Improved bendable circuit board electroplating equipment

Abstract

The utility model discloses improved bendable circuit board electroplating equipment. The improved bendable circuit board electroplating equipment comprises a tank body, and a front guide wheel, a rear guide wheel and a plurality of groups of tightening guide components which are respectively arranged in the tank body, the tank body is used for containing an electroplating solution with a liquid level; the front guide wheel and the rear guide wheel are located on the inlet side and the outlet side of the groove body respectively. Each group of tightening guide assembly comprises a tightening guide wheel and an electroplating anode which are respectively immersed below the liquid level; the tightening guide wheel is located below the front guide wheel and the rear guide wheel and located between the front guide wheel and the rear guide wheel to form a conveying path. The tightening guide wheel is in a long strip shape, and the diameter of the tightening guide wheel is gradually decreased from the middle to the two ends, so that the tightening guide wheel is of a structure with the thick middle and the two thin ends. The electroplating anode is located on one side of the conveying path. According to the utility model, when the to-be-plated part is connected with the tightening guide wheel, the tightening guide wheel can be outwards ejected out of the middle part of the to-be-plated part for a plurality of distances, so that the to-be-plated part can be kept in a tightening state from the middle part to two sides, and finally, the quality of a plating layer can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, in particular to an improved bendable circuit board electroplating equipment. Background Art

[0002] Conventional electroplating equipment used to manufacture bendable circuit boards usually has a roll-to-roll structure, that is, the workpiece to be plated is generally continuously transported horizontally or vertically using multiple pressure wheels in existing electroplating equipment. Generally, the workpiece to be plated includes polyethylene terephthalate (PET) or polyimide (PI), on which a conductive layer is provided, and the conductive layer is an extremely thin metal film layer (such as a copper film). Therefore, it is impossible to use a clamp to fix the workpiece to be plated as in the traditional process, and a pressure wheel is required to form a conveying path.

[0003] For electroplating equipment, application publication number CN104514028A discloses an electroplating equipment, which specifically discloses that it includes a trough body, which is used to hold an electroplating solution, wherein the electroplating solution has a liquid surface when held in the trough body; a plurality of guide wheels, which are arranged in the above-mentioned trough body; at least one cathode wheel, which is arranged on the liquid surface of the above-mentioned electroplating solution in the above-mentioned trough body and does not contact the above-mentioned electroplating solution, wherein the cathode wheel and the above-mentioned guide wheels form a conveying path to continuously convey the workpiece to be plated, wherein the workpiece to be plated is immersed below the liquid surface of the above-mentioned electroplating solution in at least a portion of the conveying path; at least one electroplating anode, which is arranged on the above-mentioned conveying path and immersed below the liquid surface of the above-mentioned electroplating solution, wherein the electroplating anode is arranged parallel to the plane of the above-mentioned workpiece to be plated; and a separation groove, which is arranged in the above-mentioned trough body, at least one side of the separation groove has a plurality of through holes, wherein the above-mentioned electroplating solution passes into the above-mentioned trough body through the separation groove, and is sprayed toward the above-mentioned workpiece to be plated close to the above-mentioned electroplating anode.

[0004] However, there is still room for improvement in the above-mentioned electroplating equipment. For example, since the guide wheels arranged in the tank body are generally ordinary cylindrical guide wheels, and these cylindrical guide wheels are in the process of conveying the workpieces to be plated, because the workpieces to be plated are generally in the form of long sheets, that is, they have a certain width, as the workpieces to be plated are moving on the cylindrical guide wheels, there is a chance that wrinkles will appear on the workpieces to be plated during the electroplating process because the workpieces to be plated are not sufficiently stretched between the middle and both sides. This will affect the plating quality of the workpieces to be plated, for example, the metal film layer may become uneven during the electroplating process, or the metal deposition thickness may be uneven, etc., that is, the defective rate is high.

[0005] Therefore, it is necessary to improve the existing technology. Utility Model Content

[0006] In view of the problems existing in the above-mentioned prior art, the purpose of the utility model is to provide an improved bendable circuit board electroplating equipment, which can make the middle diameter of the workpiece to be plated be pushed outward a certain distance from the middle of the workpiece to be plated when the workpiece to be plated is connected to the tensioning guide wheel, so that the workpiece to be plated can be kept in a taut state from the middle to both sides, the workpiece to be plated will be relatively stable during the movement, and wrinkles are not easy to appear on the workpiece to be plated, and the quality of the coating can be guaranteed ultimately.

