Carrier for chip packaging

Abstract

The utility model relates to the field of packaging, and discloses a carrier for chip packaging, which comprises a cover plate and a substrate, the base body comprises a frame placing area and a raised support body, the raised support body is located in the frame placing area, the raised support body is used for supporting a base island of the lead frame, and the height of the raised support body is equal to the suspension height of the base island; the cover plate is provided with a hollowed-out area, and the hollowed-out area corresponds to the frame containing area. The base body is provided with the protruding supporting bodies, so that the base island can be stably supported, and the base island can be prevented from vibrating and deforming after being stressed. And the cover plate can apply a certain pressure to the lead frame, so that the lead frame is prevented from moving in the technological process. The carrier can be conveyed along with the lead frame according to the procedures of soldering lugs and soldering wires, the carrier is removed after the soldering wire process is finished, and the material strips including the lead frame do not need to be repeatedly loaded and unloaded in the carrier, so that the problems of inaccurate positioning or material blocking and the like are avoided.

Description

Technical Field

[0001] The present application relates to the field of packaging, and in particular to a carrier for chip packaging. Background Art

[0002] When the chip and the lead frame are packaged in DFN (Dual Flat No-lead Package), the base island 2 of the frame can be packaged in the package body 4, so that the packaged structure has no base island (heat sink), such as Figure 1 Please refer to Figure 2 and Figure 3 The chip 1 is placed on the base island 2 of the lead frame, the chip 1 is connected to the pin 5 through the wire 3, the base island 2 is connected to the frame as a whole through the connecting rib 6, the base island 2 is suspended from the bottom plane of the lead frame, and there is a certain suspension height H, so the base island 2 will not be exposed to the package body.

[0003] Since the base island is suspended in the air, it will bring certain difficulties to the packaging process during packaging. For example, when performing processes such as soldering pads and soldering wires, tools such as glue dispensing heads and soldering needles will operate on the base island. Because the base island is suspended in the air, the base island will vibrate and deform under stress, resulting in poor glue dispensing and soldering wires, which in turn affects the packaging. Currently, the problem of base island vibration and deformation can be improved by increasing the strength of the connecting ribs, but the improvement effect is limited. In addition, during packaging, the solder pads and soldering wires are designed separately. After the soldering pad process is completed, the chip and lead frame are removed from the material box of the solder pad fixture and placed in the material box of the soldering wire fixture for soldering. Multiple conversions can easily lead to inaccurate positioning, and it is also easy to get stuck and scratch the material strips.

[0004] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Utility Model Content

[0005] The purpose of this application is to provide a carrier for chip packaging to improve the quality of chip solder pads and solder wires, improve the packaging quality, and avoid problems such as inaccurate positioning or jamming of material strips during the packaging process.

[0006] In order to solve the above technical problems, the present application provides a carrier for chip packaging, comprising:

[0007] Cover plate and base body;

[0008] The base includes a frame placement area and a protruding support body, wherein the protruding support body is located in the frame placement area, and the protruding support body is used to support the base island of the lead frame, and the height of the protruding support body is equal to the suspended height of the base island;

[0009] The cover plate is provided with a hollow area, and the hollow area corresponds to the frame placement area.

[0010] Optionally, also include:

[0011] Positioning piles, the positioning piles are arranged in the frame placement area;

[0012] The cover plate is provided with a through hole in an area corresponding to the positioning pile, the through hole matching the size of the positioning pile.

[0013] Optionally, also include:

[0014] A direction marker body is located on the cover plate and is used to indicate the installation direction of the cover plate.

[0015] Optionally, the direction indicator body is an opening, and the opening extends from the hollow area to the edge of the cover plate.

[0016] Optionally, also include:

[0017] A groove is arranged on the base, the groove is arranged on two opposite sides of the frame placement area, and extends from the frame placement area to the edge of the base.

[0018] Optionally, on each side of the frame placement area, there are multiple grooves, and the grooves are evenly distributed.

[0019] Optionally, also include:

[0020] Positioning holes are arranged at two opposite ends of the base.

[0021] Optionally, the frame placement area includes a plurality of frame placement unit areas, and each of the frame placement unit areas is provided with the protruding support body.

[0022] Optionally, the side surface of the protruding support body is an inclined surface, and the size of the upper surface of the protruding support body is smaller than the size of the lower surface of the protruding support body, wherein the upper surface of the protruding support body is a surface away from the base.

[0023] Optionally, the inclination angle of the inclined surface ranges from 8° to 15°, including endpoint values.

