Optical module

Abstract

The utility model discloses an optical module. The optical module comprises a circuit board, an optical fiber array and an optical coupling lens, a gain chip and a photoelectric conversion chip group are arranged on the circuit board in the length direction of the circuit board, and the optical coupling lens is arranged on the circuit board and located on the side, away from the gain chip, of the photoelectric conversion chip group. The orthographic projection of the photoelectric conversion chip set on the circuit board is located in the orthographic projection range of the optical coupling lens on the circuit board, the orthographic projection of the gain chip on the circuit board and the orthographic projection of the optical coupling lens on the circuit board are partially overlapped, and the optical fiber array is optically coupled with the side, away from the gain chip, of the optical coupling lens. The optical coupling lens can meet the requirement for the installation size of a high-speed optical module, and has a higher integration level.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the rapid expansion of big data, artificial intelligence and other technical applications, data traffic has shown explosive growth. Optical modules are indispensable for the high-speed transmission of massive data, and optical communication technology is indispensable. Optical modules are tools for the mutual conversion of optical and electrical signals and are key components for optical communication. The rapid growth of data traffic has also placed higher and higher requirements on the transmission rate of optical modules. The optical module rate required by the current high-speed transmission market has been updated from 100G and 400G to 800G or even 1.6T.

[0003] In order to achieve higher speeds, the integration of optical modules has increased exponentially, and more optoelectronic devices are packaged within the protocol size, which puts higher requirements on the layout of internal devices in the optical module. Multimode optical modules need to use optical coupling lenses to transmit signal light. In low-speed optical modules, due to the small number of optoelectronic devices and sufficient layout space on the circuit board, the size of the optical coupling lenses is large for process convenience, which makes it difficult for existing optical coupling lenses to meet the needs in high-speed optical modules. Utility Model Content

[0004] In order to overcome the above shortcomings, the purpose of the present application is to provide an optical module, in which the optical coupling lens in the optical module can adapt to the size requirements of the high-speed optical module.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] An optical module, comprising:

[0007] A circuit board, wherein a gain chip and a photoelectric conversion chip group are arranged on the circuit board, and the photoelectric conversion chip group and the gain chip are arranged along the length direction of the circuit board;

[0008] An optical coupling lens is arranged on the circuit board and is located on a side of the photoelectric conversion chip group away from the gain chip, the orthographic projection of the photoelectric conversion chip group on the circuit board is located within the orthographic projection range of the optical coupling lens on the circuit board, and the orthographic projection of the gain chip on the circuit board partially overlaps with the orthographic projection of the optical coupling lens on the circuit board;

[0009] The optical fiber array is optically coupled to a side of the optical coupling lens away from the gain chip.

[0010] In one embodiment, the size of the optical coupling lens is no more than 4.0 mm*6.0 mm, the length of the optical coupling lens along the length direction of the circuit board is no more than 6.0 mm, and the width of the optical coupling lens along the width direction of the circuit board is no more than 4.0 mm.

[0011] In one embodiment, the optical coupling lens comprises:

[0012] The optical fiber coupling portion is arranged on the circuit board and optically coupled with the optical fiber array.

[0013] and a photoelectric coupling portion, which is arranged on a side of the optical fiber coupling portion away from the optical fiber array and has an accommodation gap with the circuit board, and the photoelectric coupling portion is configured to align with the emitted and / or received optical signals of the photoelectric conversion chipset;

[0014] The photoelectric coupling part and the optical fiber coupling part are integrally formed.

[0015] In one embodiment, the width of the photoelectric coupling portion along the length direction of the circuit board is no greater than 1 mm.

[0016] In one embodiment, the photoelectric coupling unit includes a first coupling lens group and a first reflection surface, the first coupling lens group is located on the transmission path of the photoelectric conversion chip group for emitting and / or receiving the optical signal, and the first reflection surface is located on the emission path of the first coupling lens group;

[0017] The optical fiber coupling portion includes a second coupling lens group, which is located on the reflection path of the first reflection surface and is aligned with the end surface of the optical fiber array.

