Adjustable silicon wafer tool

Abstract

The utility model relates to an adjustable silicon wafer tool, which comprises at least two vertical plates, a bottom supporting rod and a supporting block, the two vertical plates are connected through at least two parallel cross rods, and the vertical plates below the cross rods are provided with first waist-shaped holes; at least two bottom supporting rods are horizontally arranged, the bottom supporting rods are connected with the two vertical plates through the first kidney-shaped holes, and the two supporting rods move along the first kidney-shaped holes to adjust the distance; and the supporting block is arranged above the cross rod. According to the utility model, the height of the top plate for fixing the silicon wafer can be adjusted by adjusting the height of the supporting block so as to adapt to silicon wafers with different height sizes. The distance between the two bottom supporting rods can be adjusted by adjusting the positions of the bottom supporting rods along the first kidney-shaped holes so as to adapt to silicon wafers with different width sizes. And the supporting blocks and the bottom supporting rods are matched with each other so as to fix silicon wafers with different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to an adjustable silicon wafer tooling. Background Art

[0002] In the silicon wafer cutting process, the resin plate must first be bonded to the top plate, and then one side of the silicon rod must be bonded to the resin plate. The silicon rod is then fixed in the slicer cabin through the top plate and cut. The silicon wafers formed by cutting are closely arranged together and remain bonded to the adhesive plate. The top plate and the bonded silicon wafers are then fixed by the silicon wafer fixture to debond, so that the adhesive plate and the silicon wafer are separated.

[0003] After separation, the silicon wafer falls into the silicon wafer jig. In order to safely and stably handle the silicon wafer that falls into the silicon wafer jig, the size of the jig must fit the shape of the silicon wafer. This results in poor versatility of the silicon wafer jig. When debonding silicon wafers of different sizes, different silicon wafer jigs need to be replaced, which increases the debonding cost and reduces the debonding efficiency. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide an adjustable silicon wafer tooling to increase the versatility of the silicon wafer tooling.

[0005] To achieve the above purpose, the technical solution of the utility model is as follows:

[0006] An adjustable silicon wafer tooling comprises a vertical plate, a bottom support rod and a support block, wherein at least two vertical plates are provided, and the two vertical plates are connected by at least two parallel cross rods, and a first waist-shaped hole is provided on the vertical plate below the cross rod; at least two bottom support rods are horizontally provided, and the bottom support rods connect the two vertical plates through the first waist-shaped holes, and the two support rods move along the first waist-shaped holes to adjust the spacing; the support block is provided above the cross rod.

[0007] Compared with the prior art, the beneficial technical effects of the utility model are as follows:

[0008] (1) The adjustable silicon wafer fixture of the utility model has a support block on the crossbar. By adjusting the height of the support block, the height of the top plate for fixing the silicon wafer can be adjusted to accommodate silicon wafers of different heights. The bottom support rod is connected to the vertical plate through a first waist-shaped hole. By adjusting the position of the bottom support rod along the first waist-shaped hole, the spacing between the two bottom support rods can be adjusted to accommodate silicon wafers of different widths. The support block and the bottom support rod cooperate with each other to fix silicon wafers of different sizes.

[0009] (2) Furthermore, a first adjustment block is provided on the vertical plate, and the first adjustment block is connected to the bottom support rod through a connecting rod. When the position of the first adjustment block is adjusted along the vertical plate, the first adjustment block moves along the vertical plate, and the bottom support rod is driven to move along the first waist-shaped hole through the connecting rod, thereby adjusting the horizontal position of the bottom support rod to support silicon wafers of different widths. The adjustment is simple and convenient, and the adjustment time is reduced.

