Millimeter wave isolation transmission packaging structure

Abstract

The utility model discloses a millimeter wave isolation transmission packaging structure, which comprises a first base island, a second base island, a first plastic packaging body, a first chip, a first antenna, a second chip, a second antenna and a second plastic packaging body, and is characterized in that the bottom of the first base island is provided with a first material reduction area; a second subtractive area is arranged at the bottom of the second base island, and a gap is formed between the second base island and the first base island; the first plastic package body is connected with the first base island and the second base island and fills the first subtractive material area and the second subtractive material area. The first chip is arranged on the first base island and corresponds to the first subtractive area; the first antenna is arranged on the first base island and is electrically connected with the first chip; the second chip is arranged on the second base island and corresponds to the second subtractive area; the second antenna is arranged on the second base island and electrically connected with the second chip, and the second antenna is in wireless communication connection with the first antenna. According to the millimeter wave isolation transmission packaging structure, the carrier strength and the voltage-withstanding isolation level are both considered.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a millimeter wave isolation transmission packaging structure. Background Art

[0002] Millimeter wave transmission requires transceiver chip + transceiver antenna as an overall solution. The traditional millimeter wave isolation transmission packaging structure is generally large and thick. If the thin and small QFN / DFN packaging process is applied to the millimeter wave isolation transmission packaging structure, the bottom carrier pad used for support needs to be hidden or even removed, otherwise the exposed bottom carrier pad will make the packaging structure fail to meet the isolation requirements. Currently, there are two processes in the industry to solve this problem: MIS process and HFBP process. The MIS process generates a carrier by combining a substrate RDL process with an EMC process, while the HFBP process uses the traditional QFN / DFN process and finally etches away a small part of the bottom carrier pad. The plate is covered with ink; both the MIS process and the HFBP process have certain disadvantages for isolated packaging products. In the MIS process, the metal layer and the connection between layers are almost all achieved through electroplating, and the metal thickness and connection strength cannot be compared with the traditional frame; although the HFBP process ensures the consistency with the QFN process in terms of integrity, the supporting metal at the chip position still exists, and the corresponding withstand voltage level will be affected by the thickness of the bottom oil film, and the withstand voltage strength of the isolated packaging product cannot be achieved; in addition, in the application of millimeter wave isolated transmission, metal is not allowed to exist at the antenna position, and the HFBP process cannot be used. The substrate strength and current carrying capacity in the MIS process will be weaker. Therefore, a frame packaging solution that does not rely on frame support and can meet the corresponding withstand voltage and stress strength is needed to fill the technical gap. Utility Model Content

[0003] The technical problem solved by the utility model is to provide a millimeter wave isolation transmission packaging structure that takes into account both carrier strength and withstand voltage isolation level.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a millimeter wave isolation transmission packaging structure, comprising:

[0005] A first base island, wherein a first material reduction area is provided at the bottom of the first base island;

[0006] A second base island, wherein a second material reduction area is provided at the bottom of the second base island, and a gap is provided between the second base island and the first base island;

[0007] a first plastic encapsulation body, the first plastic encapsulation body respectively connecting the first base island and the second base island and filling the first material reduction area and the second material reduction area;

[0008] A first chip, the first chip is disposed on the first base island and is disposed corresponding to the first material reduction area;

[0009] a first antenna, which is disposed on the first base island and is electrically connected to the first chip;

[0010] A second chip, the second chip is disposed on the second base island and is disposed corresponding to the second material reduction area;

[0011] a second antenna, the second antenna being disposed on the second base island and electrically connected to the second chip, and the second antenna being wirelessly connected to the first antenna;

[0012] A second plastic sealing body, wherein the second plastic sealing body is located above the first base island and the second base island and respectively connects the first base island, the second base island and the first plastic sealing body;

[0013] The radiation area of ​​the first antenna is covered by the first plastic packaging body and the second plastic packaging body, and the radiation area of ​​the second antenna is covered by the first plastic packaging body and the second plastic packaging body.

[0014] In one embodiment, the first antenna and the second antenna are disposed close to each other.

[0015] In one embodiment, the first antenna is located at one end of the first base island close to the second base island, and the second antenna is located at one end of the second base island close to the first base island.

[0016] In one embodiment, a first notch is provided at one end of the first base island close to the second base island, and a radiation area of ​​the first antenna is arranged corresponding to the first notch.

[0017] In one embodiment, the first antenna is located on the top surface of the first base island or in the first reduced material area.

[0018] In one embodiment, the first antenna and the first base island are an integrated structure formed by integral processing.

[0019] In one embodiment, the first antenna and the second antenna are arranged opposite to each other.

[0020] In one embodiment, the first chip is located on the top surface of the first base island, and the second plastic package covers the first chip.

[0021] In one embodiment, the first chip is located in the first material reduction area, and the first plastic package covers the first chip.

[0022] In one embodiment, the first plastic packaging body and / or the second plastic packaging body fills the gap.

