Conveying mechanism of sorting machine

Abstract

The utility model discloses a sorting machine conveying mechanism which comprises a carrying plate, a first conveying belt is arranged on the upper surface of the carrying plate, a supporting frame is fixedly connected to the upper surface of the carrying plate, two second conveying belts and two third conveying belts are arranged at the bottom of the supporting frame, and an air pump is fixedly connected to the outer wall of the top of the supporting frame. One end of an air inlet of the air pump is fixedly connected with a three-way pipe, the two ends of the three-way pipe are fixedly connected with a first connecting pipe and a second connecting pipe, the bottoms of the first connecting pipe and the second connecting pipe are fixedly connected with a plurality of air suction pipes, and the air suction pipes penetrate through the supporting frame. According to the silicon wafer conveying mechanism, silicon wafers of various types can be conveyed, the using effect of the conveying mechanism is improved, workers can conveniently arrange the silicon wafers, the using convenience of the conveying mechanism is improved, the position of the bottom plate can be prevented from being changed, and the silicon wafer collecting stability of the material collecting assembly is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of sorting machines, in particular to a conveying mechanism of a sorting machine. Background Art

[0002] After cleaning, the silicon wafers are subjected to multiple tests using a silicon wafer sorter. At this time, the silicon wafers need to be transported to the sorter through a conveying mechanism.

[0003] Silicon wafers are square and come in a variety of different sizes. However, when transporting different types of silicon wafers, the machine's conveyor belt needs to be adjusted, which is cumbersome and greatly affects work efficiency. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a conveying mechanism for a sorting machine.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The conveying mechanism of the sorting machine includes a carrier plate, a first conveyor belt is provided on the upper surface of the carrier plate, a support frame is fixedly connected to the upper surface of the carrier plate, two second conveyor belts and two third conveyor belts are provided at the bottom of the support frame, an air pump is fixedly connected to the top outer wall of the support frame, one end of the air inlet of the air pump is fixedly connected to a three-way pipe, both ends of the three-way pipe are fixedly connected to a first connecting pipe and a second connecting pipe, a plurality of suction pipes are fixedly connected to the bottom of the first connecting pipe and the second connecting pipe, and the suction pipes pass through the support frame, a material collecting assembly for collecting silicon wafers is provided on the upper surface of the carrier plate, and a control assembly is provided on the top of the support frame for controlling the connection between the first connecting pipe and the three-way pipe.

[0007] As a further solution of the utility model, the control component includes an infrared sensor, which is fixedly connected to the top inner wall of the support frame. A solenoid valve is provided on the circumferential outer wall of the three-way pipe near the first connecting pipe, and the infrared sensor is electrically connected to the solenoid valve.

[0008] As a further solution of the utility model, the material receiving assembly includes a bottom plate, which is placed on the upper surface of the carrier plate and is located directly below the third conveyor belt. The upper surface of the bottom plate is located on both sides and is fixedly connected to side plates. The upper surface of the bottom plate is located on the other two sides and is fixedly connected to two retaining rods. The upper surface of the carrier plate is provided with a clamping assembly for fixing the bottom plate.

[0009] As a further solution of the utility model, the clamping assembly includes two slide grooves, both of which are opened on the upper surface of the carrier plate, and both of the slide grooves are slidably connected with limit plates for clamping the bottom plate. A two-way cylinder is provided at the bottom of the carrier plate, and both ends of the two-way cylinder are respectively fixed to the two limit plates, and the two-way cylinder is fixed to the carrier plate through a fixing component.

[0010] As a further solution of the utility model, the fixing component is a convex block, the convex block is fixedly connected to the bottom of the carrier plate, a mounting hole is opened on one side of the convex block, and the bidirectional cylinder is fixed in the mounting hole.

[0011] As a further solution of the present invention, the two second transmission belts are oppositely distributed, and the two third transmission belts are oppositely distributed.

[0012] As a further solution of the present invention, the second connecting pipe is located between the two second conveyor belts, and the first connecting pipe is located between the two third conveyor belts.

[0013] The beneficial effects of the utility model are:

[0014] 1. Through the coordinated use of the second conveyor belt and the third conveyor belt, since there is a gap between the two second conveyor belts and there is also a gap between the two third conveyor belts, as long as the silicon wafer is larger than the gap between the two second conveyor belts and the two third conveyor belts, it can be transported. Therefore, more types of silicon wafers can be transported, thereby improving the use effect of the conveying mechanism.

[0015] 2. Through the setting of the receiving component, the receiving component can uniformly collect the transported silicon wafers, thereby facilitating the staff to sort the silicon wafers and improving the convenience of using the conveying mechanism.

[0016] 3. By setting up the clamping assembly, the bottom plate is clamped and fixed using the clamping assembly so that the bottom plate cannot move, thereby preventing the position of the bottom plate from changing and improving the stability of the collecting assembly in collecting silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural diagram of the conveying mechanism of the sorting machine proposed by the utility model;

[0018] Figure 2 It is a partial cross-sectional structural schematic diagram of the conveying mechanism of the sorting machine proposed by the utility model;

[0019] Figure 3 This is a partially enlarged structural schematic diagram of the conveying mechanism of the sorting machine proposed in the utility model.

