base surface of the slurry conveying swing arm is provided with a plurality of locking screw holes, and the slurry landing point position is fixed by locking screws in the locking screw holes; In the case where the landing point calibration device is movably arranged on the surface of the base, the position of the calibration positioning hole coincides with the positions of several adjacent locking screw holes.

5. The landing point calibration device according to claim 4, characterized in that: The number of the calibration positioning holes is 3.

6. The landing point calibration device according to claim 1, characterized in that: The landing point calibration device also includes a landing point reference mark, and the landing point reference mark includes an arrow portion aligned with the position scale bar and movable along the extension direction of the position scale bar; The landing point reference mark is arranged on the surface of the base.

7. The landing point calibration device according to claim 6, characterized in that: The landing point reference mark includes a positioning fixture, and the positioning fixture is used to limit the movement of the arrow portion in the extension direction of the position scale bar.

8. A wafer grinding device, characterized in that: It comprises a grinding disc, a lifting retaining ring surrounding the edge of the grinding disc, a polishing head, a slurry delivery swing arm for providing grinding liquid to a preset area of ​​the grinding disc, and a landing point calibration device as claimed in any one of claims 1 to 7; The drop point calibration device is used to calibrate the slurry conveying swing arm so that the slurry drop point provided by the slurry conveying swing arm is located in the preset area.

9. The wafer grinding device according to claim 8, wherein: The slurry conveying swing arm comprises a swing arm with a slurry nozzle and a base, and the swing arm can rotate around the base to adjust the position of the slurry landing point; The base surface of the slurry conveying swing arm is provided with a plurality of locking screw holes, and the relative position of the swing arm and the base is fixed by locking screws in the plurality of locking screw holes.

10. The wafer grinding device according to claim 8, wherein: It also includes a landing point tool, which is close to the outer edge of the grinding disc and corresponds to the position of the slurry nozzle of the slurry delivery swing arm, and is used to obtain the precise position of the slurry landing point relative to the landing point tool; The scale positions in the position scale bar correspond one-to-one to the precise positions.

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