Silicon optical chip compatible with 400G DR4 and 400G FR4 and silicon optical module

Abstract

The utility model relates to a silicon optical chip compatible with 400G DR4 and 400G FR4. Four first light inlet waveguides are respectively coupled with four light outlet waveguides through four MZ modulators, and two second light inlet waveguides are respectively coupled with input ends of two 1 * 2 equal-ratio optical splitters. And four output ends of the two 1 * 2 equal-ratio optical splitters are respectively coupled with input ends of the four MZ modulators. According to the 400G DR4 silicon optical module, two light emitting assemblies are respectively coupled with two second light inlet waveguides, and a four-channel optical fiber array is coupled with four light outlet waveguides. According to the 400G FR4 silicon optical module, four light emitting assemblies are respectively coupled with four first light inlet waveguides, and an AWG device is coupled with four light outlet waveguides. The silicon optical chip has the beneficial effects that the silicon optical chip can be compatible with the application of a 400G DR4 silicon optical module and a 400G FR4 silicon optical module, so that the cost of a single silicon optical chip is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon photonic modules, and in particular to a silicon photonic chip and a silicon photonic module compatible with 400G DR4 and 400G FR4. Background Art

[0002] Traditional 400G DR4 silicon photonic modules such as Figure 1 As shown, it includes: two optical transmission components with the same wavelength, a four-channel optical fiber array and a 400G DR4 silicon photonic chip. The 400G DR4 silicon photonic chip integrates four MZ modulators, two 1×2 equal-ratio optical splitters, two input optical waveguides and four output optical waveguides. The two input optical waveguides are respectively coupled with the input ends of the two 1×2 equal-ratio optical splitters, and the four output ends of the two 1×2 equal-ratio optical splitters are respectively coupled with the input ends of the four MZ modulators, and the output ends of the four MZ modulators are coupled with the four output optical waveguides. The two optical transmission components are respectively coupled with the two input optical waveguides of the 400G DR4 silicon photonic chip, and the four-channel optical fiber array is coupled with the four output optical waveguides of the 400G DR4 silicon photonic chip.

[0003] Traditional 400G FR4 silicon photonic modules such as Figure 2 As shown, it includes: four optical transmission components with different wavelengths, a single-channel optical fiber array and a 400G FR4 silicon photonic chip. The 400G FR4 silicon photonic chip integrates four MZ modulators, a combiner, four input optical waveguides and one output optical waveguide. The four input optical waveguides are coupled to the input end of the combiner through four MZ modulators, and the output optical waveguide is coupled to the output end of the combiner. The four optical transmission components are coupled to the four input optical waveguides on the 400G FR4 silicon photonic chip, and the single-channel optical fiber array is coupled to the output optical waveguide on the 400G FR4 silicon photonic chip.

[0004] That is, 400G DR4 silicon photonic modules and 400G FR4 silicon photonic modules use two different silicon photonic chips. The silicon photonic chips currently used in 400G FR4 silicon photonic modules have the following disadvantages:

[0005] 1) Low usage leads to high chip tape-out costs, which in turn leads to high R&D and testing costs amortized to a single chip;

[0006] 2) Since the MZ modulator has many heating resistor components and the thermal conductivity of silicon is very high (148W / mk), the heat from the MZ modulator affects the built-in combiner, resulting in low yield and poor product performance. Utility Model Content

[0007] The technical problem to be solved by the present invention is to provide a silicon photonic chip and a silicon photonic module compatible with 400G DR4 and 400G FR4, so as to overcome the deficiencies in the above-mentioned prior art.

[0008] The utility model provides a technical solution to the above technical problems as follows: a silicon photonic chip compatible with 400G DR4 and 400G FR4, comprising: four MZ modulators and two 1×2 equal-ratio optical splitters integrated inside the chip, as well as four first input optical waveguides, two second input optical waveguides and four output optical waveguides integrated inside the chip and on the same side, the four first input optical waveguides are respectively coupled with the four output optical waveguides via the four MZ modulators, the two second input optical waveguides are respectively coupled with the input ends of the two 1×2 equal-ratio optical splitters, and the four output ends of the two 1×2 equal-ratio optical splitters are respectively coupled with the input ends of the four MZ modulators.

