Blackbody radiation furnace

Abstract

The utility model relates to the technical field of black body heating, in particular to a black body radiation furnace which comprises a furnace body, a heating test part is arranged on the furnace body, the heating test part is made of a black body material, and the heating test part is used for calibrating a temperature measuring gun. According to the black body radiation furnace provided by the invention, the heating test part is prepared from the black body material, so that the heat transfer efficiency is higher, electric energy or fuel energy can be converted into radiation energy, the radiation energy can be absorbed by the black body material to the greatest extent, the energy loss is reduced, and the heating test part can be uniformly heated to the required temperature in a relatively short time; the production efficiency is improved; temperature control is accurate, stable and reliable; non-contact heating is achieved, and pollution and cross infection are avoided.

Description

Technical Field

[0001] The present application belongs to the technical field of blackbody heating, and more specifically, relates to a blackbody radiation furnace. Background Art

[0002] At present, with the advancement of science and technology, most people have abandoned the traditional glass mercury thermometer with low safety and switched to electronic temperature equipment. Electronic temperature equipment is currently divided into two types, one is non-contact electronic temperature equipment, such as temperature measuring guns, and the other is contact electronic temperature equipment, such as electronic temperature pens. The temperature measuring gun is favored by people because of its short temperature measuring time among non-contact electronic temperature equipment, but the temperature measuring gun needs to be calibrated before it can be put on the market to ensure the accuracy of measurement, so calibration is essential.

[0003] At present, there is a problem that the temperature measurement drift will increase with the increase of times of use. If it is not calibrated, there will be errors in each temperature measurement. When the error is large, it can reach about 1-2 degrees Celsius, which will seriously affect clinical medical activities. Therefore, if you want to ensure the accuracy of the electronic thermometer, it is necessary to calibrate it. However, the existing calibration equipment mostly uses the hot air furnace vault infrared temperature measurement system, which has poor reliability in complex environments, slow heating speed of the temperature gun to be tested, and prone to uneven heating. Summary of the invention

[0004] To achieve the above-mentioned purpose, the technical solution adopted in the present application is: a blackbody radiation furnace, comprising a furnace body, on which a heating test part is arranged, the heating test part is made of blackbody material, and the heating test part is used to calibrate the temperature gun.

[0005] Optionally, the heating test portion comprises a black body groove which is concavely arranged, and a groove of the black body groove forms a test hole;

[0006] A temperature sensor and a fixing bolt are arranged on the bottom wall of the black body slot located on one side in the furnace body, and a heating rod is arranged on the ring wall of the black body slot located on one side in the furnace.

[0007] Optionally, the temperature sensor is located at the center of the blackbody slot; a plurality of fixing bolts are provided, and are circumferentially arranged at equal angles around the temperature sensor; a plurality of heating rods are provided and are circumferentially arranged at equal angles, and are circumferentially arranged at equal angles around the blackbody slot.

[0008] Optionally, the heating rod is a heating resistance wire or a heating tube.

[0009] Optionally, a controller is further provided on the furnace body, and a temperature display area and a temperature and power control area are provided on the controller;

[0010] The controller is provided with a temperature display module, a temperature and power control module, and a main control module, and the temperature display module, the temperature and power control module are all connected to the main control module;

[0011] The temperature display module is used to control the content displayed in the temperature display area, and the power control module is used to adjust and control the temperature and power through the operation of the temperature and power control area.

[0012] Optionally, the main control module includes chip U1; a temperature and power control module, used to detect the current temperature of the black body furnace; the temperature and power control module includes chip U7 and chip U8, pin 1 of chip U7 is connected to a +5V power supply via resistor R23, pin 1 of chip U7 is also connected to pin 33 of the main control module, and pin 2 of chip U7 is grounded; pin 1 of chip U8 is connected to a +5V power supply via resistor R15, pin 1 of chip U8 is also connected to pin 32 of chip U1, and pin 2 of chip U8 is grounded.

