Slitting device for alloy resistor base material

Abstract

The utility model relates to a slitting device for an alloy resistor base material, and the device comprises a heating part which is used for carrying out preheating treatment when viscose passes through the heating part; when the adhesive and the alloy coiled material pass through the crimping part, a composite base material is formed; the cutting device comprises a cooling assembly and a cutting part, the cutting part is arranged on the cooling assembly, and a composite base material is cooled when passing through the cooling assembly and is cut through the cutting part. Through cooperation of the heating part and the cooling assembly, the method can be fully utilized, in the process that the viscose and the alloy coil are combined and separated, it can be fully guaranteed that the viscose achieves the good expansion and shrinkage effect along with temperature changes, and therefore the final slitting quality of the composite base material is guaranteed.

Description

Technical Field

[0001] The present application belongs to the technical field of alloy resistor production, and specifically relates to a slitting device for alloy resistor substrates. Background Art

[0002] Alloy resistors are resistors that use alloys as current media and are often used to sample current in circuits. They are used to feedback the changing current in the circuit in order to further control or influence the current changes. They are mainly used in products such as battery protection boards, power supplies, inverters, lamps, motors, etc.

[0003] At present, in the production process of alloy foil resistors, when the alloy coil is bonded with the adhesive and the slitting step is performed, the adhesive and the alloy coil are often not in sufficient contact, which affects the good bonding between the two and even forms bubbles. During cutting, due to insufficient bonding, the adhesive and the alloy coil are pulled and misaligned or separated, thus affecting the subsequent processing. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of the embodiments of the present application and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and invention title of the present application to avoid blurring the purpose of this section, specification abstract and invention title, and such simplifications or omissions cannot be used to limit the scope of the present application.

[0005] In view of the following technical problems in the prior art: At present, in the process of alloy resistor manufacturing, when it comes to the cutting process of the material, it is easy to damage the bonding quality between the adhesive and the alloy. To solve this technical problem, this application provides the following technical solutions:

[0006] A slitting method for alloy resistor substrates, comprising the following steps:

[0007] Preheat the adhesive;

[0008] The adhesive is kept in a hot state and then bonded and pressed to the alloy coil to form a composite substrate;

[0009] The composite substrate is subjected to a cooling treatment, and the composite substrate is cut simultaneously in a cooling environment.

[0010] As a preferred technical solution for the slitting method of alloy resistor substrates, the preheating step of the viscose also includes a first temperature monitoring, and the early stage of the cutting process of the composite substrate also includes a second temperature monitoring. When the difference between the first temperature monitoring result and the second temperature monitoring result reaches a threshold, the cutting step is performed.

[0011] As a preferred technical solution for the slitting method of the alloy resistor substrate, it also includes a step of applying double-sided pressure to the composite substrate, which is performed simultaneously with the step of cutting the composite substrate.

[0012] Based on the above method, the present application also provides a slitting device for alloy resistor substrate, comprising:

[0013] A heating section, wherein the adhesive is preheated when passing through the heating section;

[0014] A crimping portion, through which the adhesive and the alloy coil form a composite substrate;

[0015] A cooling assembly and a cutting portion, wherein the cutting portion is disposed on the cooling assembly, and the composite substrate is cooled when passing through the cooling assembly and is cut by the cutting portion;

[0016] Wherein, the heating part, the crimping part and the cooling component are arranged in sequence.

[0017] As a preferred technical solution for a slitting device for alloy resistor substrates, the heating portion includes a heating box, which is provided with a through channel for the glue to pass through, and the heating box has a temperature monitoring function.

[0018] As a preferred technical solution for a slitting device for alloy resistor substrates, the device has a first path and a second path, the adhesive reaches the crimping part from the first path, and the alloy coil reaches the crimping part from the second path, the heating box is located on the first path, and the first path is located above the second path.