[0018] In one embodiment, the optical fiber coupling portion further comprises:

[0019] A second reflection surface is located on a reflection path of the first reflection surface and between the first reflection surface and the second coupling lens group, and an inclination direction of the second reflection surface is opposite to an inclination direction of the first reflection surface;

[0020] The light detection chip is arranged on a reflection path corresponding to the second reflection surface on the circuit board.

[0021] In one embodiment, the optical fiber coupling portion further comprises:

[0022] A third coupling lens group is located on the reflection path of the second reflection surface,

[0023] The third coupling lens group and the first coupling lens group are located in the same plane.

[0024] In one embodiment, it further includes:

[0025] A front portion is located on a side of the optical coupling lens close to the optical fiber array,

[0026] The front portion extends from the optical coupling lens toward the optical fiber array and is connected to the circuit board.

[0027] In one embodiment, the photoelectric conversion chipset includes at least one light emitting element and at least one light receiving element, and the light emitting elements and the light receiving elements are arranged in a linear array along the width direction of the circuit board.

[0028] In one embodiment, the optical fiber array comprises:

[0029] An optical fiber bracket connected to the optical coupling lens;

[0030] A plurality of transmitting optical fibers and a plurality of receiving optical fibers, wherein the plurality of transmitting optical fibers and the plurality of receiving optical fibers are arrayed on an optical fiber bracket;

[0031] The transmitting optical fiber is used to receive the optical signal generated by the photoelectric conversion chipset and transmit the optical signal to the outside of the optical module;

[0032] The receiving optical fiber is used to receive the optical signal transmitted from the outside of the optical module, and couple the optical signal transmitted from the outside of the optical module into the photoelectric conversion chipset.

[0033] Beneficial Effects

[0034] The size of the optical coupling lens of the present application is reduced, and the optical coupling lens is not completely covered on the gain chip, which reduces the lens pasting area on the circuit board and improves the effective space utilization rate in the optical module, so that the optical coupling lens can be suitable for the installation size requirements of high-speed optical modules and has a higher degree of integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings are used to provide an understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure. The shapes and sizes of the components in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the content of the present application.

[0036] Figure 1 A schematic diagram of the optical module structure provided in an embodiment of the present application;

[0037] Figure 2 A schematic diagram of the optical module split structure provided in an embodiment of the present application;

[0038] Figure 3 A schematic cross-sectional view of an optical module provided in an embodiment of the present application Figure 1 ;

[0039] Figure 4 A schematic cross-sectional view of an optical module provided in an embodiment of the present application Figure 2 ;

[0040] Figure 5 A bottom view of an optical coupling lens provided in an embodiment of the present application;

[0041] Figure 6 Schematic diagram of the optical coupling lens structure provided in the embodiment of the present application Figure 1 ;

[0042] Figure 7 Schematic diagram of the optical coupling lens structure provided in the embodiment of the present application Figure 2 . DETAILED DESCRIPTION

[0043] The above scheme is further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate the present application and are not limited to the scope of the present application. The implementation conditions adopted in the examples can be further adjusted as the conditions of the specific manufacturer, and the unspecified implementation conditions are usually the conditions in conventional experiments.

[0044] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connecting" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. In this article, "electrical connection" includes the situation where the constituent elements are connected together through an element with some electrical function. "Elements with some electrical function" are not particularly limited as long as they can transfer electrical signals between the connected constituent elements. "Elements with some electrical function" can be, for example, electrodes or wiring, or switching elements such as transistors, or other functional elements such as resistors, inductors or capacitors. "Up", "down", "left", "right", etc. are only used to indicate relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0045] In this application, the directions or positional relationships indicated by the terms "upper", "lower", "inner", "middle", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0046] The present application discloses an optical module, which includes a circuit board, an optical fiber array and an optical coupling lens: a gain chip and a photoelectric conversion chip group arranged along the length direction of the circuit board are arranged on the circuit board, the optical coupling lens is arranged on the circuit board and is located on a side of the photoelectric conversion chip group away from the gain chip, the orthographic projection of the photoelectric conversion chip group on the circuit board is located within the orthographic projection range of the optical coupling lens on the circuit board, the orthographic projection of the gain chip on the circuit board and the orthographic projection of the optical coupling lens on the circuit board have a partial overlap, the optical fiber array is optically coupled to a side of the optical coupling lens away from the gain chip, and the optical coupling lens in the present application can be suitable for the installation size requirements of high-speed optical modules and has a higher degree of integration.