[0024] The present application provides a carrier for chip packaging, comprising: a cover plate and a base; the base comprises a frame placement area and a raised support body, the raised support body is located in the frame placement area, the raised support body is used to support the base island of the lead frame, and the height of the raised support body is equal to the suspended height of the base island; the cover plate is provided with a hollow area, and the hollow area corresponds to the frame placement area.

[0025] It can be seen that the carrier of the present application includes a cover plate and a base, and a raised support body is provided on the base, and the height of the raised support body is equal to the suspended height of the base island of the lead frame, so the raised support body can stably support the base island. When performing processes such as welding pieces and welding wires, the base island is supported by the raised support body after being stressed, which can prevent the base island from vibrating and deforming, thereby improving the packaging quality. The cover plate can apply a certain pressure to the lead frame to prevent the lead frame from moving during the processes such as welding pieces and welding wires, and the hollow area can expose the lead frame to ensure that the processes such as welding pieces and welding wires are carried out normally. In addition, after the lead frame is placed in the carrier, the carrier can be transferred along with the lead frame according to the process of welding pieces and welding wires, and the carrier can be removed after the welding wire process is completed, without the need to repeatedly load and unload the material strips of the lead frame in the carrier, thereby avoiding problems such as inaccurate positioning or jamming. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 It is a schematic diagram of a chip DFN packaging structure in the related art;

[0028] Figure 2 It is a top view of the chip and the lead frame welding piece and the welding wire in the related technology;

[0029] Figure 3 It is a structural schematic diagram of a lead frame in the related art;

[0030] Figure 4 A top view of a cover plate provided in an embodiment of the present application;

[0031] Figure 5 A top view of a substrate provided in an embodiment of the present application;

[0032] Figure 6 A front view of a substrate provided in an embodiment of the present application;

[0033] Figure 7 A schematic diagram of the distribution of the lead frame provided in the embodiment of the present application;

[0034] Figure 8 A schematic diagram of the distribution of a protruding support body provided in an embodiment of the present application;

[0035] Fig. 9 A top view of a protruding support provided by an embodiment of the present application;

[0036] Fig.10 A front view of a protruding support provided by an embodiment of the present application;

[0037] Fig.11 A schematic diagram of a packaging process provided by an embodiment of the present application;

[0038] In the figure, 1, chip, 2, base island, 3, wire, 4, package body, 5, pin, 6, connecting rib, 7, substrate, 8, cover plate, 9, lead frame, 10, material strip, 71, frame placement area, 72, raised support body, 73, positioning pile, 74, groove, 711, frame placement unit area, 81, through hole, 82, direction mark body, 83, hollow area. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0040] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0041] As described in the background technology section, during packaging, since the base island of the lead frame is suspended, the base island will vibrate and deform when subjected to force during operation, resulting in poor glue dispensing and wire welding. However, after increasing the strength of the connecting ribs connected to the base island, the problems of base island vibration and deformation still cannot be effectively solved. In addition, during the packaging process, the chip and lead frame need to be taken out of the material box, which is easy to get stuck and scratch the material strip.

[0042] In view of this, the present application provides a carrier for chip packaging, please refer to Figures 4 to 6 ,include:

[0043] Cover plate 8 and base body 7;

[0044] The base 7 includes a frame placement area 71 and a protruding support 72. The protruding support 72 is located in the frame placement area 71. The protruding support 72 is used to support the base island of the lead frame. The height of the protruding support 72 is equal to the suspended height of the base island.

[0045] The cover plate 8 is provided with a hollow area 83 , and the hollow area 83 corresponds to the frame placement area 71 .

[0046] The suspended height H of the base island is the distance between the lower surface of the base island and the bottom plane of the lead frame, such as Figure 1 shown.

[0047] The lead frame is placed in the frame placement area 71 of the substrate 7, such as Figure 6 As shown, the height of the protruding support body 72 is equal to the suspended height of the base island. The base island is located on the protruding support body 72, which provides a stable support for the base island, and the base island is no longer suspended below. During the packaging process, the chip is located on the base island. When the soldering pad and wire bonding processes are performed, the base island is subjected to force. However, due to the support of the protruding support body 72, the base island will not vibrate, deform, or have other problems.

[0048] The frame placement area 71 may include a frame placement unit area 711, and the number of the frame placement unit area 711 is at least one. Each frame placement unit area 711 is provided with the protruding support body 72, and the arrangement form of the protruding support body 72 in each frame placement unit area 711 is the same as the arrangement form of the lead frame. Figure 7 The lead frame shown in FIG. 1 has the protruding support bodies 72 arranged in the unit area 711 of each frame as shown in FIG. Figure 8 shown.