[0013] Optionally, the main control module is connected to a power rectifier module, which is used to convert AC power into DC power. The power rectifier module includes a chip D7 and a chip U2. Pin 3 of the chip U2 is connected to a +12V power supply, and pin 2 of the chip U2 is grounded. Pin 3 of the chip U2 is connected to one end of a capacitor C2, one end of a capacitor C30, one end of a capacitor C32, one end of a capacitor C8, and pin 1 of the chip D7. Pin 4 of the chip D7 is connected to the other end of the capacitor C2, the other end of the capacitor C30, the other end of the capacitor C32, and the other end of the capacitor C8, which are arranged in parallel. Pin 4 is also grounded; Pins 2 and 3 of chip D7 are connected to Pins 2 and 1 of terminal CN9 respectively; a 220V to 12V transformer is connected between terminal CN9 and terminal CN5, and Pin 1 of terminal CN5 is connected to Pin 1 of terminal CN4, Pin 1 of terminal CN6, Pin 1 of terminal CN7 and Pin 1 of terminal CN8 respectively; Pin 2 of terminal CN5 is connected to Pin 2 of terminal CN4, Pin 2 of terminal CN6, Pin 2 of terminal CN7 and Pin 2 of terminal CN8 respectively; Terminal CN4 is connected to a 220V input power supply.

[0014] Optionally, the main control module is connected to a heating rod module, and the heating rod module is connected to a heating rod for heating the black body furnace;

[0015] The heating rod module includes relay RELAY4 and relay RELAY5, wherein pin 1 of relay RELAY4 is connected to pin 2 of transistor Q4, pin 1 of transistor Q4 is connected to the main control module via resistor R32, and pin 3 of transistor Q4 is grounded via resistor R20; pin 1 of relay RELAY4 is also connected to pin 4 of relay RELAY4 via diode D10; pin 2 of relay RELAY4 is connected to the heating rod, and pin 5 of relay RELAY4 is connected to the heating rod; pin 1 of relay RELAY5 is connected to pin 2 of transistor Q5, pin 1 of transistor Q5 is connected to the main control module via resistor R35, and pin 3 of transistor Q5 is grounded via resistor R36; pin 1 of relay RELAY5 is also connected to pin 4 of relay RELAY5 via diode D11; pin 2 of relay RELAY5 is connected to the heating rod, and pin 5 of relay RELAY5 is connected to the heating rod.

[0016] Optionally, the main control module is connected to a power indicator light module, which is used to display the power status; the power indicator light module includes a chip U16 and a chip U3, and the pin 1 of the chip U16 is connected to the pin 6 of the chip U16 via a capacitor C33, and the pin 6 of the chip U16 is also connected to one end of the capacitor C34, one end of the resistor R27, one end of the capacitor C11, and a +5V power supply through an inductor L6; the pin 2 of the chip U16 is connected to the pin 6 of the chip U16 via a diode D8, and the pin 2 of the chip U16 is also connected to the other end of the capacitor C34, the other end of the capacitor C11, one end of the resistor R28, and ground; the other end of the resistor R28 is respectively connected to the pin 3 of the chip U16 and the other end of the resistor R27; the pin 4 of the chip U16 is connected to the pin 5 of the chip U16 via a resistor R6;

[0017] Pin 1 of chip U3 is connected to pin 3 of chip U3, and pin 1 of chip U3 is also connected to a +5V power supply; pin 1 of chip U3 is also connected to pin 2 of chip U3 via capacitor C3, and pin 2 of chip U3 is also grounded; pin 4 of chip U3 is respectively connected to one end of capacitor C4, one end of diode D9 and ground via capacitor C5; pin 5 of chip U3 is respectively connected to the other end of capacitor C4, the other end of diode D9 and a 3.3V power supply; the 3.3V power supply is grounded via a series resistor R29 and a diode LED1.

[0018] Optionally, the main control module includes a chip U1; pin 1 of the chip U1 is respectively connected to a 3.3V power supply and one end of a resistor R2, the other end of the resistor R2 is connected to pin 7 of the chip U1, and pin 7 of the chip U1 is also grounded via a capacitor C1; pin 44 of the chip U1 is grounded via a resistor R1;

[0019] Pin 37 of chip U1 is connected to pin 4 of terminal H1, pin 34 of chip U1 is connected to pin 3 of terminal H1, pin 2 of terminal H1 is grounded, and pin 1 of terminal H1 is connected to 3.3V power supply;

[0020] Pins 5 and 6 of chip U1 are connected to a crystal oscillator module, which includes chip X1. Chip X1 is obtained from the market, and the model of chip X1 is 8MHz. Pin 5 of chip U1 is connected to pin 1 of chip X1, and pin 1 of chip X1 is also connected to one end of resistor R24 ​​and one end of capacitor C21 respectively; pin 6 of chip U1 is connected to pin 3 of chip X1, and pin 3 of chip X1 is connected to the other end of resistor R24 ​​and one end of capacitor C20 respectively, and the other end of capacitor C20 is connected to the other end of capacitor C21; pins 2 and 4 of chip X1 are grounded.

