Physical vapor deposition equipment

Abstract

The utility model provides physical vapor deposition equipment which comprises an adsorption device, a gas-liquid separation device, a gas-liquid separation device and a gas-liquid separation device, the fixed plate is fixed right above the adsorption device in a suspended manner, a target material is fixed on the fixed plate, the target material is positioned on one surface, facing the adsorption device, of the fixed plate, and the orthographic projection of the target material on the adsorption device covers the base material; one end of the mechanical arm control assembly is provided with a shielding disc, the mechanical arm control assembly is allowed to drive the shielding disc to move until the shielding disc is located between the adsorption device and the target material, and the orthographic projection of the shielding disc on the adsorption device covers the adsorption device; the monitoring device comprises a plurality of signal generating ends and a plurality of signal receiving ends, the signal generating ends and the shielding disc are located at the same height, the signal generating ends are located on one side of the mechanical arm control assembly, and the signal receiving ends are located on the other side of the mechanical arm control assembly. The surface of the deposition platform can be kept clean, and the position of the shielding structure can be continuously monitored.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a physical vapor deposition device. Background Art

[0002] Physical vapor deposition (PVD) refers to a technique that uses physical methods to vaporize the surface of a material source into gaseous atoms, molecules or partially ionize them into ions under vacuum conditions, and converts the material source into a thin film deposited on the surface of a substrate through a low-pressure gas (or plasma) process. In the semiconductor thin film physical vapor deposition process, after a deposition process is completed, the surface of the material source must be cleaned, and the cleaning of the surface of the material source will contaminate the platform surface. Utility Model Content

[0003] The purpose of the utility model is to provide a physical vapor deposition device, which can keep the platform surface clean and continuously monitor the position of the shielding structure to timely discover the position deviation of the shielding structure and improve the process yield and efficiency.

[0004] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0005] The utility model provides a physical vapor deposition device, comprising:

[0006] An adsorption device, on which a substrate is mounted;

[0007] A fixed plate, suspended and fixed just above the adsorption device, and a target material is fixed on the fixed plate, wherein the target material is located on a side of the fixed plate facing the adsorption device, and the orthographic projection of the target material on the adsorption device covers the substrate;

[0008] a robot arm control assembly, wherein a shielding disk is installed at one end of the robot arm control assembly, allowing the robot arm control assembly to drive the shielding disk to move until the shielding disk is located between the adsorption device and the target material, and the orthographic projection of the shielding disk on the adsorption device covers the adsorption device; and

[0009] A monitoring device, comprising a plurality of signal generating ends and a plurality of signal receiving ends, wherein the signal generating end is at the same height as the shielding plate, and the signal generating end is located on one side of the robot arm control component, and the signal receiving end is located on the other side of the robot arm control component.

[0010] In an embodiment of the present invention, the moving direction of the shielding plate is parallel to the surface of the substrate.

[0011] In an embodiment of the present invention, the plurality of signal generating ends and the plurality of signal receiving ends are distributed in a linear array along a direction parallel to the surface of the shielding plate.

[0012] In an embodiment of the present invention, the robot arm control assembly includes a claw, and the claw is engaged with the side of the shielding plate.

[0013] In one embodiment of the utility model, the robotic arm control assembly includes a robotic arm, which is fixedly connected or hinged to the claw and allows the robotic arm to drive the claw to perform circular motion or linear motion, wherein part of the movement path of the robotic arm and the protective plate is blocked between the signal generating end and the signal receiving end.

[0014] In one embodiment of the utility model, the signal generating end is matched with at most one of the signal receiving ends, a signal transmission path of part of the signal generating end and the signal receiving end passes through the moving path of the shielding plate, and a signal transmission path of part of the signal generating end and the signal receiving end passes through the moving path of the robotic arm.

[0015] In an embodiment of the present invention, the physical vapor deposition equipment includes at least four signal generating ends and at least four signal receiving ends.

[0016] In an embodiment of the present invention, there is a first preset distance between the shielding disk and the surface of the adsorption device, and there is a second preset distance between the shielding disk and the surface of the target material.

