Coating film production equipment

Abstract

The utility model relates to the technical field of silicon wafer coating, in particular to coating production equipment which comprises a cooling device arranged at the outlet end of a coating procedure or between the coating procedure and a PL testing procedure. The cooling device comprises a plurality of first cooling modules arranged in parallel in the conveying direction and a plurality of second cooling modules arranged in parallel in the conveying direction, and the conveying path of the carrier plate penetrates through the space between the first cooling modules and the second cooling modules. When the carrier plate is conveyed to the cooling device, the upper surfaces of the carrier plate and the silicon wafer are subjected to radiation cooling through the first cooling module, the lower surface of the carrier plate is cooled through the second cooling module, and the coated silicon wafer is subjected to cooling treatment before a PL test. The problem that qualified silicon wafer products are rejected due to erroneous judgment caused by temperature difference of different silicon wafers is avoided, meanwhile, the surfaces of the cooled silicon wafers are not in a molten state, and then the problem that sucker marks and belt marks appear in the subsequent transfer process is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer coating, and in particular to a coating production device. Background Art

[0002] In the current PECVD process, after the silicon wafer is coated, the carrier is transferred out of the unloading chamber, and the robot suction cup sucks the silicon wafer from the carrier to the transmission belt. The transmission belt drives the silicon wafer to the PL testing equipment to test the grayscale level of the silicon wafer. Then, the defective silicon wafers are removed and the qualified silicon wafers are flipped and transferred into the drying basket.

[0003] In the above process, since the temperature of the carrier is high when it is transferred from the unloading chamber, the temperature of the silicon wafer on the carrier is also the same as that of the carrier. The robot suction cup sucks the silicon wafer from the surface of the carrier and places it on the belt. The belt drives the silicon wafer to be transferred to the PL testing equipment. However, the high-temperature silicon wafer has a problem of too low grayscale value during the PL test, resulting in the silicon wafer being incorrectly rejected; and after the high-temperature silicon wafer is adsorbed by the robot suction cup, the problem of suction cup mark appears. At the same time, the high-temperature silicon wafer is transported by belt, and there is a problem of belt mark after transportation. Utility Model Content

[0004] In order to solve one of the above technical problems, the present application provides a coating production equipment for cooling silicon wafers on a carrier, including a cooling device arranged on a carrier conveying path, the cooling device is arranged at the exit end of the coating process, or between the coating process and the PL test process; the cooling device includes a plurality of first cooling modules arranged in parallel along the conveying direction, and a plurality of second cooling modules arranged in parallel along the conveying direction, and the conveying path of the carrier passes between the first cooling module and the second cooling module. When the carrier is conveyed to the cooling device, the upper surface of the carrier and the silicon wafer is radiated and cooled by the first cooling module, and the lower surface of the carrier is cooled by the second cooling module, and the coated silicon wafer is cooled before the PL test, so as to realize that the silicon wafer is at room temperature before the PL test, so as to avoid the temperature difference between different silicon wafers and the misjudgment resulting in the rejection of qualified silicon wafer products, and at the same time, the surface of the silicon wafer after cooling will not be in a molten state, thereby avoiding the problems of suction cup marks and belt marks in the subsequent transfer process.

[0005] Preferably, the first cooling module comprises a mounting plate arranged parallel to the conveying direction, and a plurality of cooling water pipes are arranged on the surface of the mounting plate close to the carrier. When the carrier stays under the first cooling module, the carrier and the upper surface of the silicon wafer are physically cooled by radiation through the cold radiation of the cooling water pipe, thereby achieving the purpose of cooling the carrier and the silicon wafer.

[0006] Preferably, several cooling water pipes are connected in sequence, and the cooling water pipe is U-shaped. One end of the U-shaped cooling water pipe is a water inlet, and the other end is a water outlet. Several cooling water pipes are connected in sequence and use one water path.

[0007] Preferably, the second cooling module comprises a bottom plate, and a plurality of wind knife assemblies disposed on the bottom plate and used to blow air to the lower surface of the carrier. When the carrier stays above the second cooling module, the wind knife assemblies blow air toward the lower surface of the carrier to cool it, thereby achieving the purpose of physically cooling the carrier.

