Cache device

Abstract

The utility model belongs to the field of semiconductor processing equipment, and relates to a cache device which comprises a cache mechanism and a restoration mechanism, and the cache mechanism is provided with more than two cache spaces; the restoration mechanism comprises more than two restoration assemblies and at least one driving assembly, and each restoration assembly is movably arranged at a pick-and-place opening of the cache mechanism; the driving assemblies are installed on the buffering mechanism, one driving assembly is connected with at least one restoration assembly, and therefore the two or more restoration assemblies move in the restoration direction in the same direction or in the opposite directions. According to the caching device, the sheet-shaped products are cached through the more than two caching spaces, and after the sheet-shaped products are cached in the caching spaces, the driving assembly drives the more than two restoration assemblies to move towards each other or back to back in the restoration direction, so that the corresponding restoration assemblies abut against the sheet-shaped products in the caching spaces. Therefore, restoration of the sheet-shaped products in the multiple cache spaces is achieved, and the restoration efficiency of the cache device is improved while it is ensured that the sheet-shaped products in the cache spaces are stacked in order.

Description

Technical Field

[0001] The present application relates to semiconductor processing equipment, and in particular, to a cache device. Background Art

[0002] When the existing cache device receives silicon wafers, the silicon wafers are not stacked neatly together. There will be a certain error in the left and right positions of the stacked silicon wafers, causing them to tilt to one side, resulting in the robot arm deviating from its position when loading the stacked silicon wafers into the graphite boat, causing damage to the silicon wafers. Utility Model Content

[0003] In view of this, it is necessary to provide a buffer device to improve the technical problem that workpieces in the existing buffer device are not properly stacked and are easily damaged.

[0004] An embodiment of the present application provides a cache device for caching sheet products. The cache device includes a cache mechanism and a correction mechanism. The cache mechanism has a cache space with more than two cache sheet products, and the two or more cache spaces are distributed in parallel along the correction direction; the correction mechanism includes more than two correction components and at least one driving component. The correction components are arranged in parallel along the correction direction, and each correction component is movably arranged at a loading and unloading port of the cache mechanism; the driving component is installed on the cache mechanism, and one driving component is connected to at least one correction component, so that the two or more correction components move toward or away from each other along the correction direction, and the correction component is used to push against the sheet products in the cache space.

[0005] The above-mentioned cache device caches the sheet products through more than two cache spaces. After the sheet products are cached in the cache space, the driving component drives more than two alignment components to move toward or away from each other along the alignment direction, so that the corresponding alignment components abut against the sheet products in the cache space. In this way, alignment of the sheet products in multiple cache spaces is achieved, and the alignment efficiency of the cache device is improved while ensuring that the sheet products in the cache space are neatly coded.

[0006] In at least one embodiment, the return component includes a first connecting member and a first return and / or a second return member, the first connecting member is slidably installed on the cache mechanism, the first connecting member includes a first side and a second side arranged along the return direction; the first return member is arranged on the first side of the first connecting member along the first direction, the first direction intersects with the return direction and the upper surface of the first connecting member; the second return member is arranged on the second side of the first connecting member along the first direction, and the second return member in a return component and the second return member of the adjacent return component are offset from each other in the return direction; wherein, two or more return components are arranged along the return direction When moving toward or away from each other, two adjacent first connecting members move relative to each other, so that the first returning member in a returning component and the second returning member in an adjacent returning component jointly abut the sheet product, and the second returning member in the returning component and the first returning member in the adjacent returning component jointly abut the sheet product; or, when two adjacent first connecting members move relative to each other, the first connecting member drives the first returning member to abut one side of the sheet product; or, when two adjacent first connecting members move relative to each other, the first connecting member drives the second returning member to abut against one side of the sheet product cached in the adjacent cache space.

[0007] In at least one embodiment, the return component also includes a second connecting member, one end of the second connecting member is connected to the first return member, and the other end of the second connecting member is connected to the second return member; in two adjacent return components, the second connecting member in one return component is bent toward or away from the cache space to form a groove; when the two adjacent return components move relative to each other, the second connecting member in one return component can be inserted into the groove in the adjacent return component; in two adjacent return components, a guide portion is provided on the second side of a first connecting member, and a guide groove is provided on the second side of the other first connecting member; when the two adjacent return components move relative to each other, the guide portion slides in the guide groove.