[0017] In an embodiment of the present utility model, the monitoring device includes a sensor collection circuit, which is electrically connected to the signal receiving end and receives displacement data of the robot arm control component.

[0018] In one embodiment of the utility model, the monitoring device includes a liquid crystal display, which is electrically connected to the sensor collection circuit and displays the displacement information of the processed displacement data, wherein the liquid crystal display includes an alarm unit, and when the displacement information does not conform to a preset path, the alarm unit displays an alarm icon and generates an alarm signal.

[0019] As described above, the utility model provides a physical vapor deposition device, which can ensure that the surface of the substrate platform is not contaminated without moving the substrate platform and the material source when cleaning the surface of the material source, thereby increasing the service life of the substrate platform and avoiding the accumulation of materials on the surface of the substrate platform, which may cause errors in the placement of the substrate. In addition, the utility model can continuously detect the position of the shielding structure to avoid deviation of the position of the shielding structure, thereby improving the safety of material source cleaning and protecting the substrate platform from contamination. Therefore, the physical vapor deposition device provided by the utility model can improve the maintenance effect of the equipment and improve the yield and efficiency of the deposition process.

[0020] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a structural schematic diagram of a physical vapor deposition device in one embodiment of the utility model.

[0023] Figure 2 It is a top view schematic diagram of a robot arm control assembly in one embodiment of the utility model.

[0024] Figure 3 It is a top view schematic diagram of a robot arm control assembly in another embodiment of the utility model.

[0025] Figure 4 Schematic diagram of the internal distribution of the sensor monitoring box in one embodiment of the utility model.

[0026] Figure 5 Schematic diagram of the structure of the monitoring module in one embodiment of the utility model.

[0027] In the figure: 100, workbench; 110, adsorption device; 111, substrate; 112, protective cover; 1121, working chamber; 1122, opening; 200, fixing plate; 210, target material; 220, power module; 300, robot arm control component; 310, base; 320, rotation power source; 330, rotation axis; 331, claw; 332, robot arm; 3321, first arm; 3322, second arm; 333, first hinge; 334, second hinge; 335, slide groove structure; 400, shielding plate; 500, sensor monitoring box; 510, first transmitter; 520, second transmitter; 530, third transmitter; 540, fourth transmitter; 600, receiving module; 610, first receiver; 620, second receiver; 630, third receiver; 640, fourth receiver. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In the process of physical vapor deposition, the wafer is placed on an electrostatic adsorption device, and the position of the wafer is fixed by electrostatic adsorption. The goal of physical vapor deposition is to form a thin film structure required for the process on the surface of the wafer. The material of the thin film structure is consistent with the material type of the target material. By vaporizing the target material and then stimulating the movement of the ions of the target material, the ions of the vaporized target material move to the surface of the wafer, thereby forming a thin film structure. The target material can be a pure metal, alloy or compound, a conductive material or a non-conductive material, a low melting point material or a high melting point material, a liquid phase material or a solid phase material, or a block material or a powdered material. By processing the target material, the target material reaches the desired state and participates in the physical vapor deposition process. In this embodiment, the wafer is called a substrate.

[0030] See also Figures 1 to 5As shown, the utility model provides a physical vapor deposition device, which includes an adsorption device 110, a fixed plate 200, a robot control assembly 300 and a monitoring device 700. A substrate 111 is installed on the adsorption device 110. The fixed plate 200 is suspended and fixed directly above the adsorption device 110, and a target material 210 is fixed on the fixed plate 200. The target material 210 is located on the side of the fixed plate 200 facing the adsorption device 110, and the orthographic projection of the target material 210 on the adsorption device 110 covers the substrate 111. A shielding plate 400 is installed at one end of the robot control assembly 300, and the robot control assembly 300 can drive the shielding plate 400 to move until the shielding plate 400 is located between the adsorption device 110 and the target material 210. When the shielding plate 400 is located between the adsorption device 110 and the target material 210, the orthographic projection of the shielding plate 400 on the adsorption device 110 covers the adsorption device 110. The monitoring device 700 includes a plurality of signal generating ends and a plurality of signal receiving ends, wherein the signal generating end is at the same height as the shielding plate 400 , and the signal generating end is located on one side of the robot arm control component 300 , and the signal receiving end is located on the other side of the robot arm control component 300 .