[0023] The beneficial effects of the utility model are as follows: the millimeter-wave isolation transmission packaging structure has a novel structure, and a prefabricated frame can be obtained by the first injection molding of the first plastic package body. The presence of the first plastic package body in the prefabricated frame effectively improves the strength of the frame's material reduction area, thereby solving the problems of chip bonding and wire bonding stability in the material reduction area in the application of the millimeter-wave isolation transmission packaging structure; the prefabricated frame improves the freedom of frame design and production, and material reduction can be performed except for the pin area. The creepage distance has strong support, which is conducive to ensuring the withstand voltage isolation level; the prefabricated frame improves the freedom of the base island, which is more friendly to the antenna operation, and can ensure that there is no metal in the radiation area of ​​the antenna, which is conducive to improving the signal transmission quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0025] Figure 1 It is a cross-sectional view of the millimeter wave isolation transmission packaging structure of the first embodiment of the utility model;

[0026] Figure 2 This is a simplified schematic diagram of the structure of the millimeter wave isolation transmission packaging structure of the first embodiment of the utility model from a top view;

[0027] Figure 3 It is a cross-sectional view of the millimeter wave isolation transmission packaging structure of the second embodiment of the utility model;

[0028] Figure 4 This is a simplified schematic diagram of the structure of the millimeter wave isolation transmission packaging structure of the second embodiment of the utility model from a top view.

[0029] Description of Figure Numbers:

[0030] 1. First base island; 11. First material reduction area; 12. First gap;

[0031] 2. Second base island; 21. Second material reduction area; 22. Second notch;

[0032] 3. The first plastic sealing body;

[0033] 4. The first chip;

[0034] 5. The first antenna;

[0035] 6. Second chip;

[0036] 7. Second antenna;

[0037] 8. The second plastic sealing body;

[0038] 9. Gap. DETAILED DESCRIPTION

[0039] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0042] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0043] In addition, if the meaning of "and / or" appears in the full text is to include three parallel solutions, taking "and / or" as an example, it includes solutions, or solutions, or solutions that are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] Embodiment 1

[0046] Please refer to Figure 1 and Figure 2 , Embodiment 1 of the utility model is: a millimeter wave isolation transmission packaging structure, comprising a first base island 1, a second base island 2, a first plastic package 3, a first chip 4, a first antenna 5, a second chip 6, a second antenna 7 and a second plastic package 8, the bottom of the first base island 1 is provided with a first material reduction area 11; the bottom of the second base island 2 is provided with a second material reduction area 21, and a gap 9 is provided between the second base island 2 and the first base island 1; the first plastic package 3 respectively connects the first base island 1 and the second base island 2 and fills the first material reduction area 11 and the second material reduction area 21; the first chip 4 is arranged on the first base island 1 and corresponds to the first material reduction area 11; the second An antenna 5 is arranged on the first base island 1 and is electrically connected to the first chip 4; the second chip 6 is arranged on the second base island 2 and is arranged corresponding to the second material reduction area 21; the second antenna 7 is arranged on the second base island 2 and is electrically connected to the second chip 6, and the second antenna 7 is wirelessly connected to the first antenna 5; the second plastic package 8 is located above the first base island 1 and the second base island 2 and is respectively connected to the first base island 1, the second base island 2 and the first plastic package 3; the radiation area of ​​the first antenna 5 is covered by the first plastic package 3 and the second plastic package 8, and the radiation area of ​​the second antenna 7 is covered by the first plastic package 3 and the second plastic package 8.

[0047] The material of the first plastic sealing body 3 may be selected from EMC materials, and similarly, the material of the second plastic sealing body 8 may be selected from EMC materials, etc.

[0048] In order to improve the signal transmission effect and ensure the miniaturization of the millimeter wave isolation transmission packaging structure, it is preferred that the first antenna 5 and the second antenna 7 are arranged close to each other. Further preferably, the first antenna 5 is located at one end of the first base island 1 close to the second base island 2, and the second antenna 7 is located at one end of the second base island 2 close to the first base island 1, and the first antenna 5 and the second antenna 7 are arranged opposite to each other.

[0049] In this embodiment, a first notch 12 is provided at one end of the first base island 1 close to the second base island 2, and a radiation area of ​​the first antenna 5 is set corresponding to the first notch 12; a second notch 22 is provided at one end of the second base island 2 close to the first base island 1, and a radiation area of ​​the second antenna 7 is set corresponding to the second notch 22. The existence of the first notch 12 can reduce the influence of the first base island 1 on the first antenna 5, and the existence of the second notch 22 can reduce the influence of the second base island 2 on the second antenna 7, so that the first antenna 5 and the second antenna 7 can achieve high-quality communication.

[0050] In this embodiment, the first antenna 5 is located on the top surface of the first base island 1, and the second antenna 7 is located on the top surface of the second base island 2. In other embodiments, the first antenna 5 can be located in the first reduced material area 11, and the second antenna 7 can be located in the second reduced material area 21. The specific settings can be based on actual needs.