[0010] (3) Furthermore, a side support rod is provided, which supports the vertical side of the silicon wafer to prevent the silicon wafer from sliding off the bottom support rod. The side support rod is adjusted by a second adjustment block. By adjusting the position of the second adjustment block along the vertical plate, the horizontal position of the side support rod can be adjusted to accommodate silicon wafers of different widths. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A schematic diagram of the three-dimensional structure of an adjustable silicon wafer tooling, a top plate and a silicon wafer provided in an embodiment of the utility model is shown.

[0012] Markings in the accompanying drawings:

[0013] 1. Vertical plate; 11. Adjustment hole; 12. First waist-shaped hole; 13. Fourth waist-shaped hole; 2. Cross bar; 3. Bottom support rod; 4. First adjustment block; 41. Connecting rod; 5. Side support rod; 6. Second adjustment block; 61. Adjustment plate; 62. Tooth-shaped portion; 63. Second waist-shaped hole; 64. Rack; 65. Third waist-shaped hole; 7. Support block; 71. Connection hole; 8. Top plate; 81. Lifting rod; 9. Silicon wafer. DETAILED DESCRIPTION

[0014] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the attached drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the attached drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and purpose that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model.

[0015] In the description of the present invention, the orientations or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0016] Figure 1 The schematic diagram of the three-dimensional structure of the adjustable silicon wafer tooling, top plate and silicon wafer provided by the embodiment of the utility model is shown. Figure 1 , an adjustable silicon wafer tooling, including a vertical plate 1, a bottom support rod 3 and a support block 7, at least two vertical plates 1 are provided, the two vertical plates 1 are connected by at least two parallel cross bars 2, and a first waist-shaped hole 12 is provided on the vertical plate 1 below the cross bar 2. The first waist-shaped hole 12 can be provided horizontally or tilted, and the bottom support rod 3 moves along the first waist-shaped hole 12 to change the horizontal position. At least two bottom support rods 3 are provided horizontally, and the bottom support rods 3 connect the two vertical plates 1 through the first waist-shaped hole 12, and the two support rods move along the first waist-shaped hole 12 to adjust the spacing. The support block 7 is provided above the cross bar 2, and a V-shaped groove (not marked in the figure) is provided on the upper surface of the support block 7. Specifically, the lifting rod 81 of the top plate 8 is inserted into the V-shaped groove of the support block 7, and the cross bar 2 supports the top plate 8 through the support block 7. At this time, the silicon wafer 9 fixed below the top plate 8, and the lower end of the silicon wafer 9 is against the bottom support rod 3. The height of the top plate 8 for fixing the silicon wafer 9 is adjusted to accommodate silicon wafers 9 of different heights. The position of the bottom support rod 3 is adjusted along the first waist-shaped hole 12, and the spacing between the two bottom support rods 3 can be adjusted to accommodate silicon wafers 9 of different widths. The support block 7 and the bottom support rod 3 cooperate with each other to fix silicon wafers 9 of different sizes.

[0017] Among them, the cross bar 2 is welded and connected to the vertical plate 1. The bottom support rod 3 and the side support rod 5 can be limited on the vertical plate 1 by various plate-rod connection methods known in the prior art to prevent the bottom support rod 3 and the side support rod 5 from sliding along their length direction. Preferably, the diameters of both ends of the cross bar 2, the bottom support rod 3 and the side support rod 5 are reduced and provided with threads, and the steps (not shown in the figure) at the reduced diameters are against the bottom plate, and nuts (not shown in the figure) are screwed in from the threads at both ends at the same time, and the nuts and steps cooperate to fix the cross bar 2, the bottom support rod 3 and the side support rod 5 on the vertical plate 1 to prevent the bottom support rod 3 and the side support rod 5 from sliding along their length direction.

[0018] The specific structures of the first adjustment block 4, the side support rod 5 and the support block 7 are described below:

[0019] The vertical plate 1 is provided with a first adjustment block 4, which is connected to the bottom support rod 3 through a connecting rod 41. When the position of the first adjustment block 4 is adjusted along the vertical plate 1, the first adjustment block 4 moves along the vertical plate 1, and at the same time, the bottom support rod 3 is driven to move along the first waist-shaped hole 12 through the connecting rod 41, thereby adjusting the horizontal position of the bottom support rod 3 to support silicon wafers 9 of different widths. The adjustment is simple and convenient, and the adjustment time is reduced.