[0031] See also Figure 1 and Figure 2 As shown, in one embodiment of the utility model, the physical vapor deposition equipment includes a workbench 100. In this embodiment, the adsorption device 110 is an electrostatic adsorption device, and the adsorption device 110 is fixed on the workbench 100. In this embodiment, the substrate 111 is a wafer. In the physical vapor deposition process, the substrate 111 is mounted on the adsorption device 110. After the physical vapor deposition process is completed, the substrate 111 is removed. In this embodiment, after the substrate 111 is removed, the shielding plate 400 is moved between the adsorption device 111 and the target material 210. In this embodiment, the moving direction of the shielding plate 400 is parallel to the surface of the adsorption device 110 and also parallel to the surface of the substrate 111.

[0032] See also Figure 1 As shown, in one embodiment of the utility model, a fixed plate 200 is mounted on a machine frame. A target material 210 is fixed on the fixed plate 200. In this embodiment, the physical vapor deposition equipment includes a power module 220. The power module 220 is mounted on the fixed plate 200. The power module 220 includes a radio frequency power supply, a radio frequency matcher, a radio frequency filter, a direct current power supply, a magnetron, and the like. When the power module 220 is working, the target material 210 is converted into a gas phase state and sputtered onto the substrate 111.

[0033] See also Figure 1As shown, in one embodiment of the present invention, the physical vapor deposition device further includes a protective cover 112, which is mounted on the workbench 100 and surrounds the adsorption device 111 and the target material 210. An opening 1122 is provided on the protective cover 112. The protective cover 112 is connected to the fixing plate 200. The protective cover 112 can prevent ions from sputtering outside the machine.

[0034] See also Figures 1 to 3 As shown, in one embodiment of the utility model, the robot arm control assembly 300 includes a base 310, a rotating power source 320 and a rotating shaft 330. The rotating power source 320 may be a motor. The rotating shaft 330 is connected to the rotor of the rotating power source 320. In this embodiment, the rotating shaft 330 is perpendicular to the surface of the adsorption device 111. The robot arm control assembly 300 includes a claw 331 and a robot arm 332, wherein the claw 331 is engaged with the shielding plate 400, and specifically, the claw 331 is engaged with the side of the shielding plate 400. The robot arm 332 is fixedly connected or hinged to the claw 331, and the robot arm 332 can drive the claw 331 to perform circular motion or linear motion. Part of the movement path of the robot arm 332 and the shielding plate 400 is blocked between the signal generating end and the signal receiving end.

[0035] See also Figure 1 and Figure 2 As shown, in one embodiment of the utility model, the claw 331 is a circular ring structure, wherein the circular ring angle of the claw 331 is greater than 180° and less than 360°. The mechanical arm 332 is fixedly connected to the claw 331. In this embodiment, the mechanical arm 332 can be one or more. Among them, multiple mechanical arms 332 are distributed in parallel. Among them, the mechanical arm 332 is fixedly connected to the rotating shaft 330, and the mechanical arm 332 rotates coaxially with the rotating shaft 330. In this embodiment, during the physical vapor deposition process, the mechanical arm 332 drives the shielding plate 400 to rotate out of the opening 1122. After the physical vapor deposition process is completed, the mechanical arm 332 drives the shielding plate 400 to rotate from the opening 1122 into the protective cover 112 until the shielding plate 400 is blocked between the target material 210 and the adsorption device 111. In this embodiment, when the shielding plate 400 moves between the target 210 and the adsorption device 111, there is a first preset distance between the shielding plate 400 and the surface of the adsorption device 110, and there is a second preset distance between the shielding plate 400 and the surface of the target 210. The present invention does not limit the specific values ​​of the first preset distance and the second preset distance.

