Water storage type water-cooling semiconductor refrigeration air conditioning system

Abstract

The utility model discloses a water storage type water-cooling semiconductor refrigeration air-conditioning system, which relates to the technical field of semiconductor refrigeration, and is characterized in that when a semiconductor refrigeration sheet is electrified for refrigeration, the heat end of the semiconductor refrigeration sheet is communicated with the water storage type water-cooling semiconductor refrigeration air-conditioning system; due to the fact that the semiconductor chilling plate is located in the household replacement water storage container, heat exchange is carried out between the hot end and normal-temperature water in the household replacement water storage container, almost all heat is absorbed by the water in the household replacement water storage container, the purpose of heat dissipation can be achieved without being discharged into the environment, the heat cannot be dissipated indoors, and the service life of the household replacement water storage container is prolonged. And an additional heat dissipation fan is not needed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration, in particular to a water storage type water-cooled semiconductor refrigeration air conditioning system. Background Art

[0002] Semiconductor refrigeration is also known as electronic refrigeration or thermoelectric refrigeration. It uses a PN junction composed of special semiconductor materials to form a thermocouple pair to produce the Peltier effect, which is a new refrigeration method using direct current cooling.

[0003] One end of the semiconductor refrigeration chip is the cooling end, and the other end is the heating end. When the semiconductor refrigeration chip is in use, in order to maintain its stable cooling effect, an external fan is generally required to conduct the heat from the heating end outward in time.

[0004] However, the additional cooling fan will make it inconvenient to use and install. At the same time, in relatively closed and narrow spaces such as bathrooms, the heat blown out by the external fan is difficult to be discharged to the outside, and the cooling effect will be worse during cooling. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, the utility model provides a water storage type water-cooled semiconductor refrigeration air-conditioning system to solve the problems that the heating end of the existing semiconductor refrigeration plate needs to use an external heat dissipation fan, which is inconvenient to install and use, and for relatively closed and narrow spaces such as bathrooms, the heat blown out by the external fan is difficult to be discharged to the outdoors, resulting in a poor cooling effect during cooling.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a water storage type water-cooled semiconductor refrigeration air conditioning system, comprising:

[0007] A semiconductor refrigeration module is placed in a household replacement water storage container, the semiconductor refrigeration module comprises a semiconductor refrigeration sheet, a water cooling plate, a water pump and a first water pipe, the semiconductor refrigeration sheet is fitted with the water cooling plate, a first circulating water channel is arranged in the water cooling plate, and the water outlet / inlet end of the water pump is connected to one end of the first circulating water channel through the first water pipe;

[0008] The heat exchange module comprises a heat exchange plate and a fan, wherein the heat exchange plate is provided with a second circulating water channel, and the fan is located on one side of the heat exchange plate;

[0009] The heat exchange pipeline includes a second water pipe and a third water pipe. The two ends of the second circulating water channel of the heat exchange plate are respectively connected to the second water pipe and the third water pipe. The water inlet / outlet of the water pump is connected to the second water pipe. The other end of the first circulating water channel is connected to the third water pipe.

[0010] Preferably, the semiconductor refrigeration module also includes a shell and a heat sink, the shell and the heat sink form a closed space, the other side of the semiconductor refrigeration plate is attached to the heat sink, and the semiconductor refrigeration plate, water cooling plate, water pump and first water pipe are all located in the closed space.

[0011] Preferably, a plurality of first heat dissipation fins are provided on the side of the heat dissipation plate facing away from the shell.

[0012] Preferably, a plurality of second heat dissipation fins are fixedly mounted on one side of the heat exchange plate, and the second heat dissipation fins are located between the fan and the heat exchange plate.

[0013] Preferably, the water cooling plate, the heat exchange plate, the heat dissipation plate, the first heat dissipation fins and the second heat dissipation fins are made of aluminum alloy, copper or ceramic.

[0014] Preferably, the interior of the shell is filled with thermal insulation foam material.

[0015] Preferably, thermally conductive interface materials are filled between the semiconductor refrigeration plate and the water cooling plate and the heat dissipation plate.

