Chip optical packaging structure

Abstract

The utility model discloses a chip optical packaging structure. The chip optical packaging structure comprises two optical interconnection structures, the at least one multi-core optical fiber is connected with the two optical interconnection structures; in the direction from outside to the multi-core optical fiber, the optical interconnection structure comprises at least one silicon optical chip, at least one micro-lens array and a laser direct writing chip, and the number and the position of chip optical waveguides of the silicon optical chip are in one-to-one correspondence with the number and the position of micro-lenses in the micro-lens array; in the laser direct-writing chip, at one end close to the micro-lens array, the centers of the end surfaces of the plurality of direct-writing optical waveguides are arranged along a straight line to form a two-dimensional planar waveguide; at one end far away from the micro-lens array, the centers of the peripheral waveguide end surfaces of the plurality of direct writing optical waveguides enclose a circle to form a three-dimensional optical waveguide; the direct writing optical waveguides at the end face of the three-dimensional optical waveguide are in one-to-one correspondence with fiber cores of the multi-core optical fiber. The optical paths of the at least two silicon optical chips are coupled and connected through the micro-lens array, the laser direct writing chip and the multi-core optical fiber, so that the optical path difference between the chips can be effectively controlled.

Description

Technical Field

[0001] The utility model embodiment relates to the field of chip packaging technology, and in particular to a chip optical packaging structure. Background Art

[0002] Quantum computing has developed rapidly in recent years, and has made great progress in two important aspects: the number of quantum bits and the precision of operation. Various physical systems, such as ion traps, superconductors, optical lattices, optical tweezer atoms, silicon quantum dots, and optical quantum computing, are all developing rapidly in the direction of miniaturization and integration.

[0003] Optical quantum computing has also made some progress in miniaturization and integration. Based on the electro-optical and thermo-optical effects of materials, and compatible with existing precision processing technology, hundreds of adjustable devices such as quantum entanglement sources and multi-mode interferometers are integrated into the same centimeter-sized chip. The chip is packaged using optical fiber and electronic control devices. The light source is input into the optical chip through optical fiber, and the phase of a single beam splitter in the chip is adjusted by external electricity and heat. The chip then outputs the modulated optical signal through optical fiber to the receiving device and converts it into an electrical signal, thereby realizing a programmable large-scale optical quantum computing chip.

[0004] For a single silicon photonic chip, optical packaging can be completed by using an ordinary optical fiber array for end-face coupling. For some optical quantum computing, two optical chips need to be directly connected in series to obtain the desired optical quantum computing results. Optical quantum computing has extremely high requirements for the optical path difference of entangled light, requiring that the physical path difference of light in each connected optical waveguide is less than 100 microns, and the relative phase of each optical path is stable.

[0005] If the two chips are connected by direct coupling using an ordinary optical fiber array, the length of the fiber pigtail is generally greater than 1 meter, and the consistency of each channel length is difficult to control at the micron level, which will lead to a large difference in optical path and fail to meet the requirements. Moreover, if there are many optical waveguide channels in the package, and the two chips are connected by an ordinary optical fiber array, the system will appear to be more messy, affecting the accuracy of large-scale optical quantum computing. Utility Model Content

[0006] The utility model provides a chip optical packaging structure, which directly connects the optical paths of two silicon photonic chips through a microlens array, a laser direct writing chip and a multi-core optical fiber, and can effectively control the optical path difference between the chips.

[0007] In a first aspect, the present application provides a chip optical packaging structure, comprising:

[0008] two optical interconnect structures;

[0009] At least one multi-core optical fiber, used to connect the two optical interconnection structures;

[0010] From the outside to the direction of the multi-core optical fiber, the optical interconnection structure includes:

[0011] at least one silicon photonic chip, wherein the silicon photonic chip comprises a plurality of chip optical waveguides;

[0012] At least one microlens array, the microlens array comprising a plurality of microlenses, the number and positions of the chip optical waveguides respectively corresponding to the number and positions of the microlenses;

[0013] A laser direct writing chip, comprising a plurality of direct writing optical waveguides, wherein at one end close to the microlens array, the centers of the end faces of the plurality of direct writing optical waveguides are arranged along a straight line to form a two-dimensional planar waveguide; at one end away from the microlens array, the centers of the peripheral waveguide end faces of the plurality of direct writing optical waveguides are arranged in a circle to form a three-dimensional optical waveguide;

[0014] The multi-core optical fiber includes a plurality of cores, and each direct-writing optical waveguide at the end face of the three-dimensional optical waveguide corresponds one-to-one to the cores of the multi-core optical fiber.