[0020] In the figure: 1. carrier plate; 2. slide groove; 3. limit plate; 4. side plate; 5. bottom plate; 6. support frame; 7. first connecting pipe; 8. air pump; 9. solenoid valve; 10. three-way pipe; 11. second connecting pipe; 12. first conveyor belt; 13. two-way cylinder; 14. bump; 15. second conveyor belt; 16. third conveyor belt; 17. suction pipe; 18. infrared sensor. DETAILED DESCRIPTION

[0021] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, so that the embodiments of the application described here, based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application.

[0022] Reference Figure 1-Figure 3 The conveying mechanism of the sorting machine includes a carrier plate 1, a first conveyor belt 12 is provided on the upper surface of the carrier plate 1, a support frame 6 is fixed to the upper surface of the carrier plate 1 by bolts, two second conveyor belts 15 and two third conveyor belts 16 are provided at the bottom of the support frame 6, an air pump 8 is fixed to the top outer wall of the support frame 6 by bolts, a three-way pipe 10 is fixed to one end of the air inlet of the air pump 8 by bolts, a first connecting pipe 7 and a second connecting pipe 11 are fixed to both ends of the three-way pipe 10 by bolts, a plurality of suction pipes 17 are welded to the bottom of the first connecting pipe 7 and the second connecting pipe 11, and the suction pipe 17 passes through the support frame 6, a receiving assembly for collecting silicon wafers is provided on the upper surface of the carrier plate 1, a control assembly is provided on the top of the support frame 6, which is used to control the communication between the first connecting pipe 7 and the three-way pipe 10, and the silicon wafers are transported through the first conveyor belt 12, and the air pump 8 is started at the same time, The air pump 8 will evacuate the first connecting pipe 7 and the second connecting pipe 11 through the three-way pipe 10. When the silicon wafer is transported to the bottom of the support frame 6, the suction pipe 17 on the second connecting pipe 11 will adsorb the silicon wafer, so that the silicon wafer contacts the second conveyor belt 15, so that the second conveyor belt 15 transports the silicon wafer. When the second conveyor belt 15 transports the silicon wafer to the third conveyor belt 16, the suction pipe 17 on the first connecting pipe 7 will adsorb the silicon wafer, and the third conveyor belt 16 will transport the silicon wafer. Since there is a gap between the two second conveyor belts 15 and the two third conveyor belts 16, as long as the silicon wafer is larger than the gap between the two second conveyor belts 15 and the two third conveyor belts 16, it can be transported. More types of silicon wafers can be transported, which improves the use effect of the conveying mechanism.

[0023] In the utility model, the control component includes an infrared sensor 18, which is fixed to the top inner wall of the support frame 6 by bolts. A solenoid valve 9 is provided at a position near the first connecting pipe 7 on the circumferential outer wall of the three-way pipe 10. The infrared sensor 18 is electrically connected to the solenoid valve 9. When the silicon wafer is transported to the bottom of the infrared sensor 18, the infrared sensor 18 senses the silicon wafer and closes the solenoid valve 9. At this time, the suction pipe 17 on the first connecting pipe 7 cannot adsorb the silicon wafer, causing the silicon wafer to fall;

[0024] The material receiving assembly includes a bottom plate 5, which is placed on the upper surface of the carrier plate 1, and the bottom plate 5 is located directly below the third conveyor belt 16. The upper surface of the bottom plate 5 is welded with side plates 4 at both sides, and the upper surface of the bottom plate 5 is welded with two retaining rods at the other two sides. The silicon wafers will fall onto the bottom plate 5. At this time, the silicon wafers will be collected under the cooperation of the side plates 4 and the retaining rods. The upper surface of the carrier plate 1 is provided with a clamping assembly for fixing the bottom plate 5, and the clamping assembly includes two slide grooves 2, and the two slide grooves 2 are both opened on the upper surface of the carrier plate 1. The two slide grooves 2 are slidably connected with limit plates 3 for clamping the bottom plate 5. A two-way cylinder 13 is provided at the bottom of the carrier plate 1. The two ends of the two-way cylinder 13 are respectively fixed to the two limit plates 3. The two-way cylinder 13 is fixed to the carrier plate 1 through a fixing component. The fixing component is a protrusion 14. The protrusion 14 is welded to the bottom of the carrier plate 1. A mounting hole is opened on one side of the protrusion 14. The two-way cylinder 13 is fixed in the mounting hole. The two second conveyor belts 15 are oppositely distributed, and the two third conveyor belts 16 are oppositely distributed. The two-way cylinder 13 contracts and drives the two limit plates 3 to move toward each other along the slide groove 2, so that the two limit plates 3 clamp and fix the bottom plate 5 to prevent the bottom plate 5 from displacement. The second connecting pipe 11 is located between the two second conveyor belts 15, and the first connecting pipe 7 is located between the two third conveyor belts 16.

