Metal electrode structure
By opening electrode holes on the PET planar substrate and setting the reaction electrode layer and functional film layer therein, the problems of defects in the edge of the electrochemical sensor electrode and uneven spread of the functional film layer are solved, and electrode performance with high reactivity and high precision is achieved.
Patent Information
- Application Number
- CN202421073217.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-05-16
AI Technical Summary
Existing electrochemical sensor electrodes are prone to edge defects during the manufacturing process, which affects the electrode performance. The planar pattern electrode is not conducive to the uniform spread of the sensor functional film layer, resulting in the impact of the sensor function.
A metal electrode structure is designed, using a PET planar substrate, with metal foil conductive layers pasted on both sides, and electrode holes are opened on the substrate to expose the metal foil conductive layer, and a reaction electrode layer and a functional film layer are arranged in the electrode hole, so that the three are connected.
By electroplating in the electrode holes, precious metal materials are saved, highly reactive electrode layers are obtained, edge defects are avoided, and the sensor functional film layer is evenly spread, and electrode performance and detection accuracy are improved.
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Figure CN222866601U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electrochemical sensors, in particular to a metal electrode structure. Background Art
[0002] Electrodes are the basic functional components of sensors, providing a place for electrochemical reactions and conducting electricity. Electrodes are reprocessed and made into sensors that can be used in medical diagnosis, agriculture, food, and environmental testing. They are mainly used in high-precision electrochemical testing, such as blood sugar test strips, blood gas test cards, etc.
[0003] Currently, most electrochemical sensor electrodes on the market are planar pattern electrodes printed or sputtered on substrates, such as blood glucose test strips, uric acid test strips, etc. The pattern accuracy of printed electrodes is affected by the stability of the printing process, and the process of sputtering electrodes is complex and the cost is high.
[0004] Electroplating can produce high-performance metal electrodes at a lower cost, but direct electroplating to generate planar pattern electrodes is prone to defects at the edges, which can affect electrode performance.
[0005] Planar pattern electrodes are not conducive to the uniform spreading of the sensor functional film layer mixture on the electrode surface due to the large difference in surface hydrophilicity between the metal and the substrate, which affects the function of the constructed sensor.
[0006] In order to obtain high consistency, the electrode reaction area generally needs to be controlled. Insulating ink can be printed on the electroplating plane electrode pattern to separate the functional areas and improve the electrode performance, but the process operation is difficult. Utility Model Content
[0007] The purpose of the utility model is to solve the technical problems existing in the background technology, and for this purpose, a metal electrode structure is provided.
[0008] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:
[0009] A metal electrode structure includes a PET flat substrate;
[0010] Two metal foil conductive layers are attached to one side of the PET flat substrate, and the two metal foil conductive layers are not connected to each other;
[0011] The PET planar substrate is provided with two electrode holes penetrating the PET planar substrate, and the two electrode holes are not connected to each other;
[0012] Two metal foil conductive layers respectively seal one side opening of the two electrode holes;
[0013] A reaction electrode layer and a functional membrane layer are arranged in the two electrode holes;
[0014] The metal foil conductive layer, the reaction electrode layer and the functional film layer are connected in sequence.
[0015] The following is a technical solution further defined by the present utility model: the two metal foil conductive layers are both configured to be L-shaped, and the two electrode holes are both configured to be circular.
[0016] The following is a technical solution further defined by the present utility model: the two reaction electrode layers are not connected to each other, and the two functional film layers are not connected to each other.
[0017] The following is a technical solution further defined by the present utility model: the two metal foil conductive layers are both configured as rectangles, and the two electrode holes are both configured as semicircles.
[0018] The following is a technical solution further defined by the present utility model: the two reaction electrode layers are not connected to each other, and the two functional film layers are connected to each other.
[0019] Compared with the prior art, the utility model has the following technical effects:
[0020] The utility model provides an electrode hole on a flat substrate covered with a metal foil conductive layer on one side, thereby exposing the metal foil conductive layer, and arranging a reaction electrode layer in the electrode hole. The area of the electrode hole corresponds to the electrode reaction area. Therefore, it is only necessary to perform electroplating in the hole, thereby saving precious metal materials and obtaining a precious metal coating with high reaction activity. At the same time, because the exposed metal foil conductive layer is a single flat surface, edge defects are avoided. The electrode hole also provides a limiting and containing point for the mixed liquid of the sensor functional membrane layer, thereby solving the problem of poor diffusion and obtaining high precision and high stability.
[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 It is a schematic structural diagram of the conductive electrode surface of Example 1 of the utility model;
[0024] Figure 2 This is a schematic diagram of the structure of the reaction electrode surface of Example 1 of the utility model;
[0025] Figure 3It is a schematic structural diagram of the reaction electrode surface after electroplating in Example 1 of the utility model;
[0026] Figure 4 This is a schematic diagram of the structure of the reaction electrode surface after the functional film is coated in Example 1 of the utility model;
[0027] Figure 5 This is a schematic diagram of the cross-sectional structure at the center of Example 1 of the utility model;
[0028] Figure 6 This is a schematic structural diagram of the reaction electrode surface of Example 2 of the utility model;
[0029] Figure 7 It is a schematic structural diagram of the reaction electrode surface after electroplating in Example 2 of the utility model;
[0030] Figure 8 This is a schematic diagram of the structure of the reaction electrode surface after the functional film is coated in Example 2 of the utility model;
[0031] Fig. 9 It is a schematic diagram of the cross-sectional structure at the center of Example 2 of the present utility model.