[0008] In at least one embodiment, the cache mechanism includes a first cache space and a second cache space arranged in parallel, and the correction mechanism includes two groups of first correction components and second correction components. The first correction components in the two groups are symmetrically arranged at the access port of the first cache space, and the second correction components in the two groups are symmetrically arranged at the access port of the second cache space.

[0009] In at least one embodiment, the cache mechanism includes a base, a fixed plate, and a first support assembly, a second support assembly, and a third support assembly that are arranged in sequence along the correction direction. The driving assembly is installed on the base, and the fixed plate is arranged above the base; the first support assembly, the second support assembly, and the third support assembly are all installed between the base and the fixed plate, and a first cache space is formed between the first support assembly and the second support assembly, and a second cache space is formed between the second support assembly and the third support assembly.

[0010] In at least one embodiment, the first support assembly includes a first mounting plate and a plurality of first support members, the first mounting plate is fixed to the base, and the plurality of first support members are arranged at equal intervals along the first direction on the surface of the first mounting plate facing the first cache space; the second support assembly includes a second mounting plate, a plurality of second support members and a plurality of third support members, the second mounting plate is fixed to the base, the plurality of second support members are arranged at equal intervals along the first direction on the surface of the second mounting plate facing the first cache space, and the plurality of third support members are arranged at equal intervals along the first direction on the surface of the second mounting plate facing the second cache space; the third support assembly includes a third mounting plate and a plurality of fourth support members, the third mounting plate is fixed to the base, and the plurality of fourth support members are arranged at equal intervals along the first direction on the surface of the third mounting plate facing the second cache space; the first support members correspond one-to-one with the second support members along the alignment direction to jointly carry a sheet-like product; the third support members correspond one-to-one with the fourth support members along the alignment direction to jointly carry a sheet-like product.

[0011] In at least one embodiment, the drive assembly includes a drive member and two or more transmission fixing members, the drive member is mounted to the cache mechanism, the drive member includes a belt or a screw; two or more transmission fixing members are fixedly connected to the belt or threadedly connected to the screw, and each transmission fixing member is mounted on a correction assembly; the belt or screw is configured to drive the two or more transmission fixing members to move synchronously, so that the two or more correction assemblies move toward or away from each other along the correction direction; or, the drive assembly includes two or more linear power members, all of which are mounted to the cache mechanism, and each linear power member is correspondingly connected to a correction assembly.

[0012] In at least one embodiment, the cache device further includes a lifting mechanism, which is connected to the cache mechanism and is configured to drive the cache mechanism to move along the first direction.

[0013] In at least one embodiment, the cache mechanism further includes two or more pallets, all of which are arranged at intervals along the alignment direction and connected to the same side of the cache mechanism; the pallet is installed to the side of the cache mechanism away from the pick-up and release port; the pallet is provided with a plurality of support teeth, and the plurality of support teeth are arranged at intervals along the first direction; a support tooth groove is formed between two adjacent support teeth, and each support tooth groove is configured to clamp the edge area of ​​the sheet product.

[0014] In at least one embodiment, the cache device also includes a rotating mechanism, which is rotatably connected to the cache mechanism, and the rotating mechanism is configured to drive the cache mechanism to flip around the rotation axis so that the sheet product is accommodated in the corresponding tooth groove; the rotation axis is parallel to the correction direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope.

[0016] Figure 1 A schematic diagram of the structure of a cache device provided in one embodiment of the present application;

[0017] Figure 2 for Figure 1 The schematic diagram of the structure of the cache device shown in the figure is a schematic diagram of the structure of the cache device after omitting some structures;

[0018] Figure 3 for Figure 2 The schematic diagram of the structure of the cache device shown in the figure is a schematic diagram of the structure from another angle after omitting some structures;

[0019] Figure 4 for Figure 2 The schematic diagram of the structure of the cache device shown in the figure is another perspective diagram after omitting some structures;

[0020] Figure 5 A structural frame of a correction component provided in an embodiment of the present application Figure 1 , wherein the correction component is corrected by a first correcting member;

[0021] Figure 6 A structural frame of a correction component provided in an embodiment of the present application Figure 2 , wherein the correction component is corrected by a second correcting member;

[0022] Figure 7 A structural block diagram of the cooperation between a driving assembly and a correction assembly provided in an embodiment of the present application, wherein the driving assembly is a linear power member;

[0023] Figure 8 for Figure 1 A schematic diagram of the structure of a support plate in the cache device shown;

[0024] Fig. 9 for Figure 8 A partial enlarged view of point VII in the middle.