[0008] Preferably, the wind knife assembly includes a wind knife and an ion generator disposed at the end of the wind knife, an air inlet is provided at the end of the wind knife, and a plurality of air outlets are provided on the surface of the wind knife close to the carrier. Compressed air enters the wind knife from the air inlet, and then passes through the ion generator to remove dust and static electricity, and then blows air to the lower surface of the carrier through the air outlet, thereby physically cooling the temperature.

[0009] Preferably, a plurality of the wind knife assemblies are arranged on the bottom plate in a vertical and horizontal arrangement. Exemplarily, they are arranged in a three-horizontal and three-vertical arrangement, so that the entire lower surface of the carrier plate can be covered when blowing air, thereby improving the cooling effect.

[0010] Preferably, it also includes a transmission assembly for conveying the carrier, the transmission assembly includes a mounting frame, a plurality of rollers arranged on the mounting frame along the conveying direction, and a first driving assembly arranged at one end of the mounting frame, and two adjacent rollers are connected by a synchronous belt. The driving end of the first driving assembly is connected to the first roller, and the two adjacent rollers are connected by a synchronous belt transmission, and then the first driving assembly drives the roller to rotate, so that the roller conveys the carrier to move forward.

[0011] Preferably, a plurality of guide wheels are arranged on the mounting frame along the conveying direction. When the transmission assembly is conveying the carrier plate, the guide wheels on both sides of the mounting frame abut against the side surfaces of the carrier plate, thereby guiding and limiting the carrier plate.

[0012] Preferably, it also includes several groups of cold air circulation components arranged outside the coating process and before the PL testing process. The cold air circulation components are used to perform secondary cooling on the carrier and the silicon wafer to further cool the silicon wafer and further improve the cooling effect.

[0013] Preferably, it also includes a stopping component that is arranged on the transmission component and is used to stop the carrier. When the transmission component transports the carrier to the cooling device, the stopping component stops the carrier, and then the cooling device cools the carrier and the silicon wafer, so that the temperature of the silicon wafer is reduced, so as to avoid the silicon wafer being misjudged and rejected during the test. At the same time, the silicon wafer after cooling will not have the problem of suction cup mark and belt mark in the subsequent transfer process, so as to improve the quality of the silicon wafer. The stopping component includes a second drive component, a stopper arranged at the driving end of the second drive component, and an in-place detector arranged on the transmission component. When the carrier moves into place, the in-place detector detects that the carrier is in place. At this time, the second drive component drives the stopper to move upward, and then the stopper stops the carrier, so that the carrier stays in the cooling area of ​​the cooling device for cooling.

[0014] Compared with the prior art, the beneficial effects of the present application are as follows: the present application arranges a cooling device in the carrier conveying path, and the cooling device is arranged at the outlet end of the coating process, or between the coating process and the PL testing process; the cooling device includes a plurality of groups of first cooling modules arranged in parallel along the conveying direction, and a plurality of groups of second cooling modules arranged in parallel along the conveying direction; when the carrier is conveyed out, the carrier and the silicon wafer are cooled by the cooling device, and the conveying path of the carrier passes between the first cooling module and the second cooling module; the upper surfaces of the carrier and the silicon wafer are radiatively cooled by the first cooling module, and the lower surface of the carrier is cooled by the second cooling module; the coated silicon wafer is cooled before the PL testing, so as to realize that the silicon wafer is at room temperature before the PL testing, thereby avoiding misjudgment due to temperature difference between different silicon wafers and resulting in rejection of qualified silicon wafer products; at the same time, the surface of the silicon wafer after cooling will not be in a molten state, thereby avoiding the problems of suction cup marks and belt marks in the subsequent transfer process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the description of the embodiments of the present application or the prior art are briefly introduced below. Obviously, the drawings described below are only part of the embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

[0016] Figure 1 A schematic diagram of a coating production device according to an embodiment of the present application;

[0017] Figure 2 A side view of a coating production device according to an embodiment of the present application;

[0018] Figure 3 This is a schematic diagram of the structure of the first cooling module of the embodiment of the present application;

[0019] Figure 4 This is a schematic diagram of the structure of the second cooling module in an embodiment of the present application;

[0020] Figure 5 For the embodiment of this application Figure 4 A magnified view of part A;

[0021] Figure 6 This is a schematic diagram of the structure of the air knife assembly of the embodiment of the present application;

[0022] Figure 7 This is a schematic diagram of the transmission component structure of an embodiment of the present application.

