Semiconductor wafer processing equipment

Abstract

The utility model relates to the technical field, and provides semiconductor wafer processing equipment, which comprises a device bottom bin, a supporting rod and a driving motor, the supporting rod is arranged at the top end of the device bottom bin, a top plate is welded at one end of the supporting rod far away from the device bottom bin, and the driving motor is arranged on the outer wall of the top end of the top plate. A driving shaft of the driving motor penetrates through the outer wall of the top plate to be connected with a driving roller, a driven roller is movably installed at the bottom end of the top plate through a bearing, a belt is installed on the outer wall of the driving roller and the outer wall of the driven roller, a transmission block is installed on the outer wall of the belt, and first limiting grooves are symmetrically formed in the bottom end of the top plate; a transmission plate is movably mounted on the top plate through the first limiting grooves, first limiting blocks are symmetrically arranged at the top end of the transmission plate, a sliding groove is formed in the bottom end of the transmission plate, and the transmission blocks are movably mounted in the sliding groove. According to the technical scheme, the problems that in the prior art, wafers cannot be comprehensively dried, and the cleaning efficiency is low are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, and in particular to a semiconductor wafer processing device. Background Art

[0002] Semiconductor wafer processing equipment is key equipment used to manufacture and process integrated circuits (ICs) or chips, and these equipment play a vital role in the semiconductor industry.

[0003] The patent specification with the announcement number CN 2183514 discloses a semiconductor wafer processing device, which includes a device main box through a setting domain, and a processing platform is arranged on the top of the device main box. The utility model uses the device main box, and the user opens the device main box and injects an appropriate amount of chemical cleaning liquid into the liquid storage barrel. The user places the semiconductor wafer in the processing platform, and then turns on the water pump. The water pump operates to suck the chemical cleaning liquid through the water inlet and injects it into the processing platform through the water outlet pipe, so that the semiconductor wafer can be cleaned. After the cleaning is completed, the drainage valve is opened, and the liquid in the processing platform will flow to the drainage pipe through the liquid accumulation funnel and be injected into the sedimentation barrel for sedimentation. Then the air pump is turned on, and the air pump operates to suck air through the air inlet and spray it from the air nozzle through the exhaust pipe, so that the semiconductor wafer can be dried and cleaned, thereby realizing a semiconductor wafer processing device cleaning and drying.

[0004] However, in the implementation of relevant technologies, it was found that the above-mentioned semiconductor wafer processing equipment has the following problems: the device uses a nozzle to blow dry the cleaning liquid on the surface of the wafer, but the nozzle is fixed in position and cannot fully dry the wafer. At the same time, when the device is cleaning, it is affected by the structure of the processing platform and cannot fully clean the wafer. At the same time, no filtering structure is set when the cleaning liquid is recycled, and direct recycling affects the cleaning effect. For this reason, we propose a semiconductor wafer processing equipment problem. Utility Model Content

[0005] The utility model provides a semiconductor wafer processing device, which solves the problem in the related art that the wafer cannot be fully dried and the cleaning efficiency is low.

[0006] The technical solution of the utility model is as follows:

[0007] The transmission mechanism that the transmission mechanism is used for the transmission gear is that the transmission gear of the transmission gear is connected with the transmission gear of the transmission gear to the transmission gear of the transmission gear.

[0008] Preferably, a liquid inlet is installed at the top of the bottom bin of the device, the liquid inlet penetrates the inner wall of the bottom bin of the device and is communicated with the bottom bin of the device, a reflux pipe is installed at the top of the bottom bin of the device, the top of the reflux pipe is connected to a leakage bin, a processing bin is installed at the top of the leakage bin, a leakage cavity is provided on the inner wall of the processing bin, second limiting grooves are symmetrically provided on the outer walls on both sides of the processing bin, a cleaning plate is movably installed on the processing bin through the second limiting groove, and second limiting blocks are symmetrically installed on both sides of the cleaning plate.

[0009] Preferably, a water pump is installed on the inner wall of the bottom end of the bottom bin of the device, a guide pipe is connected to one side of the water pump, a liquid outlet pipe is connected to the top of the water pump, the liquid outlet pipe passes through the outer wall of the bottom bin of the device and communicates with the liquid leakage chamber, and a valve is installed on the outer wall of the liquid outlet pipe.

[0010] Preferably, through holes are evenly arranged on one side of the second limiting groove, and the through holes penetrate the outer wall of the processing chamber.

[0011] Preferably, the first limiting block is T-shaped, and the first limiting block and the first limiting groove match each other.