[0025] Description of main component symbols:

[0026] 1. Cache device;

[0027] 10. Cache mechanism; 11. Base; 12. Fixing plate; 13. First support assembly; 131. First mounting plate; 132. First support member; 14. Second support assembly; 141. Second mounting plate; 142. Second support member; 143. Third support member; 15. Third support assembly; 151. Third mounting plate; 152. Fourth support member; 16. Cache space; 16a. First cache space; 16b. Second cache space; 17. Access opening;

[0028] 20. Correction mechanism; 21. Correction assembly; 211. First connecting member; 2111. First side; 2112. Second side; 212. First correcting member; 213. Second correcting member; 214. Second connecting member; 215. Groove; 216. Guide portion; 217. Guide groove; 21a. First correcting assembly; 21b. Second correcting assembly; 22. Driving assembly; 221. Driving member; 2211. Belt; 222. Transmission fixing member; 223. Linear power member;

[0029] 30. Lifting mechanism;

[0030] 40. support plate; 41. support tooth; 42. support tooth groove;

[0031] 50. Rotating mechanism;

[0032] X, normalization direction; Y, first direction; Z, second direction. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0034] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0036] An embodiment of the present application provides a cache device for caching sheet products. The cache device includes a cache mechanism and a correction mechanism. The cache mechanism has two or more cache spaces for caching sheet products, and the two or more cache spaces are distributed in parallel along the correction direction; the correction mechanism includes two or more correction components and at least one driving component. The correction components are arranged in parallel along the correction direction, and each correction component is movably arranged at a loading and unloading port of the cache mechanism; the driving component is installed on the cache mechanism, and one driving component is connected to at least one correction component, so that the two or more correction components move toward or away from each other along the correction direction, and the correction component is used to push against the sheet products in the cache space.

[0037] The above-mentioned cache device caches the sheet products through more than two cache spaces. After the sheet products are cached in the cache space, the driving component drives more than two alignment components to move toward or away from each other along the alignment direction, so that the corresponding alignment components abut against the sheet products in the cache space. In this way, alignment of the sheet products in multiple cache spaces is achieved, and the alignment efficiency of the cache device is improved while ensuring that the sheet products in the cache space are neatly coded.

[0038] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0039] An embodiment of the present application provides a cache device 1 for caching a sheet product. The sheet product may be a whole silicon wafer, a half silicon wafer cut from a whole silicon wafer, or other suitable products, which are not limited in the present application. For ease of description, the present application will take a half silicon wafer as an example for description.

[0040] like Figure 1 , Figure 2 and Figure 3 As shown, the cache device 1 includes a cache mechanism 10 and a correction mechanism 20. The cache mechanism 10 has more than two cache spaces 16. The two or more cache spaces 16 are arranged in parallel along the correction direction X. The cache space 16 is used to accommodate silicon wafers. The correction mechanism 20 includes more than two correction components 21 and at least one driving component 22. The correction components 21 are arranged in parallel along the correction direction X. Each correction component 21 is movably arranged at a take-and-put port 17 of the cache mechanism 10. The driving component 22 is installed on the cache mechanism 10. One driving component 22 is connected to at least one correction component 21, so that the two or more correction components 21 move toward or away from each other along the correction direction X, and use the correction component 21 to push against the sheet product in the cache space 16. The correction direction X is the moving direction of the two or more correction components 21 toward or away from each other.

[0041] It can be understood that when using the cache device 1, the technician first places the external silicon wafers in the two or more cache spaces 16 along the access opening 17 of the cache mechanism 10. After the two or more cache spaces 16 store the silicon wafers, the driving component 22 drives the two or more alignment components 21 to move toward or away from each other along the alignment direction X, so that the corresponding alignment component 21 abuts against the silicon wafer in the corresponding cache space 16, thereby realizing alignment of the silicon wafers in the multiple cache spaces 16.

