Semiconductor dehumidifier
By using vacuum copper tubes and capillary structures in semiconductor dehumidifiers and combining multiple heat dissipation fins, the problem of insufficient heat dissipation effect in the prior art is solved, and the dehumidification effect is significantly improved.
Patent Information
- Application Number
- CN202420975294.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-05-07
AI Technical Summary
The existing semiconductor dehumidifiers have insufficient heat dissipation effect, resulting in poor dehumidification effect.
Copper tubes are used as the heat dissipation component. The inside of the copper tube is in a vacuum state, containing refrigerant, and a capillary structure is set up in the copper tube, such as porous nanofibers. The refrigerant circulates quickly in the copper tube through capillary action, and the heat dissipation fins achieve efficient heat dissipation through large surface area.
By improving the heat transfer speed and refrigerant circulation efficiency, faster heat dissipation and condensation performance are achieved, thereby improving the dehumidification effect.
Smart Images
Figure CN222865093U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of air humidity regulation, and in particular to a semiconductor dehumidifier. Background Art
[0002] Semiconductor dehumidifiers use the Peltier effect between P-type and N-type semiconductor materials to achieve refrigeration and dehumidification. When current passes through the two semiconductor materials, heat and cold are generated. When the temperature difference between the cold end (cold end) and the ambient temperature is large, the water molecules in the air will be condensed into water to achieve the dehumidification effect.
[0003] The dehumidification effect of a semiconductor dehumidifier depends largely on whether the temperature difference between the end that generates cold and the environment is large enough. That is, the better the cooling effect, the better the dehumidification effect. The cooling effect of the cold end is affected by the end that generates heat (the hot end). That is, improving the heat dissipation effect of the hot end can improve the cooling effect of the cold end and thus improve the dehumidification effect.
[0004] Currently, semiconductor dehumidifiers on the market generally have aluminum fins extending from the hot end of the refrigeration plate to dissipate heat. The heat dissipation effect is average and needs to be optimized to improve the dehumidification effect. Summary of the invention
[0005] The purpose of the present application is to provide a semiconductor dehumidifier that can dissipate heat from the hot end more quickly, improve condensation performance, and thus improve the dehumidification effect.
[0006] This application is implemented through the following technical solutions:
[0007] A semiconductor dehumidifier comprises a body, a semiconductor module is arranged in the body, the semiconductor module comprises a semiconductor refrigeration plate having a cold end and a hot end, the hot end of the semiconductor refrigeration plate is provided with a heat dissipation assembly, the heat dissipation assembly comprises a base, a copper tube and a heat dissipation fin, the copper tube comprises a heat conduction section and a heat dissipation section, the heat conduction section is fixed to the base and forms a heat conduction surface for affixing the hot end, the heat dissipation section extends in a direction away from the heat conduction section, and a plurality of heat dissipation fins are arranged at intervals along the length direction of the heat dissipation section;
[0008] The interior of the copper tube is in a vacuum state and contains a refrigerant, which can change from a liquid state to a gas state after absorbing heat or change from a gas state to a liquid state after dissipating heat.
[0009] In the semiconductor dehumidifier as described above, a capillary structure is provided inside the copper tube.
[0010] In the semiconductor dehumidifier as described above, the capillary structure is porous nanofibers arranged along the length direction of the copper tube.
[0011] In the semiconductor dehumidifier as described above, the refrigerant is water.
[0012] In the semiconductor dehumidifier as described above, the heat-conducting surface is a plane.
[0013] In the semiconductor dehumidifier as described above, the heat dissipation section of the copper tube is perpendicular to the heat conduction section.
[0014] In the semiconductor dehumidifier as described above, the distance between two adjacent heat dissipation fins is 2 mm to 4 mm, and the thickness of the heat dissipation fins is 0.27 mm to 0.35 mm.
[0015] As described above, the semiconductor dehumidifier has a mounting portion and a groove, the heat-conducting section of the copper tube is embedded in the groove, and the heat-conducting surface of the heat-conducting section is flush with the notch surface of the groove, so that the heat-conducting surface and the notch surface are both in close contact with the hot end.
[0016] In the semiconductor dehumidifier as described above, the cold end of the semiconductor refrigeration plate is provided with a condensing fin.
[0017] In the semiconductor dehumidifier as described above, the semiconductor modules are provided with two and are arranged up and down, and a ventilation hole is provided between the upper and lower parts of the semiconductor modules.
[0018] Compared with the prior art, this application has the following advantages:
[0019] 1. Multiple heat dissipation fins achieve good heat dissipation effect through their large surface area. With the help of vacuum state and capillary action, the heat from the heat conduction section can be transferred to the heat dissipation section faster, which can dissipate the heat at the hot end more quickly, improve the condensation performance, and thus improve the dehumidification effect.