[0023] Attached photos

[0024] 10. Transmission assembly; 11. Mounting frame; 12. Roller; 13. First drive assembly; 14. Synchronous belt; 15. Guide wheel; 20. First cooling module; 21. Mounting plate; 22. Cooling water pipe; 30. Second cooling module; 31. Wind knife assembly; 311. Wind knife; 312. Ion generator; 313. Air inlet; 314. Air outlet; 32. Bottom plate; 40. Stop assembly; 41. Second drive assembly; 42. Block; 43. In-position detector. DETAILED DESCRIPTION

[0025] The following will disclose multiple embodiments of the present application with drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present application. In other words, in some embodiments of the present application, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0026] It should be noted that all directional indications such as up, down, left, right, front, back... in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0027] In addition, in the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present application. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0028] In order to further understand the content, features and effects of the present application, the following embodiments are given as examples and described in detail with reference to the accompanying drawings:

[0029] In order to solve the above technical problems, this embodiment provides a coating production equipment for cooling the carrier and silicon wafer after the coating process, such as Figure 1-2 As shown, it includes a cooling device arranged on the carrier conveying path, and the cooling device is arranged at the exit end of the coating process, or between the coating process and the next process, wherein the next process may be a PL test process, but is not limited to the PL test process. The cooling device includes a plurality of first cooling modules 20 arranged in parallel along the conveying direction and a plurality of second cooling modules 30 arranged in parallel along the conveying direction, and the conveying path of the carrier passes through between the first cooling module 20 and the second cooling module 30. When the silicon wafer on the carrier is coated in the coating process, the upper surface of the carrier and the silicon wafer is radiated and cooled by the first cooling module 20, and the lower surface of the carrier is cooled by the second cooling module 30, and then the coated silicon wafer is cooled before the PL test, so as to realize that the silicon wafer is at room temperature before the PL test, so as to avoid the misjudgment caused by the temperature difference between different silicon wafers and the rejection of qualified silicon wafer products, and at the same time, the surface of the silicon wafer after cooling will not be in a molten state, so as to avoid the problems of suction cup marks and belt marks in the subsequent transfer process.

[0030] Specifically, Figure 3 As shown, the first cooling module 20 includes a mounting plate 21 arranged parallel to the conveying direction, and a plurality of cooling water pipes 22 are arranged on the surface of the mounting plate 21 close to the carrier. Flowing cold water is introduced into the cooling water pipes 22, and when the carrier stays under the first cooling module 20, the cold radiation of the cooling water pipes 22 is used to radiate and physically cool the upper surface of the carrier and the silicon wafer, thereby achieving the purpose of cooling the carrier and the silicon wafer.

[0031] Furthermore, several cooling water pipes 22 are connected in sequence, and the cooling water pipes 22 are U-shaped. One end of the U-shaped cooling water pipe 22 is a water inlet, and the other end is a water outlet. Several cooling water pipes 22 are connected in sequence and use one waterway. Among them, an adjustment hole and an adjustment member are provided on the mounting plate 21, and the adjustment member is connected to the cooling water pipe 22. The adjustment member can be adjusted in height on the adjustment hole, thereby adjusting the height of the cold radiation between the cooling water pipe 22 and the carrier plate. The preferred height of the cold radiation is 10-20 mm, so that the height of the cold radiation can be adjusted according to actual production to adjust the cooling effect.

[0032] In order to achieve cooling of the bottom surface of the carrier, Figure 4-5 As shown, the second cooling module 30 includes a bottom plate 32 and a plurality of wind knife assemblies 31 disposed on the bottom plate 32 and used to blow air to the lower surface of the carrier. When the carrier stays above the second cooling module 30, the wind knife assemblies 31 blow air toward the lower surface of the carrier to cool it, thereby achieving the purpose of physically cooling the carrier.