[0042] Compared to the existing cache device 1, the cache device 1 in the present application caches silicon wafers through more than two cache spaces 16, and corrects the silicon wafers in the more than two cache spaces 16 through more than two correction components 21. This can ensure that the silicon wafers in each cache space 16 are neatly stacked, reducing the risk of damage to the silicon wafers during subsequent transportation due to placement errors of the silicon wafers, and can also improve the correction efficiency of the cache device 1.

[0043] The first direction Y is defined as being perpendicular to the alignment direction X and the upper surface of the first connecting member 211. In other embodiments, the first direction Y may not be perpendicular to the alignment direction X and the upper surface of the first connecting member 211, and this application does not limit this.

[0044] In some embodiments, Figure 2 and Figure 3 As shown, the return component 21 includes a first connecting member 211, a first return member 212, and a second return member 213. The first connecting member 211 is slidably mounted on the cache mechanism 10 and connected to the driving component 22. The first connecting member 211 includes a first side 2111 and a second side 2112 arranged along the return direction X. The first return member 212 is arranged on the first side 2111 of the first connecting member 211 along the first direction Y. The second return member 213 is arranged on the second side 2112 of the first connecting member 211 along the first direction Y, and the second return member 213 in one return component 21 and the second return member 213 of the adjacent return component 21 are mutually offset in the return direction X.

[0045] When more than two correction components 21 move toward or away from each other along the correction direction X, two adjacent first connecting members 211 move relative to each other, so that the first correction member 212 in one correction component 21 and the second correction member 213 in the adjacent correction component 21 jointly press against the silicon wafer in one cache space 16, and the second correction member 213 in the correction component 21 and the first correction member 212 in the adjacent correction component 21 jointly press against the silicon wafer in another cache space 16, so as to realize the correction of the silicon wafer in the cache space 16.

[0046] In some embodiments, Figure 2 and Figure 5As shown, the correction component 21 includes a first connecting member 211 and a first correction member 212. The first connecting member 211 is slidably mounted on the cache mechanism 10 and connected to the driving component 22. The first connecting member 211 includes a first side 2111 and a second side 2112 arranged along the correction direction X. The first correction member 212 is arranged on the first side 2111 of the first connecting member 211 along the first direction Y. When two adjacent first connecting members 211 move relative to each other (specifically, two adjacent first connecting members 211 move toward each other), the first connecting member 211 drives the first correction member 212 to press against one side of the silicon wafer to realize the correction of the silicon wafer in the cache space 16.

[0047] In some embodiments, Figure 2 and Figure 6 As shown, the correction component 21 includes a first connection member 211 and a second correction member 213. The first connection member 211 is slidably mounted on the cache mechanism 10 and connected to the driving component 22. The first connection member 211 includes a first side 2111 and a second side 2112 arranged along the correction direction X. The second correction member 213 is arranged on the second side 2112 of the first connection member 211 along the first direction Y. The second correction member 213 in a correction component 21 and the second correction member 213 of the adjacent correction component 21 are mutually offset in the correction direction X. When two adjacent first connection members 211 move relative to each other (specifically, two adjacent first connection members 211 move in opposite directions), the first connection member 211 drives the second correction member 213 to offset and abut against one side of the silicon wafer cached in the adjacent cache space 16, so as to realize the correction of the silicon wafer in the cache space 16.

[0048] In some embodiments, Figure 2 and Figure 3 As shown, the correction component 21 also includes a second connecting member 214, one end of the second connecting member 214 is connected to the first correction member 212, and the other end of the second connecting member 214 is connected to the second correction member 213, so as to improve the overall stability and strength of the correction component 21 and reduce the risk of deformation of the first correction member 212 and the second correction member 213 due to force.

[0049] In some embodiments, of two adjacent return components 21, the second connection member 214 in one return component 21 is bent toward or away from the cache space 16 to form a groove 215. In the case where the two adjacent return components 21 move relative to each other, the second connection member 214 in one return component 21 can be inserted into the groove 215 in the adjacent return component 21 to limit the relative movement distance of the two adjacent return components 21, thereby reducing the risk of squeezing and damaging the silicon wafer in the corresponding cache device 1 due to the excessive relative movement distance of the two adjacent return components 21.