[0016] Preferably, the second water pipe and the third water pipe are wrapped with thermal insulation material.

[0017] Preferably, the water level in the household replacement water storage container is not less than half the height of the semiconductor refrigeration module.

[0018] Compared with the prior art, the utility model can achieve the following beneficial effects:

[0019] (1) When the semiconductor refrigeration chip is powered on for cooling, the hot end of the semiconductor refrigeration chip exchanges heat with the water at room temperature in the household replacement water storage container because the semiconductor refrigeration chip is in the household replacement water storage container. The heat is almost completely absorbed by the water in the household replacement water storage container, and the purpose of heat dissipation can be achieved without being discharged into the environment. The heat will not be dissipated indoors, and no external heat dissipation fan is required;

[0020] (2) The air conditioning system adopts a split and independent modular setting, which improves the flexibility of the layout and application of the air conditioning system. In theory, as long as the heat exchange pipeline can be arranged, the heat exchange module can be installed in other locations in the home (not limited to the bathroom). At the same time, when one of the semiconductor refrigeration module and the heat exchange module is damaged, since the two are connected by a heat exchange pipeline, they are easy to disassemble and replace without the need for overall replacement, thus saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2This is a schematic diagram of the explosion structure of the semiconductor refrigeration module of the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the semiconductor refrigeration module, heat exchange module and household replacement water storage container of the utility model;

[0024] Wherein: 1. semiconductor refrigeration module; 11. semiconductor refrigeration sheet; 12. water cooling plate; 13. water pump; 14. first water pipe; 15. heat sink; 16. shell; 17. first heat sink fin; 2. heat exchange module; 21. heat exchange plate; 22. fan; 23. second heat sink fin; 3. heat exchange pipeline; 31. second water pipe; 32. third water pipe; 4. household replacement water storage container. DETAILED DESCRIPTION

[0025] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments. However, the following embodiments are only preferred embodiments of the present invention, not all of them. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work all belong to the protection scope of the present invention. The experimental methods in the following embodiments are conventional methods unless otherwise specified. The materials, reagents, etc. used in the following embodiments are all commercially available unless otherwise specified.

[0026] like Figure 1-Figure 3 As shown, the utility model provides a water storage type water-cooled semiconductor refrigeration air conditioning system, comprising a semiconductor refrigeration module 1, a heat exchange module 2 and a heat exchange pipeline 3;

[0027] The semiconductor refrigeration module 1 is placed in a household replacement water storage container 4. The semiconductor refrigeration module 1 includes a semiconductor refrigeration sheet 11, a water cooling plate 12, a water pump 13 and a first water pipe 14. The semiconductor refrigeration sheet 11 is fitted with the water cooling plate 12. A first circulating water channel is provided in the water cooling plate 12. The water outlet / inlet end of the water pump 13 is connected to one end of the first circulating water channel through the first water pipe 14.

[0028] The heat exchange module 2 includes a heat exchange plate 21 and a fan 22. A second circulating water channel is provided in the heat exchange plate 21. The fan 22 is located on one side of the heat exchange plate 21.

[0029] The heat exchange pipeline 3 includes a second water pipe 31 and a third water pipe 32. The two ends of the second circulating water channel of the heat exchange plate 21 are connected to the second water pipe 31 and the third water pipe 32 respectively. The water inlet / outlet of the water pump 13 is connected to the second water pipe 31. The other end of the first circulating water channel is connected to the third water pipe 32.