[0020] 2. The pore structure of porous nanofibers can enhance the capillary action, thereby enhancing the circulation effect of the refrigerant in the copper tube.
[0021] 3. The distance between two adjacent heat sinks is 2mm to 4mm. If the distance is too small, the heat dissipation will not be timely and the heat dissipation effect will be poor. Under the premise of the same number of heat sinks, if the distance is too large, the product size will be too large to fit the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0023] Figure 1 This is a full cross-sectional view of the semiconductor dehumidifier described in an embodiment of the present application.
[0024] Figure 2 for Figure 1 Schematic diagram of the structure of the semiconductor module.
[0025] Figure 3 for Figure 2 Schematic diagram of the decomposition structure. DETAILED DESCRIPTION
[0026] In order to make the technical problems, technical solutions and beneficial effects solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0027] like Figures 1 to 3 As shown, an embodiment of the present application proposes a semiconductor dehumidifier, including a body 1, a semiconductor module 2 is arranged in the body 1, the semiconductor module 2 includes a semiconductor refrigeration plate 21 with a cold end and a hot end, and the cold end of the semiconductor refrigeration plate 21 is provided with a condensation fin 211, and the condensation fin 211 is used to condense water vapor in the air into water to achieve a dehumidification effect.
[0028] The hot end of the semiconductor cooling sheet 21 is provided with a heat dissipation assembly 3, which includes a base 31, a copper tube 32 and heat dissipation fins 33. The copper tube 32 includes a heat conduction section 321 and a heat dissipation section 322. The heat conduction section 321 is fixed to the base 31 and forms a heat conduction surface 3211 for attaching to the hot end. The heat dissipation section 322 extends away from the heat conduction section 321, and a plurality of heat dissipation fins 33 are arranged at intervals along the length direction of the heat dissipation section 322.
[0029] The copper tube 32 is in a vacuum state and contains a refrigerant. A capillary structure is provided inside the copper tube 32. More specifically, the capillary structure covers the inner wall of the copper tube 32. The refrigerant can change from liquid to gas after absorbing heat or change from gas to liquid after dissipating heat. The refrigerant is preferably water, and ethanol or naphthalene can also be selected according to the situation.
[0030] The heat dissipation principle of the semiconductor dehumidifier during operation is as follows: the hot end of the semiconductor refrigeration sheet 21 contacts the heat-conducting surface 3211, and transfers the heat to the heat-conducting section 321 of the copper tube 32 in the form of heat transfer. Since the interior of the copper tube 32 is in a vacuum state, the boiling point of the refrigerant is low, and the refrigerant in the heat-conducting section 321 can turn into gas more quickly after absorbing heat. After the gaseous refrigerant reaches the heat-dissipating section 322, the temperature drops and returns to liquid under the heat dissipation effect of the heat-dissipating fins 33. The liquid refrigerant continues to return to the heat-conducting section 321 to absorb heat under the capillary effect of the capillary structure, and the cycle repeats. Among them, the multiple heat-dissipating fins achieve a good heat dissipation effect through their large surface area. With the help of the vacuum state and capillary effect, the heat of the heat-conducting section 321 can be transferred to the heat-dissipating section 322 more quickly, and the heat of the hot end can be dissipated more quickly, thereby improving the condensation performance and thus improving the dehumidification effect.
[0031] As one of the specific embodiments but not limiting, the capillary structure is porous nanofibers arranged along the length direction of the copper tube 32. The pore structure of the porous nanofibers can enhance the capillary action, thereby enhancing the circulation effect of the refrigerant in the copper tube 32.
[0032] As one of the specific implementations but not limitation, the capillary structure may also be a metal powder sintered structure or a groove structure.
[0033] The metal powder sintering structure is formed by washing the copper tube with dilute sulfuric acid, injecting ultra-high purity copper powder particles with a diameter of about 75-150μm into the copper tube, and then sintering it in a furnace. After the sintered copper tube is tightened and sealed with special tools, a metal powder sintering structure that can play a capillary role is formed. The groove structure is formed by integral molding with the copper tube.
[0034] In order to facilitate processing, the heat-conducting surface 3211 is a plane. Furthermore, the base 31 is provided with a mounting portion 311 and a groove 312, the heat-conducting section 321 of the copper tube 32 is embedded in the groove 312, and the heat-conducting surface 3211 of the heat-conducting section 321 is flush with the notch surface of the groove 312, so that the heat-conducting surface 3211 and the notch surface are both close to the hot end. The base 31 mainly plays the role of installation and fixing, and its material is aluminum, and it can also play the role of auxiliary heat dissipation.