[0036] See also Figure 1 and Figure 3As shown, in another embodiment of the utility model, the claw 331 is a circular ring structure, wherein the circular ring angle of the claw 331 is greater than 180° and less than 360°. The mechanical arm 332 includes a first force arm 3321 and a second force arm 3322. The first force arm 3321 is hinged to the rotating shaft 320, the second force arm 3322 is hinged to the first force arm 3321, and the second force arm 3322 is hinged to the claw 331. In this embodiment, the mechanical arm control component 300 includes a first hinge 333 and a second hinge 334. The first hinge 333 is a hinge axis, and the first hinge 333 is connected to the end of the first force arm 3321 and the end of the second force arm 3322. The second hinge 334 is a hinge axis, and the second hinge 334 is connected to the end of the second force arm 3322 and the claw 331. In this embodiment, the mechanical arm control component 300 includes a slide groove structure 335. The slide groove structure 335 is distributed along a straight line, and the slide groove structure 335 is perpendicular to the side wall of the workbench 100. The second hinge 334 is slidably connected in the slide groove structure 335. The rotating shaft 320 drives the first lever arm 3321 to rotate, and the first lever arm 3321 drives the second lever arm 3322 to rotate. Restricted by the slide groove structure 335, the second hinge 334 moves along the slide groove structure 335, and drives the claw 331 to move along the slide groove structure 335. While the claw 331 moves along the slide groove structure 335, it drives the shielding plate 400 to pass through the opening 1122, so that the shielding plate 400 shields the adsorption device 111.

[0037] See also Figures 1 to 5 As shown, in one embodiment of the utility model, the monitoring device 700 includes a sensor monitoring box 500 and a receiving module 600. The sensor monitoring box 500 and the receiving module 600 can be installed on the protective cover 112 or outside the protective cover 112. A plurality of transmitters are installed in the sensor monitoring box 500, and the receiving module 600 includes a plurality of receivers. The transmitter serves as a signal transmitting end of the monitoring device 700, and the receiver serves as a signal receiving end of the monitoring device 700. In this embodiment, the sensor is, for example, a laser position sensor. When there is no obstruction between the transmitter and the receiver, the receiver can receive the laser light emitted by the sensor. In this embodiment, according to whether the receiver receives the laser signal, it can be determined whether there is an obstruction on the current laser emission path, thereby determining the current position of the shielding plate 400, the claw 331 and the robotic arm 332.

[0038] See also Figures 1 to 5As shown, in one embodiment of the utility model, a plurality of signal generating ends and a plurality of signal receiving ends are distributed in a linear array along a direction parallel to the surface of the shielding plate 400. The signal generating end matches at most one signal receiving end, and the signal transmission paths of some signal generating ends and signal receiving ends pass through the moving path of the shielding plate 400, and the signal transmission paths of some signal generating ends and signal receiving ends pass through the moving path of the mechanical arm 332. In this embodiment, the physical vapor deposition device includes at least four signal generating ends and at least four signal receiving ends. Specifically, the sensor monitoring box 500 includes a first transmitter 510, a second transmitter 520, a third transmitter 530 and a fourth transmitter 540. The first transmitter 510 and the second transmitter 520 are used to monitor the position of the shielding plate 400, and the third transmitter 530 and the fourth transmitter 540 are used to monitor the position of the mechanical arm 332. The receiving module 600 includes a first receiver 610, a second receiver 620, a third receiver 630 and a fourth receiver 640. The first receiver 610 is used to receive the laser signal of the first transmitter 510. The second receiver 620 is used to receive the laser signal of the second transmitter 520. The third receiver 630 is used to receive the laser signal of the third transmitter 530. The fourth receiver 640 is used to receive the laser signal of the fourth transmitter 540.

