Optical module

Abstract

The utility model discloses an optical module which comprises a module body and an optical microstructure assembly, a plurality of pixel points are evenly arranged on the surface of one side of the module body, the optical microstructure assembly comprises a plurality of optical microstructures which are independently arranged, and each optical microstructure is arranged corresponding to at least one pixel point. All the optical microstructures are arranged above at least one corresponding pixel point, and one optical microstructure is arranged above each pixel point. According to the technical scheme, it is ensured that alignment deviation between the optical microstructures and module pixels caused by the fact that the optical module is affected by expansion and contraction of the optical film material is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of optical modules, and in particular to an optical module. Background Art

[0002] At present, the surface of most optical modules is equipped with multiple groups of optical microstructure units by matching the structure of optical film materials (such as prism films, naked-eye grating films, microlens array films, etc.). These optical microstructure units can diffuse, shape, make uniform, focus, image, and modulate the incident light beam of the optical module by adjusting parameters such as shape, focal length, arrangement, and duty cycle, so that the optical module can display specific optical effects. However, in actual use, it is found that the structural setting of this optical microstructure unit is easily affected by the expansion and contraction of the material of the optical film itself, resulting in the pre-arrangement of the optical microstructure in the film material being offset, which in turn causes the alignment deviation between the optical microstructure and the module pixel, seriously affecting the optical display effect of the optical module. Utility Model Content

[0003] The embodiment of the present application provides an optical module, which aims to solve the technical problem that the structural setting mode of the optical microstructure unit of the existing optical module easily leads to alignment deviation between the optical microstructure and the module pixel, thus seriously affecting the optical display effect of the optical module.

[0004] To this end, an embodiment of the present application provides an optical module, including a module body and an optical microstructure component, wherein a plurality of pixel points are evenly arranged on one side surface of the module body, and the optical microstructure component includes a plurality of independently arranged optical microstructures, each of the optical microstructures being arranged corresponding to at least one of the pixel points, all of the optical microstructures being arranged above at least one of the corresponding pixel points, and one optical microstructure being arranged above all of the pixel points.

[0005] Optionally, in some embodiments of the present application, the module body includes a module mainboard and a plurality of chip units, and the plurality of chip units are evenly arranged on a side surface of the module mainboard to form a plurality of pixel points in a one-to-one correspondence, and a side surface of the plurality of chip units away from the module mainboard is also covered with a packaging glue layer.

[0006] Optionally, in some embodiments of the present application, a plurality of groove positions are concavely provided on the surface of the encapsulation glue layer, each of the groove positions is respectively provided corresponding to at least one of the chip units, all of the groove positions are provided above the corresponding at least one of the chip units, and one of the optical microstructures is provided above all of the chip units;

[0007] The plurality of groove positions are arranged in one-to-one correspondence with the plurality of optical microstructures, and each of the optical microstructures is installed in a corresponding groove position.

[0008] Optionally, in some embodiments of the present application, the optical microstructure includes a microstructure body and a microstructure base, the microstructure body is disposed on the top side of the microstructure base, and the microstructure base is embedded in the corresponding groove position.

[0009] Optionally, in some embodiments of the present application, the bottom side of the microstructure base and the corresponding groove bottom of the groove are further fastened together by a first adhesive layer.

[0010] Optionally, in some embodiments of the present application, a plurality of glue overflow grooves are concavely provided on the peripheral side of the microstructure base.

[0011] Optionally, in some embodiments of the present application, each of the optical microstructures is fastened to the surface of the packaging layer via a second adhesive layer.

[0012] Optionally, in some embodiments of the present application, each of the second adhesive layers is disposed on a preset area on the surface of the packaging layer by a steel screen printing structure or a dispensing structure.

[0013] Optionally, in some embodiments of the present application, each of the optical microstructures is fastened to the surface of the packaging glue layer by a geometric fastener.

[0014] Optionally, in some embodiments of the present application, the optical microstructure component includes any one or any combination of a wide-viewing angle microstructure, a brightness enhancement microstructure, a 3D depth of field microstructure, and a photochromic microstructure.

