Waterproof microphone
By designing a waterproof microphone including a housing, MEMS diaphragm, waterproof diaphragm and semiconductor amplifier ASIC, the problem that existing microphones are difficult to achieve waterproof function in wearable electronic products is solved, and the waterproof function of the microphone single unit and the simplified design of the entire machine structure is realized.
Patent Information
- Application Number
- CN202422231400.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-09-12
AI Technical Summary
Existing microphones are difficult to achieve waterproofing in wearable electronic products, which leads to susceptibility to water when used outdoors, and the waterproofing treatment is complex, which increases the difficulty of the assembly process.
A waterproof microphone is designed, which includes a housing, a MEMS diaphragm, a waterproof diaphragm and a semiconductor amplifier ASIC. The housing is set in hollow, and the MEMS diaphragm and a semiconductor amplifier ASIC are fixedly installed inside the housing. The waterproof diaphragm completely covers the sound hole and is installed on the inner wall of the housing. The MEMS diaphragm and a semiconductor amplifier ASIC are connected by metal wires.
The waterproof function of the microphone single unit is realized, the waterproof structure design of the entire machine is simplified, the consideration of the adaptation of waterproof components is avoided, and it does not depend on seals and structural changes, and it is highly versatile.
Smart Images

Figure CN222852358U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of microphones, in particular to a waterproof microphone. Background Art
[0002] In wearable electronic products such as smartphones and watches, users have an increasingly strong demand for waterproof functions. Since the microphone unit currently does not have a waterproof function, the microphones in these outdoor products need to be waterproofed.
[0003] At present, waterproof treatment mainly adopts the method of "sealing" the whole machine, that is, adding waterproof design to the whole machine structure to prevent water from entering the microphone. However, the sealing waterproof design of the sound channel that needs to communicate with the outside world is relatively complicated, which brings many challenges to the whole machine structure and assembly process.
[0004] Among them, the sealed waterproof design at the sound channel usually requires the addition of protective rubber sleeves, waterproof nets and other waterproof components. This structure increases the assembly process, and in the structural design of the whole machine, it is necessary to consider the compatibility with the waterproof components. It is even more inconvenient to use it on small products. Utility Model Content
[0005] The purpose of the utility model is to overcome the shortcomings of the above-mentioned traditional technology and provide a waterproof microphone with strong versatility, which does not need to consider the adaptation problem of waterproof components during assembly and does not rely on any sealing parts and structural changes.
[0006] The purpose of the utility model is achieved through the following technical measures: a waterproof microphone, characterized in that it includes a shell, a MEMS diaphragm, a waterproof diaphragm and a semiconductor amplifier ASIC, the shell is hollow, the MEMS diaphragm and the semiconductor amplifier ASIC are fixedly installed inside the shell, the MEMS diaphragm plays a role of sound-to-electricity conversion, the semiconductor amplifier ASIC plays a role of signal adjustment, a sound hole is opened on the shell, the waterproof diaphragm completely covers the sound hole, the waterproof diaphragm is installed on the inner wall of the shell, and the MEMS diaphragm and the semiconductor amplifier ASIC are connected by metal wires.
[0007] As a preferred solution: the shell includes a substrate and a support member, the support member is fixedly mounted on the substrate, the substrate plays a supporting and circuit connecting role, the support member plays a supporting and signal shielding role, a cavity is formed between the substrate and the support member, and the MEMS diaphragm and the semiconductor amplifier ASIC are fixedly mounted in the cavity.
[0008] As a preferred solution: the sound hole is opened on the substrate, a substrate bonding layer is arranged on the substrate, the waterproof membrane is arranged in the substrate bonding layer, and the MEMS membrane is bonded to the top of the substrate bonding layer.
[0009] As a preferred solution: the sound hole is opened on the support member, the inner wall of the support member is bonded with a support member bonding layer, the support member bonding layer is fixedly bonded with a waterproof membrane, and the waterproof membrane completely covers the sound hole.
[0010] As a preferred solution: the semiconductor amplifier ASIC is fixedly connected to the substrate, the MEMS diaphragm and the semiconductor amplifier ASIC are connected by gold wire, and the substrate and the support are connected by solder paste.
[0011] Due to the adoption of the above technical solution, compared with the prior art, the advantages of the utility model are:
[0012] The utility model transforms the structure of the micro-microphone unit to achieve the purpose of waterproofing the microphone unit, simplifies the waterproof structure design of the whole machine, and eliminates the need to consider the adaptation of waterproof components during assembly. It is independent of any seals and structural changes and has strong versatility.
[0013] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Attached Figure 1 It is a structural schematic diagram of the first embodiment of the utility model.
[0015] Attached Figure 2 Yes Figure 1 A is an enlarged schematic diagram.
[0016] Attached Figure 3 It is a structural schematic diagram of the second embodiment of the present utility model. DETAILED DESCRIPTION
[0017] Embodiment 1: As shown in the attached Figure 1 and attached Figure 2 As shown, a waterproof microphone includes a shell 1, a MEMS diaphragm 2, a waterproof diaphragm 3 and a semiconductor amplifier ASIC4, the shell 1 is hollow, the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are fixedly installed inside the shell 1, the MEMS diaphragm 2 plays a role of sound-to-electricity conversion, and the MEMS diaphragm 2 is manufactured based on semiconductor technology; the semiconductor amplifier ASIC4 plays a signal adjustment role, and the semiconductor amplifier ASIC4 is manufactured based on semiconductor technology, the shell 1 is provided with a sound hole 5, the waterproof diaphragm 3 completely covers the sound hole 5, the waterproof diaphragm 3 is installed on the inner wall of the shell 1, and the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are connected by metal wires.
