Novel low-loss semiconductor constant-temperature testboard
By designing a low-loss semiconductor constant temperature test table including a constant temperature box and a preheating box, the problem of heat dissipation when the semiconductor is taken out from the constant temperature box is solved, and the constant temperature effect is guaranteed and the loss is reduced.
Patent Information
- Application Number
- CN202421220146.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-05-30
AI Technical Summary
When the semiconductor is removed from the constant temperature box, a large amount of heat will be dissipated, resulting in the temperature in the constant temperature box no longer being constant, and it needs to be heated again to reach the high temperature, causing equipment loss.
A low-loss semiconductor constant temperature test bench including a constant temperature box and a preheating box was designed. The constant temperature box was heated through an electric heating plate. After testing the semiconductor, the test bench and the mobile bench were moved to the left to enter the preheating box to prevent heat from dissipating, and heat the preheating box through multiple thermal conductor plates to preheat the semiconductor to be tested.
It effectively prevents heat dissipation, ensures the constant temperature effect in the constant temperature box, reduces the loss of semiconductor constant temperature testing, and reduces the temperature reduction caused by the semiconductor absorbing heat when entering the constant temperature box through the preheating box.
Smart Images
Figure CN222866713U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor testing, in particular to a novel low-loss semiconductor constant temperature testing platform. Background Art
[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. In order to ensure the quality of semiconductor products, semiconductors need to be tested at constant temperature to eliminate unqualified semiconductor chips.
[0003] At present, in the process of temperature testing of semiconductors in a constant temperature chamber, when the next semiconductor is replaced after the semiconductor test and the semiconductor is taken out of the constant temperature chamber, a large amount of heat will escape from the opening, which will make the temperature in the constant temperature chamber no longer constant. The constant temperature chamber needs to be heated again to reach the high temperature for the semiconductor constant temperature test, resulting in repeated heating of the constant temperature chamber and causing equipment loss. Therefore, a new low-loss semiconductor constant temperature test bench is proposed. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a novel low-loss semiconductor constant temperature test bench, which solves the problem that when the semiconductor is taken out of the constant temperature box, a large amount of heat will escape from the opening, causing the temperature in the constant temperature box to no longer be constant, and the constant temperature box needs to be heated again to reach the high temperature for semiconductor constant temperature testing.
[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a new type of low-loss semiconductor constant temperature test bench, including a constant temperature box and a preheating box fixedly connected to both sides of the constant temperature box, the two sides of the constant temperature box are slidably connected with the test bench through openings, one side of the test bench is fixedly connected with a moving platform, the top of the test bench and the top of the moving platform are both provided with grooves, an electric heating plate is fixedly installed at the bottom of the inner cavity of the constant temperature box, and a testing mechanism is arranged on the top of the constant temperature box.
[0006] Preferably, the testing mechanism includes an electric telescopic rod, the top of the constant temperature box is fixedly connected to the outer surface of the electric telescopic rod by an opening, the telescopic end of the electric telescopic rod is fixedly connected with a test probe, a display is provided at the top of the constant temperature box and on one side of the electric telescopic rod through an opening, and a temperature measuring instrument is provided at the bottom of the display.
[0007] Preferably, a sliding plate is fixedly connected to one side of the bottom of the test bench and one side of the bottom of the movable platform, a sliding groove is provided at the bottom of the inner cavity of the preheating box, and the interior of the sliding groove is fixedly connected to the bottom of the sliding plate through a slider.
[0008] Preferably, a threaded rod is rotatably connected to the lower part of one side of the constant temperature box through a bearing, one end of the threaded rod passes through the sliding plate and the preheating box in sequence and extends to the outside of the preheating box, and a threaded hole matching the threaded rod is opened on one side of the sliding plate on the left side.
[0009] Preferably, a plurality of heat conducting plates are fixedly mounted on both sides of the thermostatic box through openings, and one side of the heat conducting plate is in close contact with one side of the electric heating plate.
[0010] Preferably, a sealed door is hinged on the top of the preheating box via a hinge, and a handle is fixedly connected to the top of the sealed door.