[0007] In order to achieve the above purpose, the technical solution of the utility model is:

[0008] An improved bendable circuit board electroplating equipment comprises a tank body and a front guide wheel, a rear guide wheel and a plurality of groups of tightening guide components respectively arranged in the tank body; the tank body is used to contain electroplating solution, and the electroplating solution has a liquid surface when contained in the tank body; the front guide wheel and the rear guide wheel are respectively located on one side of the inlet and one side of the outlet of the tank body; each group of the tightening guide components comprises a tightening guide wheel and an electroplating anode respectively immersed under the liquid surface; the tightening guide wheel is located below the front guide wheel and the rear guide wheel and between the front guide wheel and the rear guide wheel to form a conveying path; the tightening guide wheel is in an elongated strip shape, and the diameter of the tightening guide wheel gradually decreases from the middle to the two ends so that The tensioning guide wheel forms a structure that is thick in the middle and thin at both ends; the electroplating anode is located on one side of the conveying path; by setting the tensioning guide wheel, when the workpiece to be plated is connected to it, since the diameter of the middle part of the tensioning guide wheel is larger than the two ends, the middle part can be pushed outward by a certain distance from the middle part of the workpiece to be plated, so that the workpiece to be plated can be kept in a tensioned state from the middle to both sides, and wrinkles are not easy to appear on the workpiece to be plated, and the quality of the coating can be guaranteed in the end; by gradually reducing the diameter of the tensioning guide wheel from the middle to the two ends, the distance that the workpiece to be plated is pushed outward from the middle can be gradually reduced toward the two ends, so that a transition effect can be formed, and wrinkles are not easy to appear on the workpiece to be plated during movement.

[0009] The additional structure of the above technical solution also includes the following solutions:

[0010] Furthermore, the circumference of the middle portion of the tension guide wheel is 0.5-4 mm greater than the circumference of the ends thereof, so that the tension guide wheel can be thick in the middle portion and thin at both ends.

[0011] Furthermore, the circumferences of the two ends of the tensioning guide wheel are equal, thereby ensuring the use effect of the tensioning guide wheel.

[0012] Furthermore, each group of the tightening guide assembly includes one or two tightening guide wheels; when there is one tightening guide wheel, the conveying path is in a "V" shape; when there are two tightening guide wheels, the two tightening guide wheels are arranged horizontally, so that the conveying path is in an inverted trapezoidal shape. The above arrangement can conveniently form different conveying paths.

[0013] Furthermore, when there are two tensioning guide wheels, each group of the tensioning guide assemblies further includes a travel roller located between the two tensioning guide wheels, so that the travel roller can be used to increase the tension of the workpiece to be plated along the length direction during the movement.

[0014] Furthermore, the tensioning guide components are provided with more than two arranged in sequence, and an auxiliary guide wheel located above the liquid surface is also provided between two adjacent tensioning guide components, so that the auxiliary guide wheel can be conveniently used for guiding.

[0015] Furthermore, the auxiliary guide wheels are provided with three horizontally arranged ones.

[0016] Furthermore, two of the three auxiliary guide wheels located on both sides are connected to a driving source, so that the two auxiliary guide wheels form driving wheels, thereby conveniently driving the workpiece to be plated to move.

[0017] Furthermore, the electroplating anode is made of titanium.

[0018] Furthermore, there are four electroplating anodes in each group of the tightening guide components, and the four electroplating anodes are respectively located on both sides of the two ends of the conveying path, thereby improving the efficiency of electroplating.

[0019] The beneficial effects of the utility model are:

[0020] (I) The utility model utilizes the tensioning guide wheel provided, so that when the workpiece to be plated is connected to the tensioning guide wheel, since the diameter of the middle part of the tensioning guide wheel is larger than that of the two ends, the middle part can be pushed outward from the middle part of the workpiece to be plated by a certain distance, thereby making the workpiece to be plated maintain a tensioned state from the middle part to both sides (that is, it can maintain a tensioned and fully expanded state in the width direction), and the workpiece to be plated will be very stable during the movement, which can make the workpiece to be plated less likely to have wrinkles, and the metal film layer is less likely to be uneven or the metal deposition thickness is uneven during the electroplating process, and finally the coating quality can be guaranteed, that is, the yield rate is high.

[0021] (ii) The utility model gradually reduces the diameter of the tensioning guide wheel from the middle to the two ends, so that the distance of the workpiece to be plated from the middle to the outside is gradually reduced toward the two ends, thereby forming a transition effect and making the workpiece to be plated less likely to wrinkle and more stable during movement.