[0015] Optionally, the spacing between the plurality of chip optical waveguides is the same as the spacing between the centers of the microlenses.

[0016] Optionally, the spacing between the centers of the direct-writing optical waveguides at the end face of the two-dimensional planar waveguide is the same as the spacing between the centers of the chip optical waveguides.

[0017] Optionally, the lengths of the multiple direct-writing optical waveguides in the laser direct-writing chip are the same.

[0018] Optionally, the focus of the microlens is on the end faces of the chip optical waveguide and the two-dimensional planar waveguide; or, the focus of the microlens is within a preset range of the end face of the chip optical waveguide.

[0019] Optionally, each direct-writing optical waveguide at the end face of the three-dimensional optical waveguide is arranged to fit the core end face of the multi-core optical fiber.

[0020] Optionally, the diameter of the fiber core is the same as the end face diameter of the direct-writing optical waveguide.

[0021] Optionally, the cladding shape of the multi-core optical fiber is a cylinder.

[0022] Optionally, the silicon photonic chip is a semiconductor photonic quantum chip based on silicon and silicon-based substrate materials, integrating multiple integrated silicon photonic devices.

[0023] In summary, the chip optical packaging structure provided in the present application adopts a microlens array, a laser direct writing chip and a multi-core optical fiber for coupling and series connection to replace the conventional optical fiber array, which has the advantages of small optical path and high integration, and can ensure that the optical path in each optical path between chips is consistent and the relative phase is stable. At the same time, according to the needs of quantum computing, the number of silicon photonic chips can be reasonably set, and in optical path transmission and computing applications, the accuracy and data volume of quantum computing can be greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of a chip optical packaging structure provided by the present application;

[0025] Figure 2 is a top view schematic diagram of a connection optical path of an optical interconnection structure provided by the present application;

[0026] Figure 3 It is a schematic diagram of the optical path connecting a laser direct writing chip and a multi-core optical fiber provided by the present application;

[0027] Figure 4 is a schematic diagram of a multi-core optical fiber provided by the present application;

[0028] Figure 5 is a schematic diagram of another chip optical packaging structure provided by the present application;

[0029] Figure 6 is a schematic diagram of another chip optical packaging structure provided by the present application;

[0030] Figure 7 It is a schematic diagram of another chip optical packaging structure provided in this application.

[0031] The accompanying drawings are as follows:

[0032] 1. Optical interconnection structure; 10. Multi-core optical fiber; 20. Silicon photonic chip; 30. Microlens array; 40. Laser direct writing chip; 11. Fiber core; 21. Chip optical waveguide; 31. Microlens; 41. Direct writing optical waveguide. DETAILED DESCRIPTION

[0033] The utility model is further described in detail below in conjunction with the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only the parts related to the present application rather than all structures are shown in the accompanying drawings. Various modifications and changes can be made in the present application without departing from the spirit or scope of the present application, which is obvious to those skilled in the art. Therefore, the present application is intended to cover the modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0034] The utility model proposes a chip optical packaging structure in view of one or more of the above problems existing in the prior art. Figure 1 is a schematic diagram of a chip optical packaging structure provided by the present application;

[0035] Figure 2 is a top view schematic diagram of a connection optical path of an optical interconnection structure provided by the present application; Figure 3 It is a schematic diagram of the optical path connecting a laser direct writing chip and a multi-core optical fiber provided by the present application; Figure 4 is a schematic diagram of a multi-core optical fiber provided by the present application; Figure 5 is a schematic diagram of another chip optical packaging structure provided by the present application; Figure 6 is a schematic diagram of another chip optical packaging structure provided by the present application; Figure 7 It is a schematic diagram of another chip optical packaging structure provided in this application.

