Test fixture special for LGA packaged circular fingerprint circular sensor chip

Abstract

The utility model relates to the technical field of sensor chip test fixtures, in particular to a special test fixture for a circular fingerprint circular sensor chip packaged by an LGA (Line Grid Array). According to the technical scheme, the special test fixture for the LGA packaged round fingerprint round sensor chip comprises a test seat, a test probe is arranged on the test seat, a clamping groove for embedding the round sensor chip is formed in the test seat, the test probe is communicated to the interior of the clamping groove, and the test probe is connected to the interior of the clamping groove. The testing seat is detachably provided with a positioning piece which enables the circular sensor chip to be fixed in the clamping groove. The circular sensor chip testing device has the advantages that the circular sensor chip is arranged in the clamping groove, the testing probe tests the circular sensor chip, the positioning piece fixes the circular sensor chip in the clamping groove, the probability that the circular sensor chip deviates in the testing process is reduced, the circular sensor chip testing device adapts to testing of the circular sensor chip, and the accuracy of the testing result is improved.

Description

Technical Field

[0001] The present application relates to the technical field of sensor chip test fixtures, and in particular to a special test fixture for a circular fingerprint circular sensor chip in an LGA package. Background Art

[0002] The traditional method of testing a circular fingerprint sensor chip is to place the circular sensor chip in a reserved IC card slot, press the surface of the circular fingerprint sensor chip with a finger, connect the test probe to the pad at the bottom of the circular sensor chip, analyze the returned data, and obtain the test result.

[0003] The traditional testing method is well adapted to square sensor chips, where the orientation can be determined by the bottom pad pin corresponding to the front direction.

[0004] Currently, the market demand for circular sensor chips continues to grow. However, circular sensor chips have no reference objects. During the test process, it is necessary to touch the surface of the circular sensor chip with fingers. There is a possibility that the circular sensor chip will shift, resulting in inaccurate test results. Utility Model Content

[0005] In order to adapt to the test of circular sensor chips, the present application provides a special test fixture for a circular fingerprint circular sensor chip in an LGA package.

[0006] The present application provides a special test fixture for a circular fingerprint circular sensor chip in an LGA package, which adopts the following technical solution: it includes a test socket, a test probe is provided on the test socket, a card slot for embedding the circular sensor chip is opened on the test socket, the test probe is connected to the card slot, and a positioning piece for fixing the circular sensor chip in the card slot is detachably provided on the test socket.

[0007] By adopting the above technical solution, the circular sensor chip is placed in the card slot, the test probe tests the circular sensor chip, and the positioning piece fixes the circular sensor chip in the card slot, thereby reducing the probability of the circular sensor chip being offset during the test process, being suitable for the test of the circular sensor chip, and improving the accuracy of the test results.

[0008] Preferably, the test socket includes a base and a pedestal, the pedestal is arranged above the base, the base and the pedestal are detachably connected, the positioning piece is arranged on the pedestal, the test probe is vertically arranged on the upper surface of the base, the slot is opened on the upper surface of the pedestal, a guide hole for the test probe to pass through is opened on the pedestal, and the guide hole runs through the bottom of the slot.

[0009] By adopting the above technical solution, the base and the foundation are separated, the circular sensor chip is placed in the card slot, the circular sensor chip is rotated so that its bottom pad corresponds to the guide hole on the base one by one, and then the positioning piece is installed on the base so that the circular sensor chip and the base are relatively fixed, and then the base and the foundation are fit and fixed, and the finger touches the surface of the circular sensor chip and applies downward force to connect the bottom pad of the circular sensor chip to the test probe for testing.

[0010] Preferably, the positioning member includes a pressing cover plate, which is used to fix the circular sensor chip in the card slot, the pressing cover plate and the base are arranged parallel to the base, the pressing cover plate is arranged on a side of the base away from the base, a touch opening is opened on the pressing cover plate, the touch opening and the card slot are coaxially opened and the touch opening passes through the pressing cover plate and is connected with the card slot.

[0011] By adopting the above technical solution, the cover plate is pressed down to press the circular sensor chip onto the base, and the circular sensor chip is exposed by touching the opening. The circular sensor chip is rotated at the touching opening to make its bottom pad correspond to the guide hole on the base one by one.