[0051] The first chip 4 is located on the top surface of the first base island 1, the second plastic package 8 covers the first chip 4, the second chip 6 is located on the top surface of the second base island 2, and the second plastic package 8 covers the second chip 6. In other embodiments, the first chip 4 is located in the first material reduction area 11, the first plastic package 3 covers the first chip 4, the second chip 6 is located in the second material reduction area 21, and the first plastic package 3 covers the second chip 6. In addition, arranging the first antenna 5 and the first chip 4 in the first material reduction area 11 and arranging the second antenna 7 and the second chip 6 in the second material reduction area 21 can reduce the thickness of the millimeter wave isolation transmission packaging structure to a greater extent, making the millimeter wave isolation transmission packaging structure more miniaturized.

[0052] In order to improve the structural stability and isolation effect of the millimeter wave isolation transmission packaging structure, the first plastic packaging body 3 and / or the second plastic packaging body 8 fills the gap 9.

[0053] Preferably, both the first chip 4 and the second chip 6 are full-duplex communication chips. In actual products, the first chip 4 may be a data sending chip and the second chip 6 may be a data receiving chip.

[0054] When manufacturing the millimeter wave isolation transmission packaging structure of this embodiment, the non-pin area at the bottom of the metal frame is first subjected to a material reduction process to form a first material reduction area 11, a second material reduction area 21 and a gap 9. The specific method of the material reduction process includes but is not limited to chemical etching, controlled depth milling grooves, etc., and then the first plastic encapsulation is performed to form a first plastic encapsulation body 3 to form a prefabricated frame, and then the first chip 4 and the first antenna 5 are installed on the first base island 1, and the second chip 6 and the second antenna 7 are installed on the second base island 2. Finally, the second plastic encapsulation is performed to form a second plastic encapsulation body 8 to obtain a millimeter wave isolation transmission packaging structure. The strength of the millimeter wave isolation transmission packaging structure depends on the thickness and material of the metal frame and the plastic encapsulation material, and the withstand voltage isolation level depends on the spacing of the pins and the thickness of the plastic encapsulation material.

[0055] Embodiment 2

[0056] Please refer to Figure 3 and Figure 4Embodiment 2 of the present invention is a parallel technical solution of embodiment 1, and the only difference from embodiment 1 is that the first antenna 5 and the first base island 1 are an integrated structure integrally processed and formed, that is, the first antenna 5 is directly processed and formed on the first base island 1. In other words, it can also be considered that a partial area of ​​the first base island 1 is the radiation area of ​​the first antenna 5. At this time, the first antenna 5 can be directly formed during the period when the frame undergoes subtractive processing, eliminating the process of separate antenna production and mounting, which is conducive to improving the manufacturing efficiency of the millimeter-wave isolation transmission packaging structure.

[0057] Similarly, the second antenna 7 and the second base island 2 may also be an integrated structure formed by integral processing.

[0058] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A millimeter wave isolation transmission packaging structure, characterized in that: include A first base island, wherein a first material reduction area is provided at the bottom of the first base island; A second base island, wherein a second material reduction area is provided at the bottom of the second base island, and a gap is provided between the second base island and the first base island; a first plastic encapsulation body, the first plastic encapsulation body respectively connecting the first base island and the second base island and filling the first material reduction area and the second material reduction area; A first chip, the first chip is disposed on the first base island and is disposed corresponding to the first material reduction area; a first antenna, which is disposed on the first base island and is electrically connected to the first chip; A second chip, the second chip is disposed on the second base island and is disposed corresponding to the second material reduction area; a second antenna, the second antenna being disposed on the second base island and electrically connected to the second chip, and the second antenna being wirelessly connected to the first antenna; A second plastic sealing body, the second plastic sealing body is located above the first base island and the second base island and is respectively connected to the first base island, the second base island and the first plastic sealing body; The radiation area of ​​the first antenna is covered by the first plastic packaging body and the second plastic packaging body, and the radiation area of ​​the second antenna is covered by the first plastic packaging body and the second plastic packaging body.

2. The millimeter wave isolation transmission packaging structure according to claim 1 is characterized in that: The first antenna and the second antenna are arranged close to each other.

3. The millimeter wave isolation transmission packaging structure according to claim 2 is characterized in that: The first antenna is located at one end of the first base island close to the second base island, and the second antenna is located at one end of the second base island close to the first base island.

4. The millimeter wave isolation transmission packaging structure according to claim 3 is characterized in that: A first notch is provided at one end of the first base island close to the second base island, and a radiation area of ​​the first antenna is arranged corresponding to the first notch.

5. The millimeter wave isolation transmission packaging structure according to claim 4 is characterized in that: The first antenna is located on the top surface of the first base island or in the first reduced material area.

6. The millimeter wave isolation transmission packaging structure according to claim 3 is characterized in that: The first antenna and the first base island are an integrated structure formed by integral processing.

7. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first antenna is arranged opposite to the second antenna.

8. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first chip is located on the top surface of the first base island, and the second plastic package covers the first chip.

9. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first chip is located in the first material reduction area, and the first plastic package covers the first chip.

10. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first plastic packaging body and / or the second plastic packaging body fills the gap.

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