[0018] The shell 1 includes a substrate 11 and a support member 12, and the support member 12 is fixedly mounted on the substrate 11. The substrate 11 plays a supporting and circuit connecting role, and the support member 12 plays a supporting and signal shielding role. A cavity is formed between the substrate 11 and the support member 12, and the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are fixedly mounted in the cavity. The substrate 11 can optionally use an epoxy resin board or a ceramic board, and the support member 12 can optionally use an epoxy resin board, a ceramic board, a metal shell, etc.
[0019] The sound hole 5 is opened on the substrate 11 . The substrate 11 is provided with a substrate bonding layer 111 . The waterproof membrane 3 is arranged in the substrate bonding layer 111 . The MEMS membrane 2 is bonded to the top of the substrate bonding layer 111 .
[0020] The semiconductor amplifier ASIC4 is fixedly connected to the substrate 11, the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are connected by gold wire, and the substrate 11 and the support member 12 are connected by solder paste.
[0021] Embodiment 2, as attached Figure 3 As shown, a waterproof microphone comprises a shell 1, a MEMS diaphragm 2, a waterproof diaphragm 3 and a semiconductor amplifier ASIC4, wherein the shell 1 is hollow, the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are fixedly mounted inside the shell 1, the MEMS diaphragm 2 plays a role of sound-to-electricity conversion, the semiconductor amplifier ASIC4 plays a role of signal adjustment, a sound hole 5 is opened on the shell 1, the waterproof diaphragm 3 completely covers the sound hole 5, the waterproof diaphragm 3 is mounted on the inner wall of the shell 1, and the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are connected by metal wires.
[0022] The housing 1 includes a substrate 11 and a support member 12, wherein the support member 12 is fixedly mounted on the substrate 11, wherein the substrate 11 serves as a support and circuit connection, and the support member 12 serves as a support and signal shielding. A cavity is formed between the substrate 11 and the support member 12, and the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are fixedly mounted in the cavity.
[0023] The sound hole 5 is opened on the support member 12 , and a support member bonding layer 121 is bonded to the inner wall of the support member 12 . The support member bonding layer 121 is fixedly bonded to the waterproof membrane 3 , and the waterproof membrane 3 completely covers the sound hole 5 .
[0024] The semiconductor amplifier ASIC4 is fixedly connected to the substrate 11, the MEMS diaphragm 2 and the semiconductor amplifier ASIC4 are connected by gold wire, and the substrate 11 and the support member 12 are connected by solder paste.
[0025] It should be noted that the waterproof membrane 3 completely covers the sound hole 5, so that sound can enter normally, but can prevent moisture from entering the inner cavity of the support member and the substrate, thereby achieving the purpose of waterproofing.
Claims
1. A waterproof microphone, characterized in that: The invention comprises a housing (1), a MEMS diaphragm (2), a waterproof diaphragm (3) and a semiconductor amplifier ASIC (4); the housing (1) is hollow; the MEMS diaphragm (2) and the semiconductor amplifier ASIC (4) are fixedly mounted inside the housing (1); the MEMS diaphragm (2) performs a sound-to-electricity conversion function; the semiconductor amplifier ASIC (4) performs a signal adjustment function; a sound hole (5) is provided on the housing (1); the waterproof diaphragm (3) completely covers the sound hole (5); the waterproof diaphragm (3) is mounted on the inner wall of the housing (1); and the MEMS diaphragm (2) and the semiconductor amplifier ASIC (4) are connected by metal wires.
2. A waterproof microphone according to claim 1, characterized in that: The housing (1) comprises a substrate (11) and a support member (12); the support member (12) is fixedly mounted on the substrate (11); the substrate (11) performs a supporting and circuit connection function; the support member (12) performs a supporting and signal shielding function; a cavity is formed between the substrate (11) and the support member (12); the MEMS diaphragm (2) and the semiconductor amplifier ASIC (4) are fixedly mounted in the cavity.
3. A waterproof microphone according to claim 2, characterized in that: The sound hole (5) is opened on the substrate (11); a substrate bonding layer (111) is provided on the substrate (11); the waterproof membrane (3) is provided in the substrate bonding layer (111); and the MEMS membrane (2) is bonded to the top of the substrate bonding layer (111).
4. A waterproof microphone according to claim 2, characterized in that: The sound hole (5) is formed on the support member (12); the inner wall of the support member (12) is bonded with a support member bonding layer (121); the support member bonding layer (121) is fixedly bonded to the waterproof membrane (3); and the waterproof membrane (3) completely covers the sound hole (5).
5. The waterproof microphone according to claim 2, characterized in that: The semiconductor amplifier ASIC (4) is fixedly connected to a substrate (11), the MEMS diaphragm (2) and the semiconductor amplifier ASIC (4) are connected by gold wire, and the substrate (11) and the support member (12) are connected by solder paste.