[0012] Preferably, the transmission block is in a right-angle shape, and a convex body is provided at one end of the transmission block, and the convex body matches the slide groove.

[0013] Preferably, the second limiting groove is trapezoidal, and the second limiting groove and the second limiting block match each other.

[0014] Preferably, a filter layer is installed on the inner wall of the reflux pipe, and the filter layer is composed of activated carbon.

[0015] The working principle and beneficial effects of the utility model are:

[0016] 1. In the utility model, the driving motor, the transmission block and the first limit block are set, and the active roller is driven to rotate by starting the processing chamber, and the belt transmission movement is driven by the active roller to drive the driven roller to rotate, and the transmission block is driven to move along the transmission track of the belt through the belt transmission movement, and the transmission plate is transmitted by the movement of the transmission block, and the limiting effect of the transmission plate is utilized by the first limit block and the first limit groove, and the moving direction of the transmission block is changed by the slide groove, so as to change the transmission direction of the transmission plate, so that the first limit block reciprocates and performs uniform linear motion, thereby driving the fan to move back and forth to dry the wafers placed above the cleaning plate below, and this structure can fully dry the wafers below.

[0017] 2. In the utility model, the processing bin, cleaning plate and water pump are provided, and the cleaning plate is slid by the second limit block according to the chip specifications, so as to change the spacing between the cleaning plates for better placement of the chips. After the chips are placed, the cleaning liquid inside the bottom bin of the device is transmitted to the inside of the leakage cavity provided on the inner wall of the processing bin through the liquid outlet pipe through the water pump. Through the through holes evenly provided on the inner wall of the leakage cavity, the cleaning liquid is evenly sprayed out from the inner wall of the processing bin to continuously clean the chips below. The cleaning liquid flows along the cleaning plate to the inner wall of the leakage bin, converges to the bottom end and flows to the inner wall of the reflux pipe, and is filtered and refluxed to the inside of the bottom bin of the device through the filter layer provided inside the reflux pipe. This structure can not only utilize the cleaning liquid through filtering and circulation, but also has a faster cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0019] Figure 1 This is a schematic diagram of the main structure of the device proposed by the utility model;

[0020] Figure 2 This is a schematic diagram of the half-section structure of the device body proposed by the utility model;

[0021] Figure 3 This is a schematic diagram of the chute structure proposed by the utility model;

[0022] Figure 4 This is a schematic diagram of the fan structure proposed by the utility model;

[0023] Figure 5 This is a schematic diagram of the liquid leakage chamber structure proposed by the utility model.

[0024] In the figure: 1. bottom bin of the device; 2. reflux pipe; 3. leakage bin; 4. processing bin; 5. support rod; 6. cleaning plate; 7. top plate; 8. driving motor; 9. active roller; 10. driven roller; 11. belt; 12. transmission block; 13. transmission plate; 14. first limit block; 15. first limit groove; 16. mounting block; 17. fan; 18. slide; 19. leakage chamber; 20. second limit groove; 21. second limit block; 22. water pump; 23. liquid outlet pipe; 24. valve; 25. liquid inlet; 26. filter layer; 27. guide pipe. DETAILED DESCRIPTION

[0025] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Example 1: Figure 1 to Figure 5 As shown, the present embodiment proposes a semiconductor wafer processing device, comprising a device bottom bin 1, a support rod 5 and a driving motor 8, the top of the device bottom bin 1 is equipped with a support rod 5, the end of the support rod 5 away from the device bottom bin 1 is welded with a top plate 7, the outer wall of the top of the top plate 7 is equipped with a driving motor 8, the driving shaft of the driving motor 8 passes through the outer wall of the top plate 7 and is connected with a driving roller 9, the bottom end of the top plate 7 is movably equipped with a driven roller 10 through a bearing, the outer walls of the driving roller 9 and the driven roller 10 are equipped with a belt 11, the outer wall of the belt 11 is equipped with a transmission block 12, the bottom end of the top plate 7 is symmetrically provided with a first limiting groove 15, the top plate 7 is movably equipped with a transmission plate 13 through the first limiting groove 15, the top of the transmission plate 13 is symmetrically provided with a first limiting block 14, the bottom end of the transmission plate 13 is provided with a slide groove 18, the transmission block 12 is movably installed in the slide groove 18, mounting blocks 16 are provided on both sides of the bottom end of the transmission plate 13, and a fan 17 is installed on the outer wall of the mounting block 16.

[0027] In this embodiment, the first limiting block 14 is T-shaped, and the first limiting block 14 and the first limiting groove 15 match each other.