[0049] In order to improve the packaging efficiency, the frame placement area 71 includes a plurality of frame placement unit areas 711 , that is, a plurality of lead frames can be operated at the same time, thereby improving the packaging efficiency.

[0050] The purpose of providing the hollow area 83 on the cover plate 8 is to expose the lead frame so as to perform operations such as welding sheets and wires.

[0051] After the lead frame is placed on the substrate 7 and covered with the cover plate 8, the carrier in the present application can be placed in the material box together with the lead frame to carry out the soldering and wire bonding process steps. After completion, the cover plate 8 is removed, and the soldered lead frame and chip are removed from the carrier, and then plastic-sealed. Therefore, during the soldering and wire bonding process, there is no need to load and unload the material strip from the carrier multiple times, thereby avoiding inaccurate positioning or material jamming.

[0052] In order to facilitate the placement of the lead frame onto the substrate 7 , as an implementation method, it may also include: positioning piles 73 , which are arranged in the frame placement area 71 ; and the cover plate 8 has a through hole 81 in the area corresponding to the positioning pile 73 , which matches the size of the positioning pile 73 .

[0053] The lead frame can be placed in the frame placement area 71 through the positioning piles 73 . After the cover plate 8 is covered, the positioning piles 73 pass through the through holes 81 .

[0054] The shapes of the positioning pile 73 include but are not limited to cylinder, prism, and cone. The shapes of the through hole 81 include but are not limited to circle, square, and rectangle.

[0055] The carrier of this embodiment includes a cover plate 8 and a base 7, and a protruding support body 72 is provided on the base 7, and the height of the protruding support body 72 is equal to the suspended height of the base island of the lead frame, so the protruding support body 72 can stably support the base island. When the welding piece, welding wire and other processes are carried out, the base island can be prevented from vibrating and deforming due to the support of the protruding support body 72 after the force is applied to the base island, thereby improving the packaging quality. The cover plate 8 can apply a certain pressure to the lead frame to prevent the lead frame from moving during the welding piece, welding wire and other processes, and the hollow area 83 can expose the lead frame to ensure that the welding piece, welding wire and other processes are carried out normally. In addition, after the lead frame is placed in the carrier, the carrier can be transported along with the lead frame according to the process of welding piece and welding wire, and the carrier can be removed after the welding wire process is completed, and there is no need to repeatedly load and unload the material strips of the lead frame in the carrier, thereby avoiding problems such as inaccurate positioning or jamming.

[0056] When placing the cover plate 8 on the substrate 7, there are requirements for the installation direction of the cover plate 8. In order to facilitate identification of the direction of the cover plate 8, based on the above embodiment, in one embodiment of the present application, the carrier for chip packaging may further include:

[0057] A direction indicator body 82 is located on the cover plate 8 and is used to indicate the installation direction of the cover plate 8 .

[0058] As an implementation method, Figure 4 As shown, the direction indicator 82 may be an opening, and the opening extends from the hollow area 83 to the edge of the cover plate 8. The depth of the opening may be the same as the thickness of the cover plate 8, that is, the opening penetrates the cover plate 8, or the depth of the opening is less than the thickness of the cover plate 8. However, the present application does not limit this, and in other embodiments, the direction indicator 82 may also be an arrow or other types of indicators.

[0059] When the soldering sheet and wire bonding process is performed, since the carrier is placed in the device together, in order to facilitate fixing the carrier in the device, in one embodiment of the application, Figure 5 As shown, the carrier may further include: positioning holes, which are arranged at two opposite ends of the base 7.

[0060] Please refer to Figure 5 Based on any of the above embodiments, in one embodiment of the present application, the carrier may further include:

[0061] The groove 74 is disposed on the base 7 , and the groove 74 is disposed on two opposite sides of the frame placement area 71 , and extends from the frame placement area 71 to the edge of the base 7 .

[0062] By providing the groove 74 on the base 7 , the weight of the base 7 can be reduced, which can save the manufacturing cost of the base 7 on the one hand, and make it easier to take the base 7 on the other hand.

[0063] It should be noted that in this embodiment, the number of grooves 74 is not limited and can be set at will.

[0064] As an implementable embodiment, on each side of the frame placement area 71, there are a plurality of grooves 74, and the grooves 74 are evenly distributed, so that the weight distribution of the base 7 is even, which is convenient for transportation and taking.