[0021] The present application provides a blackbody radiation furnace, which has a heating test part made of blackbody material, has higher heat transfer efficiency, can convert electrical energy or fuel energy into radiation energy, so that it can be absorbed by the blackbody material to the greatest extent, reducing energy loss, and can evenly heat the heating test part to the required temperature in a short time, thereby improving production efficiency; the temperature control is accurate, stable and reliable; non-contact heating is achieved, and contamination and cross infection are avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0023] Figure 1 This is a schematic diagram of the structure of the black body radiation furnace of this application;

[0024] Figure 2 A rear view of the black body radiation furnace of this application;

[0025] Figure 3 A cross-sectional view of a black body radiation furnace of the present application;

[0026] Figure 4 It is a structural schematic diagram of the heating test unit;

[0027] Figure 5 It is the schematic diagram of the controller structure;

[0028] Figure 6 It is the circuit diagram of the power rectifier module;

[0029] Figure 7 This is the circuit diagram of the main control module;

[0030] Figure 8 It is the circuit diagram of the temperature and power control module;

[0031] Fig. 9This is the circuit diagram of the heating rod module;

[0032] Fig.10 This is the circuit diagram of the key module;

[0033] Fig.11 This is the circuit diagram of the indicator light module;

[0034] Fig.12 This is the circuit diagram of the power indicator light;

[0035] Fig.13 The circuit diagram of the terminal block;

[0036] Fig.14 This is the circuit diagram of the crystal oscillator module;

[0037] Fig.15 This is the circuit diagram of the screen interface module.

[0038] Explanation of symbols in the figure:

[0039] 1-furnace body; 2-controller; 3-heating test part; 4-first heat dissipation hole; 5-third heat dissipation hole; 6-second heat dissipation hole; 7-cooling fan; 8-handle; 21-temperature display module; 22-temperature and power control module; 23-main control module; 31-temperature sensor; 32-heating rod; 33-heating rod; 34-black body slot; 35-test hole. DETAILED DESCRIPTION

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0041] The black body radiation furnace provided in the embodiment of the present application is now described. Figure 1 and Figure 2 A black body radiation furnace comprises a furnace body 1, and a controller 2 and a heating test part 3 are arranged on one side wall of the furnace body 1. The controller 2 is provided with a temperature display area and a temperature and power control area. The heating test part 3 is made of black body material and is used to calibrate the temperature gun. Compared with the traditional convection heat transfer method, the heating test part 3 made of black body material has higher heat transfer efficiency, and can evenly heat the heating test part 3 to the required temperature in a short time, thereby improving production efficiency.

[0042] First heat dissipation holes 4 are arranged around the heating test part 3 .

[0043] A second heat dissipation hole 6 is provided on the other side wall of the furnace body 1, and a heat dissipation fan 7 is provided at the air outlet of the second heat dissipation hole 6. The heat dissipation fan 7 is 12V, 1A, the second heat dissipation hole 6 is a long hole, and a dustproof film is provided on the outside of the heat dissipation fan 7.

[0044] Preferably, a handle is provided on the top of the furnace body 1 for easy carrying and use.

[0045] Furthermore, the second heat dissipation hole 6 and the first heat dissipation hole 4 are located on two opposite side walls. A third heat dissipation hole 5 is also arranged on the other side wall of the furnace body 1 .

[0046] The outer dimensions of the furnace body 1 are 330 mm long, 280 mm wide and 220 mm high. The inner wall of the furnace body 1 is provided with a heat-insulating layer, which is made of polyurethane foam plastic.