[0036] Reference Figure 1-Figure 7 As shown, the chip optical packaging structure provided by the embodiment of the present application includes two optical interconnect structures 1 and at least one multi-core optical fiber 10, and the multi-core optical fiber 10 is used to connect the two optical interconnect structures 1; from the outside to the multi-core optical fiber 10, the optical interconnect structure 1 includes at least one silicon photonic chip 20, at least one microlens array 30 and a laser direct writing chip 40, and the silicon photonic chip 20 includes a plurality of chip optical waveguides 21; the microlens array 30 includes a plurality of microlenses 31, and the number and position of the chip optical waveguides 21 are respectively The number and position of the direct-writing optical waveguides 41 correspond one to one; the laser direct-writing chip 40 includes a plurality of direct-writing optical waveguides 41. At one end close to the microlens array 30, the end faces of the plurality of direct-writing optical waveguides 41 are arranged along a straight line to form a two-dimensional planar waveguide; at one end away from the microlens array 30, the centers of the outer waveguide end faces of the plurality of direct-writing optical waveguides 41 form a circle to form a three-dimensional optical waveguide; the multi-core optical fiber 10 includes a plurality of fiber cores 11, and each direct-writing optical waveguide 41 at the end face of the three-dimensional optical waveguide corresponds one to one to the fiber cores 11 of the multi-core optical fiber 10.

[0037] Specifically, refer to Figure 1 , Figure 5-Figure 7 As shown, the chip optical packaging structure mainly includes three parts, two optical interconnection structures 1 arranged on the left and right, and a multi-core optical fiber 10 connecting the two optical interconnection structures 1. Among them, the optical interconnection structure 1 can also be called an optical interconnection module.

[0038] The optical interconnection structure 1 mainly includes three parts, which are respectively coupled in series by a silicon photonic chip 20, a microlens array 30 and a laser direct writing chip 40 from the outside to the multi-core optical fiber 10. The multi-core optical fiber 10 is the connection end of the two optical interconnection structures 1.

[0039] In some embodiments, Figure 1 As shown in FIG. 1 , in the optical interconnection structures 1 on the left and right sides, the numbers of silicon photonic chips 20 , microlens arrays 30 and laser direct writing chips 40 may be the same.

[0040] refer to Figure 1 As shown, the optical interconnect structure 1 is exemplarily described in a manner that a silicon photonic chip 20, a microlens array 30 and a laser direct writing chip 40 are coupled in series.

[0041] Specifically, refer to Figure 2 As shown, the multiple chip optical waveguides 21 of the silicon photonic chip 20 are usually arranged in a straight line, and each chip optical waveguide 21 is an optical channel that emits an optical signal. Silicon photonic chips 20 with different specifications and parameters have the same or different numbers of chip optical waveguides 21. Among them, the silicon photonic chip 20 used in this application is a semiconductor photonic quantum chip based on silicon and silicon-based substrate materials, integrating multiple integrated silicon photonic devices, which can be applied to large-scale photonic quantum computing and information processing, and has the advantages of high integration, high precision, high stability, etc.

[0042] refer to Figure 1 and Figure 2 As shown, the microlens array 30 is arranged at the exit end of the chip optical waveguide 21, and is composed of a plurality of microlenses 31 arranged in an array, which has the function of converging light beams. According to the number, diameter, arrangement direction, and arrangement position of the chip optical waveguides 21, the present application arranges microlenses 31 of the same number, arrangement direction, and arrangement position on the exit end face of the chip optical waveguide 21, and uses the microlenses 31 to converge the light emitted from each chip optical waveguide 21.

[0043] For example, Figure 1As shown, micro-optical technology can be used to manufacture the microlens array 30, such as arranging a plurality of microlenses 31 with the same parameter specifications on the same plane according to a certain period to form the microlens array 30. In some embodiments, considering the diameter size of the chip optical waveguide 21, the diameter range of the microlens array 30 is in the order of millimeters, micrometers, and nanometers. It should be noted that the microlens array 30 of this size needs to be observed with a microscope, a scanning electron microscope, an atomic force microscope, etc., and has the advantages of small size, light weight, easy integration, and arraying.