[0047] Next join Figure 1-Figure 7 To describe an optical module provided in an embodiment of the present application.

[0048] The optical module includes a circuit board 10, an optical coupling lens 20 and an optical fiber array 30. A gain chip 11 and a photoelectric conversion chip group 12 are arranged on the circuit board 10. The photoelectric conversion chip group 12 and the gain chip 11 are arranged along the length direction (X direction) of the circuit board 10. The optical coupling lens 20 is arranged on the circuit board 10 and is located on a side of the photoelectric conversion chip group 12 away from the gain chip 11. The orthographic projection b of the photoelectric conversion chip group 12 on the circuit board 10 is located within the range of the orthographic projection a of the optical coupling lens 20 on the circuit board 10. The orthographic projection c of the gain chip 11 on the circuit board 10 is partially overlapped with the orthographic projection a of the optical coupling lens 20 on the circuit board 10. The optical fiber array 30 is optically coupled to a side of the optical coupling lens 20 away from the gain chip 11.

[0049] It should be noted that the size of the optical coupling lens 20 of the present application is reduced, and the optical coupling lens 20 is not completely covered on the gain chip 11, which reduces the pasting area of ​​the optical coupling lens 20 on the circuit board 10 and improves the effective space utilization rate in the optical module, so that the optical coupling lens 20 can be suitable for the installation size requirements of high-speed optical modules and has a higher degree of integration.

[0050] refer to Figure 3 In this embodiment, the size of the optical coupling lens 20 is not greater than 4.0 mm*6.0 mm, the length of the optical coupling lens 20 along the length direction (X direction) of the circuit board 10 is not greater than 6.0 mm, and the width of the optical coupling lens 20 along the width direction (Y direction) of the circuit board 10 is not greater than 4.0 mm. The optical coupling lens 20 within this size can meet the installation size requirements of the high-speed optical module and improve the integration of the optical module.

[0051] refer to Figure 2In this embodiment, the photoelectric conversion chipset 12 includes at least one light-emitting element 121 and at least one light-receiving element 122. The light-emitting elements 121 and the light-receiving elements 122 are arranged in a linear array along the width direction (Y direction) of the circuit board 10, that is, at least one light-emitting element 121 and at least one light-receiving element 122 are arranged in a straight line on the circuit board 10 along the width direction (Y direction) of the circuit board 10. The light-emitting element 121 is used as a laser emitter to convert the electrical signal in the optical module into an optical signal and transmit it to the outside of the optical module; the light-receiving element 122 is used as a photodetector to receive the optical signal outside the optical module and convert it into an electrical signal.

[0052] refer to Figure 2 In this embodiment, the optical fiber array 30 includes a plurality of transmitting optical fibers (not marked in the figure), a plurality of receiving optical fibers (not marked in the figure) and an optical fiber bracket 31. The optical fiber bracket 31 is used to support a plurality of transmitting optical fibers and a plurality of receiving optical fibers. The plurality of transmitting optical fibers and a plurality of receiving optical fibers are arrayed on the optical fiber bracket 31, and the optical fiber bracket 31 is connected to the optical coupling lens 20. The transmitting optical fiber is used to receive the optical signal generated by the light-emitting element 121 and transmit the optical signal to the outside of the optical module; the receiving optical fiber is used to receive the optical signal transmitted outside the optical module and couple the optical signal to the light-receiving element 122. Specifically, the optical signal generated by the light-emitting element 121 is coupled to the transmitting optical fiber in the optical fiber array 30 through the optical coupling lens 20, and the optical signal is transmitted to the outside of the optical module through the transmitting optical fiber; the optical signal outside the optical module is input into the receiving optical fiber and coupled to the light-receiving element 122 through the optical coupling lens 20.