[0011] Beneficial Effects
[0012] The utility model provides a new type of low-loss semiconductor constant temperature test bench. Compared with the existing technology, it has the following beneficial effects:
[0013] (1) The utility model heats the thermostat to the test temperature through an electric heating plate, so that the semiconductor on the test bench can be tested at a constant temperature in the thermostat. After the semiconductor is tested, the test bench and the movable table are moved to the left, so that the test bench is moved to the preheating box and the movable table is moved to the thermostat, so that the next semiconductor can be easily tested at a constant temperature. The test bench and the movable table always block the openings, effectively preventing heat from escaping, ensuring the constant temperature effect in the thermostat, and being able to effectively reduce the loss of the semiconductor constant temperature test.
[0014] (2) The utility model conducts heat in the preheating box through multiple heat conducting plates, so that the preheating box has a certain temperature, so that the semiconductor to be tested in the preheating box can be preheated, thereby reducing the temperature drop in the constant temperature box caused by the semiconductor absorbing heat in the constant temperature box, so that the temperature loss in the constant temperature box is lower. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the external structure of the utility model;
[0016] Figure 2 It is a cross-sectional view of the structure of the utility model;
[0017] Figure 3 This is a schematic diagram of the structure of the test bench, moving table, groove, sliding plate and threaded hole of the utility model;
[0018] Figure 4 The utility model is a schematic diagram of the internal structure of the constant temperature box, preheating box, test bench, moving table, electric heating plate, slide groove, threaded rod and heat conducting plate.
[0019] In the figure: 1. Constant temperature box; 2. Preheating box; 3. Test bench; 4. Moving table; 5. Groove; 6. Electric heating plate; 7. Test mechanism; 8. Sliding plate; 9. Slide; 10. Threaded rod; 11. Threaded hole; 12. Heat conducting plate; 13. Sealed door; 14. Handle; 71. Electric telescopic rod; 72. Test probe; 73. Display; 74. Temperature measuring instrument. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0021] See also Figure 1-4 The utility model provides a technical solution: a novel low-loss semiconductor constant temperature test bench, comprising a constant temperature box 1 and a preheating box 2 fixedly connected to both sides of the constant temperature box 1, a sealing door 13 is hinged on the top of the preheating box 2 through a hinge, a handle 14 is fixedly connected to the top of the sealing door 13, a test bench 3 is slidably connected to both sides of the constant temperature box 1 through an opening, a moving platform 4 is fixedly connected to one side of the test bench 3, a groove 5 is provided on the top of the test bench 3 and the top of the moving platform 4, an electric heating plate 6 is fixedly installed on the bottom of the inner cavity of the constant temperature box 1, and a testing mechanism 7 is arranged on the top of the constant temperature box 1.
[0022] Furthermore, in order to perform a constant temperature test on the semiconductor, the testing mechanism 7 includes an electric telescopic rod 71, which is electrically connected to an external power supply and controlled by a control switch. The top of the constant temperature box 1 is fixedly connected to the outer surface of the electric telescopic rod 71 by opening an opening, and the telescopic end of the electric telescopic rod 71 is fixedly connected with a test probe 72, which is electrically connected to an external power supply and controlled by a control switch. A display 73 is provided at the top of the constant temperature box 1 and on one side of the electric telescopic rod 71 through an opening, and a temperature measuring instrument 74 is provided at the bottom of the display 73, which is electrically connected to an external power supply and controlled by a control switch.
[0023] It should be noted that the value tested by the test probe 72 and the temperature measured by the temperature measuring instrument 74 will be displayed on the display 73 .
[0024] Furthermore, in order to facilitate the movement of the test bench 3 and the mobile platform 4, a sliding plate 8 is fixedly connected to one side of the bottom of the test bench 3 and one side of the bottom of the mobile platform 4, a slide groove 9 is provided at the bottom of the inner cavity of the preheating box 2, and the interior of the slide groove 9 is fixedly connected to the bottom of the sliding plate 8 through a slider, and a threaded rod 10 is rotatably connected to the lower part of one side of the constant temperature box 1 through a bearing, one end of the threaded rod 10 passes through the sliding plate 8 and the preheating box 2 in turn and extends to the outside of the preheating box 2, a rotating opening matched with the threaded rod 10 is provided on one side of the left preheating box 2, and a threaded hole 11 matched with the threaded rod 10 is provided on one side of the left sliding plate 8.