[0032] Explanation of the reference numerals: 1. PET flat substrate; 2. Metal foil conductive layer; 3. Electrode hole; 4. Reaction electrode layer; 5. Functional film layer. DETAILED DESCRIPTION
[0033] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0034] Example 1
[0035] like Figure 1-5 As shown, this embodiment provides a metal electrode structure, which is composed of a PET flat substrate 1, a metal foil conductive layer 2, a reaction electrode layer 4 and a functional film layer 5.
[0036] Two metal foil conductive layers 2 are attached to one side of the PET flat substrate 1 and the two metal foil conductive layers 2 are not connected to each other. Figure 1-5 As shown, the two metal foil conductive layers 2 are both arranged in an L shape, and the two electrode holes 3 are both arranged in a circular shape.
[0037] The PET planar substrate 1 is provided with two electrode holes 3 penetrating the PET planar substrate 1 , and the two electrode holes 3 are not connected to each other.
[0038] The two metal foil conductive layers 2 seal one side opening of the two electrode holes 3 respectively.
[0039] Reaction electrode layers 4 and functional membrane layers 5 are arranged in the two electrode holes 3 .
[0040] The metal foil conductive layer 2, the reaction electrode layer 4 and the functional film layer 5 are connected in sequence.
[0041] The two reaction electrode layers 4 are not connected to each other, and the two functional film layers 5 are not connected to each other.
[0042] The preparation process of the metal electrode structure of Example 1 is further described below:
[0043] 1) A layer of metal foil is attached to one side of the PET flat substrate 1 as a conductive layer, which serves as a conductive electrode surface, and then two specific electrode shapes are etched out of the metal foil, wherein in this embodiment, the electrode shape is L-shaped;
[0044] 2) Laser etching is performed on the other side of the PET flat substrate 1 as a reaction electrode surface, and two electrode holes 3 of specific shapes are etched, so that the metal foil conductive layer 2 is exposed when viewed from the reaction electrode surface, and the surface morphology and roughness of the metal foil conductive layer 2 are changed;
[0045] 3) placing the reaction electrode surface in an electroplating solution and electroplating a metal electrode material of a certain thickness as a reaction electrode layer 4;
[0046] 4) Performing a dispensing or coating operation of the functional film layer 5 in the electrode hole 3 after electroplating, thereby completing the preparation of the entire product.
[0047] In the above structure:
[0048] The PET flat substrate 1 is a coil or sheet, and the thickness of the PET flat substrate 1 is 50-300 μm. The PET flat substrate 1 can be replaced by various insulating substrates such as PC and PI. The etching method on the substrate can be replaced by chemical etching, physical cutting and the like.
[0049] The metal foil is copper foil, aluminum foil or tin foil, and its thickness is 2 to 30 μm. The metal foil can be replaced by nickel, silver, platinum, palladium, gold, alloy or a multilayer structure composed of several metals, or a non-metallic conductive layer.
[0050] The metal coating (ie, the reaction electrode layer 4) is at least one layer of nickel, silver, zinc, chromium, platinum, palladium, and gold; the thickness of the metal coating is 0.01 to 15 μm. The electroplating method can be replaced by a method of quantitative drop coating of metal slurry.
[0051] It should be noted that the material properties and preparation methods involved in the above process are not within the scope of protection of the present invention and are only used by technicians in this field to understand the preparation process of the structural product of the present invention.
[0052] Example 2
[0053] On the basis of the structure of Example 1, the shapes of the metal foil conductive layer 2 and the electrode hole 3 are changed, and the connection relationship between the functional film layers 5 is changed. Specifically: Figure 6-9 As shown, the two metal foil conductive layers 2 are both set to be rectangular, and the two electrode holes 3 are both set to be semicircular. The two reaction electrode layers 4 are not connected to each other, and the two functional film layers 5 are connected to each other.
[0054] Therefore, in combination with Example 1 and Example 2, in the present invention, the electrode hole 3 can be circular, semicircular, annular, square or other geometric shapes, and the number of holes can be increased according to the purpose; in addition, in the present invention, the shape and pattern of the metal foil conductive layer 2 can be changed according to the actual application.
[0055] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any technician familiar with the field can make many possible changes and modifications to the technical solution of the utility model by using the above disclosed methods and technical contents without departing from the scope of the technical solution of the utility model, or modify it into an equivalent embodiment of equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the utility model without departing from the content of the technical solution of the utility model should be included in the protection scope of the utility model.
Claims
1. A metal electrode structure, characterized in that: It comprises a PET flat substrate (1); Two metal foil conductive layers (2) are adhered to one side of the PET flat substrate (1), and the two metal foil conductive layers (2) are not connected to each other; The PET plane substrate (1) is provided with two electrode holes (3) penetrating the PET plane substrate (1), and the two electrode holes (3) are not connected to each other; Two metal foil conductive layers (2) respectively seal one side opening of two electrode holes (3); A reaction electrode layer (4) and a functional membrane layer (5) are arranged in the two electrode holes (3); The metal foil conductive layer (2), the reaction electrode layer (4) and the functional film layer (5) are connected in sequence.
2. A metal electrode structure as claimed in claim 1, characterized in that: The two metal foil conductive layers (2) are both arranged in an L shape, and the two electrode holes (3) are both arranged in a circular shape.
3. A metal electrode structure as claimed in claim 2, characterized in that: The two reaction electrode layers (4) are not connected to each other, and the two functional membrane layers (5) are not connected to each other.
4. A metal electrode structure as claimed in claim 1, characterized in that: The two metal foil conductive layers (2) are both arranged in a rectangular shape, and the two electrode holes (3) are both arranged in a semicircular shape.
5. A metal electrode structure as claimed in claim 4, characterized in that: The two reaction electrode layers (4) are not connected to each other, and the two functional membrane layers (5) are connected to each other.