[0022] (III) The tensioning guide wheel used in the present invention ensures good tension between the middle and both sides of a thinner piece to be plated and has a good stabilizing effect when moving. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0024] Figure 2 This is a schematic diagram of the structure of the tension guide wheel of the utility model. Figure 1 ;

[0025] Figure 3 This is a schematic diagram of the structure of the tension guide wheel of the utility model. Figure 2 ;

[0026] Figure 4 yes Figure 3 Cross-sectional view along AA.

[0027] Reference numerals:

[0028] 1. Tank body; 2. Front guide wheel; 3. Rear guide wheel; 4. Liquid level; 5. Tension guide wheel; 51. Middle part; 52. End part; 6. Electroplating anode; 7. Travel roller; 8. Parts to be plated; 9. Auxiliary guide wheel. DETAILED DESCRIPTION

[0029] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments. The following description is only exemplary and does not limit the protection scope of the utility model.

[0030] like Figure 1-Figure 4 As shown, an improved bendable circuit board electroplating equipment includes a tank body 1 and a front guide wheel 2, a rear guide wheel 3 and a plurality of tension guide components respectively arranged in the tank body 1.

[0031] like Figure 1 As shown, specifically, the tank body 1 is mainly used to contain the electroplating solution, and the electroplating solution has a liquid level 4 when contained in the tank body 1; specifically, the tank body 1 is composed of a bottom plate and a plurality of side plates. In addition, the electroplating solution contains metal ions, and the metal ions can be copper ions, cobalt ions, nickel ions, zinc ions, tin ions or silver ions, etc. In this embodiment, the metal ions are copper ions.

[0032] like Figure 1 As shown, preferably, the front guide wheel 2 and the rear guide wheel 3 are respectively located on one side of the entrance and one side of the exit of the tank body 1, so that the workpiece 8 to be plated can be guided in direction by the corresponding front guide wheel 2 and the rear guide wheel 3 when entering and passing through the tank body 1.

[0033] like Figure 1 As shown, preferably, each set of tensioning guide components includes a tensioning guide wheel 5 and an electroplating anode 6 respectively immersed in the liquid surface 4.

[0034] like Figure 1 As shown, with respect to the setting of the tensioning guide wheel 5, the tensioning guide wheel 5 is located below the front guide wheel 2 and the rear guide wheel 3 and between the front guide wheel 2 and the rear guide wheel 3 to form a conveying path, thereby facilitating the electroplating process when the workpiece 8 to be plated moves in the tank body 1.

[0035] like Figure 2-Figure 4 As shown, the shape of the tension guide wheel 5 is as follows: the tension guide wheel 5 is specifically in the shape of a long strip, and the diameter of the tension guide wheel 5 gradually decreases from the middle portion 51 to the two ends, so that the tension guide wheel 5 forms a structure with a thick middle portion 51 and thin ends;

[0036] Preferably, the electroplating anode 6 is located on one side of the conveying path so that the surface of the workpiece 8 can be electroplated.

[0037] During use, by using the tensioning guide wheel 5, when the workpiece 8 to be plated is connected to it, the diameter of the middle part 51 of the tensioning guide wheel 5 is larger than that of the two ends, so that the middle part 51 can push out a certain distance of the middle part 51 of the workpiece 8 to be plated, thereby making the workpiece 8 to be plated maintain a tensioned state between the middle part and the two sides (i.e., in the width direction), and the workpiece 8 to be plated will be very stable during the movement, and it is also possible to make the workpiece 8 to be plated less prone to wrinkles and ultimately ensure the quality of the coating, i.e., high yield; by gradually reducing the diameter of the tensioning guide wheel 5 from the middle part 51 to the two ends, the distance that the workpiece 8 to be plated is pushed outward from the middle part 51 can be gradually reduced toward the two ends, thereby forming a transition effect, and it is also possible to make the workpiece 8 to be plated less prone to wrinkles during the movement and have good stability. In addition, by using the tensioning guide wheel 5 of this structure, even a thinner workpiece 8 to be plated can ensure a good tension between the middle part and the two sides and have a good stability effect when moving.

[0038] like Figure 2-Figure 4 As shown, for the specific size setting of the tension guide wheel 5, the circumference of the middle part 51 of the tension guide wheel 5 is set to be 0.5-4 mm larger than the circumference of the end part 52 thereof. The above data is obtained by the research and development personnel through repeated experiments. The tension guide wheel 5 under this structure can ensure the stable use effect of the tension guide wheel 5 during use.

[0039] like Figure 2-Figure 4 As shown, specifically, the circumferences of the two ends 52 of the tensioning guide wheel 5 are equal, so that the stability of the tensioning guide wheel 5 when connected to the workpiece 8 to be plated can be ensured, and the workpiece 8 to be plated is not prone to deviation.