[0033] Specifically, Figure 6 As shown, the wind knife assembly 31 includes a wind knife 311 and an ion generator 312 inserted into the end of the wind knife 311. The end of the wind knife 311 is provided with an air inlet 313, and the surface of the wind knife 311 close to the carrier is provided with a plurality of air outlets 314. Compressed air enters the wind knife 311 from the air inlet 313, and then passes through the ion generator 312 to remove dust and static electricity, and then blows air to the lower surface of the carrier through the air outlet 314, thereby physically cooling the temperature.

[0034] In the above scheme, several wind knife assemblies 31 are arranged on the base plate 32 in a vertical and horizontal arrangement. Exemplarily, several wind knife assemblies 31 are arranged in the form of three horizontal and three vertical, so that the entire lower surface of the carrier plate can be covered when blowing air, thereby improving the cooling effect.

[0035] It should be noted that in some embodiments, the cooling device may only use the first cooling module 20 or the second cooling module 30, that is, the first cooling module 20 may be set above and below the carrier conveying path, or the second cooling module 30 may be set, which can also achieve the purpose of cooling the carrier and silicon wafer. It is also possible that the positions of the first cooling module 20 and the second cooling module 30 in this embodiment can be swapped, and any modifications, equivalent replacements and improvements made within the spirit and principles of the above-mentioned embodiments should be included in the protection scope of the technical solution. It also includes several groups of cold air circulation components arranged outside the coating process and before the PL testing process. The cold air circulation components are used to perform secondary cooling on the carrier and silicon wafer, so as to further cool the silicon wafer and improve the cooling effect.

[0036] In this embodiment, a transmission component 10 for transporting the carrier is also included. The transmission component 10 can be arranged between the coating process and the PL testing process. When the coating process is completed, the transmission component 10 transports the carrier to the cooling device for cooling, and then transports it to the PL testing process. Specifically, Figure 7 As shown, the transmission assembly 10 includes a mounting frame 11, a plurality of rollers 12 arranged on the mounting frame 11 along the conveying direction, and a first driving assembly 13 arranged at one end of the mounting frame 11, and two adjacent rollers 12 are connected by a synchronous belt 14. The rollers 12 are used to carry and transport the carrier. Exemplarily, the first driving assembly 13 can be a motor, and the driving end of the first driving assembly 13 is connected to the first roller 12, and the two adjacent rollers 12 are connected by a synchronous belt 14, and then the first driving assembly 13 drives the roller 12 to rotate, so that the roller 12 transports the carrier to move forward.

[0037] Further, such as Figure 5 As shown, a plurality of guide wheels 15 are arranged on the mounting frame 11 along the conveying direction, and the transmission assembly 10 abuts against the side of the carrier through the guide wheels 15 on both sides of the mounting frame 11 during the conveying of the carrier, thereby guiding and limiting the carrier.

[0038] The transmission assembly 10 further includes a stop assembly 40 for stopping the carrier. Figure 5 As shown, after the transmission component 10 transports the carrier to the cooling device, the carrier is stopped by the stop component 40, and then the carrier and the silicon wafer are cooled by the cooling device, so that the temperature of the silicon wafer is reduced, thereby preventing the silicon wafer from being misjudged and rejected during testing. At the same time, the silicon wafer after cooling will not have the problem of suction cup mark and belt mark in the subsequent transfer process, thereby improving the quality of the silicon wafer.

[0039] Specifically, the stop assembly 40 includes a second drive assembly 41, a stopper 42 disposed at the drive end of the second drive assembly 41, and an in-position detector 43 disposed on the transmission assembly 10. Exemplarily, the second drive assembly 41 may be a cylinder, and the in-position detector 43 may be a beam sensor disposed on both sides of the mounting frame 11. When the carrier moves into position, the in-position detector 43 detects that the carrier is in position, and at this time, the second drive assembly 41 drives the stopper 42 to move upward, and then the stopper 42 stops the carrier, so that the carrier stays in the cooling area of ​​the cooling device for cooling.