[0025] Furthermore, in order to preheat the semiconductor being tested in the preheating box 2 , a plurality of heat conducting plates 12 are fixedly mounted on both sides of the constant temperature box 1 through openings, and one side of the heat conducting plate 12 is in close contact with one side of the electric heating plate 6 .
[0026] It should be noted that by preheating the semiconductor to be tested in the preheating box 2, the heat absorbed by the semiconductor after entering the constant temperature box 1 can be lower, thereby reducing the loss of the semiconductor constant temperature test.
[0027] When in use, the electric heating plate 6 is controlled to heat, so that the temperature in the thermostatic box 1 rises, and the temperature in the thermostatic box 1 is monitored by the temperature measuring instrument 74, and the temperature in the thermostatic box 1 is displayed by the display 73. After the temperature in the thermostatic box 1 is heated to the test temperature, the heating of the electric heating plate 6 is stopped, and the semiconductor is tested on the test bench 3. By controlling the electric telescopic rod 71 to extend, the electric telescopic rod 71 will drive the test probe 72 to move downward to contact the semiconductor, and the semiconductor constant temperature test is observed;
[0028] At the same time, the sealing door 13 on the right is opened, and the next semiconductor to be tested is placed into the groove 5 on the movable platform 4. The heat is conducted through the multiple heat conducting plates 12 so that the preheating box 2 has a certain temperature, and the semiconductor on the movable platform 4 is preheated;
[0029] After testing the semiconductor, when the next semiconductor needs to be tested, the threaded rod 10 is rotated, the threaded rod 10 will drive the sliding plate 8 on the left to move to the left, and the sliding plate 8 will drive the test bench 3 and the movable table 4 to move to the left, and the test bench 3 will be moved to the preheating box 2 on the left, and the movable table 4 will be moved to the constant temperature box 1, and the test probe 72 will be controlled again to perform a constant temperature test on the semiconductor.
Claims
1. A novel low-loss semiconductor constant temperature test bench, comprising a constant temperature box (1) and a preheating box (2) fixedly connected to both sides of the constant temperature box (1), characterized in that: The two sides of the thermostatic box (1) are slidably connected to a test bench (3) through openings, one side of the test bench (3) is fixedly connected to a moving platform (4), the top of the test bench (3) and the top of the moving platform (4) are both provided with grooves (5), an electric heating plate (6) is fixedly installed at the bottom of the inner cavity of the thermostatic box (1), and a testing mechanism (7) is arranged at the top of the thermostatic box (1).
2. A novel low-loss semiconductor constant temperature test bench according to claim 1, characterized in that: The testing mechanism (7) comprises an electric telescopic rod (71); the top of the thermostatic box (1) is fixedly connected to the outer surface of the electric telescopic rod (71) by means of an opening; the telescopic end of the electric telescopic rod (71) is fixedly connected to a testing probe (72); a display (73) is provided at the top of the thermostatic box (1) and on one side of the electric telescopic rod (71) by means of an opening; and a temperature measuring instrument (74) is provided at the bottom of the display (73).
3. A novel low-loss semiconductor constant temperature test bench according to claim 1, characterized in that: A sliding plate (8) is fixedly connected to one side of the bottom of the test bench (3) and one side of the bottom of the moving platform (4); a sliding groove (9) is provided at the bottom of the inner cavity of the preheating box (2); and the interior of the sliding groove (9) is fixedly connected to the bottom of the sliding plate (8) via a sliding block.
4. A novel low-loss semiconductor constant temperature test bench according to claim 3, characterized in that: A threaded rod (10) is rotatably connected to the lower side of one side of the thermostatic box (1) via a bearing, one end of the threaded rod (10) passes through the sliding plate (8) and the preheating box (2) in sequence and extends to the outside of the preheating box (2), and a threaded hole (11) adapted to the threaded rod (10) is provided on one side of the sliding plate (8) on the left side.
5. The novel low-loss semiconductor constant temperature test bench according to claim 1 is characterized in that: A plurality of heat-conducting plates (12) are fixedly mounted on both sides of the thermostatic box (1) through openings, and one side of the heat-conducting plate (12) is in close contact with one side of the electric heating plate (6).
6. The novel low-loss semiconductor constant temperature test bench according to claim 1 is characterized in that: A sealed door (13) is hingedly connected to the top of the preheating box (2) via a hinge, and a handle (14) is fixedly connected to the top of the sealed door (13).