[0047] See also Figure 5 The controller 2 is provided with a temperature display module 21, a temperature and power control module 22, and a main control module 23. The temperature display module 21 and the temperature and power control module 22 are all connected to the main control module 23. The temperature and power control module 22 can accurately control the heating temperature and keep it constant, ensuring the uniformity and consistency of the heating of the black body material and avoiding the occurrence of problems such as deformation and cracking of the black body material. The main control module 23 can realize the accurate setting, automatic adjustment and recording of the temperature curve, reduce the intervention of manual operation, and improve the stability and consistency of production.

[0048] The controller 2 turns the heating of the black body radiation furnace on and off through the main control module 23. The temperature display area controls the displayed content through the temperature display module 21, and the temperature and power control area controls the temperature and power through the temperature and power control module 22.

[0049] See also Figure 3 and Figure 4 The heating test part 3 includes a concave black body groove 34, and the groove of the black body groove 34 forms a test hole 35. The test hole 35 is used for calibrating the temperature measuring gun in the hole. The test hole 35 is preferably set to be circular, or other shapes are also acceptable.

[0050] A temperature sensor 31 and fixing bolts 33 are arranged on the bottom wall of a black body slot 34 located on one side of the furnace body 1, wherein the temperature sensor 31 is located at the center of the black body slot 34; a plurality of fixing bolts 33 are arranged, and are arranged at equal angles around the temperature sensor 31 in the circumferential direction. Specifically, preferably, three fixing bolts 33 are arranged, and five or more fixing bolts 33 may also be arranged.

[0051] A heating rod 32 is provided on a groove ring wall on one side of the black body groove 34 located in the furnace body 1. Three heating rods 3 are arranged circumferentially at equal angles, and five or more heating rods can also be provided, as long as the heating requirements of the black body furnace of the present application can be met. The heating rod 32 is connected to the temperature and power control module 22 in the controller 2, and the temperature and power control module 22 is used to control the temperature and power of the heating rod 32. When the temperature sensor 31 detects the temperature of the heating rod 32, the temperature signal is input to the temperature display module 21, and the temperature display module 21 displays the current temperature. The heating rod 32 is a heating resistance wire or a heating tube. The temperature control is precise, stable and reliable.

[0052] The blackbody radiation furnace of the present application can convert electrical energy or fuel energy into radiation energy, so that it can be absorbed by the blackbody material to the greatest extent, reducing energy loss. At the same time, since the blackbody radiation furnace does not produce harmful gases and wastewater, it has high resource utilization and environmental friendliness. Different from the traditional contact heat transfer method, the blackbody radiation furnace can achieve non-contact heating, avoiding the problems of pollution and cross infection. It is also suitable for heating and heat treatment of various materials, including metals, ceramics, glass, plastics, etc.

[0053] See also Figures 6 to 15 The main control module 23 is respectively connected to the power rectifier module, the temperature and power control module 22, the heating rod module, the button module, the LED indicator module, the power indicator module, the screen interface module and the crystal oscillator module.

[0054] The temperature and power control module 22 detects the current temperature of the black body furnace; the heating rod module is used to heat the black body furnace; the button module is used to control the selection mode and set the temperature and calibration, etc.; the LED indicator module is used to display the current working status; the power indicator module is used to display the power status; the screen interface module is used to connect to an external screen.

[0055] The main control module includes chip U1, which is commercially available and has a model number of STM32F103C8T6. Pin 1 of chip U1 is connected to a 3.3V power supply and one end of resistor R2, and the other end of resistor R2 is connected to pin 7 of chip U1. Pin 7 of chip U1 is also grounded via capacitor C1; pin 44 of chip U1 is grounded via resistor R1.

[0056] Pin 37 of chip U1 is connected to pin 4 of terminal H1, pin 34 of chip U1 is connected to pin 3 of terminal H1, pin 2 of terminal H1 is grounded, and pin 1 of terminal H1 is connected to a 3.3V power supply.

[0057] Pins 5 and 6 of chip U1 are connected to a crystal oscillator module. Specifically, the crystal oscillator module includes chip X1, which is commercially available and has a model of 8MHz. Pin 5 of chip U1 is connected to pin 1 of chip X1, which is also connected to one end of resistor R24 ​​and one end of capacitor C21; pin 6 of chip U1 is connected to pin 3 of chip X1, which is connected to the other end of resistor R24 ​​and one end of capacitor C20, and the other end of capacitor C20 is connected to the other end of capacitor C21; pins 2 and 4 of chip X1 are grounded.