[0012] Preferably, the base is provided with mounting columns, and there are four mounting columns, which are distributed in a rectangular shape on the base. Four positioning column mounting holes are opened on the base, and the four positioning column mounting holes correspond to the four mounting columns one by one. The positioning column mounting holes are for the mounting columns to pass through.

[0013] By adopting the above technical solution, the four mounting columns pass through the four column mounting holes respectively, so that the base and the pedestal are fitted together.

[0014] Preferably, a rubber pad is provided on the lower pressing cover plate, the rubber pad is in a ring shape, the rubber pad is embedded in the touch opening, the outer ring wall of the rubber pad fits with the hole wall of the touch opening, and the inner ring wall of the rubber pad is used to fit with the peripheral wall of the circular sensor chip.

[0015] By adopting the above technical solution, the anti-slip force of the rubber pad enables the circular sensor chip to be firmly fixed in the card slot.

[0016] Preferably, four tightening screws are arranged on the base, and the tightening screws pass through the base and the lower pressure cover plate, and the tightening screws fix the base and the lower pressure cover plate, and the four tightening screws are distributed on the lower pressure cover plate in a rectangular shape.

[0017] By adopting the above technical solution, the four tightening screws make the connection points between the lower pressure cover plate and the base evenly distributed, and the connection relationship is relatively stable.

[0018] Preferably, the tightening screw includes a tightening nut and a tightening screw, the tightening nut is vertically penetrated through the base, the tightening screw is vertically penetrated through the lower pressure cover plate, and the tightening nut and the tightening screw are threadedly connected.

[0019] By adopting the above technical solution, after the tightening nut and the tightening screw pass through the base and the lower pressure cover plate respectively, the tightening nut and the tightening screw are threadedly connected to fix the lower pressure cover plate on the base.

[0020] Preferably, the tightening screw also includes a support spring, which is sleeved on the screw rod of the tightening nut, one end of the support spring abuts against the nut of the tightening nut, and the other end of the support spring abuts against the upper surface of the lower pressure cover plate.

[0021] By adopting the above technical solution, the elastic supporting force of the supporting spring enables the circular sensor chip to be firmly fixed in the card slot.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. The anti-slip force of the rubber pad makes the round sensor chip firmly fixed in the card slot;

[0024] 2. The elastic supporting force of the supporting spring firmly fixes the circular sensor chip in the card slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of this application;

[0026] Figure 2 It is a cross-sectional schematic diagram of the overall structure of the present application;

[0027] Figure 3 It is a cross-sectional schematic diagram of a part of the structure of the present application;

[0028] Figure 4 It is a structural schematic diagram of the base of the present application.

[0029] Explanation of the reference numerals: 1. Base; 2. Mounting column; 21. Positioning round rod; 22. Tighten the screw; 3. Press down the cover plate; 4. Tighten the screw; 41. Tighten the nut; 42. Support spring; 43. Tighten the screw; 5. Test probe; 6. Positioning column mounting hole; 7. Slot; 8. Guide hole; 9. Base; 11. Touch opening; 12. Rubber pad. DETAILED DESCRIPTION

[0030] The present application is further described in detail below in conjunction with the accompanying drawings.

[0031] The present application discloses a special test fixture for a circular fingerprint circular sensor chip in an LGA package, which is used for testing circular sensor chips.

[0032] refer to Figure 1 , Figure 2 , a special test fixture for a circular fingerprint circular sensor chip in an LGA package, comprising a test seat, the test seat comprising a base 9 and a pedestal 1, the pedestal 1 being arranged above the base 9, the base 9 and the base 1 being detachably connected, a mounting column 2 being arranged on the base 9, four mounting columns 2 being arranged, the four mounting columns 2 being rectangularly distributed on the base 9, four positioning column mounting holes 6 being opened on the base 1, the four positioning column mounting holes 6 corresponding to the four mounting columns 2 one by one, the positioning column mounting holes 6 being for the mounting columns 2 to pass through, in this embodiment, when the mounting columns 2 pass through the positioning column mounting holes 6, the base 1 and the base 9 are fitted together, and the projection surfaces of the base 1 and the base 9 in the vertical direction coincide with each other, the mounting column 2 comprises a positioning cylinder and a tightening screw 22, the positioning cylinder being arranged perpendicular to the upper surface of the base 9, the tightening screw 22 passing through the base 9 is connected to the bottom thread of the positioning cylinder, so that the positioning cylinder and the base 9 are fixed.