[0020] The side support rod 5 passes through the second waist-shaped hole 63 and extends from the vertical plate 1. The part of the side support rod 5 extending from the vertical plate 1 acts as a handle, and the lifting device (not shown in the figure) lifts the entire tooling through the handle to avoid interference between the lifting device and the silicon wafer 9 in the tooling, thereby damaging the silicon wafer 9.

[0021] At least two connection holes 71 are provided on the support block 7 in the up-down direction, and the support block 7 is connected to the cross bar 2 through the connection holes 71. The connection holes 71 can be ordinary holes or threaded holes. When the connection holes 71 are ordinary holes, the support block 7 and the cross bar 2 are connected by a pin. When the connection holes 71 are threaded holes, the support block 7 and the cross bar 2 are threadedly connected.

[0022] The specific structure of the second adjustment block 6 is described below:

[0023] A second waist-shaped hole 63 is provided on the vertical plate 1, and a side support rod 5 is provided between adjacent vertical plates 1 through the second waist-shaped hole 63. The second waist-shaped hole 63 can be provided horizontally or tilted, and the side support rod 5 can adjust the horizontal position along the second waist-shaped hole 63. Preferably, two side support rods 5 are provided horizontally, and the two side support rods 5 can respectively support the two sides of the silicon wafer 9 to increase the stability of the silicon wafer 9.

[0024] The vertical plate 1 is provided with an adjustment plate 61, a toothed portion 62 is provided on the adjustment plate 61, a rack 64 is provided on the vertical plate 1 to mesh with the toothed portion 62, and a second waist-shaped hole 63 is provided on the adjustment plate 61. By utilizing the cooperation between the toothed portion 62 and the rack 64, the relative position of the vertical plate 1 and the adjustment plate 61 can be accurately adjusted, thereby adjusting the position of the second waist-shaped hole 63 on the adjustment plate 61, thereby changing the horizontal adjustment range of the side support rod 5, and increasing the practicality of the tooling.

[0025] The vertical plate 1 is provided with a second adjustment block 6, and a third waist-shaped hole 65 is opened on the second adjustment block 6. The side support rod 5 connected to the vertical plate 1 passes through the third waist-shaped hole 65. The side support rod 5 passes through the second waist-shaped hole 63 and the third waist-shaped hole 65 at the same time, and the position of the second adjustment block 6 is adjusted, that is, the side support rod 5 is controlled to move along the second waist-shaped hole 63, and the horizontal position of the side support rod 5 is changed.

[0026] The specific structure of the vertical plate 1 is described below:

[0027] The vertical plate 1 is provided with a fourth waist-shaped hole 13, and the adjustment plate 61 is connected to the vertical plate 1 through the fourth waist-shaped hole 13. Bolts and nuts (not shown in the figure) pass through the fourth waist-shaped hole 13 to fix the positions of the adjustment plate 61 and the vertical plate 1. The fourth waist-shaped hole 13 facilitates the adjustment of the relative positions of the adjustment plate 61 and the vertical plate 1, and cooperates with the toothed portion 62 and the rack 64 to quickly adjust the position of the adjustment plate 61, thereby adjusting the position of the second waist-shaped hole 63, and changing the horizontal adjustment range of the side support rod 5.

[0028] Several adjustment holes 11 are arranged on the vertical plate 1 in the vertical direction. The first adjustment block 4 and the second adjustment block 4 are connected to the adjustment holes 11 at different positions by bolts and nuts to change their positions relative to the vertical plate 1, thereby changing the positions of the bottom support rod 3 and the side support rod 5 to adapt to silicon wafers 9 of different sizes.