[0050] It can be understood that when two adjacent return assemblies 21 move toward each other, the second return member 213 in one return assembly 21 moves offset from the second return member 213 in the adjacent return assembly 21. At this time, the second connecting member 214 in one return assembly 21 can be inserted into the groove 215 of the second connecting member 214 in the adjacent return assembly 21.

[0051] When the second return piece 213 in a return assembly 21 and the second return piece 213 of the adjacent return assembly 21 are moved to the target position, the end of the second connection piece 214 in the groove 215 along the return direction X can abut against the groove wall of the groove 215, and the groove wall of the groove 215 can prevent the second connection piece 214 in the groove 215 from continuing to move, so that the second return piece 213 in a return assembly 21 and the second return piece 213 of the adjacent return assembly 21 stop relative movement. In this way, the risk of squeezing and damaging the silicon wafer in the corresponding cache device 1 due to the excessive relative movement distance of the two adjacent return assemblies 21 is reduced.

[0052] It is worth noting that the target position specifically refers to the position where the second correcting member 213 in the correcting assembly 21 and the first correcting member 212 in the adjacent correcting assembly 21 abut against the silicon wafer together.

[0053] In some embodiments, Figure 4 As shown, in two adjacent return assemblies 21, a second side 2112 of a first connecting member 211 is provided with a guide portion 216, and a second side 2112 of the other first connecting member 211 is provided with a guide groove 217. When the two adjacent return assemblies 21 move relative to each other, the guide portion 216 slides in the guide groove 217 to improve the relative motion accuracy of the two adjacent return assemblies 21 and reduce the risk of damaging the silicon wafer due to offset when the two return assemblies 21 move relative to each other. Preferably, the guide portion 216 is a protrusion that matches the guide groove 217.

[0054] In some embodiments, Figure 1 , Figure 2 and Figure 3As shown, the cache mechanism 10 includes a first cache space 16a and a second cache space 16b arranged in parallel, and the correction mechanism 20 includes two groups of first correction components 21a and second correction components 21b, wherein the first correction components 21a in the two groups are symmetrically arranged at the access opening 17 of the first cache space 16a, and the second correction components 21b in the two groups are symmetrically arranged at the access opening 17 of the second cache space 16b. It can be understood that when the cache device 1 corrects the silicon wafer, one of the two groups of first correction components 21a and second correction components 21b corrects the same end of the two silicon wafers accommodated in the first cache space 16a and the second cache space 16b, and at the same time, the other group of the two groups of first correction components 21a and second correction components 21b corrects the other end of the silicon wafer accommodated in the first cache space 16a and the second cache space 16b. Thus, the correction of both ends of the silicon wafer is achieved at the same time, and the correction effect of the cache device 1 is improved.

[0055] In other embodiments, the number of cache spaces 16 and the number of correction components 21 may be other, which is not limited in the present application, and those skilled in the art may choose according to actual conditions.

[0056] In some specific embodiments, Figure 1 , Figure 2 and Figure 3 As shown, the cache mechanism 10 includes a base 11, a fixed plate 12, a first support assembly 13, a second support assembly 14 and a third support assembly 15. The drive assembly 22 is mounted on the base 11, the fixed plate 12 is arranged above the base 11, and the first support assembly 13, the second support assembly 14 and the third support assembly 15 are all mounted between the base 11 and the fixed plate 12, and are arranged at intervals along the alignment direction X. Among them, a first cache space 16 is formed between the first support assembly 13 and the second support assembly 14, and a second cache space 16 is formed between the second support assembly 14 and the third support assembly 15. By setting the first cache space 16 and the second cache space 16, the cache of double-row silicon wafers can be realized. It should also be noted that the cache device 1 can adjust the spacing between two adjacent ones through the first support assembly 13, the second support assembly 14 and the third support assembly 15 to adapt to silicon wafers of different sizes, thereby improving the flexibility of the cache device 1.

[0057] In some more specific embodiments, the first support assembly 13 includes a first mounting plate 131 and a plurality of first support members 132, the first mounting plate 131 is fixed to the base 11, and the plurality of first support members 132 are arranged at equal intervals along the first direction Y on the surface of the first mounting plate 131 facing the first cache space 16. The second support assembly 14 includes a second mounting plate 141, a plurality of second support members 142 and a plurality of third support members 143, the second mounting plate 141 is fixed to the base 11, the plurality of second support members 142 are arranged at equal intervals along the first direction Y on the surface of the second mounting plate 141 facing the first cache space 16, and the plurality of third support members 143 are arranged at equal intervals along the first direction Y on the surface of the second mounting plate 141 facing the second cache space 16.