[0019] As a preferred technical solution for a slitting device for alloy resistor substrates, the cooling assembly comprises:

[0020] A bearing surface and a pressing portion movably arranged relative to the bearing surface, wherein the bearing surface is used to bear the composite substrate;

[0021] A pressing sheet with two ends elastically connected to the lower pressing portion and located above the bearing surface;

[0022] A water cooling mechanism acts on the pressing plate.

[0023] As a preferred technical solution for a slitting device for alloy resistor substrates, two opposite ends of the pressing sheet are connected with connecting seats, the connecting seats are slidably connected to the pressing part, and a spring assembly is connected between the connecting seats and the pressing part.

[0024] As an optimal technical solution for a slitting device for alloy resistor substrates, the cutting part includes a cutting knife, which is slidably matched with the pressing part and is connected to the pressing part by a spring assembly. A positioning groove is constructed through the pressing plate, and the cutting blade end is located in the positioning groove.

[0025] As an optimal technical solution for a slitting device for alloy resistor substrates, the water cooling mechanism includes a first cavity constructed in the cutting knife and a second cavity constructed inside the pressing sheet, the first cavity is connected to the second cavity, and the cooling liquid passes through the first cavity and the second cavity in sequence.

[0026] The slitting method and device for alloy resistor substrate provided in the present application have the following beneficial effects:

[0027] In the method of the present application, the viscose is preheated before being combined with the alloy coil, so that the viscose can have an expansion effect, thereby expanding its volume, and when it is cut after being combined with the alloy coil, the viscose can be shrunk by cooling, thereby reducing its volume, so that when the viscose and the alloy coil are not in contact due to the air filled therebetween, the air can be shrunk by cooling, thereby achieving the effect of eliminating the air, and at the same time, the air filled therein can be fully squeezed out by the shrinkage of the viscose, thereby achieving a good combination between the viscose and the alloy coil, so as to ensure that the two will not be offset during the cutting process.

[0028] 2 In the method of the present application, by adding a temperature monitoring link, the preheating and cooling conditions of the viscose can be monitored, thereby ensuring that the viscose can be sufficiently heated during the process and sufficiently cooled during cutting, thereby achieving a certain temperature change effect to ensure that the viscose has a good shrinkage effect during the cutting process.

[0029] In the device of the present application, the heating part and the cooling component cooperate to fully utilize the method of the present application, so that in the process of combining the viscose and the alloy roll and separating them, it can be fully ensured that the viscose can achieve a good expansion and contraction effect with the temperature change, thereby ensuring the final slitting quality of the composite substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0031] Figure 1 is the degree of flow in this application regarding the method.

[0032] Figure 2 It is a schematic diagram of the change of the air gap inside the substrate in this application.

[0033] Figure 3This is a schematic diagram of the device in use in this application.

[0034] Figure 4 For this application Figure 3 Front view of .

[0035] Figure 5 For about Figure 3 A separate display diagram of the middle part structure.

[0036] Figure 6 It is a schematic diagram of the positional relationship between the pressing sheet and the cutting knife in this application.

[0037] Figure 7 For about Figure 3 Schematic diagram of the vertical section of the middle structure.

[0038] Reference numerals:

[0039] 100, heating unit; 101, heating box; 101a, through passage;

[0040] 200, crimping portion;

[0041] 300, cooling assembly; 301, bearing surface; 302, lower pressing portion; 303, pressing sheet; 303a, connecting seat; 303b, positioning groove;

[0042] 400, cutting unit; 401, cutting knife;

[0043] 500, first cavity;

[0044] 600. Second cavity. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the drawings in the specification.