[0009] The beneficial effects of the utility model are as follows: the silicon photonic chip has 6 light input waveguides, which is the sum of the number of light input waveguides of the two existing silicon photonic chips, and then two 1×2 equal ratio optical splitters are used for light splitting. When the silicon photonic chip is applied to a 400G DR4 silicon photonic module, two light emitting components with the same wavelength coupled to the two second light input waveguides are arranged on the input side of the silicon photonic chip, and a four-channel optical fiber array coupled to the four light output waveguides on the silicon photonic chip is arranged on the output side of the silicon photonic chip; when applied to a 400G FR4 silicon photonic module, four light emitting components with different wavelengths coupled to the four first light input waveguides are arranged on the input side of the silicon photonic chip, and an AWG device coupled to the four light output waveguides on the silicon photonic chip is arranged on the output side of the silicon photonic chip; the silicon photonic chip is compatible with the application of 400G DR4 silicon photonic modules and 400GFR4 silicon photonic modules, so there is no need to worry about 400G. The problem of small usage of FR4 silicon photonic chips is solved, and the cost of a single silicon photonic chip is reduced. In addition, the silicon photonic chip eliminates the combiner to avoid the thermal impact of the MZ modulator on the built-in combiner, which would lead to low yield and poor product performance.

[0010] Based on the above technical solution, the utility model also provides a 400G DR4 silicon photonic module, including: two optical transmission components with the same wavelength, a four-channel optical fiber array and a silicon photonic chip, the two optical transmission components are respectively coupled with the two second input optical waveguides on the silicon photonic chip, and the four-channel optical fiber array is coupled with the four output optical waveguides on the silicon photonic chip.

[0011] The above further beneficial effects are as follows: the two lights emitted by the two optical emitting components with the same wavelength are coupled into the two second optical input waveguides respectively, and then the light in each second optical input waveguide is divided into two lights by a 1×2 equal-ratio optical splitter coupled to the second optical input waveguide, and enter the two MZ modulators respectively, and then propagate to the two optical output waveguides through the two MZ modulators, and finally the two lights are coupled from the two optical output waveguides into the two optical fibers of the four-channel optical fiber array. Since there are two 1×2 equal-ratio optical splitters, the light that finally enters the four-channel optical fiber array is four-path, that is, a 400G DR4 silicon photonic module can be constructed based on the designed silicon photonic chip.

[0012] Furthermore, the optical emission component includes: a laser chip, a collimating lens, an optical isolator and a converging lens which are sequentially distributed along the light propagation direction, and the laser chip is fixed on a ceramic heat sink.

[0013] Based on the above technical solution, the utility model also provides a 400G FR4 silicon photonic module, which is characterized in that it includes: four optical transmission components with different wavelengths, an AWG device and a silicon photonic chip, the four optical transmission components are respectively coupled with the four first input optical waveguides on the silicon photonic chip, and the AWG device is coupled with the four output optical waveguides on the silicon photonic chip.

[0014] The further beneficial effect of adopting the above method is that the four lights emitted by the four optical transmission components with different wavelengths are respectively coupled into the four first optical input waveguides, and then the light in each first optical input waveguide is propagated to an optical output waveguide through the MZ modulator coupled to the first optical input waveguide, and finally the four lights emitted from the four optical output waveguides are respectively coupled into the AWG device, and the AWG device combines the four lights into one optical fiber output. In this solution, since a mature external AWG device is used to realize the combining function, the integrated combiner in the silicon photonic chip is cancelled to avoid the thermal influence of the MZ modulator on the built-in combiner, thereby causing low yield and poor product performance. In addition, a 400G FR4 silicon photonic module can be constructed based on the designed silicon photonic chip.

[0015] Furthermore, the optical emission component includes: a laser chip, a collimating lens, an optical isolator and a converging lens which are sequentially distributed along the light propagation direction, and the laser chip is fixed on a ceramic heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural diagram of a 400G DR4 silicon photonic module in the prior art;

[0017] Figure 2 This is a structural diagram of a 400G FR4 silicon photonic module in the prior art;

[0018] Figure 3This is a structural diagram of a silicon photonic chip compatible with 400G DR4 and 400G FR4 in the present invention;

[0019] Figure 4 This is a structural diagram of the 400G DR4 silicon photonic module in the present utility model;

[0020] Figure 5 This is a structural diagram of the 400G FR4 silicon photonic module in the present invention.