[0053] refer to Figure 4-Figure 5 In this embodiment, the optical coupling lens 20 is made of a light-transmitting material, and the light-transmitting material here specifically refers to a material that can be penetrated by light of a common wavelength in the field of optical communications. In a preferred embodiment, the material of the optical coupling lens 20 can be polyetherimide (PE I). The optical coupling lens 20 includes a photoelectric coupling part 21 and a fiber coupling part 22. The photoelectric coupling part 21 and the fiber coupling part 22 are integrally formed. The fiber coupling part 22 is bonded to the circuit board 10 and optically coupled to the fiber array 30. The photoelectric coupling part 21 is arranged at one end of the fiber coupling part 22 away from the fiber array 30, and there is an accommodation gap (not marked in the drawings) between the photoelectric coupling part 21 and the circuit board 10. The photoelectric coupling part 21 is used to align the optical signal emitted and / or received by the photoelectric conversion chipset 12, that is, the photoelectric coupling part 21 is aligned with the light-emitting surface of the light-emitting element 121 and the light-receiving surface of the light-receiving element 122.

[0054] refer to Figure 5In this embodiment, the width of the photoelectric coupling part 21 along the length direction (X) of the circuit board 10 is not greater than 1 mm, that is, the distance from the side of the photoelectric coupling part 21 away from the optical fiber coupling part 22 to the side of the photoelectric coupling part 21 close to the optical fiber coupling part 22 is not greater than 1 mm. This design not only reduces the size of the photoelectric coupling part 21, but also further reduces the size of the optical coupling lens 20, thereby meeting the requirements for the installation size of the high-speed optical module.

[0055] refer to Figure 3-Figure 7In this embodiment, the optoelectronic coupling unit 21 includes a first coupling lens group 211 and a first reflection surface 212. The first coupling lens group 211 is located on the propagation path of the output and / or received optical signal of the optoelectronic conversion chip group 12, and the first reflection surface 212 is located on the output path of the first coupling lens group 211; the optical fiber coupling unit 22 includes a second coupling lens group 221, and the second coupling lens group 221 is located on the reflection path of the first reflection surface 212 and is aligned with the end face of the optical fiber array 30. Here, the end face alignment of the optical fiber array 30 specifically refers to the alignment of the second coupling lens group 221 with the end face optical axes of the receiving optical fiber and the transmitting optical fiber. Specifically, the first coupling lens group 211 is configured to collimate and converge the optical signal generated by the light-emitting element 121 and then inject it into the optical coupling lens 20, or to allow the external optical signal incident from the second coupling lens group 221 and reflected from the first reflection surface 212 to be emitted toward the light-receiving element 122; the second coupling lens group 221 is configured to allow the optical signal converged and incident from the first coupling lens group 211 and reflected from the first reflection surface 212 to be emitted toward the end face of the transmitting optical fiber, or to allow the external signal light emitted from the end face of the receiving optical fiber to be converged and then injected into the optical coupling lens 20. That is, the light signal generated by the light emitting element 121 is collimated and converged and then incident on the first reflecting surface 212, the first reflecting surface 212 reflects the light signal to the second coupling lens group 221, the second coupling lens group 221 emits the light signal to the end face of the transmitting optical fiber, and the transmitting optical fiber transmits the light signal to the outside of the optical module; the receiving optical fiber receives the light signal outside the optical module (hereinafter referred to as the external light signal) and the light signal is incident on the first reflecting surface 212 through the second coupling lens group 221, the first reflecting surface 212 reflects the external light signal to the first coupling lens group 211, the first coupling lens group 211 emits the external light signal to the light receiving element 122, and the light receiving element 122 converts the external light signal into the required telecommunication signal inside the optical module. No., further, the first coupling lens group 211 includes a plurality of first coupling lenses 2111, which are arranged in a linear array along the width direction (Y) of the circuit board 10, and each of the first coupling lenses 2111 is a circular convex lens protruding toward the side of the photoelectric conversion chip group 12; the second coupling lens group 221 includes a plurality of second coupling lenses 2211, and a first groove 225 is arranged on the side of the optical coupling lens 20 close to the optical fiber array 30, and the plurality of second coupling lenses 2211 are arranged in a linear array along the width direction (Y) of the circuit board 10, and each of the second coupling lenses 2211 is a circular convex lens protruding toward the side of the optical fiber array 30.