[0028] In this embodiment, the transmission block 12 is in a right-angle shape, and a convex body is provided at one end of the transmission block 12 , and the convex body matches the slide groove 18 .

[0029] Specific as Figure 1 , Figure 3 and Figure 4As shown, when this structure is used, the driving motor 8, the transmission block 12 and the first limit block 14 are set, and the active roller 9 is driven to rotate by starting the processing chamber 4, and the active roller 9 is used to drive the belt 11 to transmit the movement to drive the driven roller 10 to rotate, and the transmission block 12 is driven to move along the transmission track of the belt 11 through the transmission movement of the belt 11, and the transmission plate 13 is transmitted through the movement of the transmission block 12, and the first limit block 14 and the first limit groove 15 are used to limit the transmission plate 13. At the same time, the moving direction of the transmission block 12 is changed through the slide groove 18, so as to change the transmission direction of the transmission plate 13, so that the first limit block 14 reciprocates and performs uniform linear motion, thereby driving the fan 17 to move back and forth to dry the wafers placed above the cleaning plate 6 below. This structure can fully dry the wafers below.

[0030] Embodiment 2: A liquid inlet 25 is installed at the top of the bottom bin 1 of the device, and the liquid inlet 25 penetrates the inner wall of the bottom bin 1 of the device and is communicated with the bottom bin 1 of the device, a reflux pipe 2 is installed at the top of the bottom bin 1 of the device, and the top of the reflux pipe 2 is connected to the leakage bin 3, and a processing bin 4 is installed at the top of the leakage bin 3, and a leakage cavity 19 is provided on the inner wall of the processing bin 4, and second limiting grooves 20 are symmetrically provided on the outer walls on both sides of the processing bin 4, and a cleaning plate 6 is movably installed on the processing bin 4 through the second limiting grooves 20, and second limiting blocks 21 are symmetrically installed on both sides of the cleaning plate 6.

[0031] In this embodiment, a water pump 22 is installed on the inner wall of the bottom end of the bottom bin 1 of the device, a guide pipe 27 is connected to one side of the water pump 22, a liquid outlet pipe 23 is connected to the top of the water pump 22, the liquid outlet pipe 23 passes through the outer wall of the bottom bin 1 of the device and communicates with the leakage chamber 19, and a valve 24 is installed on the outer wall of the liquid outlet pipe 23.

[0032] In this embodiment, through holes are evenly arranged on one side of the second limiting groove 20 , and the through holes penetrate the outer wall of the processing chamber 4 .

[0033] In this embodiment, the second limiting groove 20 is trapezoidal, and the second limiting groove 20 and the second limiting block 21 match each other.

[0034] In this embodiment, a filter layer 26 is installed on the inner wall of the reflux pipe 2, and the filter layer 26 is made of activated carbon.

[0035] Specific as Figure 1 , Figure 2 and Figure 5As shown, when this structure is used, the processing chamber 4, cleaning plate 6 and water pump 22 are set, and the cleaning plate 6 is slid by the second limit block 21 according to the chip specifications, so as to change the spacing between the cleaning plates 6 to better place the chips. After the chips are placed, the cleaning liquid inside the bottom chamber 1 of the device is transmitted to the inside of the leakage chamber 19 set on the inner wall of the processing chamber 4 through the liquid outlet pipe 23 through the water pump 22. Through the through holes evenly set on the inner wall of the leakage chamber 19, the cleaning liquid is evenly sprayed from the inner wall of the processing chamber 4 to continuously clean the chips below. The cleaning liquid flows along the cleaning plate 6 to the inner wall of the leakage chamber 3, converges to the bottom end and flows to the inner wall of the reflux pipe 2, and is filtered and refluxed to the inside of the bottom chamber 1 of the device through the filter layer 26 set inside the reflux pipe 2. This structure can not only utilize the cleaning liquid through filtering and circulation, but also has a faster cleaning efficiency.