[0025] Working principle: When it is needed, the silicon wafer is transported through the first conveyor belt 12, and the air pump 8 is started at the same time. The air pump 8 will evacuate the first connecting pipe 7 and the second connecting pipe 11 through the three-way pipe 10. When the silicon wafer is transported to the bottom of the support frame 6, the suction pipe 17 on the second connecting pipe 11 will adsorb the silicon wafer, so that the silicon wafer contacts the second conveyor belt 15, so that the second conveyor belt 15 transports the silicon wafer. When the second conveyor belt 15 transports the silicon wafer to the third conveyor belt 16, the suction pipe 17 on the first connecting pipe 7 will adsorb the silicon wafer, and the third conveyor belt 16 will be connected to the third conveyor belt 17. The three conveyor belts 16 will convey the silicon wafers. When the silicon wafers are conveyed to the bottom of the infrared sensor 18, the infrared sensor 18 will sense the silicon wafers and close the solenoid valve 9. At this time, the suction pipe 17 on the first connecting pipe 7 cannot adsorb the silicon wafers, causing the silicon wafers to fall onto the bottom plate 5. Since there is a gap between the two second conveyor belts 15 and the two third conveyor belts 16, as long as the silicon wafer is larger than the gap between the two second conveyor belts 15 and the two third conveyor belts 16, it can be conveyed. More types of silicon wafers can be conveyed, thereby improving the use effect of the conveying mechanism.

[0026] The present invention has been described through the above-mentioned embodiments. Those skilled in the art will appreciate that the present invention is not limited to the above-mentioned embodiments, and more modifications may be made according to the teachings of the present invention. These modifications are all within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A conveying mechanism of a sorting machine, comprising a carrier plate (1), characterized in that: A first conveyor belt (12) is provided on the upper surface of the carrier plate (1), a support frame (6) is fixedly connected to the upper surface of the carrier plate (1), two second conveyor belts (15) and two third conveyor belts (16) are provided at the bottom of the support frame (6), an air pump (8) is fixedly connected to the top outer wall of the support frame (6), one end of the air inlet of the air pump (8) is fixedly connected to a three-way pipe (10), both ends of the three-way pipe (10) are fixedly connected to a first connecting pipe (7) and a second connecting pipe (11), the bottoms of the first connecting pipe (7) and the second connecting pipe (11) are fixedly connected to a plurality of suction pipes (17), and the suction pipes (17) pass through the support frame (6), a material receiving assembly for collecting silicon wafers is provided on the upper surface of the carrier plate (1), and a control assembly is provided on the top of the support frame (6) for controlling the connection between the first connecting pipe (7) and the three-way pipe (10).

2. The conveying mechanism of the sorting machine according to claim 1, characterized in that: The control component comprises an infrared sensor (18), the infrared sensor (18) being fixedly connected to the top inner wall of the support frame (6), a solenoid valve (9) being provided at a position near the first connecting pipe (7) on the circumferential outer wall of the three-way pipe (10), and the infrared sensor (18) being electrically connected to the solenoid valve (9).

3. The conveying mechanism of the sorting machine according to claim 1, characterized in that: The material receiving assembly comprises a bottom plate (5), the bottom plate (5) being placed on the upper surface of the carrier plate (1), and the bottom plate (5) being located directly below the third conveyor belt (16), the upper surface of the bottom plate (5) being fixedly connected to side plates (4) at positions on both sides, the upper surface of the bottom plate (5) being fixedly connected to two stopper rods at positions on the other two sides, and the upper surface of the carrier plate (1) being provided with a clamping assembly for fixing the bottom plate (5).

4. The conveying mechanism of the sorting machine according to claim 3, characterized in that: The clamping assembly comprises two slide grooves (2), both of which are arranged on the upper surface of the carrier plate (1), and both of which are slidably connected with a limit plate (3) for clamping the bottom plate (5), and a two-way cylinder (13) is provided at the bottom of the carrier plate (1), and both ends of the two-way cylinder (13) are respectively fixed to the two limit plates (3), and the two-way cylinder (13) is fixed to the carrier plate (1) through a fixing component.

5. The conveying mechanism of the sorting machine according to claim 4, characterized in that: The fixing component is a convex block (14), the convex block (14) is fixedly connected to the bottom of the carrier plate (1), a mounting hole is provided on one side of the convex block (14), and the bidirectional cylinder (13) is fixed in the mounting hole.

6. The conveying mechanism of the sorting machine according to claim 1, characterized in that: The two second conveyor belts (15) are arranged opposite to each other, and the two third conveyor belts (16) are arranged opposite to each other.

7. The conveying mechanism of the sorting machine according to claim 1, characterized in that: The second connecting pipe (11) is located between the two second conveyor belts (15), and the first connecting pipe (7) is located between the two third conveyor belts (16).

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