[0058] Pins 8, 32, 35, and 47 of chip U1 are all grounded;

[0059] Pins 9, 24, 36 and 48 of the chip U1 are all connected to a 3.3V power supply; the 3.3V power supply is also grounded after passing through capacitors C13, C29, C14 and C15 connected in parallel.

[0060] Pins 10 to 13 of the chip U1 are connected to the indicator light module. Specifically, pin 10 of the chip U1 is grounded via a series resistor R4 and a diode D1; pin 11 of the chip U1 is grounded via a series resistor R7 and a diode D2; pin 12 of the chip U1 is grounded via a series resistor R8 and a diode D3; and pin 13 of the chip U1 is grounded via a series resistor R9 and a diode D4.

[0061] Pins 15 to 20, 28 to 30, and 39 to 43 of chip U1 are connected to the screen interface module. Specifically, the screen interface module includes screen line CN1 and transistor Q2. Screen line CN1 and transistor Q2 are obtained from the market. The model of transistor Q2 is S8050J3Y.

[0062] Pins 15 to 20 of chip U1 are respectively connected to pins 8 to 13 of screen cable row CN1, pin 29 of chip U1 is connected to pin 19 of screen cable row CN1, pin 30 of chip U1 is connected to pin 7 of screen cable row CN1, pins 39 to 43 of chip U1 are respectively connected to pins 14 to 19 of screen cable row CN1, pin 28 of chip U1 is respectively connected to pin 1 of transistor Q2 via resistor R26, pin 3 of transistor Q2 is connected to pin 1 of transistor Q2 via resistor R25, pin 3 of transistor Q2 is also grounded, pin 2 of transistor Q2 is connected to pin 24 of screen cable row CN1 via resistor R3, pins 1, 5 and 20 of screen cable row CN1 are all grounded, and pins 6 and 21 to 23 of screen cable row CN1 are all connected to a 3.3V power supply.

[0063] Pins 21, 22, 25, 38 and 45 of chip U1 are connected to the key module. Specifically, pin 21 of chip U1 is respectively connected to one end of resistor R11, pin 17 of pin header U12, pin 2 of switch SW3 and one end of capacitor C16. The other end of resistor R11 is connected to a 3.3V power supply, pin 16 of pin header U12 is grounded, pin 2 of switch SW3 can be turned on and off and connected to pin 4 of switch SW3, and the other end of capacitor C16 is grounded.

[0064] Pin 22 of chip U1 is respectively connected to one end of resistor R12, pin 17 of pin header U13, pin 2 of switch SW4, and one end of capacitor C17. The other end of resistor R12 is connected to 3.3V power supply. Pin 16 of pin header U13 is grounded. Pin 2 of switch SW4 can be turned on and off and connected to pin 4 of switch SW4. The other end of capacitor C17 is grounded.

[0065] Pin 25 of chip U1 is respectively connected to one end of resistor R14, pin 17 of pin header U14, pin 2 of switch SW5, and one end of capacitor C18. The other end of resistor R14 is connected to 3.3V power supply, pin 16 of pin header U14 is grounded, pin 2 of switch SW5 can be turned on and off and connected to pin 4 of switch SW5, and the other end of capacitor C18 is grounded.

[0066] Pin 38 of chip U1 is respectively connected to one end of resistor R13, pin 17 of pin header U15, pin 2 of switch SW6, and one end of capacitor C19. The other end of resistor R13 is connected to 3.3V power supply, pin 16 of pin header U15 is grounded, pin 2 of switch SW6 can be turned on and off and connected to pin 4 of switch SW6, and the other end of capacitor C19 is grounded.

[0067] Pin 45 of chip U1 is respectively connected to one end of resistor R5, pin 17 of pin header U9, pin 2 of switch SW1, and one end of capacitor C9. The other end of resistor R5 is connected to 3.3V power supply, pin 16 of pin header U9 is grounded, pin 2 of switch SW1 can be turned on and off and connected to pin 4 of switch SW1, and the other end of capacitor C9 is grounded.

[0068] Pins 26 and 27 of chip U1 are connected to a heating rod module. Specifically, the heating rod module includes relay RELAY4 and relay RELAY5, both of which are commercially available and have model numbers SRD-12VDC-SL-C.