[0021] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0022] 1. Silicon photonic chip, 110. MZ modulator, 120. 1×2 equal ratio optical splitter, 130. First optical input waveguide, 140. Second optical input waveguide, 150. Output optical waveguide, 2. Optical emitting component, 210. Laser chip, 220. Collimating lens, 230. Optical isolator, 240. Converging lens, 250. Ceramic heat sink, 3. Four-channel optical fiber array, 4. AWG device. DETAILED DESCRIPTION

[0023] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0024] Example 1

[0025] like Figure 3 As shown, a silicon photonic chip compatible with 400G DR4 and 400G FR4 includes: four MZ modulators 110 and two 1×2 equal-ratio optical splitters 120 integrated in the chip, and four first input optical waveguides 130, two second input optical waveguides 140 and four output optical waveguides 150 integrated in the chip and on the same side, wherein the four first input optical waveguides 130 are respectively coupled to the four output optical waveguides 150 via the four MZ modulators 110, and the two second input optical waveguides 140 are respectively coupled to the input ends of the two 1×2 equal-ratio optical splitters 120, and the two 1×2 equal-ratio optical splitters 140 are respectively coupled to the input ends of the two 1×2 equal-ratio optical splitters 120. The four output ends of 120 are respectively coupled with the input ends of the four MZ modulators 110, that is, the two output ends of one of the two 1×2 equal-ratio optical splitters 120 are coupled with the input ends of two of the four MZ modulators 110, and the two output ends of the other 1×2 equal-ratio optical splitter 120 are coupled with the input ends of the other two of the four MZ modulators 110. The equal-ratio splitting of the 1×2 equal-ratio optical splitter 120 can be understood as a splitting ratio of 50:50.

[0026] When the silicon photonic chip is applied to a 400G DR4 silicon photonic module, two same-wavelength optical transmission components 2 coupled to the two second input optical waveguides 140 are arranged on the input side of the silicon photonic chip 1, and a four-channel optical fiber array 3 coupled to the four output optical waveguides 150 on the silicon photonic chip 1 is arranged on the output side of the silicon photonic chip 1;

[0027] When applied to a 400G FR4 silicon photonic module, four optical transmission components 2 with different wavelengths coupled to the four first input optical waveguides 130 are arranged on the input side of the silicon photonic chip 1, and an AWG device 4 coupled to the four output optical waveguides 150 on the silicon photonic chip 1 is arranged on the output side of the silicon photonic chip 1;

[0028] This silicon photonic chip is compatible with the applications of 400G DR4 silicon photonic modules and 400G FR4 silicon photonic modules, so there is no need to worry about the small amount of 400G FR4 silicon photonic chips used, and the cost of a single silicon photonic chip is reduced. In addition, this silicon photonic chip eliminates the combiner to avoid the thermal impact of the MZ modulator on the built-in combiner, which may lead to low yield and poor product performance.

[0029] Example 2

[0030] like Figure 4 As shown, a 400G DR4 silicon photonic module comprises: two optical emitting components 2 of the same wavelength, a four-channel optical fiber array 3 and a silicon photonic chip 1 as in Example 1, wherein the two optical emitting components 2 are respectively coupled to two second input optical waveguides 140 on the silicon photonic chip 1, and the four-channel optical fiber array 3 is coupled to four output optical waveguides 150 on the silicon photonic chip 1;

[0031] The two lights emitted by the two optical emitting components 2 with the same wavelength are coupled into the two second optical input waveguides 140 respectively, and then the light in each second optical input waveguide 140 is divided into two lights by the 1×2 equal-ratio optical splitter 120 coupled to the second optical input waveguide 140, and enters the two MZ modulators 110 respectively, and then propagates to the two optical output waveguides 150 through the two MZ modulators 110. Finally, the two lights are coupled into the two optical fibers of the four-channel optical fiber array 3 from the two optical output waveguides 150. Since there are two 1×2 equal-ratio optical splitters 120, the light that finally enters the four-channel optical fiber array 3 is four-path.