[0044] Among them, micro-optics technology is an optical technology that combines microelectronics and micromechanics, involving the design, manufacture and application of optical components of micron or submicron size. This technology breaks the traditional thinking framework of macroscopic space scale and realizes functions such as processing, transmission and imaging of optical information through tiny optical components.

[0045] Continue to refer Figure 1-Figure 2 As shown, the laser direct writing chip 40 is arranged on the optical axis of the micro lens array 30, and is composed of a plurality of direct writing optical waveguides 41. The direct writing optical waveguides 41 can transmit the optical signal converged by the micro lens 31. Figure 1-Figure 3 As shown, at one end close to the microlens array 30, the end faces of a plurality of direct-writing optical waveguides 41 are arranged in a straight line along the arrangement direction of the microlenses 31. Figure 1-Figure 3 A two-dimensional planar waveguide is formed in the Y direction as shown; at one end away from the microlens array 30, the center of the peripheral waveguide end faces of the plurality of direct-writing optical waveguides 41 are surrounded by a circle. Figure 3 A three-dimensional optical waveguide is formed on the ZY plane shown.

[0046] Exemplarily, femtosecond laser direct writing technology can be used to produce mutual influence of light, heat, and electrical parameters on specific materials, forming a three-dimensional optical waveguide array inside a transparent solid medium. It has high-precision, true three-dimensional processing capabilities and can accurately control the parameters and array structure of the direct-writing optical waveguide 41 in the laser direct-writing chip 40.

[0047] Among them, femtosecond laser direct writing technology is a technology that uses femtosecond lasers to rapidly manufacture three-dimensional micro-nano structures. This technology mainly relies on the two-photon polymerization effect to build three-dimensional structures in photosensitive materials. The characteristics of femtosecond lasers are their ultra-short pulse time and ultra-high peak power, which can emit huge power in an instant.

[0048] Reference Figure 1-Figure 4 As shown, the multicore optical fiber 10 is arranged on the peripheral waveguide end face of a three-dimensional optical waveguide formed by multiple direct writing optical waveguides 41. In some embodiments, the multicore optical fiber 10 can be a new type of optical fiber with a cladding diameter of 125 μm and multiple fiber cores 11 coated inside.

[0049] Exemplarily, the diameter of the fiber core 11 is ≥ 2 μm. Optionally, the cladding shape of the multi-core optical fiber 10 is cylindrical. Compared with ordinary single-core optical fibers, the multi-core optical fiber 10 can simultaneously transmit multiple optical signals in one optical fiber, which can greatly improve the communication capacity, has the characteristics of high-density channels and low crosstalk, and has broad application prospects in communications and other aspects.

[0050] The silicon photonic chips 20 in the optical interconnect structures 1 on the left and right sides can simultaneously transmit and receive optical signals. Figure 1 As shown, the optical signal emitted by the silicon photonic chip 20 on the left is taken as an example. Specifically, the optical signal emitted from the chip optical waveguide 21 of the silicon photonic chip 20 on the left is converged to the laser direct writing chip 40 through the one-to-one corresponding microlenses 31. The direct writing optical waveguide 41 of the laser direct writing chip 40 converts the optical path of the two-dimensional plane into three dimensions, and transmits it to the one-to-one corresponding fiber core 11 channel of the multi-core optical fiber 10, and then passes through the other end of the multi-core optical fiber 10 to the laser direct writing chip 40 of the optical interconnection structure 1 on the right. This laser direct writing chip 40 converts the three-dimensional optical path into two dimensions again, and then also converges to the waveguide of the silicon photonic chip 20 on the right through the microlens array 30, realizing the sending-receiving mode of the optical signal from the silicon photonic chip 20 on the left to the silicon photonic chip 20 on the right.