[0058] The third support assembly 15 includes a third mounting plate 151 and a plurality of fourth support members 152. The third mounting plate 151 is fixed to the base 11. The plurality of fourth support members 152 are arranged at equal intervals along the first direction Y on the surface of the third mounting plate 151 facing the second cache space 16. In the first cache space 16, the first support member 132 corresponds to the second support member 142 one by one along the normalization direction X to jointly carry a silicon wafer. In the second cache space 16, the third support member 143 corresponds to the fourth support member 152 one by one along the normalization direction X to jointly carry a silicon wafer.

[0059] It can be understood that by arranging the first support member 132 and the second support member 142 in the first cache space 16a, and the first support member 132 and the second support member 142 are aligned with each other along the return direction X, the silicon wafer can be stably accommodated in the first cache space 16a. By arranging the third support member 143 and the fourth support member 152 in the second cache space 16b, and the third support member 143 and the fourth support member 152 are aligned with each other along the return direction X, the silicon wafer can be stably accommodated in the second cache space 16b.

[0060] It should be noted that the cache device 1 can adapt to silicon wafers of different thicknesses by adjusting the spacing between two adjacent first support members 132, the spacing between two adjacent second support members 142, the spacing between two adjacent third support members 143, and the spacing between two adjacent fourth support members 152, thereby further improving the flexibility of the cache device 1.

[0061] In some embodiments, Figure 4As shown, the driving assembly 22 includes a driving member 221 and two or more transmission fixing members 222. The driving member 221 is installed to the cache mechanism 10. The driving member 221 includes a belt 2211. All the transmission fixing members 222 are fixedly connected to the belt 2211. Each transmission fixing member 222 is installed on a return assembly 21. The belt 2211 is configured to drive the two or more transmission fixing members 222 to move synchronously, so that the two or more return assemblies 21 move toward or away from each other along the return direction X.

[0062] In some embodiments, Figure 4 As shown, the driving member 221 includes a screw rod (not shown), all the transmission fixing members 222 are threadedly connected to the screw rod, and each transmission fixing member 222 is installed on a correction component 21. The screw rod is configured to drive more than two transmission fixing members 222 to move synchronously, so that more than two correction components 21 move toward or away from each other along the correction direction X.

[0063] Through the cooperation of the driving member 221, the transmission fixing member 222 and the belt 2211 (or the screw), a single driving member 221 can simultaneously drive more than two alignment components 21 to move, thereby reducing the use of the driving member 221, simplifying the structure and reducing the production cost. It should also be noted that the belt drive method has a higher transmission smoothness, which can reduce impact and vibration and ensure the stability of the silicon wafer.

[0064] In other embodiments, each correction component 21 is controlled by a separate drive component 22. Figure 7 As shown, the driving assembly 22 includes more than two linear power members 223, all of which are installed on the cache mechanism 10, each linear power member 223 is correspondingly connected to a return assembly 21, and the linear power member 223 is configured to drive the return assembly 21 to move.

[0065] In some embodiments, Figure 1 As shown, the cache device 1 also includes a lifting mechanism 30, which is connected to the cache mechanism 10 and is configured to drive the cache mechanism 10 to move along the first direction Y. It can be understood that when it is necessary to cache silicon wafers, the lifting mechanism 30 drives the cache mechanism 10 to move so that the access port 17 in the cache mechanism 10 is aligned with the discharge of the silicon wafer of the external device in a direction perpendicular to the first direction Y. When the external device transports the silicon wafer along the discharge, the silicon wafer can enter the corresponding cache space 16 through the access port 17 in the cache mechanism 10, thereby realizing automatic caching of the workpiece. Through the setting of the lifting mechanism 30, the automation degree of the cache device 1 can be improved, thereby further improving the working efficiency of the cache device 1.