[0033] Specifically, refer to Figure 2 , Figure 3 A plurality of test probes 5 are arranged on the base 9, and the test probes 5 are aligned with the bottom pads of the circular sensor chip. A card slot 7 for embedding the circular sensor chip is provided on the base 1, and the card slot 7 is provided on the upper surface of the base 1. A guide hole 8 for the test probe 5 to pass through is provided on the base 1, and the guide hole 8 corresponds to the test probe 5 one by one. The guide hole 8 passes through the bottom of the card slot 7, so that the test probe 5 is connected to the card slot 7.

[0034] Since it is necessary to touch the surface of the circular sensor chip with fingers during the test, there is a possibility that the circular sensor chip may be offset, resulting in inaccurate test results. A detachable positioning piece is provided on the test seat to fix the circular sensor chip in the card slot 7. Before the test, the base 1 and the base 9 are separated, and the circular sensor chip is placed in the card slot 7. The circular sensor chip is rotated so that its bottom pad corresponds to the guide hole 8 on the base 1 one by one. The positioning piece is then installed on the base 1 so that the circular sensor chip and the base 1 are relatively fixed. Then, the base 1 and the base 9 are fitted and fixed. The finger touches the surface of the circular sensor chip and applies downward force to connect the bottom pad of the circular sensor chip to the test probe 5 for testing.

[0035] refer to Figure 1 , Figure 4Specifically, the positioning member includes a pressing cover plate 3, the pressing cover plate 3 and the base 1 are arranged parallel to the base 9, the pressing cover plate 3 is arranged on the side of the base 1 away from the base 9, a touch opening 11 is opened on the pressing cover plate 3, the touch opening 11 and the card slot 7 are opened coaxially and the touch opening 11 passes through the pressing cover plate 3 and is connected with the card slot 7; a rubber pad 12 is arranged on the pressing cover plate 3, the rubber pad 12 is in a ring shape, the rubber pad 12 is embedded in the touch opening 11, the outer ring wall of the rubber pad 12 is in contact with the hole wall of the touch opening 11, the inner ring wall of the rubber pad 12 is used to be in contact with the peripheral wall of the circular sensor chip, and the anti-slip force of the rubber pad 12 makes the circular sensor chip firmly fixed in the card slot 7.

[0036] Furthermore, four tightening screws 4 are arranged on the base 1, and the tightening screws 4 pass through the base 1 and the lower pressure cover plate 3. The tightening screws 4 fix the base 1 and the lower pressure cover plate 3. The four tightening screws 4 are distributed in a rectangular shape on the lower pressure cover plate 3. The tightening screws 4 include a tightening nut 41, a support spring 42 and a tightening screw 43. The tightening nut 41 is vertically penetrated through the base 1, and the tightening screw 43 is vertically penetrated through the lower pressure cover plate 3. The tightening nut 41 and the tightening screw 43 are threadedly connected. The support spring 42 is sleeved on the screw rod of the tightening nut 41, and one end of the support spring 42 abuts against the nut of the tightening nut 41, and the other end of the support spring 42 abuts against the upper surface of the lower pressure cover plate 3. The elastic supporting force of the support spring 42 firmly fixes the circular sensor chip in the card slot 7.

[0037] The implementation principle of the special test fixture for circular fingerprint circular sensor chip in LGA package in the embodiment of the present application is as follows: separate the base 1 from the base 9, lift the lower pressing cover plate 3, place the circular fingerprint sensor chip in the card slot 7, rotate the circular sensor chip through the touch opening 11 reserved in the center of the lower pressing cover plate 3, so that the bottom pad thereof corresponds to the guide hole 8 of the base 1 one by one, loosen the lower pressing cover plate 3, because the supporting force of the supporting spring 42 and the anti-slip force of the rubber pad 12, the circular sensor chip will be firmly fixed in the card slot 7, pass the mounting column 2 through the positioning column mounting hole 6, make the base 1 fit with the base 9, touch the surface of the sensor chip with a finger and apply downward force, so that the bottom pad of the circular sensor chip is connected to the test probe 5, and then the test can be carried out, thereby reducing the probability of the circular sensor chip being offset during the test process, being suitable for the test of the circular sensor chip, and improving the accuracy of the test results.