[0030] Take the use of the water storage type water-cooled semiconductor refrigeration air conditioning system in the bathroom as an example for explanation: the household replacement water storage container 4 at this time can be a water tank of the toilet (here taking this as an example) or an additional water tank that can be connected to the water tank of the toilet and can store water in the toilet;

[0031] The heat exchange module 2 is installed on the wall of the toilet (preferably above the toilet, so as to facilitate the layout of the heat exchange pipeline 3), the semiconductor refrigeration module 1 is placed in the water tank of the toilet (a hole can be opened on the toilet water tank cover to facilitate the passage of the heat exchange pipeline 3), the water outlet of the water pump 13 is connected to one end of the first circulating water channel through the first water pipe 14, and the water inlet of the water pump 13 is connected to the second water pipe 31;

[0032] When in use, when the bathroom needs to be cooled, the semiconductor cooling sheet 11 is powered on to cool the contact surface of the semiconductor cooling sheet 11 and the water-cooling plate 12, thereby cooling the water-cooling plate 12, thereby cooling the water in the first circulating water channel, and the cooled water passes through the water pump 13, passes through the first water pipe 14 and the second water pipe 31 into the second circulating water channel, the temperature of the heat exchange plate 21 is reduced, the heat exchange plate 21 exchanges heat with the surrounding air, and the fan 22 blows out the cooled air, thereby realizing the cooling work in the bathroom;

[0033] As for the hot end of the semiconductor refrigeration sheet 11, since the semiconductor refrigeration sheet 11 is in the water tank of the toilet, the hot end exchanges heat with the water at room temperature in the water tank of the toilet, and the heat is almost completely absorbed by the water in the water tank of the toilet, and the purpose of heat dissipation can be achieved without being discharged into the environment. The heat will not be dissipated indoors, and no external heat dissipation fan is required;

[0034] At the same time, the water in the water tank of the toilet will be flushed out in time when the toilet is used, and then the water tank of the toilet will be automatically replaced with water at room temperature, so the water after heat exchange at the hot end will not be wasted, and it belongs to normal water use. When the toilet needs to be cooled in the subsequent use, the water at room temperature in the water tank of the toilet will continue to exchange heat and continue to dissipate heat at the hot end of the semiconductor refrigeration plate 11;

[0035] The air-conditioning system adopts a split and independent modular setting, which improves the flexibility of the layout and application of the air-conditioning system. In theory, as long as the heat exchange pipeline 3 can be arranged, the heat exchange module 2 can be installed in other locations in the home (not limited to the bathroom). At the same time, when one of the semiconductor refrigeration module 1 and the heat exchange module 2 is damaged, since the two are connected by the heat exchange pipeline 3, they are easy to disassemble and replace, and there is no need to replace the entire system, which saves costs.

[0036] like Figure 1 and Figure 2As shown, the semiconductor refrigeration module 1 also includes a shell 16 and a heat sink 15. The shell 16 and the heat sink 15 form a closed space. The other side of the semiconductor refrigeration sheet 11 is always attached to the heat sink 15. The semiconductor refrigeration sheet 11, the water cooling plate 12, the water pump 13 and the first water pipe 14 are all located in the closed space.

[0037] The water pump 13 is preferably installed on the water cooling plate 12, and may also be installed on the inner wall of the housing 16;

[0038] The heat sink 15 is provided to contact the water in the household replacement water storage container 4, and the shell 16 and the heat sink 15 enclose the semiconductor refrigeration chip 11 in a closed space, thereby preventing the water in the household replacement water storage container 4 from directly contacting the hot end of the semiconductor refrigeration chip 11, thereby avoiding the semiconductor refrigeration chip 11 from being damaged by being soaked in water for a long time.

[0039] like Figure 1 and Figure 2 As shown, a plurality of first heat dissipation fins 17 are provided on the side of the heat dissipation plate 15 facing away from the housing 16;

[0040] By adding the first heat dissipation fins 17, the heat dissipation area can be significantly increased, thereby increasing the contact area between the heat dissipation end and water, thereby improving the heat exchange efficiency.

[0041] like Figure 1 As shown, a plurality of second heat dissipation fins 23 are fixedly installed on one side of the heat exchange plate 21, and the second heat dissipation fins 23 are located between the fan 22 and the heat exchange plate 21;

[0042] By providing the second heat dissipation fins 23, the heat exchange area can be significantly increased, thereby improving the heat exchange efficiency, and thus improving the cooling effect when the air conditioner is cooling.