[0066] In some embodiments, Figure 1 , Figure 8 and Fig. 9 As shown, the cache mechanism 10 also includes more than two pallets 40, all of which are arranged at intervals along the alignment direction X and connected to the same side of the cache mechanism 10. The cache mechanism 10 includes a take-in and take-out port 17 corresponding to each cache space 16, and the take-in and take-out port 17 is arranged along the second direction Z. The take-in and take-out port 17 is configured to allow silicon wafers to enter and exit the cache space 16, and the second direction Z intersects with the first direction Y and the alignment direction X. The pallet 40 is installed to the side of the cache mechanism 10 away from the take-in and take-out port 17, and the pallet 40 is provided with a plurality of teeth 41, and the plurality of teeth 41 are arranged at intervals along the first direction Y, and a tooth 41 groove is formed between two adjacent teeth 41, and each tooth 41 groove is configured to clamp the edge area of ​​the silicon wafer.

[0067] In some embodiments, the rotation axis is defined to be parallel to the normalization direction X. Figure 1 As shown, the cache device 1 also includes a rotating mechanism 50, which is rotatably connected to the cache mechanism 10. The rotating mechanism 50 is configured to drive the cache mechanism 10 to flip around the rotation axis so that the silicon wafer is accommodated in the corresponding tooth 41 groove, thereby facilitating the subsequent robot mechanism to absorb the silicon wafer.

[0068] It is understandable that when the rotating mechanism 50 drives the cache mechanism 10 to flip, the silicon wafer is accommodated in the corresponding groove of the tooth 41. In this way, not only can the stability of the silicon wafer during the flipping process be ensured and the risk of the silicon wafer falling can be reduced, but also all the silicon wafers can be tilted in the same direction, which is convenient for taking and placing the workpiece and improving the handling efficiency of the silicon wafer.

[0069] Preferably, the flip angle of the cache mechanism 10 is 90°-100°. In this way, it is possible to avoid the silicon wafer falling due to the flip angle of the cache mechanism 10 being too large, or the external robot mechanism having difficulty in picking up the silicon wafer due to the flip angle of the cache mechanism 10 being too small.

[0070] Exemplarily, the working process of the cache device 1 provided in the present application is as follows: the lifting mechanism 30 drives the cache mechanism 10 to move along the first direction Y to cache the silicon wafers in more than two cache spaces 16. After the silicon wafers in more than two cache spaces 16 are fully cached, the driving component 22 drives more than two correction components 21 to move toward or away from each other along the correction direction X, so that the corresponding correction component 21 abuts against the silicon wafer in the corresponding cache space 16, thereby realizing the correction of the silicon wafers in multiple cache spaces 16. After the silicon wafer correction is completed, the rotating mechanism 50 drives the cache mechanism 10 to flip 90°, so that the silicon wafer in the cache space 16 falls into the corresponding tooth 41 groove in the support plate 40, and finally, the external robot mechanism takes away the silicon wafer in the cache mechanism 10.

[0071] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A buffer device for buffering sheet products, characterized in that: The cache device comprises: A caching mechanism having two or more caching spaces for caching the sheet products, wherein the two or more caching spaces are arranged in parallel along the normalization direction; The correction mechanism includes two or more correction components and at least one driving component. The correction components are arranged in parallel along the correction direction, and each of the correction components is movably arranged at a loading and unloading port of the cache mechanism; the driving component is installed on the cache mechanism, and one driving component is connected to at least one of the correction components, so that the two or more correction components move toward or away from each other along the correction direction, and the correction components are used to push against the sheet product in the cache space.

2. The cache device according to claim 1, characterized in that: The correction components include: A first connecting member, the first connecting member is slidably mounted on the cache mechanism; the first connecting member comprises a first side and a second side arranged along the return direction; a first correcting member, the first correcting member being disposed on a first side of the first connecting member along a first direction, the first direction intersecting the correcting direction and an upper surface of the first connecting member; and / or a second return member, the second return member being disposed on a second side of the first connecting member along the first direction, and the second return member in one return assembly and the second return member in an adjacent return assembly are offset from each other in the return direction; When two or more of the return components move toward or away from each other along the return direction, two adjacent first connecting members move relative to each other, so that the first return member in one return component and the second return member in the adjacent return component jointly abut against the sheet product, and the second return member in the return component and the first return member in the adjacent return component jointly abut against the sheet product; Alternatively, when two adjacent first connecting members move relative to each other, the first connecting member drives the first correcting member to abut against one side of the sheet product; Alternatively, when two adjacent first connecting members move relative to each other, the first connecting member drives the second correcting member to be offset and abut against one side of the sheet product cached in the adjacent cache space.