[0038] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A special test fixture for a circular fingerprint circular sensor chip in an LGA package, comprising a test seat, on which a test probe (5) is arranged, characterized in that: The test seat is provided with a slot (7) for embedding a circular sensor chip, the test probe (5) is connected to the slot (7), and a positioning piece for fixing the circular sensor chip in the slot (7) is detachably provided on the test seat.

2. The LGA packaged circular fingerprint sensor chip dedicated test fixture according to claim 1, characterized in that: The test socket comprises a base (9) and a pedestal (1), wherein the pedestal (1) is arranged above the base (9), the base (9) and the pedestal (1) are detachably connected, the positioning member is arranged on the pedestal (1), the test probe (5) is vertically arranged on the upper surface of the base (9), the card slot (7) is provided on the upper surface of the pedestal (1), and a guide hole (8) for the test probe (5) to pass through is provided on the pedestal (1), and the guide hole (8) passes through the bottom of the card slot (7).

3. The LGA packaged circular fingerprint sensor chip dedicated test fixture according to claim 2, characterized in that: The positioning member comprises a lower pressing cover plate (3), the lower pressing cover plate (3) being used to fix the circular sensor chip in the card slot (7), the lower pressing cover plate (3) and the base (1) being arranged in parallel with the base (9), the lower pressing cover plate (3) being arranged on a side of the base (1) away from the base (9), the lower pressing cover plate (3) being provided with a touch opening (11), the touch opening (11) and the card slot (7) being arranged coaxially, and the touch opening (11) passing through the lower pressing cover plate (3) and being connected with the card slot (7).

4. The LGA packaged circular fingerprint circular sensor chip dedicated test fixture according to claim 3, characterized in that: The base (9) is provided with mounting columns (2), and there are four mounting columns (2). The four mounting columns (2) are distributed on the base (9) in a rectangular shape. The base (1) is provided with four positioning column mounting holes (6), and the four positioning column mounting holes (6) correspond to the four mounting columns (2) one by one. The positioning column mounting holes (6) are for the mounting columns (2) to pass through.

5. The LGA packaged circular fingerprint circular sensor chip dedicated test fixture according to claim 4, characterized in that: A rubber pad (12) is provided on the lower pressing cover plate (3), the rubber pad (12) being in a ring shape and embedded in the touch opening (11), the outer ring wall of the rubber pad (12) being in contact with the hole wall of the touch opening (11), and the inner ring wall of the rubber pad (12) being in contact with the peripheral wall of the circular sensor chip.

6. The LGA packaged circular fingerprint sensor chip dedicated test fixture according to claim 5, characterized in that: Four tightening screws (4) are arranged on the base (1), and the tightening screws (4) pass through the base (1) and the lower pressure cover plate (3). The tightening screws (4) fix the base (1) and the lower pressure cover plate (3), and the four tightening screws (4) are distributed on the lower pressure cover plate (3) in a rectangular shape.

7. The special test fixture for the LGA packaged circular fingerprint circular sensor chip according to claim 6, characterized in that: The tightening screw (4) comprises a tightening nut (41) and a tightening screw (43); the tightening nut (41) is vertically inserted into the base (1); the tightening screw (43) is vertically inserted into the lower pressure cover plate (3); and the tightening nut (41) and the tightening screw (43) are threadedly connected.

8. The special test fixture for the LGA packaged circular fingerprint circular sensor chip according to claim 7, characterized in that: The tightening screw (4) further comprises a support spring (42), wherein the support spring (42) is sleeved on the screw rod of the tightening nut (41), one end of the support spring (42) abuts against the nut of the tightening nut (41), and the other end of the support spring (42) abuts against the upper surface of the lower pressure cover plate (3).

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