[0065] For example, Figure 5 As shown, four grooves 74 are provided on each of the two opposite sides of the frame placement area 71, and the intervals between adjacent grooves 74 are equal.

[0066] Please refer to Fig. 9 and Fig.10 Based on any of the above embodiments, in one embodiment of the present application, the side surface of the protruding support body 72 is an inclined surface, the upper surface size of the protruding support body 72 is smaller than the lower surface size of the protruding support body 72, wherein the upper surface of the protruding support body 72 is the surface away from the base 7.

[0067] The shape of the protruding support body 72 can be a prism, a frustum, or the like.

[0068] In this embodiment, the side surface of the raised support body 72 is set as an inclined surface, so that the upper surface of the raised support body 72 is smaller than the lower surface. This allows the raised support body 72 to more effectively cooperate in placing the lead frame, positioning the lead frame, supporting the lead frame, etc., and also facilitates the removal and placement of the lead frame, and is less likely to cause scratches, jamming, and other problems.

[0069] For example, when the base island size of the lead frame is 3.3*1.78 mm and the suspended height of the base island is 0.1 mm, the size of the protruding support body 72 may be 3.4*1.8*0.1 mm.

[0070] As an implementable embodiment, the inclination angle α of the inclined surface ranges from 8° to 15°, including the end value, so as to reduce the difficulty of manufacturing the protruding support body 72 and facilitate the removal of the lead frame from the protruding support body 72.

[0071] For example, the inclination angle α may be 8°, 9°, 10°, 11°, 12°, 13°, 14°, 15°, etc.

[0072] The packaging process in the related art is roughly lead frame→solder pad→wire bonding→plastic sealing. When the carrier of the present application is used for packaging, the packaging process is roughly lead frame→lead frame loaded into carrier→solder pad→wire bonding→remove carrier→plastic sealing.

[0073] like Fig.11 As shown, the lead frame 9 is positioned in the frame placement area 71 according to the positioning piles 73, and the cover plate 8 is covered; the carrier and the lead frame 9 are loaded into the material box together, and then the process steps such as welding sheets and welding wires are carried out; then the cover plate 8 is removed, the material strip 10 is removed from the carrier, and then subsequent process steps such as plastic sealing are carried out.

[0074] During the process of soldering the pads and wires, with the support of the carrier clamping and the raised support body 72, the firm structure can obtain good soldering pad and wire quality, thereby successfully completing the manufacturing work of the packaging structure.

[0075] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0076] The above is a detailed introduction to the carrier for chip packaging provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the scheme and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. A carrier for chip packaging, characterized in that: include: Cover plate and base body; The base includes a frame placement area and a protruding support body, wherein the protruding support body is located in the frame placement area, and the protruding support body is used to support the base island of the lead frame, and the height of the protruding support body is equal to the suspended height of the base island; The cover plate is provided with a hollow area, and the hollow area corresponds to the frame placement area.

2. The carrier for chip packaging according to claim 1, characterized in that: Also includes: Positioning piles, the positioning piles are arranged in the frame placement area; The cover plate is provided with a through hole in an area corresponding to the positioning pile, the through hole matching the size of the positioning pile.

3. The carrier for chip packaging according to claim 1, characterized in that: Also includes: A direction marker body is located on the cover plate and is used to indicate the installation direction of the cover plate.

4. The carrier for chip packaging as claimed in claim 3, characterized in that: The direction indicator body is an opening, and the opening extends from the hollow area to the edge of the cover plate.

5. The carrier for chip packaging according to claim 1, characterized in that: Also includes: A groove is arranged on the base, the groove is arranged on two opposite sides of the frame placement area, and extends from the frame placement area to the edge of the base.

6. The carrier for chip packaging according to claim 5, characterized in that: On each side of the frame placement area, there are a plurality of grooves, and the grooves are evenly distributed.

7. The carrier for chip packaging according to claim 1, characterized in that: Also includes: Positioning holes are arranged at two opposite ends of the base.

8. The carrier for chip packaging as claimed in claim 1, characterized in that: The frame placement area includes a plurality of frame placement unit areas, and each of the frame placement unit areas is provided with the protruding support body.

9. The carrier for chip packaging according to any one of claims 1 to 8, characterized in that: The side surface of the protruding support body is an inclined surface, and the size of the upper surface of the protruding support body is smaller than the size of the lower surface of the protruding support body, wherein the upper surface of the protruding support body is a surface away from the base.

10. The carrier for chip packaging according to claim 9, characterized in that: The inclination angle of the inclined surface ranges from 8° to 15°, including endpoint values.

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