[0046] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0047] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present application. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0048] Secondly, the present application is described in detail with reference to schematic diagrams. When describing the embodiments of the present application in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0049] Example 1

[0050] Reference Figure 1 and Figure 2 , which is the first embodiment of the present application, provides a method for slitting an alloy resistor substrate, the method comprising at least the following steps, which are performed in sequence:

[0051] S1. Before the viscose is combined with the alloy coil, at least the viscose is preheated so that the viscose can fully form a thermal expansion effect and carry a certain temperature;

[0052] S2, while keeping the adhesive in a hot state, laminating and pressing the alloy coil, so that the two are combined into a composite substrate, and the combined composite substrate still has a certain temperature;

[0053] S3, cooling the formed composite substrate, and simultaneously cutting the composite substrate in a cold environment;

[0054] Based on the above, when the method is implemented, the corresponding steps are all completed by the corresponding equipment. Specifically, after the viscose is preheated, the viscose expands due to heat and forms a composite substrate after combining with the alloy coil. The composite substrate is cooled during the cutting process. At this time, if there are air gaps in the composite substrate, the volume of the air gaps shrinks due to the temperature reduction. At the same time, due to the cooling of the viscose, it shrinks, which has a further squeezing effect on the shrunk air gaps. When cooling, the squeezing effect gradually spreads from the middle of the composite substrate to both sides, so that the squeezing effect is gradually exerted from both sides of the middle phase, thereby further promoting the discharge of the shrunk air gaps. The entire change process of the air gap is roughly as follows: Figure 2 As shown, in addition, the cooling here can be carried out by equipment or by natural cooling. Natural cooling can reduce the energy consumption required for the implementation of this method, and at the same time prevent the composite substrate from shrinking and expanding too rapidly to cause deformation, so that the viscose and alloy roll of the composite substrate are fully connected in the process more stable. Through the action of this method, the bonding effect between the viscose and the alloy roll can be fully improved, so that when cutting, the cutting force is not easy to cause deviation between the viscose and the alloy roll, thereby improving the cutting accuracy and ensuring the quality of the entire process.

[0055] Furthermore, in the method, in the step of preheating the viscose, a first temperature monitoring process is also included, and the process of cutting the composite substrate also includes a second temperature monitoring process in the early stage. The first temperature monitoring helps to ensure the heating effect of the viscose so that it can fully reach the predetermined temperature before compounding. The second temperature monitoring process helps to ensure the cooling effect, and the cutting step is only performed when the difference between the first temperature monitoring result and the second temperature monitoring result reaches a threshold, that is, it is ensured that the viscose reaches a certain temperature change during the process, thereby having a sufficient shrinkage effect, so as to ensure that the cutting process is performed in a state where the air gap is fully discharged.

[0056] Furthermore, the method also includes a step of applying pressure on both sides of the composite substrate, which is performed simultaneously with the step of cutting the composite substrate. Specifically, when applying pressure, it is performed from the middle of the composite substrate to both sides, and from the cut portion to both ends. The pressure treatment can further achieve the discharge of air gaps from the middle of the composite substrate to both ends.

[0057] Example 2

[0058] Reference Figure 3-7 , which is the second embodiment of the present application, provides a slitting device for alloy resistor substrates, the device is used to cooperate with the specific implementation of the method described in Example 1, and the device includes the following parts:

[0059] A heating unit 100, wherein the adhesive may be preheated when passing through the heating unit 100;

[0060] A crimping portion 200, where the adhesive and the alloy coil will form a composite substrate when passing through the crimping portion 200;

[0061] A cutting section 400, through which the composite substrate is cut during the cooling process;

[0062] The heating part 100, the crimping part 200 and the cutting part 400 are arranged in sequence in terms of positional relationship. The adhesive and the alloy coil first pass through the crimping part 200 and then to the cutting part 400. The adhesive passes through the heating part 100 before reaching the crimping part 200.

[0063] In the above, during the processing of the device, the heating part 100 cooperates with the crimping part 200 to realize the molding of the composite substrate and make the composite substrate carry the temperature. When the composite substrate reaches the cutting part 400, the composite substrate leaves the front link and enters the cooling process, so that the shrinking effect can be achieved. At this time, the composite substrate is cut into sections by the cutting part 400.

[0064] Since the device uses the method provided by the present application, compared with the existing equipment, it can further ensure the final slitting effect of the material and make the coating quality of the alloy coil higher;

[0065] Here, in order to increase the cooling speed, a cooling component 300 can also be set. The cooling process of the composite substrate can be further intensified by the cooling component 300. When the cooling component 300 is set, the cooling component 300 can be set together with the cutting part 400, and the cutting part 400 can be set on the cooling component 300, so that the composite substrate can be cut synchronously while being cooled by the cooling component 300.