[0032] Furthermore, the optical emission component 2 includes: a laser chip 210, a collimating lens 220, an optical isolator 230 and a converging lens 240 which are sequentially distributed along the light propagation direction. The light emitted by the laser chip 210 is sequentially coupled into a second optical waveguide 140 through the collimating lens 220, the optical isolator 230 and the converging lens 240. The laser chip 210 is fixed on a ceramic heat sink 250.

[0033] Example 3

[0034] like Figure 5 As shown, a 400G FR4 silicon photonic module comprises: four optical emitting components 2 of different wavelengths, an AWG device 4 and a silicon photonic chip 1 as in Example 1, wherein the four optical emitting components 2 are respectively coupled with four first input optical waveguides 130 on the silicon photonic chip 1, and the AWG device 4 is coupled with four output optical waveguides 150 on the silicon photonic chip 1;

[0035] The four lights emitted by the four optical emitting components 2 with different wavelengths are coupled into the four first optical input waveguides 130 respectively, and then the light in each first optical input waveguide 130 is propagated to an optical output waveguide 150 through the MZ modulator 110 coupled to the first optical input waveguide 130, and finally the four lights emitted from the four optical output waveguides 150 are coupled into the AWG device 4 respectively, and the AWG device 4 combines the four lights into one optical fiber output. In this solution, since a mature external AWG device 4 is used to realize the combining function, the integrated combiner in the silicon photonic chip 1 is cancelled to avoid the problem of low yield and poor product performance due to the thermal influence of the MZ modulator 110 on the built-in combiner.

[0036] Furthermore, the optical emission component 2 includes: a laser chip 210, a collimating lens 220, an optical isolator 230 and a converging lens 240 which are sequentially distributed along the light propagation direction. The light emitted by the laser chip 210 is sequentially coupled into a first light input waveguide 130 through the collimating lens 220, the optical isolator 230 and the converging lens 240. The laser chip 210 is fixed on a ceramic heat sink 250.

[0037] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A silicon photonic chip compatible with 400G DR4 and 400G FR4, characterized in that: include: Four MZ modulators (110) and two 1×2 equal-ratio optical splitters (120) are integrated inside the chip, and four first optical input waveguides (130), two second optical input waveguides (140) and four optical output waveguides (150) are integrated inside the chip and located on the same side. The four first optical input waveguides (130) are coupled to the four optical output waveguides (150) via the four MZ modulators (110), the two second optical input waveguides (140) are coupled to the input ends of the two 1×2 equal-ratio optical splitters (120), and the four output ends of the two 1×2 equal-ratio optical splitters (120) are coupled to the input ends of the four MZ modulators (110).

2. A silicon photonic module, characterized in that: include: Two light emitting components (2) with the same wavelength, a four-channel optical fiber array (3), and a silicon photonic chip (1) as claimed in claim 1, wherein the two light emitting components (2) are respectively coupled to two second light input waveguides (140) on the silicon photonic chip (1), and the four-channel optical fiber array (3) is coupled to four light output waveguides (150) on the silicon photonic chip (1).

3. A silicon photonic module according to claim 2, characterized in that: The light emitting component (2) comprises: a laser chip (210), a collimating lens (220), an optical isolator (230) and a converging lens (240) which are sequentially distributed along the light propagation direction; the laser chip (210) is fixed on a ceramic heat sink (250).

4. A silicon photonic module, characterized in that: include: Four optical emitting components (2) of different wavelengths, an AWG device (4), and a silicon photonic chip (1) as claimed in claim 1, wherein the four optical emitting components (2) are respectively coupled to four first input optical waveguides (130) on the silicon photonic chip (1), and the AWG device (4) is coupled to four output optical waveguides (150) on the silicon photonic chip (1).

5. A silicon photonic module according to claim 4, characterized in that: The light emitting component (2) comprises: a laser chip (210), a collimating lens (220), an optical isolator (230) and a converging lens (240) which are sequentially distributed along the light propagation direction; the laser chip (210) is fixed on a ceramic heat sink (250).

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