[0069] Pin 1 of relay RELAY4 is connected to pin 2 of transistor Q4, pin 1 of transistor Q4 is connected to the main control module via resistor R32, and pin 3 of transistor Q4 is grounded via resistor R20;

[0070] Pin 1 of relay RELAY4 is also connected to pin 4 of relay RELAY4 through diode D10;

[0071] Pin 2 of relay RELAY4 is connected to the heating rod 32 , and pin 5 of relay RELAY4 is connected to the heating rod 32 .

[0072] Pin 1 of relay RELAY5 is connected to pin 2 of transistor Q5, pin 1 of transistor Q5 is connected to the main control module via resistor R35, and pin 3 of transistor Q5 is grounded via resistor R36;

[0073] Pin 1 of relay RELAY5 is also connected to pin 4 of relay RELAY5 through diode D11;

[0074] Pin 2 of relay RELAY5 is connected to the heating rod 32 , and pin 5 of relay RELAY5 is connected to the heating rod 32 .

[0075] Pins 32 and 33 of chip U1 are connected to the temperature and power control module 22. Specifically, the temperature and power control module 22 includes chip U7 and chip U8, both of which are commercially available and are both model KF350-3.5-2P.

[0076] Pin 1 of chip U7 is connected to +5V power supply through resistor R23. Pin 1 of chip U7 is also connected to pin 33 of the main control module. Pin 2 of chip U7 is grounded.

[0077] Pin 1 of chip U8 is connected to a +5V power supply via resistor R15. Pin 1 of chip U8 is also connected to pin 32 of the main control module. Pin 2 of chip U8 is grounded.

[0078] The main control module 23 is connected to a power rectifier module, which is used to convert the mains power into direct current. It is used to convert the mains power 220V into 12V direct current. The power rectifier module adopts a switching power supply with an output voltage of 12V and an output current of 5A.

[0079] The power rectifier module includes a chip D7 and a chip U2, both of which are commercially available. The model of the chip D7 is KBP307, and the model of the chip U2 is L7812CV.

[0080] Pin 3 of chip U2 is connected to a +12V power supply, pin 2 of chip U2 is grounded, pin 3 of chip U2 is connected to one end of capacitor C2, one end of capacitor C30, one end of capacitor C32, one end of capacitor C8 and pin 1 of chip D7, pin 4 of chip D7 is connected to the other end of capacitor C2, the other end of capacitor C30, the other end of capacitor C32 and the other end of capacitor C8 which are arranged in parallel, and pin 4 of chip D7 is also grounded; pins 2 and 3 of chip D7 are respectively connected to pins 2 and 1 of terminal CN9. A 220V to 12V transformer is connected between terminal CN9 and terminal CN5, and pin 1 of terminal CN5 is respectively connected to pin 1 of terminal CN4, pin 1 of terminal CN6, pin 1 of terminal CN7, and pin 1 of terminal CN8; pin 2 of terminal CN5 is respectively connected to pin 2 of terminal CN4, pin 2 of terminal CN6, pin 2 of terminal CN7, and pin 2 of terminal CN8; terminal CN4 is connected to a 220V input power supply.

[0081] The power indicator light module includes chip U16 and chip U3, both of which are commercially available. The model of chip U16 is TPMP2359DJ, and the model of chip U3 is SGM2019-3.3YN5G / TR.

[0082] Pin 1 of chip U16 is connected to pin 6 of chip U16 via capacitor C33. Pin 6 of chip U16 is also connected to one end of capacitor C34, one end of resistor R27, one end of capacitor C11 and +5V power supply via inductor L6.

[0083] Pin 2 of chip U16 is connected to pin 6 of chip U16 via diode D8. Pin 2 of chip U16 is also connected to the other end of capacitor C34, the other end of capacitor C11, one end of resistor R28, and ground respectively; the other end of resistor R28 is connected to pin 3 of chip U16 and the other end of resistor R27 respectively;

[0084] Pin 4 of chip U16 is connected to pin 5 of chip U16 via resistor R6.