[0015] The technical solution provided by the present application, because the optical microstructure component of the optical module includes a number of independently arranged optical microstructures, and each optical microstructure is independently arranged above at least one corresponding pixel point, so that the installation and fixation of each optical microstructure will not be affected by the installation and fixation of other optical microstructures, nor will it be affected by the spacing between the pixels of the optical module. In this way, the installation and fixation method of the optical microstructure of the optical module will not be affected by the expansion and contraction of the optical film material to cause the alignment deviation between the optical microstructure and the module pixel, nor will it need to re-open the mold and make the optical film material according to the pixel spacing due to the installation needs of the optical module with different pixel spacing, resulting in an exponential increase in the mold cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 This is a schematic top view of a partial structure of an optical module in an embodiment of the present application;

[0018] Figure 2 for Figure 1 A schematic side view of the optical module shown;

[0019] Figure 3 for Figure 1 Another schematic diagram of partial disassembly of the structure of the optical module shown;

[0020] Figure 4 for Figure 2 The assembly diagram of the optical module shown;

[0021] Figure 5 for Figure 1 A schematic diagram of another partial structural disassembly of the optical module shown;

[0022] Figure 6 for Figure 1 A partial schematic diagram of another structure of the optical module shown. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0024] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, the descriptions of "first", "second", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0026] In one embodiment, Figure 1 and Figure 2 As shown, an embodiment of the present application provides an optical module 100, which may specifically include a module body 110 and an optical microstructure component 120. A plurality of pixel points 111 are evenly arranged on a surface of one side of the module body 110. The optical microstructure component 120 includes a plurality of independently arranged optical microstructures 121. Each optical microstructure 121 is arranged corresponding to at least one pixel point 111, and all optical microstructures 121 are arranged above at least one corresponding pixel point 111, and an optical microstructure 121 is arranged above all pixel points 111.

[0027] It can be understood that the optical module 100 of the embodiment of the present application can specifically be an LED display module with a specific optical display effect. The above-mentioned independently arranged several optical microstructures 121 specifically refer to each optical microstructure 121 being independently made, not connected to other optical microstructures 121, and being independent structures. Compared with the existing several optical microstructures directly arranged in the same optical film material, the several optical microstructures 121 of the present application can be obtained by any one of PMMA material, PC material, PS material, silicone material and resin material through mold injection molding and extrusion molding to form independent optical microstructures 121, which are then arranged above the corresponding at least one pixel point 111. Each of the optical microstructures 121 mentioned above is respectively arranged corresponding to at least one pixel point 111, all the optical microstructures 121 are arranged above the corresponding at least one pixel point 111, and an optical microstructure 121 is arranged above all the pixel points 111. Specifically, each optical microstructure 121 can be arranged corresponding to one pixel point 111, or corresponding to multiple pixel points 111 (that is, two or more pixel points 111), so that by setting the optical microstructure 121 above the corresponding pixel point 111 or multiple pixel points 111, the outgoing light beam of the corresponding pixel point 111 or multiple pixel points 111 is diffused, shaped, uniformed, focused, imaged, etc., to obtain the desired optical display effect. At the same time, an optical microstructure 121 is arranged above each pixel point 111 to ensure that the outgoing light beam of each pixel point 111 is modulated accordingly by the corresponding optical microstructure 121.

[0028] In addition, the above-mentioned upper side of the pixel point 111 specifically refers to the side of the pixel point 111 away from the module body 110 , that is, the side of the chip unit mentioned later away from the module main board 112 .

[0029] In this way, the optical module 100 of the embodiment of the present application, because the optical microstructure assembly 120 of the optical module 100 includes a plurality of independently arranged optical microstructures 121, and each optical microstructure 121 is independently arranged above at least one corresponding pixel point 111, so that the installation and fixation of each optical microstructure 121 will not be affected by the installation and fixation of other optical microstructures 121, and will not be affected by the spacing between the pixels 111 of the optical module 100. In this way, the installation and fixation method of the optical microstructure 121 of the optical module 100 will not be affected by the expansion and contraction of the optical film material to cause the alignment deviation between the optical microstructure 121 and the module pixel (i.e., the pixel point 111 mentioned above), and will not need to re-open the mold and manufacture the optical film material according to the pixel spacing due to the installation needs of the optical module 100 with different pixel spacings, resulting in an exponential increase in the mold cost.

[0030] In some examples, such as Figure 1 and Figure 2 As shown, the module body 110 may specifically include a module mainboard 112 and a plurality of chip units, the plurality of chip units are evenly arranged on one side surface of the module mainboard 112 to form a plurality of pixel points 111 in one-to-one correspondence, and a surface of a side of the plurality of chip units away from the module mainboard 111 is also covered with a packaging glue layer 113. Thus, through the above-mentioned structural arrangement, the plurality of pixel points 111 formed by the plurality of chip units in one-to-one correspondence can be covered and protected by the packaging glue layer 113, so as to effectively improve the service life of the plurality of pixel points 111.

[0031] It is understandable that each chip unit may specifically include an R chip, a G chip and a B chip, so as to obtain any color required through a mixed display of the R chip, the G chip and the B chip.