[0040] In summary, in one or more embodiments of the present application, the present application scheme is provided with a cooling device in the carrier conveying path, and the cooling device is provided at the outlet end of the coating process, or between the coating process and the PL testing process; the cooling device includes several groups of first cooling modules arranged in parallel along the conveying direction, and several groups of second cooling modules arranged in parallel along the conveying direction. When the carrier is conveyed out, the carrier and the silicon wafer are cooled by the cooling device, and the conveying path of the carrier passes between the first cooling module and the second cooling module. The upper surfaces of the carrier and the silicon wafer are radiatively cooled by the first cooling module, and the lower surface of the carrier is cooled by the second cooling module. The coated silicon wafer is cooled before the PL test to achieve room temperature of the silicon wafer before the PL test, so as to avoid misjudgment due to temperature difference between different silicon wafers and the rejection of qualified silicon wafer products. At the same time, the surface of the silicon wafer after cooling will not be in a molten state, thereby avoiding the problems of suction cup marks and belt marks in the subsequent transfer process.

[0041] The above-described implementation methods do not constitute a limitation on the protection scope of the technical solution. Any modification, equivalent replacement and improvement made within the spirit and principle of the above-described implementation methods shall be included in the protection scope of the technical solution.

Claims

1. A coating production equipment for cooling a carrier plate and a silicon wafer after a coating process, characterized in that: The invention comprises a cooling device arranged on a carrier conveying path, wherein the cooling device is arranged at the exit end of a coating process or between a coating process and a PL testing process; the cooling device comprises a plurality of first cooling modules (20) arranged in parallel along a conveying direction, and a plurality of second cooling modules (30) arranged in parallel along a conveying direction, and the carrier conveying path passes between the first cooling modules (20) and the second cooling modules (30).

2. The coating production equipment according to claim 1, characterized in that: The first cooling module (20) comprises a mounting plate (21) arranged parallel to the conveying direction, and a plurality of cooling water pipes (22) are arranged on a surface of the mounting plate (21) close to the carrier plate.

3. The coating production equipment according to claim 2, characterized in that: A plurality of the cooling water pipes (22) are connected in sequence, and the cooling water pipes (22) are U-shaped.

4. The coating production equipment according to claim 1, characterized in that: The second cooling module (30) comprises a base plate (32) and a plurality of wind knife assemblies (31) arranged on the base plate (32) and used for blowing air to the lower surface of the carrier plate.

5. The coating production equipment according to claim 4, characterized in that: The wind knife assembly (31) comprises a wind knife (311) and an ion generator (312) arranged at the end of the wind knife (311); an air inlet (313) is provided at the end of the wind knife (311); and a plurality of air outlets (314) are provided on a surface of the wind knife (311) close to the carrier plate.

6. The coating production equipment according to claim 4, characterized in that: A plurality of the wind knife assemblies (31) are arranged on the bottom plate (32) in a vertical and horizontal arrangement.

7. The coating production equipment according to claim 1, characterized in that: It also includes a transmission assembly (10) for conveying a carrier plate, the transmission assembly (10) comprising a mounting frame (11), a plurality of rollers (12) arranged on the mounting frame (11) along a conveying direction, and a first driving assembly (13) arranged at one end of the mounting frame (11), wherein two adjacent rollers (12) are connected via a synchronous belt (14).

8. The coating production equipment according to claim 7, characterized in that: A plurality of guide wheels (15) are arranged on the mounting frame (11) along the conveying direction.

9. The coating production equipment according to claim 1, characterized in that: It also includes several groups of cold air circulation components arranged outside the coating process and before the PL testing process.

10. The coating production equipment according to claim 7, characterized in that: It also includes a stopping assembly (40) arranged on the transmission assembly (10) and used to stop the carrier plate, the stopping assembly (40) comprising a second drive assembly (41), a stop block (42) arranged at a drive end of the second drive assembly (41), and an in-position detector (43) arranged on the transmission assembly (10).

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