[0085] Pin 1 of chip U3 is connected to pin 3 of chip U3, and pin 1 of chip U3 is also connected to a +5V power supply; pin 1 of chip U3 is also connected to pin 2 of chip U3 via capacitor C3, and pin 2 of chip U3 is also grounded;

[0086] Pin 4 of chip U3 is connected to one end of capacitor C4, one end of diode D9 and ground respectively through capacitor C5; pin 5 of chip U3 is connected to the other end of capacitor C4, the other end of diode D9 and 3.3V power supply respectively; 3.3V power supply is connected to ground through resistor R29 and diode LED1 connected in series.

[0087] Based on the blackbody radiation characteristics, this application can achieve precise control of the temperature in the radiation furnace by controlling the surface temperature and reflectivity of the blackbody in the radiation furnace. At the same time, the blackbody radiation furnace can also change the radiation distribution to further improve the heating efficiency and uniformity.

[0088] The blackbody radiation furnace provided in the present application has a higher heat transfer efficiency by adopting a heating test part made of blackbody material, can convert electrical energy or fuel energy into radiation energy so that it can be absorbed by the blackbody material to the greatest extent, reducing energy loss, and can evenly heat the heating test part to the required temperature in a relatively short time, thereby improving production efficiency; the temperature control is precise, stable and reliable; and non-contact heating is achieved to avoid contamination and cross infection.

[0089] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A black body radiation furnace, comprising a furnace body, characterized in that: A heating test part is arranged on the furnace body, the heating test part is made of a black body material, and the heating test part is used to calibrate a temperature measuring gun.

2. The black body radiation furnace according to claim 1, characterized in that: The heating test part comprises a black body groove which is concavely arranged, and the groove of the black body groove forms a test hole; A temperature sensor and a fixing bolt are arranged on the bottom wall of the black body slot located on one side in the furnace body, and a heating rod is arranged on the ring wall of the black body slot located on one side in the furnace.

3. The black body radiation furnace according to claim 2, characterized in that: The temperature sensor is located at the center of the black body slot; a plurality of fixing bolts are provided, and are arranged at equal angles around the temperature sensor; a plurality of heating rods are provided and are arranged circumferentially at equal angles, and are arranged at equal angles around the black body slot.

4. The black body radiation furnace according to claim 2 or 3, characterized in that: The heating rod is a heating resistance wire or a heating tube.

5. The black body radiation furnace according to claim 2, characterized in that: A controller is also provided on the furnace body, and a temperature display area and a temperature and power control area are provided on the controller; The controller is provided with a temperature display module, a temperature and power control module, and a main control module, and the temperature display module, the temperature and power control module are all connected to the main control module; The temperature display module is used to control the content displayed in the temperature display area, and the power control module is used to adjust and control the temperature and power through the operation of the temperature and power control area.

6. The black body radiation furnace according to claim 5, characterized in that: The main control module includes chip U1; a temperature and power control module, which is used to detect the current temperature of the black body furnace; the temperature and power control module includes chip U7 and chip U8, pin 1 of chip U7 is connected to a +5V power supply via resistor R23, pin 1 of chip U7 is also connected to pin 33 of the main control module, and pin 2 of chip U7 is grounded; pin 1 of chip U8 is connected to a +5V power supply via resistor R15, pin 1 of chip U8 is also connected to pin 32 of chip U1, and pin 2 of chip U8 is grounded.

7. The black body radiation furnace according to claim 5, characterized in that: The main control module is connected to a power rectifier module, which is used to convert AC power into DC power. The power rectifier module includes a chip D7 and a chip U2. Pin 3 of the chip U2 is connected to a +12V power supply, and pin 2 of the chip U2 is grounded. Pin 3 of the chip U2 is connected to one end of a capacitor C2, one end of a capacitor C30, one end of a capacitor C32, one end of a capacitor C8, and pin 1 of the chip D7. Pin 4 of the chip D7 is connected to the other end of the capacitor C2, the other end of the capacitor C30, the other end of the capacitor C32, and the other end of the capacitor C8, which are arranged in parallel. Pin 4 of the chip D7 is connected to the other end of the capacitor C2, the other end of the capacitor C30, the other end of the capacitor C32, and the other end of the capacitor C8, which are arranged in parallel. It is also grounded; pins 2 and 3 of chip D7 are respectively connected to pins 2 and 1 of terminal CN9; a 220V to 12V transformer is connected between terminal CN9 and terminal CN5, and pin 1 of terminal CN5 is respectively connected to pin 1 of terminal CN4, pin 1 of terminal CN6, pin 1 of terminal CN7 and pin 1 of terminal CN8; pin 2 of terminal CN5 is respectively connected to pin 2 of terminal CN4, pin 2 of terminal CN6, pin 2 of terminal CN7 and pin 2 of terminal CN8; terminal CN4 is connected to a 220V input power supply.