[0066] Further, see Figure 3 The heating part 100 includes a heating box 101, which is provided with a through channel 101a for the glue to pass through. The interior of the heating box 101 is a heating zone, and the glue is heated when passing through the through channel 101a. The heating box 101 also has a temperature monitoring function, so as to ensure that the internal temperature is always at a set value to ensure that the glue has a certain heating effect when passing through. The heating box 101 can adopt a box structure, and a heating element such as an electric heating wire is arranged inside.

[0067] Further, see Figure 4 The device has a first path and a second path. Specifically, the viscose reaches the crimping part 200 from the first path, and the alloy coil reaches the crimping part 200 from the second path. The heating box 101 is located on the first path, and the first path is located above the second path, so that the viscose is located above the alloy coil before the viscose and the alloy coil reach the crimping part 200. The viscose will soften due to heat, thereby forming a falling effect, thereby preventing it from being entangled, and when it contacts the alloy coil, the viscose can overlap on the alloy coil through the upper and lower relationship to complete the alignment effect before crimping. The first path and the second path only represent the paths passed by the viscose and the alloy coil, which represent an orientation relationship between the two, which can be virtual existence, or real existence, such as a guide channel can be set.

[0068] Further, see Figure 3-7 , the cooling assembly 300 comprises:

[0069] A carrying surface 301 and a pressing portion 302 movably arranged relative to the carrying surface 301, wherein the carrying surface 301 may be provided by a base, and the carrying surface 301 is used to carry the composite substrate;

[0070] A pressing piece 303 elastically connected to the lower pressing part 302 at both ends, the pressing piece 303 is made of metal and has a certain toughness, and is located above the bearing surface 301. For example, the pressing piece 303 can be a spring piece;

[0071] A water cooling mechanism acting on the pressing plate 303;

[0072] In the process of cooling and cutting the composite substrate, the lower pressing part 302 moves downward, so that the pressing sheet 303 is pressed against the adhesive side of the composite substrate, thereby applying pressure to the composite substrate. The surface of the pressing sheet 303 is arc-shaped, specifically, it is curved in the length direction, such as Figure 6 As shown, in the thickness direction, it is also in an arc shape, so that when it contacts the composite substrate, it can achieve the effect of gradually applying pressure from both sides of the intermediate phase, thereby promoting the discharge of the air gap. The water cooling component can cool the pressing plate 303 in this process, so that the pressing plate 303 can gradually form a cooling effect on the composite substrate from both sides of the intermediate phase through the heat transfer effect. The lower pressing part 302 and the base can be set for vertical sliding. The activity control of the lower pressing part 302 can be carried out by equipment such as a cylinder or a push rod, and the equipment can be set on the base. This part of the structure is omitted in the figure.

[0073] Further, see Figure 5 The two opposite ends of the pressing sheet 303 are connected with connecting seats 303a, and the connecting seats 303a are slidably connected to the pressing part 302, and a spring assembly is connected between the pressing part 302. When the pressing part 302 moves vertically, the pressing sheet 303 is pressed against the composite substrate to form a deformation, so that the two opposite ends are separated from each other. The connecting seats 303a are used to cooperate with the movement of the end of the pressing sheet 303 relative to the pressing part 302. The spring assembly helps to push the pressing sheet 303 to the initial position on the pressing part 302 when the shape of the pressing sheet 303 is restored. The spring assembly here can adopt a structure such as a U spring or a leaf spring.