[0056] refer to Figure 3-Figure 4In this embodiment, the first reflection surface 212 is configured to reflect the light signal incident from the first coupling lens group 211 toward the second coupling lens group 221, or to reflect the external light signal incident from the second coupling lens group 221 toward the first coupling lens group 211. The first reflection surface 212 is tilted relative to the light emitting direction of the first coupling lens group 211, and the angle between the first reflection surface 212 and the optical axis of the first coupling lens group 211 is between 40-50°. Preferably, the angle between the first reflection surface 212 and the optical axis of the first coupling lens group 211 is 45°.

[0057] refer to Figure 3-Figure 7 In this embodiment, since the optical module in this application is a high-speed optical module, the high-speed optical module has a high temperature when working, which will cause the output power of the light-emitting element to fluctuate and affect the stability of the optical signal. Therefore, it is necessary to add an optical signal power detection function to the transmission path of the light-emitting element to generate the optical signal. It is further necessary to set a second reflection surface 223 on the optical fiber coupling part 22. The second reflection surface 223 is located on the reflection path of the first reflection surface 212 and between the first reflection surface 212 and the second coupling lens group 221. The inclination direction of the second reflection surface 223 is opposite to the inclination direction of the first reflection surface 212. As a preferred embodiment, the second reflection surface 223 is set at 90° with the first reflection surface 212. Specifically, a second groove 226 is provided on the side of the optical fiber coupling part 22 away from the circuit board 10. The second reflection surface 223 is located in the second groove 226. The second reflection surface 223 reflects part of the optical signal reflected by the first reflection surface 212 to the side of the optical fiber coupling part 22 close to the circuit board 10. Correspondingly, a light detection chip 13 is arranged on the reflection path corresponding to the second reflection surface 223 on the circuit board 10, so that the light signal reflected by the second reflection surface 223 can be detected, and then the real-time output power of the light-emitting element 121 can be obtained, and the output power of the light-emitting element 121 can be adjusted and controlled based on this, so as to improve the stability of the light signal. Further, in order to improve the detection accuracy, a third coupling lens group 224 is arranged on the optical fiber coupling part 22, and the third coupling lens group 224 is located on the reflection path of the second reflection surface 223. Specifically, a third groove 227 is arranged on the side of the optical fiber coupling part 22 close to the circuit board 10, and the third coupling lens group 224 is arranged in the third groove 227, and the third coupling lens group 224 and the first coupling lens group 211 are located in the same plane, and the light signal reflected by the second reflection surface 223 to the side of the optical fiber coupling part 22 close to the circuit board 10 is collimated and converged by the third coupling lens group 224 and then emitted.

[0058] refer to Figure 4 and Figure 6In this embodiment, it also includes a front portion 23, which is located on the side of the optical coupling lens 20 close to the optical fiber array 30. The front portion 23 extends from the optical coupling lens 20 toward the optical fiber array 30, and the front portion 23 is connected to the circuit board 10. The front portion 23 is bonded to the circuit board 10 by glue, which further increases the contact area between the optical coupling lens 20 and the circuit board 10, making the contact between the optical coupling lens 20 and the circuit board 10 more firm and stable.

[0059] refer to Figure 6-Figure 7 In this embodiment, the optical coupling lens 20 also includes a positioning post 24, which extends from the bottom of the optical fiber coupling portion 22 toward the optical fiber array 30. An opening 311 that is compatible with the positioning post 24 is provided on the optical fiber bracket 31. The positioning post 24 is inserted into the opening 311. This design allows the second coupling lens group 221 to be aligned with the transmitting optical fiber and the receiving optical fiber.

[0060] refer to Figure 6-Figure 7 In the present embodiment, a first limiting surface 25 is provided on a side of the optical coupling lens 20 close to the optical fiber array 30, and a second limiting surface (not marked in the figure) matched with the first limiting surface 25 is provided on a side of the optical fiber array 30 close to the optical coupling lens 20. The first limiting surface 25 and the second limiting surface are both inclined. In a preferred embodiment, the angle between the first limiting surface 25 and the body of the optical coupling lens 20 is 8°. In the present embodiment, the end faces of multiple transmitting optical fibers and receiving optical fibers are also inclined by designing the first limiting surface 25 and the second limiting surface to be inclined, thereby effectively preventing the optical signal from generating backscattered reflected light when entering and exiting the optical fiber end face, thereby generating signal interference.