[0051] In other embodiments, the silicon photonic chips 20 on the left and right sides can simultaneously transmit and receive optical signals without affecting each other. Specifically, based on the emission of optical signals by the silicon photonic chip 20 on the left, the silicon photonic chip 20 on the right also emits optical signals. The optical signals emitted from the chip optical waveguide 21 of the silicon photonic chip 20 on the right are converged to the laser direct writing chip 40 through the one-to-one corresponding microlenses 31. The direct writing optical waveguide 41 of the laser direct writing chip 40 converts the two-dimensional plane optical path into three dimensions, and transmits it to the one-to-one corresponding fiber core 11 channel of the multi-core optical fiber 10, and then passes through the other end of the multi-core optical fiber 10 to the laser direct writing chip 40 of the left optical interconnection structure 1. This laser direct writing chip 40 converts the three-dimensional optical path into two dimensions again, and then converges to the waveguide of the silicon photonic chip 20 on the left through the microlens array 30, thereby realizing the transmission-reception mode of optical signals from the right silicon photonic chip 20 to the left silicon photonic chip 20, that is, realizing the transmission-reception mode of bidirectional optical signals.

[0052] The present application uses a microlens array 30 to transmit the optical signal in the silicon photonic chip 20 to the laser direct writing chip 40, and uses spatial light to complete the transmission of the light wave, which can avoid the optical path difference generated by using ordinary optical fiber array transmission, and realize the silicon photonic chip 20 to receive and calculate the optical signal, thereby improving the calculation accuracy of applications such as quantum computing. The bidirectional optical signal transmission-reception mode is realized, which will not be described in detail here.

[0053] In some embodiments, the number of silicon photonic chips can be reasonably set according to the requirements of quantum technology calculations, and the device parameter specifications of the silicon photonic chips 20, the microlens array 30 and the laser direct writing chip 40 on the left and right sides can be set to be the same, not completely the same, or different. In optical path transmission and computing applications, the accuracy and data volume of quantum computing can be greatly improved.

[0054] In some embodiments, Figure 5 As shown, the optical interconnection structure 1 on the left side is composed of two silicon photonic chips 20, two groups of microlens arrays 30 and a laser direct writing chip 40, and the optical interconnection structure 1 on the right side is composed of a silicon photonic chip 20, two groups of microlens arrays 30 and a laser direct writing chip 40; the number and position of the direct writing optical waveguides 41 in the laser direct writing chip 40 correspond to the number and position of each group of microlenses 31 and the chip optical waveguide 21; a multi-core optical fiber 10 is used to couple and connect with the direct writing optical waveguides 41 of the optical interconnection structure 1 on both sides.

[0055] In some embodiments, Figure 6 As shown, the optical interconnection structure 1 on the left is composed of two silicon photonic chips 20, two groups of microlens arrays 30 and a laser direct writing chip 40, and the optical interconnection structure 1 on the right is composed of three silicon photonic chips 20, three groups of microlens arrays 30 and a laser direct writing chip 40. The number and position of the direct writing optical waveguides 41 in the laser direct writing chip 40 correspond to the number and position of each group of microlenses 31 and the chip optical waveguide 21; a multi-core optical fiber 10 is used to couple and connect with the direct writing optical waveguides 41 of the optical interconnection structure 1 on both sides.

[0056] In some embodiments, Figure 7 As shown, the optical interconnection structure 1 on the left is composed of two silicon photonic chips 20, two groups of microlens arrays 30 and a laser direct writing chip 40, and the optical interconnection structure 1 on the right is composed of a silicon photonic chip 20, two groups of microlens arrays 30 and a laser direct writing chip 40. The number and position of the direct writing optical waveguides 41 in the laser direct writing chip 40 correspond to the number and position of each group of microlenses 31 and the chip optical waveguide 21; two multi-core optical fibers 10 are respectively coupled and connected to the direct writing optical waveguides 41 of the optical interconnection structure 1 on both sides.

[0057] It should be noted that Figure 5-Figure 7 In the figure, the laser direct writing chip 40 can be an integrated setting, or two laser direct writing chips 40 can be combined and stacked, as long as the number and position of the direct writing optical waveguides 41 in the laser direct writing chip 40 correspond to the number and position of each group of microlenses 31 and chip optical waveguides 21; one or more multi-core optical fibers 10 are set according to the number of channels of the optical signal and the number of optical cores in each multi-core optical fiber 10.