[0032] In some examples, such as Figures 3 to 5 As shown, the surface of the encapsulation glue layer 113 is concavely provided with a plurality of groove positions 114, each groove position 114 is respectively provided corresponding to at least one chip unit, all the groove positions 114 are provided above the corresponding at least one chip unit, and an optical microstructure 121 is provided above all the chip units. The plurality of groove positions 114 are provided in a one-to-one correspondence with the plurality of optical microstructures 121, and each optical microstructure 121 is installed in a corresponding groove position 114. Thus, through the above-mentioned structural setting, each optical microstructure 121 can be embedded and installed in the corresponding groove position 114, so as to ensure that each optical microstructure 121 is installed and fixed more firmly.

[0033] It is understandable that, according to the actual installation and fixing requirements of each optical microstructure 121, the groove clamping position 114 can be specifically set to any shape, including but not limited to, the cross-section of the groove clamping position 114 is a trapezoidal structure (specifically, as shown in FIG. Figure 5 As shown) or I-shaped structure (specifically, as shown Figure 3 and Figure 4 As shown). In this way, it can be further ensured that each optical microstructure 121 is installed and fixed more firmly, so that it is not easy to fall off from the corresponding groove clamping position 114. The groove depth of the groove clamping position 114 can be specifically 0.1mm to 0.5mm. In this way, by setting this parameter, it can be ensured that each optical microstructure 121 is installed and fixed more firmly, and each optical microstructure 121 is closer to the corresponding pixel point 111, so as to ensure its optical modulation effect on the outgoing light beam of the corresponding pixel point 111.

[0034] In some examples, such as Figures 3 to 5As shown, the optical microstructure 121 includes a microstructure body 1211 and a microstructure base 1212, wherein the microstructure body 1211 is arranged on the top side of the microstructure base 1212, and the microstructure base 1212 is embedded in the corresponding groove position 114. Thus, through the above-mentioned structural setting, in each optical microstructure 121, only the microstructure base 1212 is embedded in the corresponding groove position 114, and the microstructure body 1211 is partially or completely exposed outside the corresponding groove position 114, so as to ensure that the optical modulation effect of the microstructure body 1211 on the output light beam of the corresponding pixel point will not be affected by the encapsulation layer 113. Furthermore, the bottom side of the microstructure base 1212 and the groove bottom of the corresponding groove position 114 are further fastened and connected by the first adhesive layer 115. Thus, the first adhesive layer 115 can be further bonded and fixed to ensure that each optical microstructure 121 is installed and fixed more firmly. Furthermore, a plurality of overflow glue grooves 1213 are concavely provided on the peripheral side of the microstructure base 1212. Thus, through the above-mentioned structural setting, when the bottom side of the microstructure base 1212 and the bottom of the corresponding groove clamping position 114 are further fastened and connected through the first adhesive layer 115, the first adhesive layer 115 will be squeezed and flow to the surroundings, so that the first adhesive layer 115 overflows and flows between the groove clamping position 114 and the microstructure base 1212, and the plurality of overflow glue grooves 1213 increase the contact area between the microstructure base 1212 and the first adhesive layer 115, and at the same time, the first adhesive layer 115 is embedded in the microstructure base 1212 to form a whole, and forms a mortise and tenon structure with the groove clamping position 114 on the packaging layer 113, so that the optical microstructure 121 is more firmly fixed on the optical module 100.

[0035] It is understandable that the height of the microstructure base can be specifically 0.1mm to 0.5mm. In this way, by setting this parameter, it is possible to ensure that each optical microstructure 121 is installed and fixed more firmly, while making the microstructure body 1211 of each optical microstructure 121 closer to the corresponding pixel point 111, to ensure its optical modulation effect on the outgoing light beam of the corresponding pixel point 111. The width of the overflow glue groove 1213 is 0.4 to 0.6 times the height of the microstructure base 1212. In this way, by setting this parameter, it is possible to ensure that a plurality of overflow glue grooves 1213 maximize the contact area between the microstructure base 1212 and the first adhesive layer 115, while not adversely affecting the structural strength of the microstructure base 1212 itself.

[0036] In some examples, such as Figure 6As shown, each optical microstructure 121 can be specifically fastened to the surface of the encapsulation layer 113 by a second adhesive layer 116. In this way, the installation and fixation of each optical microstructure 121 on the surface of the encapsulation layer 113 can be effectively achieved through the structural setting of the second adhesive layer 116. Further, each second adhesive layer 116 is set in a preset area on the surface of the encapsulation layer 113 through a steel screen printing structure or a dispensing structure. In this way, through the above structural setting, it can be ensured that each second adhesive layer 116 is efficiently set in a preset area on the surface of the encapsulation layer 113.