[0040] Preferably, each set of tensioning guide assemblies may include one or two tensioning guide wheels 5 .

[0041] In other embodiments, when there is only one tensioning guide wheel 5, the conveying path can be made into a "V" shape.

[0042] like Figure 1 As shown, in this embodiment, when there are two tensioning guide wheels 5, the two tensioning guide wheels 5 are horizontally arranged so that the conveying path is in an inverted trapezoid, for example, an inverted isosceles trapezoid.

[0043] like Figure 1 As shown, in addition, when there are two tensioning guide wheels 5, each set of tensioning guide components can also include a travel roller 7 located between the two tensioning guide wheels 5, so that after the workpiece 8 to be plated is connected with the travel roller 7, the tension of the workpiece 8 to be plated along the length direction during the movement can be improved, which can also make the workpiece 8 to be plated less likely to have wrinkles, so as to ensure the quality of the coating.

[0044] like Figure 1 As shown, in order to ensure the quality of the coating, more than two tightening guide assemblies are arranged in sequence, and an auxiliary guide wheel 9 located on the liquid surface 4 is also provided between two adjacent tightening guide assemblies. Therefore, by using more than two tightening guide assemblies, the workpiece 8 to be plated can continuously enter each group of tightening guide assemblies in sequence, so that the effect of multiple electroplating can be achieved, and the metal deposition thickness of the metal film layer during the electroplating process is more uniform and less prone to unevenness, that is, the yield is high. At the same time, due to the provision of the auxiliary guide wheel 9, it can play a guiding role between adjacent tightening guide assemblies, so that the workpiece 8 to be plated can form the effect of entering each tightening guide assembly in sequence, and multiple electroplating can be achieved.

[0045] Since there are more than two tension guide assemblies, two or more "V"-shaped or inverted trapezoidal conveying paths are connected to each other to form a total conveying path. For specific settings, please refer to Figure 1 The styles shown in the figure will not be described in detail here.

[0046] like Figure 1 As shown, in the present embodiment, three groups of tensioning guide assemblies are provided, but those skilled in the art should know that the number of tensioning guide assemblies can be increased or decreased accordingly according to actual needs.

[0047] like Figure 1As shown, in this embodiment, three auxiliary guide wheels 9 are arranged horizontally to ensure the stability of the workpiece 8 to be plated after being connected to the auxiliary guide wheels 9. Among the three auxiliary guide wheels 9, two auxiliary guide wheels 9 located on both sides are connected to the driving source, so that the two auxiliary guide wheels 9 form driving wheels, and facilitate auxiliary pulling of the workpiece 8 to be plated to move, thereby improving the movement stability of the workpiece 8 to be plated; when the driving wheel is connected to the workpiece 8 to be plated, its top will be connected to the bottom surface of the workpiece 8 to be plated. In addition, the remaining wheels that are not connected to the driving source are passive wheels that can be rotated by the movement of the workpiece 8 to be plated.

[0048] In this embodiment, the electroplating anode 6 is made of titanium, but those skilled in the art should know that other materials can be selected according to actual needs for the material selection of the electroplating anode 6, which will not be described in detail here. In addition, the electroplating anode 6 in this embodiment is a curved anode plate so as to be used in conjunction with the conveying path of the workpiece 8 to be plated.

[0049] Since the electroplating anode 6 is an anode and the metal film layer is a cathode, the metal film layer can be thickened after being electroplated by the electroplating equipment, and the specific thickness can be determined according to requirements.

[0050] like Figure 1 As shown, in this embodiment, there are four electroplating anodes 6 in each set of tightening guide assemblies, and the four electroplating anodes 6 are respectively located on both sides of the two ends of the conveying path. In this way, the two surfaces of the workpiece 8 to be plated can be electroplated simultaneously, which accelerates the efficiency of electroplating. Therefore, if three sets of tightening guide assemblies are provided, the number of electroplating anodes 6 is correspondingly twelve.

[0051] In this embodiment, the tension guide wheel 5 is made of EPDM rubber or thermoplastic vulcanized rubber. Therefore, the tension guide wheel 5 is made of the above materials after multiple tests by the research and development personnel, and these materials can be used well on the plated workpiece 8 and are not likely to affect the plated workpiece 8.

[0052] The plated part 8 includes a metal seed layer containing copper metal and nickel metal, a plastic film layer disposed on the metal seed layer and containing PI or PET, and a metal film layer disposed on the plastic film layer and containing copper, gold, silver, palladium, iridium, nickel, or chromium. In this embodiment, the metal film layer is made of copper metal.