[0058] In summary, the chip optical packaging structure provided in the present application adopts a microlens array, a laser direct writing chip and a multi-core optical fiber for coupling and series connection to replace the conventional optical fiber array. It has the advantages of small optical path and high integration. It can ensure that the optical path in each optical path between chips is consistent and the relative phase is stable, which is conducive to improving the accuracy of quantum computing.

[0059] Based on the above embodiments, continue to refer to Figure 2 As shown, the spacing between the plurality of chip optical waveguides 21 is the same as the spacing between the centers of the microlenses 31 .

[0060] For example, Figure 2 As shown, the spacing between two adjacent chip optical waveguides 21 and the spacing between the centers of two adjacent microlenses 31 are both set to a, for example, a=127 μm. In this way, the microlenses 31 can be used to converge the optical signals emitted from the chip optical waveguides 21 into the direct writing optical waveguide 41 .

[0061] Optional, continue to refer to Figure 1-Figure 2 As shown, the focus of the microlens 31 is on the end faces of the chip optical waveguide 21 and the two-dimensional planar waveguide; or, the focus of the microlens 31 is within a preset range of the end face of the chip optical waveguide 21 .

[0062] For details, please refer to Figure 1-Figure 2 As shown, the two focal points of the microlens 31 are respectively arranged on the end faces of the two-dimensional optical waveguide formed by the chip optical waveguide 21 and the direct writing optical waveguide 41, or within an error range of ±2um inside and outside the end face. Such an arrangement is beneficial for the microlens 31 to transmit all the light on the end face of the microlens 31, avoiding light leakage, thereby improving the coupling efficiency of the microlens 31.

[0063] Based on the above embodiments, continue to refer to Figure 2 As shown, the spacing a between the centers of the direct-writing optical waveguides 41 at the end face of the two-dimensional planar waveguide is the same as the spacing a between the centers of the chip optical waveguides 21 .

[0064] For details, please refer to Figure 2 As shown, such an arrangement realizes a one-to-one correspondence between the number and position of the microlenses 31 and the two-dimensional planar waveguide of the laser direct writing chip 40. The laser direct writing chip 40 converts the optical signal emitted by the lens from two-dimensional to three-dimensional, which can be directly coupled with the multi-core optical fiber 10 behind it.

[0065] Based on the above embodiments, continue to refer to Figure 2 As shown, the lengths of the multiple direct-writing optical waveguides 41 in the laser direct-writing chip 40 are the same.

[0066] Specifically, a laser direct writing chip 40 is used to convert the two-dimensional plane light wave signal into three dimensions, and matched with the multi-core optical fiber 10 for transmission, ensuring that the lengths of the optical fibers are consistent and the relative phases are stable, making full use of the three-dimensional space vector characteristics of photons, saving space, and increasing information transmission capacity and density.

[0067] On the basis of the above embodiment, each direct-writing optical waveguide 41 at the end face of the three-dimensional optical waveguide is bonded to the end face of the core 11 of the multi-core optical fiber 10, so that optical adhesive can be used for bonding to reduce light leakage and improve coupling efficiency.

[0068] On the basis of the above embodiment, the diameter of the fiber core 11 is the same as the end face diameter of the direct writing optical waveguide 41, which is beneficial to the bidirectional transmission of optical signals and reduces the loss of optical signal transmission.

[0069] In some embodiments, continue to refer to Figure 1 As shown, the two optical interconnect structures 1 are symmetrically arranged with the multi-core optical fiber 10 as the symmetry axis.

[0070] Specifically, Figure 1 As shown, the device parameter specifications of the two optical interconnect structures 1 on the left and right sides are the same. Figure 1 As shown, each optical interconnection structure 1 is composed of a silicon photonic chip 20, a microlens array 30 and a direct writing chip 40, and the two optical interconnection structures 1 are connected to each other with the middle part of the multi-core optical fiber 10 as the symmetry axis.