[0061] The above embodiments are only for illustrating the technical concept and features of the present application, and their purpose is to enable people familiar with the technology to understand the content of the present application and implement it accordingly, and they cannot be used to limit the protection scope of the present application. Any equivalent transformation or modification made according to the spirit of the present application shall be included in the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: A circuit board, wherein a gain chip and a photoelectric conversion chip group are arranged on the circuit board, and the photoelectric conversion chip group and the gain chip are arranged along the length direction of the circuit board; An optical coupling lens is arranged on the circuit board and is located on a side of the photoelectric conversion chip group away from the gain chip, the orthographic projection of the photoelectric conversion chip group on the circuit board is located within the orthographic projection range of the optical coupling lens on the circuit board, and the orthographic projection of the gain chip on the circuit board partially overlaps with the orthographic projection of the optical coupling lens on the circuit board; The optical fiber array is optically coupled to a side of the optical coupling lens away from the gain chip.

2. The optical module according to claim 1, characterized in that: The size of the optical coupling lens is no larger than 4.0mm*6.0mm. The length of the optical coupling lens along the length direction of the circuit board is not greater than 6.0 mm, The width of the optical coupling lens along the width direction of the circuit board is no greater than 4.0 mm.

3. The optical module according to claim 1, characterized in that: The optical coupling lens comprises: The optical fiber coupling portion is arranged on the circuit board and optically coupled with the optical fiber array. and a photoelectric coupling portion, which is arranged on a side of the optical fiber coupling portion away from the optical fiber array and has an accommodation gap with the circuit board, and the photoelectric coupling portion is configured to align with the emitted and / or received optical signals of the photoelectric conversion chipset; The photoelectric coupling part and the optical fiber coupling part are integrally formed.

4. The optical module according to claim 3, characterized in that: The width of the photoelectric coupling portion along the length direction of the circuit board is no greater than 1 mm.

5. The optical module according to claim 3, characterized in that: The photoelectric coupling unit comprises a first coupling lens group and a first reflection surface, wherein the first coupling lens group is located on a propagation path of the photoelectric conversion chip group for emitting and / or receiving the optical signal, and the first reflection surface is located on an emitting path of the first coupling lens group; The optical fiber coupling portion includes a second coupling lens group, which is located on the reflection path of the first reflection surface and is aligned with the end surface of the optical fiber array.

6. The optical module according to claim 5, characterized in that: The optical fiber coupling unit also includes: A second reflection surface is located on a reflection path of the first reflection surface and between the first reflection surface and the second coupling lens group, and an inclination direction of the second reflection surface is opposite to an inclination direction of the first reflection surface; The light detection chip is arranged on a reflection path corresponding to the second reflection surface on the circuit board.

7. The optical module according to claim 6, characterized in that: The optical fiber coupling unit also includes: The third coupling lens group is located on the reflection path of the second reflection surface, and the third coupling lens group and the first coupling lens group are located in the same plane.

8. The optical module according to claim 1, characterized in that: Also includes: A front portion is located on a side of the optical coupling lens close to the optical fiber array, The front portion extends from the optical coupling lens toward the optical fiber array and is connected to the circuit board.

9. The optical module according to claim 1, characterized in that: The photoelectric conversion chipset includes at least one light emitting element and at least one light receiving element, and the light emitting elements and the light receiving elements are arranged in a linear array along the width direction of the circuit board.

10. The optical module according to claim 1, characterized in that: The optical fiber array comprises: An optical fiber bracket connected to the optical coupling lens; A plurality of transmitting optical fibers and a plurality of receiving optical fibers, wherein the plurality of transmitting optical fibers and the plurality of receiving optical fibers are arrayed on an optical fiber bracket; The transmitting optical fiber is used to receive the optical signal generated by the photoelectric conversion chipset and transmit the optical signal to the outside of the optical module; The receiving optical fiber is used to receive the optical signal transmitted from the outside of the optical module, and couple the optical signal transmitted from the outside of the optical module into the photoelectric conversion chipset.

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