[0053] Combination Figure 1 , the specific use principle of the utility model is introduced below to facilitate understanding of the utility model:

[0054] First, the workpiece 8 to be plated enters from the entrance of the tank body 1 and is connected to the front guide wheel 2, then is connected to the two tension guide wheels 5 and the travel roller 7 of the first tension guide assembly in sequence, and then is connected to the three auxiliary guide wheels 9, and so on, and then is connected to the second and third groups of tension guide assemblies, and finally passes through the exit of the tank body 1 through the rear guide wheel 3. During the movement of the workpiece 8 to be plated, the tension between the middle and the two sides of the workpiece 8 to be plated can be maintained so that it can be electroplated stably and the quality of the plating layer can be improved.

[0055] The present invention is not limited to the above-mentioned embodiments. If various changes or modifications to the present invention do not depart from the spirit and scope of the present invention, and if these changes and modifications fall within the claims of the present invention and the scope of equivalent technologies, the present invention is also intended to include these changes and modifications.

Claims

1. An improved bendable circuit board electroplating equipment, characterized in that: It comprises a tank body, and a front guide wheel, a rear guide wheel and a plurality of groups of tension guide components respectively arranged in the tank body; The tank body is used to contain the electroplating solution, and the electroplating solution has a liquid level when contained in the tank body; The front guide wheel and the rear guide wheel are respectively located on one side of the inlet and one side of the outlet of the tank body; Each group of the tightening guide components includes a tightening guide wheel and an electroplating anode respectively immersed under the liquid surface; The tension guide wheel is located below the front guide wheel and the rear guide wheel and between the front guide wheel and the rear guide wheel to form a conveying path; the tension guide wheel is in an elongated shape, and the diameter of the tension guide wheel gradually decreases from the middle to the two ends, so that the tension guide wheel forms a structure with a thick middle part and thin ends; The electroplating anode is located at one side of the conveying path; By providing the tensioning guide wheel, when the workpiece to be plated is connected to the tensioning guide wheel, since the diameter of the middle part of the tensioning guide wheel is larger than that of the two ends, the middle part of the tensioning guide wheel can be pushed outward by a certain distance from the middle part of the workpiece to be plated, thereby making the workpiece to be plated maintain a tensioned state from the middle part to both sides, making it less likely for wrinkles to appear on the workpiece to be plated and ultimately ensuring the quality of the coating; by gradually reducing the diameter of the tensioning guide wheel from the middle part to the two ends, the distance that the workpiece to be plated is pushed outward from the middle part can be gradually reduced toward the two ends, thereby forming a transition effect and making it less likely for wrinkles to appear on the workpiece to be plated during movement.

2. The improved bendable circuit board electroplating equipment according to claim 1 is characterized in that: The circumference of the middle portion of the tension guide wheel is 0.5-4 mm greater than the circumference of the end portion thereof.

3. The improved bendable circuit board electroplating equipment according to claim 2 is characterized in that: The circumferences of the two ends of the tension guide wheel are equal.

4. The improved bendable circuit board electroplating equipment according to claim 1, characterized in that: Each group of the tightening guide assemblies includes one or two tightening guide wheels; When there is one tensioning guide wheel, the conveying path is in a "V" shape; When there are two tensioning guide wheels, the two tensioning guide wheels are horizontally arranged so that the conveying path is in an inverted trapezoidal shape.

5. The improved bendable circuit board electroplating equipment according to claim 4 is characterized in that: When there are two tensioning guide wheels, each group of the tensioning guide components further includes a travel roller located between the two tensioning guide wheels.

6. The improved bendable circuit board electroplating equipment according to claim 1, characterized in that: The tightening guide components are provided with two or more components arranged in sequence, and an auxiliary guide wheel located on the liquid surface is also provided between two adjacent tightening guide components.

7. The improved bendable circuit board electroplating equipment according to claim 6 is characterized in that: The auxiliary guide wheels are provided with three horizontally arranged ones.

8. The improved bendable circuit board electroplating equipment according to claim 7 is characterized in that: Two of the three auxiliary guide wheels located on both sides are connected to a driving source, so that the two auxiliary guide wheels form driving wheels.

9. The improved bendable circuit board electroplating equipment according to claim 1, characterized in that: The electroplating anode is made of titanium.

10. The improved bendable circuit board electroplating equipment according to claim 1, characterized in that: There are four electroplating anodes in each group of the tightening guide components, and the four electroplating anodes are respectively located on both sides of the two ends of the conveying path.

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