[0036] Working principle: Inject cleaning liquid into the bottom bin 1 of the device through the liquid inlet 25, slide the cleaning plate 6 according to the size of the wafer, change the spacing between the cleaning plates 6, place the wafer on the cleaning plate 6, start the water pump 22, and transmit the cleaning liquid inside the bottom bin 1 of the device through the liquid outlet pipe 23 to the inside of the leakage cavity 19 arranged on the inner wall of the processing bin 4. Through the through holes evenly arranged on the inner wall of the leakage cavity 19, the cleaning liquid is evenly sprayed from the inner wall of the processing bin 4 to continuously clean the wafer below. The cleaned cleaning liquid flows along the cleaning plate 6 to the inner wall of the leakage bin 3, converges to the bottom and flows to the inner wall of the reflux pipe 2, and is filtered and refluxed to the inside of the bottom bin 1 of the device. The wafer is cleaned in all directions by spraying it all over the wafer continuously. After cleaning, start The processing chamber 4 is driven to drive the active roller 9 to rotate, and the active roller 9 is used to drive the belt 11 to transmit the movement so as to drive the driven roller 10 to rotate, and the transmission block 12 is driven to move along the transmission track of the belt 11 through the transmission movement of the belt 11, and the transmission plate 13 is transmitted through the movement of the transmission block 12, and the first limit block 14 and the first limit groove 15 are used to limit the transmission plate 13. At the same time, the moving direction of the transmission block 12 is changed through the slide groove 18, so as to change the transmission direction of the transmission plate 13, so that the first limit block 14 reciprocates back and forth to make a uniform linear motion, so as to drive the fan 17 to move back and forth to dry the wafers placed below on the cleaning plate 6. This structure can not only filter and recycle the cleaning liquid, but also has higher cleaning efficiency, and can fully dry the wafers.

[0037] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor wafer processing device, characterized in that: The invention comprises a device bottom bin (1), a support rod (5) and a driving motor (8), wherein the top of the device bottom bin (1) is provided with a support rod (5), the end of the support rod (5) away from the device bottom bin (1) is welded with a top plate (7), the outer wall of the top of the top plate (7) is provided with a driving motor (8), the driving shaft of the driving motor (8) passes through the outer wall of the top plate (7) and is connected with a driving roller (9), the bottom of the top plate (7) is provided with a driven roller (10) movably mounted via a bearing, the outer walls of the driving roller (9) and the driven roller (10) are provided with belts (11), and the belts (11) are provided with a plurality of belts. A transmission block (12) is installed on the outer wall of the belt (11); a first limiting groove (15) is symmetrically arranged at the bottom end of the top plate (7); a transmission plate (13) is movably installed on the top plate (7) through the first limiting groove (15); a first limiting block (14) is symmetrically arranged at the top end of the transmission plate (13); a slide groove (18) is arranged at the bottom end of the transmission plate (13); the transmission block (12) is movably installed in the slide groove (18); mounting blocks (16) are arranged on both sides of the bottom end of the transmission plate (13); and a fan (17) is installed on the outer wall of the mounting block (16).

2. A semiconductor wafer processing device according to claim 1, characterized in that: The top of the bottom bin (1) of the device is provided with a liquid inlet (25), the liquid inlet (25) penetrates the inner wall of the bottom bin (1) and communicates with the bottom bin (1), the top of the bottom bin (1) of the device is provided with a reflux pipe (2), the top of the reflux pipe (2) is connected to a liquid leakage bin (3), the top of the liquid leakage bin (3) is provided with a processing bin (4), the inner wall of the processing bin (4) is provided with a liquid leakage cavity (19), the outer walls on both sides of the processing bin (4) are symmetrically provided with second limiting grooves (20), the processing bin (4) is movably provided with a cleaning plate (6) through the second limiting grooves (20), and second limiting blocks (21) are symmetrically provided on both sides of the cleaning plate (6).

3. The semiconductor wafer processing equipment according to claim 1, characterized in that: A water pump (22) is installed on the inner wall of the bottom end of the bottom bin (1) of the device, a flow guide pipe (27) is connected to one side of the water pump (22), a liquid outlet pipe (23) is connected to the top end of the water pump (22), the liquid outlet pipe (23) passes through the outer wall of the bottom bin (1) of the device and communicates with the liquid leakage chamber (19), and a valve (24) is installed on the outer wall of the liquid outlet pipe (23).

4. A semiconductor wafer processing device according to claim 2, characterized in that: Through holes are evenly arranged on one side of the second limiting groove (20), and the through holes penetrate the outer wall of the processing chamber (4).

5. The semiconductor wafer processing equipment according to claim 1, characterized in that: The first limiting block (14) is T-shaped, and the first limiting block (14) and the first limiting groove (15) match each other.

6. The semiconductor wafer processing equipment according to claim 1, characterized in that: The transmission block (12) is in a right-angle shape, and a convex body is provided at one end of the transmission block (12), and the convex body matches the slide groove (18).

7. The semiconductor wafer processing equipment according to claim 2, characterized in that: The second limiting groove (20) is trapezoidal in shape, and the second limiting groove (20) and the second limiting block (21) match each other.

8. The semiconductor wafer processing equipment according to claim 2, characterized in that: The inner wall of the reflux pipe (2) is provided with a filter layer (26), and the filter layer (26) is composed of activated carbon.

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