[0071] In response to certain requirements of optical quantum computing, the present invention uses a microlens array 30 to couple the optical signal in the silicon photonic chip 20 into the laser direct writing chip 40, and then couples it with the multi-core optical fiber 10, so that the two silicon photonic chips 20 are coupled and connected, which can effectively control the optical path difference.

[0072] Continue to refer to Figure 1 As shown, the optical packaging process is as follows:

[0073] (1) Align each microlens 31 in the microlens array 30 with the chip optical waveguide 21 in the first silicon photonic chip 20 on the left in terms of spatial position, and then use optical glue to bond and fix the lower surface of the microlens array 30.

[0074] (2) Align the direct writing optical waveguide 41 of the laser direct writing chip 40 with each optical path coupling of the microlens array 30, and use optical glue to bond and fix the lower surface of the laser direct writing chip 40.

[0075] (3) The end face of the multi-core optical fiber 10 is coupled with the end face of the laser direct writing chip 40, and refractive index matching optical glue is dripped on the end faces of the two ends, and it is cured using ultraviolet (UV) light.

[0076] (4) Couple the tail fiber of the multi-core optical fiber 10 with the direct writing optical waveguide 41 of the laser direct writing chip 40 on the right, and then align the laser direct writing chip 40 with the microlens 31 of the microlens array 30; couple and align the microlens 31 of the microlens array 30 with the second silicon photonic chip 20 on the right, and complete the entire optical package in which the two silicon photonic chips 20 are directly connected.

[0077] In practical applications, the silicon photonic chips 20 in the optical interconnection structures 1 on the left and right sides can transmit optical signals at the same time, or either of the two can transmit optical signals.

[0078] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A chip optical packaging structure, characterized in that: include: two optical interconnect structures; At least one multi-core optical fiber, used to connect the two optical interconnection structures; From the outside toward the multi-core optical fiber, the optical interconnection structure includes: at least one silicon photonic chip, wherein the silicon photonic chip comprises a plurality of chip optical waveguides; At least one microlens array, the microlens array comprising a plurality of microlenses, the number and positions of the chip optical waveguides respectively corresponding to the number and positions of the microlenses; A laser direct writing chip, comprising a plurality of direct writing optical waveguides, wherein at one end close to the microlens array, the centers of the end faces of the plurality of direct writing optical waveguides are arranged along a straight line to form a two-dimensional planar waveguide; at one end away from the microlens array, the centers of the peripheral waveguide end faces of the plurality of direct writing optical waveguides are arranged in a circle to form a three-dimensional optical waveguide; The multi-core optical fiber includes a plurality of cores, and each direct-writing optical waveguide at the end face of the three-dimensional optical waveguide corresponds one-to-one to the cores of the multi-core optical fiber.

2. The chip optical packaging structure according to claim 1, characterized in that: The spacing between the plurality of chip optical waveguides is the same as the spacing between the centers of the microlenses.

3. The chip optical packaging structure according to claim 1, characterized in that: The spacing between the centers of the direct-writing optical waveguides at the end face of the two-dimensional planar waveguide is the same as the spacing between the centers of the chip optical waveguides.

4. The chip optical packaging structure according to claim 2, characterized in that: The lengths of the multiple direct-writing optical waveguides in the laser direct-writing chip are the same.

5. The chip optical packaging structure according to claim 1, characterized in that: The focus of the microlens is on the end faces of the chip optical waveguide and the two-dimensional planar waveguide; or, The focal point of the microlens is within a preset range of the end face of the chip optical waveguide.

6. The chip optical packaging structure according to claim 1, characterized in that: Each direct-writing optical waveguide at the end face of the three-dimensional optical waveguide is arranged in contact with the core end face of the multi-core optical fiber.

7. The chip optical packaging structure according to claim 1, characterized in that: The diameter of the fiber core is the same as the end face diameter of the direct writing optical waveguide.

8. The chip optical packaging structure according to claim 1, characterized in that: The cladding shape of the multi-core optical fiber is a cylinder.

9. The chip optical packaging structure according to claim 1, characterized in that: The silicon photonic chip is a semiconductor photonic quantum chip based on silicon and silicon-based substrate materials, integrating multiple integrated silicon photonic devices.

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