[0043] The water cooling plate 12, the heat exchange plate 21, the heat dissipation plate 15, the first heat dissipation fins 17 and the second heat dissipation fins 23 are made of aluminum alloy, copper or ceramic;

[0044] Since the greater the thermal conductivity of the material, the faster the heat transfer speed and the smaller the thermal resistance, the thermal conductivity effect can be improved by using materials with large thermal conductivity of aluminum alloy, copper or ceramic as the water cooling plate 12, heat exchange plate 21, heat sink 15, first heat sink fin 17 and second heat sink fin 23.

[0045] The interior of the shell 16 is filled with thermal insulation foam material to further improve the heat insulation and waterproof sealing inside the enclosed space.

[0046] The semiconductor refrigeration sheet 11 and the water cooling plate 12 and the heat sink 15 are filled with thermal interface materials. The thermal interface materials can be thermal grease or thermal pads, so as to reduce the contact thermal resistance between them and improve the thermal conductivity effect.

[0047] The second water pipe 31 and the third water pipe 32 are wrapped with heat-insulating materials on the outside to reduce the loss of cold when the air conditioner is cooling.

[0048] The water level in the household replacement water storage container 4 is not lower than half the height of the semiconductor refrigeration module 1. When the air conditioner is cooling, it is ensured that there is enough water at room temperature in the household replacement water storage container 4 to exchange heat with the heat sink 15 and the first heat sink fin 17, thereby ensuring that the heat is well handled.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water storage type water-cooled semiconductor refrigeration air conditioning system, characterized in that: include: A semiconductor refrigeration module (1) is placed in a household replacement water storage container (4), the semiconductor refrigeration module (1) comprising a semiconductor refrigeration sheet (11), a water cooling plate (12), a water pump (13) and a first water pipe (14), the semiconductor refrigeration sheet (11) and the water cooling plate (12) being arranged in close contact with each other, a first circulating water channel being arranged in the water cooling plate (12), and a water outlet / inlet end of the water pump (13) being connected to one end of the first circulating water channel via the first water pipe (14); A heat exchange module (2) comprises a heat exchange plate (21) and a fan (22), wherein a second circulating water channel is provided in the heat exchange plate (21), and the fan (22) is located on one side of the heat exchange plate (21); The heat exchange pipeline (3) comprises a second water pipe (31) and a third water pipe (32), the two ends of the second circulating water channel of the heat exchange plate (21) are respectively connected to the second water pipe (31) and the third water pipe (32), the water inlet end / water outlet end of the water pump (13) is connected to the second water pipe (31), and the other end of the first circulating water channel is connected to the third water pipe (32).

2. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 1, characterized in that: The semiconductor refrigeration module (1) further comprises a shell (16) and a heat sink (15), wherein the shell (16) and the heat sink (15) form a closed space, the other side of the semiconductor refrigeration sheet (11) is always attached to the heat sink (15), and the semiconductor refrigeration sheet (11), the water cooling plate (12), the water pump (13) and the first water pipe (14) are all located in the closed space.

3. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 2 is characterized in that: A plurality of first heat dissipation fins (17) are provided on the side of the heat dissipation plate (15) facing away from the housing (16).

4. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 3 is characterized in that: A plurality of second heat dissipation fins (23) are fixedly mounted on one side of the heat exchange plate (21), and the second heat dissipation fins (23) are located between the fan (22) and the heat exchange plate (21).

5. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 4 is characterized in that: The water cooling plate (12), the heat exchange plate (21), the heat dissipation plate (15), the first heat dissipation fin (17) and the second heat dissipation fin (23) are made of aluminum alloy, copper or ceramic.

6. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 2, characterized in that: The interior of the shell (16) is filled with heat-insulating foam material.

7. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 2, characterized in that: The semiconductor refrigeration sheet (11), the water cooling plate (12) and the heat dissipation plate (15) are all filled with heat-conducting interface materials.

8. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 2, characterized in that: The second water pipe (31) and the third water pipe (32) are wrapped with thermal insulation material.

9. The water storage type water-cooled semiconductor refrigeration and air conditioning system according to claim 2, characterized in that: The water level in the household replacement water storage container (4) is not lower than half the height of the semiconductor refrigeration module (1).

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