8. The black body radiation furnace according to claim 5, characterized in that: The main control module is connected to a heating rod module, and the heating rod module is connected to a heating rod for heating the black body furnace; The heating rod module includes a relay RELAY4 and a relay RELAY5, wherein the pin 1 of the relay RELAY4 is connected to the pin 2 of the transistor Q4, the pin 1 of the transistor Q4 is connected to the main control module via a resistor R32, and the pin 3 of the transistor Q4 is grounded via a resistor R20; Pin 1 of relay RELAY4 is also connected to pin 4 of relay RELAY4 via diode D10; pin 2 of relay RELAY4 is connected to the heating rod, and pin 5 of relay RELAY4 is connected to the heating rod; pin 1 of relay RELAY5 is connected to pin 2 of transistor Q5, pin 1 of transistor Q5 is connected to the main control module via resistor R35, and pin 3 of transistor Q5 is grounded via resistor R36; pin 1 of relay RELAY5 is also connected to pin 4 of relay RELAY5 via diode D11; pin 2 of relay RELAY5 is connected to the heating rod, and pin 5 of relay RELAY5 is connected to the heating rod.

9. The black body radiation furnace according to claim 5, characterized in that: The main control module is connected to a power indicator light module, which is used to display the power status; the power indicator light module includes a chip U16 and a chip U3, wherein the pin 1 of the chip U16 is connected to the pin 6 of the chip U16 via a capacitor C33, and the pin 6 of the chip U16 is respectively connected to one end of the capacitor C34, one end of the resistor R27, one end of the capacitor C11, and a +5V power supply via an inductor L6; the pin 2 of the chip U16 is connected to the pin 6 of the chip U16 via a diode D8, and the pin 2 of the chip U16 is also respectively connected to the other end of the capacitor C34, the other end of the capacitor C11, one end of the resistor R28, and ground; the other end of the resistor R28 is respectively connected to the pin 3 of the chip U16 and the other end of the resistor R27; the pin 4 of the chip U16 is connected to the pin 5 of the chip U16 via a resistor R6; Pin 1 of chip U3 is connected to pin 3 of chip U3, and pin 1 of chip U3 is also connected to a +5V power supply; pin 1 of chip U3 is also connected to pin 2 of chip U3 via capacitor C3, and pin 2 of chip U3 is also grounded; pin 4 of chip U3 is respectively connected to one end of capacitor C4, one end of diode D9 and ground via capacitor C5; pin 5 of chip U3 is respectively connected to the other end of capacitor C4, the other end of diode D9 and a 3.3V power supply; the 3.3V power supply is grounded via a series resistor R29 and a diode LED1.

10. The black body radiation furnace according to claim 5, characterized in that: The main control module includes a chip U1; pin 1 of the chip U1 is connected to a 3.3V power supply and one end of a resistor R2, the other end of the resistor R2 is connected to pin 7 of the chip U1, and the pin 7 of the chip U1 is also grounded via a capacitor C1; pin 44 of the chip U1 is grounded via a resistor R1; Pin 37 of chip U1 is connected to pin 4 of terminal H1, pin 34 of chip U1 is connected to pin 3 of terminal H1, pin 2 of terminal H1 is grounded, and pin 1 of terminal H1 is connected to 3.3V power supply; Pins 5 and 6 of chip U1 are connected to a crystal oscillator module. The crystal oscillator module includes chip X1. Chip X1 is obtained from the market. The model of chip X1 is 8MHz. Pin 5 of chip U1 is connected to pin 1 of chip X1. Pin 1 of chip X1 is also connected to one end of resistor R24 ​​and one end of capacitor C21 respectively. Pin 6 of chip U1 is connected to pin 3 of chip X1. Pin 3 of chip X1 is connected to the other end of resistor R24 ​​and one end of capacitor C20 respectively. The other end of capacitor C20 is connected to the other end of capacitor C21. Pins 2 and 4 of chip X1 are both grounded.

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