[0074] Further, see Figure 3-7 The cutting part 400 includes a cutting knife 401, which is slidably matched with the pressing part 302 and is connected to the pressing part 302 by a spring assembly. A positioning groove 303b is formed on the pressing sheet 303, which is located in the middle of the pressing sheet 303 and has a size consistent with the thickness and width of the cutting knife 401. The cutting end of the cutting knife 401 is located in the positioning groove 303b. The spring assembly here helps to keep the cutting end of the cutting knife 401 from always leaving the positioning groove 303b, and the pressing sheet 303 will not be relative to the pressing part 3 02 forms a horizontal displacement. The spring assembly here can be a Z-shaped spring. When the pressing part 302 moves vertically downward, the cutting knife 401 contacts the composite substrate. As the pressing part 302 continues to move downward, the pressing sheet 303 is completely pressed against the surface of the composite substrate. The spring assembly is compressed to the bottom, and the pressing part 302 applies vertical force to the cutting knife 401. The cutting knife 401 punches and cuts the substrate. The pressing cooperation of the pressing sheet 303 helps to maintain the composite stability between the viscose and the alloy roll, so that no deviation occurs during the cutting process.

[0075] Further, see Figure 3-7 The water cooling mechanism includes a first cavity 500 constructed in the cutting blade 401 and a second cavity 600 constructed inside the pressing plate 303. The first cavity 500 is connected to the second cavity 600, and the connection can be achieved through a hose. When cooling, the cooling liquid passes through the first cavity 500 and the second cavity 600 in sequence to cool the cutting blade 401 and the pressing plate 303. The temperature of the cutting blade 401 is lower than the temperature of the pressing plate 303, so that the composite substrate is cooled starting from the cutting position. The flow of the cooling liquid in the pipeline can be achieved by an external pump body structure.

[0076] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0077] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application, which should be included in the scope of the claims of the present application.

Claims

1. A slitting device for alloy resistor substrate, characterized in that: The device comprises: A heating part (100), wherein the adhesive is preheated when passing through the heating part (100); A crimping portion (200), wherein the adhesive and the alloy coil form a composite substrate when passing through the crimping portion (200); A cutting section (400), through which the composite substrate is cut during the cooling process; Wherein, the heating part (100), the crimping part (200) and the cutting part (400) are arranged in sequence.

2. The slitting device for alloy resistor substrate according to claim 1, characterized in that: The heating part (100) comprises a heating box (101) on which a through channel (101a) is provided for the glue to pass through, and the heating box (101) has a temperature monitoring function.

3. The slitting device for alloy resistor substrate according to claim 2, characterized in that: The device has a first path and a second path, the adhesive reaches the crimping part (200) via the first path, and the alloy coil reaches the crimping part (200) via the second path, the heating box (101) is located on the first path, and the first path is located above the second path.

4. The slitting device for alloy resistor substrate according to claim 3, characterized in that: The device also has a cooling assembly (300), the cooling assembly (300) comprising: A bearing surface (301) and a pressing portion (302) movably arranged relative to the bearing surface (301), wherein the bearing surface (301) is used to bear a composite substrate; A pressing sheet (303) with two ends elastically connected to the lower pressing portion (302), located above the bearing surface (301); A water cooling mechanism acts on the pressing plate (303).

5. The slitting device for alloy resistor substrate according to claim 4, characterized in that: A connecting seat (303a) is connected to two opposite ends of the pressing sheet (303), the connecting seat (303a) is slidably connected to the pressing portion (302), and a spring assembly is connected between the connecting seat (303a) and the pressing portion (302).

6. The slitting device for alloy resistor substrate according to claim 4, characterized in that: The cutting portion (400) comprises a cutting knife (401) which is slidably matched with the pressing portion (302) and is connected to the pressing portion (302) by a spring assembly; a positioning groove (303b) is formed through the pressing sheet (303), and the blade end of the cutting knife (401) is located in the positioning groove (303b).

7. The slitting device for alloy resistor substrate according to claim 6, characterized in that: The water cooling mechanism comprises a first cavity (500) constructed in the cutting knife (401) and a second cavity (600) constructed inside the pressing sheet (303); the first cavity (500) is connected to the second cavity (600), and the cooling liquid passes through the first cavity (500) and the second cavity (600) in sequence.

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