[0029] The specific working process of the utility model is as follows:

[0030] When replacing silicon wafers 9 of different sizes, loosen the nuts at both ends of the bottom support rod 3, and loosen the bolts and nuts that fix the first adjustment block 4. Adjust the position of the first adjustment block 4 up and down. During the movement of the first adjustment block 4, the bottom support rod 3 moves along the first waist-shaped hole 12, and the spacing between the two bottom support rods 3 changes. Adjust the spacing between the two bottom support rods 3 to adapt to the width of the silicon wafer 9. Tighten the bolts and nuts that fix the first adjustment block 4, and tighten the nuts at both ends of the bottom support rod 3. Then, loosen the nuts at both ends of the side support rod 5, and loosen the bolts and nuts that fix the second adjustment block 6. Adjust the position of the second adjustment block 6 up and down. During the movement of the second adjustment block 6, the side support rod 5 moves along the second waist-shaped hole 63 and the third waist-shaped hole 65, and the horizontal position of the side support rod 5 changes. Adjust the horizontal position of the side support rod 5 to adapt to the width of the silicon wafer 9. Tighten the bolts and nuts that fix the second adjustment block 6, and tighten the nuts at both ends of the side support rod 5. Finally, pull out the pin inserted into the connection hole 71 and the crossbar 2, adjust the support block to a suitable height, and then insert the pin into the connection hole 71 and the crossbar 2 of the support block 7. The adjustment of the tooling is completed.

[0031] It can be seen that the above-mentioned adjustable silicon wafer fixture, the support block 7, the bottom support rod 3 and the side support rod 5 cooperate with each other to fix silicon wafers 9 of different sizes.

[0032] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An adjustable silicon wafer tooling, characterized in that: Including vertical plate, bottom support rod and support block, At least two vertical plates are provided, and the two vertical plates are connected by at least two parallel horizontal bars, and a first waist-shaped hole is provided on the vertical plate below the horizontal bar; At least two bottom support rods are horizontally arranged, and the bottom support rods are connected to the two vertical plates through the first waist-shaped holes, and the two bottom support rods are moved along the first waist-shaped holes to adjust the spacing; The support block is arranged above the cross bar.

2. The adjustable silicon wafer tooling as claimed in claim 1, characterized in that: The vertical plate is provided with a first adjusting block, and the first adjusting block is connected to the bottom supporting rod through a connecting rod.

3. The adjustable silicon wafer tooling as claimed in claim 1, characterized in that: The vertical plates are provided with second waist-shaped holes, and side support rods are provided between adjacent vertical plates through the second waist-shaped holes.

4. The adjustable silicon wafer tooling as claimed in claim 3, characterized in that: The vertical plate is provided with an adjustment plate, the adjustment plate is provided with a toothed portion, the vertical plate is provided with a rack meshing with the toothed portion, and the second waist-shaped hole is provided on the adjustment plate.

5. The adjustable silicon wafer tooling as claimed in claim 3, characterized in that: The vertical plate is provided with a second adjustment block, the second adjustment block is provided with a third waist-shaped hole, and the side support rod connected to the vertical plate passes through the third waist-shaped hole.

6. The adjustable silicon wafer tooling as claimed in claim 3, characterized in that: The side support rod passes through the second waist-shaped hole and extends from the vertical plate.

7. The adjustable silicon wafer tooling as claimed in claim 4, characterized in that: A fourth waist-shaped hole is formed on the vertical plate, and the adjustment plate is connected to the vertical plate via the fourth waist-shaped hole.

8. The adjustable silicon wafer tooling as claimed in claim 1, characterized in that: At least two connection holes are provided on the support block along the up-down direction, and the support block is connected to the cross bar through the connection holes.

9. The adjustable silicon wafer tooling as claimed in claim 1, characterized in that: The vertical plate is provided with a plurality of adjustment holes in the upper and lower directions.

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