[0039] See also Figures 1 to 5 As shown, in one embodiment of the utility model, the monitoring device 700 includes a sensor collection circuit 710, a signal conversion amplifier 720, a central processing unit 730, a signal output module 740, a liquid crystal display 750 and a signal feedback module 760. The sensor collection circuit 710 is electrically connected to the receiving module 600 and receives the displacement data of the robot arm control component 300. When the receiver does not receive the laser signal, it indicates that the monitored object is on the laser conduction path. The utility model can continuously monitor the displacement state of the robot arm 332 and the shielding plate 400 through lateral monitoring. The receiver generates the displacement data of the robot arm control component 300 according to the received laser signal information and sends it to the sensor collection circuit 710. The signal conversion amplifier 720 amplifies the signal received by the receiving module 600. The central processing unit 730 processes the displacement data of the robot arm control component 300, converts the displacement data into instruction data and display data, and sends it to the signal output module 740.

[0040] See also Figures 1 to 5As shown, in one embodiment of the utility model, the signal output module 740 is electrically connected to the liquid crystal display 750 and the signal feedback module 760. The liquid crystal display 750 displays the displacement information after the displacement data is processed in a visual manner. The liquid crystal display 750 includes an alarm unit 751. When the displacement information does not conform to the preset path, the alarm unit 751 displays an alarm icon and generates an alarm signal. The command data is fed back to the signal feedback module 760. Under the intervention of the central processor 730 and external personnel, when there is a problem with the movement of the shielding plate 400, it can be intervened and corrected immediately.

[0041] The embodiments of the utility model disclosed above are only used to help illustrate the utility model. The embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A physical vapor deposition device, characterized in that: include: An adsorption device, on which a substrate is mounted; A fixed plate, suspended and fixed just above the adsorption device, and a target material is fixed on the fixed plate, wherein the target material is located on a side of the fixed plate facing the adsorption device, and the orthographic projection of the target material on the adsorption device covers the substrate; A robot arm control assembly, wherein a shielding disk is installed at one end of the robot arm control assembly, allowing the robot arm control assembly to drive the shielding disk to move until the shielding disk is located between the adsorption device and the target material, and the orthographic projection of the shielding disk on the adsorption device covers the adsorption device; as well as A monitoring device, comprising a plurality of signal generating ends and a plurality of signal receiving ends, wherein the signal generating end is at the same height as the shielding plate, and the signal generating end is located on one side of the robot arm control component, and the signal receiving end is located on the other side of the robot arm control component.

2. A physical vapor deposition device according to claim 1, characterized in that: The moving direction of the shielding disk is parallel to the surface of the substrate.

3. A physical vapor deposition device according to claim 1, characterized in that: The plurality of signal generating ends and the plurality of signal receiving ends are distributed in a linear array along a direction parallel to the surface of the shielding plate.

4. A physical vapor deposition device according to claim 1, characterized in that: The robot arm control assembly includes a claw that is engaged with a side of the shielding plate.

5. A physical vapor deposition device according to claim 4, characterized in that: The robotic arm control assembly includes a robotic arm, which is fixedly connected or hinged to the claw and allows the robotic arm to drive the claw to perform circular motion or linear motion, wherein part of the movement path of the robotic arm and the shielding plate is blocked between the signal generating end and the signal receiving end.

6. The physical vapor deposition device according to claim 1, characterized in that: The signal generating end is matched with at most one of the signal receiving ends, and the signal transmission paths of part of the signal generating end and the signal receiving end pass through the moving path of the shielding plate, and the signal transmission paths of part of the signal generating end and the signal receiving end pass through the moving path of the robotic arm.

7. The physical vapor deposition device according to claim 1, characterized in that: The physical vapor deposition equipment includes at least four signal generating ends and at least four signal receiving ends.

8. The physical vapor deposition device according to claim 1, characterized in that: There is a first preset distance between the shielding disk and the surface of the adsorption device, and there is a second preset distance between the shielding disk and the surface of the target material.

9. The physical vapor deposition device according to claim 1, characterized in that: The monitoring device includes a sensor collection circuit, which is electrically connected to the signal receiving end and receives displacement data of the robot arm control component.

10. A physical vapor deposition device according to claim 9, characterized in that: The monitoring device includes a liquid crystal display, which is electrically connected to the sensor collection circuit and displays the displacement information after the displacement data is processed. The liquid crystal display includes an alarm unit. When the displacement information does not conform to a preset path, the alarm unit displays an alarm icon and generates an alarm signal.

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