3. The cache device according to claim 2, characterized in that: The correction component further includes a second connecting member, one end of the second connecting member is connected to the first correction member, and the other end of the second connecting member is connected to the second correction member; In two adjacent return assemblies, the second connecting member in one return assembly is bent toward or away from the buffer space to form a groove; when the two adjacent return assemblies move relative to each other, the second connecting member in one return assembly can be inserted into the groove in the adjacent return assembly; In two adjacent return assemblies, a guide portion is provided on the second side of one of the first connecting members, and a guide groove is provided on the second side of the other of the first connecting members; when the two adjacent return assemblies move relative to each other, the guide portion slides in the guide groove.

4. The cache device according to claim 1, characterized in that: The cache mechanism includes a first cache space and a second cache space arranged in parallel, and the correction mechanism includes two groups of first correction components and second correction components. The first correction components in the two groups are symmetrically arranged at the access ports of the first cache space, and the second correction components in the two groups are symmetrically arranged at the access ports of the second cache space.

5. The cache device according to claim 4, characterized in that: The cache mechanism comprises: a base to which the drive assembly is mounted; a fixing plate disposed above the base; and A first support assembly, a second support assembly and a third support assembly are arranged in sequence and spaced apart along the alignment direction. The first support assembly, the second support assembly and the third support assembly are all installed between the base and the fixed plate. A first cache space is formed between the first support assembly and the second support assembly, and a second cache space is formed between the second support assembly and the third support assembly.

6. The cache device according to claim 5, characterized in that: The first support assembly includes a first mounting plate and a plurality of first support members, the first mounting plate is fixed to the base, and the plurality of first support members are arranged at equal intervals along a first direction on a surface of the first mounting plate facing the first cache space; the first direction intersects with the return direction; The second support assembly comprises a second mounting plate, a plurality of second support members and a plurality of third support members, the second mounting plate is fixed to the base, the plurality of second support members are arranged at equal intervals along the first direction on the surface of the second mounting plate facing the first cache space, and the plurality of third support members are arranged at equal intervals along the first direction on the surface of the second mounting plate facing the second cache space; The third support assembly comprises a third mounting plate and a plurality of fourth support members, the third mounting plate is fixed to the base, and the plurality of fourth support members are arranged at equal intervals along the first direction on a surface of the third mounting plate facing the second cache space; The first support member and the second support member correspond one-to-one along the return direction to jointly carry the sheet product; the third support member and the fourth support member correspond one-to-one along the return direction to jointly carry the sheet product.

7. The cache device according to claim 1, characterized in that: The drive assembly comprises: a driving member mounted to the cache mechanism, the driving member comprising a belt or a screw; Two or more transmission fixing members are fixedly connected to the belt or threadedly connected to the screw rod, and each of the transmission fixing members is installed on one of the correction components; the belt or the screw rod is configured to drive the two or more transmission fixing members to move synchronously, so that the two or more correction components move toward or away from each other along the correction direction; or, The drive assembly comprises: More than two linear power members are installed on the buffer mechanism, and each of the linear power members is correspondingly connected to one of the return components.

8. The cache device according to claim 1, characterized in that: The cache device also includes: A lifting mechanism is connected to the cache mechanism and is configured to drive the cache mechanism to move along a first direction, wherein the first direction intersects with the return direction.

9. The cache device according to claim 1, characterized in that: The cache mechanism also includes: Two or more pallets are arranged at intervals along the alignment direction and connected to the same side of the cache mechanism; the pallets are installed to the side of the cache mechanism away from the access opening; The support plate is provided with a plurality of support teeth, which are spaced apart along a first direction, wherein the first direction intersects with the alignment direction; a support tooth groove is formed between two adjacent support teeth, and each support tooth groove is configured to clamp an edge area of ​​the sheet product.

10. The cache device according to claim 9, characterized in that: The cache device also includes: The rotating mechanism is rotatably connected to the buffer mechanism, and the rotating mechanism is configured to drive the buffer mechanism to flip around a rotating axis so that the sheet product is accommodated in the corresponding tooth groove; the rotating axis is parallel to the return direction.

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