[0037] It is understandable that, compared with the whole-surface spraying method, which easily leads to uneven thickness of the optical module 100, the glue dispensing structure in this example can be glued point by point according to the input coordinates, so that only the preset area is provided with the second adhesive layer 116 to ensure the thickness consistency of the optical module 100. The steel mesh printing structure in this example performs full-plate printing of the optical module 100 by steel mesh printing, that is, the steel mesh screen is distributed with through holes in a matrix, and the positions of the through holes correspond to the pixel points 111 of the module one by one. The shape of the through holes can be circular, square, polygonal, etc. The screen and the module are aligned by positioning points, so that each second adhesive layer 116 can be quickly printed above the corresponding pixel point 111 of the module (that is, the preset area on the surface of the encapsulation glue layer 113) through the through hole of the screen, which is more efficient than the glue dispensing structure.

[0038] In addition, each optical microstructure 121 is also fastened to the surface of the packaging glue layer 113 by a geometric fastener (not shown). In this way, the geometric fastener structure can effectively realize the installation and fixation of each optical microstructure 121 on the surface of the packaging glue layer 113, and each optical microstructure 121 can be easily disassembled and replaced according to actual needs.

[0039] In some examples, such as Figures 1 to 4 As shown, the optical microstructure component 120 includes any one or any combination of a wide viewing angle microstructure, a brightness enhancement microstructure, a 3D depth of field microstructure, and a photochromic microstructure. Thus, through the above-mentioned structural setting, the various types of optical microstructures can be placed differently according to the actual optical effect display requirements of the optical module to achieve a variety of optical functions such as wide viewing angle, brightness enhancement, or parallax effect.

[0040] In some examples, such as Figures 1 to 4 As shown, the microstructure body 1211 mentioned in the above example can be made of any one of PMMA, PC, PS, silicone and resin materials through mold injection and extrusion. Thus, through the above structural setting, the microstructure body 1211 can be formed into any shape and any desired microstructure according to actual needs.

[0041] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that: It comprises a module body and an optical microstructure component, wherein a plurality of pixel points are evenly arranged on one side surface of the module body, and the optical microstructure component comprises a plurality of independently arranged optical microstructures, each of the optical microstructures being arranged corresponding to at least one of the pixel points, all of the optical microstructures being arranged above at least one of the corresponding pixel points, and one of the optical microstructures being arranged above all of the pixel points.

2. The optical module according to claim 1, characterized in that: The module body includes a module mainboard and a plurality of chip units, wherein the plurality of chip units are evenly arranged on one side surface of the module mainboard to form a plurality of pixel points in a one-to-one correspondence, and a surface of the plurality of chip units on one side away from the module mainboard is also covered with a packaging glue layer.

3. The optical module according to claim 2, characterized in that: The surface of the packaging glue layer is concavely provided with a plurality of groove positions, each of which corresponds to at least one chip unit, and all of the groove positions are arranged above the corresponding at least one chip unit, and one groove position is arranged above all of the chip units; The plurality of groove positions are arranged in one-to-one correspondence with the plurality of optical microstructures, and each of the optical microstructures is installed in a corresponding groove position.

4. The optical module according to claim 3, characterized in that: The optical microstructure comprises a microstructure body and a microstructure base, wherein the microstructure body is arranged on the top side of the microstructure base, and the microstructure base is embedded in the corresponding groove position.

5. The optical module according to claim 4, characterized in that: The bottom side of the microstructure base is further fastened to the bottom of the corresponding groove of the groove through a first adhesive layer.

6. The optical module according to claim 5, characterized in that: A plurality of overflow glue grooves are also concavely provided on the peripheral side of the microstructure base.

7. The optical module according to claim 2, characterized in that: Each of the optical microstructures is fastened to the surface of the packaging glue layer through a second adhesive layer.

8. The optical module according to claim 7, characterized in that: Each of the second adhesive layers is disposed on a preset area on the surface of the packaging layer by a steel screen printing structure or a dispensing structure.

9. The optical module according to claim 2, characterized in that: Each of the optical microstructures is fastened to the surface of the packaging glue layer through a geometric fastener.

10. The optical module according to any one of claims 1 to 9, characterized in that: The optical microstructure component includes any one or any combination of a wide-viewing angle microstructure, a brightness enhancement microstructure, a 3D depth of field microstructure, and a photochromic microstructure.

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