[0035] In this embodiment, a plurality of copper tubes 32 can be arranged in parallel, and the heat dissipation sections 322 of the copper tube 32 extend from both ends of the heat conduction section 321 and are perpendicular to the heat conduction section 321. In this way, the heat dissipation fins 33 can be arranged on the heat dissipation section 322 more conveniently.
[0036] In this embodiment, the distance between two adjacent heat dissipation fins 33 is 2 mm to 4 mm. If the distance is too small, the heat dissipation will not be timely and the heat dissipation effect will be poor. Under the premise of the same number of heat dissipation fins, if the distance is too large, the product size will be too large to fit the whole machine.
[0037] In addition, the thickness of the heat dissipation fins 33 is 0.27 mm to 0.35 mm. In addition to maintaining a low material cost, more heat dissipation fins can be arranged in the same arrangement length to increase the heat dissipation surface area.
[0038] In order to further enhance the dehumidification effect, two semiconductor modules 2 are provided and arranged up and down, and a ventilation hole 10 is provided between the upper and lower semiconductor modules 2.
[0039] Furthermore, the semiconductor dehumidifier includes an air supply unit 4, which is arranged on one side of the heat dissipation component 3. More preferably, the air supply unit 4 is arranged between the heat dissipation components 3 of two semiconductor modules 2, and can drive the gas to pass through the gaps between adjacent heat dissipation fins 33 to take away the heat of the heat dissipation fins 33.
[0040] It should be understood that the terms "first", "second", etc. are used in this application to describe various information, but this information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information. In addition, the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0041] As described above, one or more implementation methods are provided in combination with specific contents, and the specific implementation of this application is not limited to these descriptions. Any similarity or similarity with the method, structure, etc. of this application, or some technical deductions or replacements made based on the concept of this application should be considered as the protection scope of this application.
Claims
1. A semiconductor dehumidifier, comprising a body (1), wherein a semiconductor module (2) is arranged in the body (1), wherein the semiconductor module (2) comprises a semiconductor refrigeration sheet (21) having a cold end and a hot end, wherein the hot end of the semiconductor refrigeration sheet (21) is provided with a heat dissipation component (3), characterized in that: The heat dissipation component (3) comprises a base (31), a copper tube (32) and heat dissipation fins (33); the copper tube (32) comprises a heat conduction section (321) and a heat dissipation section (322); the heat conduction section (321) is fixed to the base (31) and forms a heat conduction surface (3211) for affixing to a hot end; the heat dissipation section (322) extends in a direction away from the heat conduction section (321); and a plurality of heat dissipation fins (33) are arranged at intervals along the length direction of the heat dissipation section (322); The interior of the copper tube (32) is in a vacuum state and contains a refrigerant, wherein the refrigerant can change from a liquid state to a gas state after absorbing heat or change from a gas state to a liquid state after dissipating heat.
2. A semiconductor dehumidifier according to claim 1, characterized in that: A capillary structure is provided in the copper tube (32).
3. A semiconductor dehumidifier according to claim 2, characterized in that: The capillary structure is porous nanofibers arranged along the length direction of the copper tube (32).
4. A semiconductor dehumidifier according to claim 1, characterized in that: The refrigerant is water.
5. A semiconductor dehumidifier according to claim 1, characterized in that: The heat-conducting surface (3211) is a plane.
6. A semiconductor dehumidifier according to claim 1, characterized in that: The heat dissipation section (322) of the copper tube (32) is perpendicular to the heat conduction section (321).
7. A semiconductor dehumidifier according to claim 1, characterized in that: The distance between two adjacent heat dissipation fins (33) is 2 mm to 4 mm, and the thickness of the heat dissipation fins (33) is 0.27 mm to 0.35 mm.
8. A semiconductor dehumidifier according to any one of claims 1 to 7, characterized in that: The base (31) is provided with a mounting portion (311) and a groove (312); the heat-conducting section (321) of the copper tube (32) is embedded in the groove (312); the heat-conducting surface (3211) of the heat-conducting section (321) is flush with the notch surface of the groove (312), so that the heat-conducting surface (3211) and the notch surface are both in close contact with the hot end.
9. A semiconductor dehumidifier according to any one of claims 1 to 7, characterized in that: The cold end of the semiconductor refrigeration sheet (21) is provided with a condensing fin (211).
10. A semiconductor dehumidifier according to any one of claims 1 to 7, characterized in that: The semiconductor modules (2) are provided with two and are arranged up and down, and a ventilation opening (10) is provided between the upper and lower parts of the semiconductor module (2).