Capacitor
By adopting a mixed assembly method of series and parallel series and a curved design in the porcelain dielectric capacitor, the problem of insufficient mechanical stress resistance after assembly is solved, the capacitance and voltage withstand value of the capacitor are improved, and the risk of failure caused by heating is reduced.
Patent Information
- Application Number
- CN202420388044.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-29
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-02-28
AI Technical Summary
Existing porcelain dielectric capacitors have poor mechanical stress resistance after assembly, and the weld point falls off and porcelain cracks occur from time to time. Especially in the assembly of large-sized products with a size of 6560 and above, there is a risk of uneven temperature or excessive high temperature leading to failure of porcelain dielectric capacitors.
The porcelain dielectric capacitor is assembled in series and parallel mixed connection, soldered through soldering sheets, and soldered electrodes using soft leads to assemble in an aluminum alloy shell with a curved design, increasing the heat dissipation area and reducing the risk of temperature unevenness during installation and welding.
The capacitor capacity and voltage withstand value are improved, the assembly process is optimized, and the problem of insufficient mechanical stress resistance after assembly of large-size products is solved, the risk of welding points falling off and porcelain cracks is reduced, and the risk of failure caused by heating is reduced through improved shell design.
Smart Images

Figure CN222867452U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electronic components, and specifically relates to a capacitor. Background Art
[0002] Ceramic capacitors are widely used in various circuits due to their advantages such as non-polarity and superior high-frequency performance. With the continuous development of electronic equipment, there is an increasing demand for high-energy and high-power capacitors. Affected by ceramic powder and electrode slurry, the current withstand voltage and capacitance of ceramic capacitors are limited. Usually, multiple ceramic capacitors are assembled by metal brackets to increase the capacitance. However, this method can only increase the capacitance by connecting multiple products in parallel, and cannot increase the withstand voltage at the same time. In addition, the assembly process is complicated, and the mechanical stress resistance of the assembled product is poor. Welding points often fall off and ceramic cracks occur. For the assembly of large-size products such as 6560 and above, different assembly methods need to be adopted to improve the performance of capacitors.
[0003] The patent document with the publication number "CN208271746U" discloses a series-parallel ceramic capacitor group, including a first multilayer ceramic capacitor chip group, a second multilayer ceramic capacitor chip group, a first lead, a second lead and a third lead; the first multilayer ceramic capacitor chip group and the second multilayer ceramic capacitor chip group are soldered in series to the first lead by solder; the end of the first multilayer ceramic capacitor chip group away from the first lead is soldered to the second lead by solder, and the end of the second multilayer ceramic capacitor chip group away from the first lead is soldered to the third lead by solder; the first multilayer ceramic capacitor chip group includes A first multilayer ceramic capacitor chip and a second multilayer ceramic capacitor chip are welded in parallel by solder; the second multilayer ceramic capacitor chip group includes a third multilayer ceramic capacitor chip and a fourth multilayer ceramic capacitor chip which are welded in parallel by solder; the technical solution provided by the patent document increases the overall capacity of the capacitor and expands the application range of the capacitor by connecting multilayer ceramic capacitor chip groups in series and parallel to form a large-capacity capacitor. However, the multilayer ceramic capacitor chip groups are welded by leads, and there is a risk of uneven or excessively high temperature during the welding process, which may cause the welding points of the ceramic capacitor to fall off and the ceramic body to crack and fail. Utility Model Content
[0004] In order to solve the above technical problems, the utility model provides a capacitor.
[0005] The utility model is realized through the following technical solutions.
[0006] The utility model provides a capacitor, comprising a single ceramic capacitor A, a single ceramic capacitor B, a welding sheet A, a welding sheet B, a welding sheet C, a soft lead A, a soft lead B and a shell. After a plurality of single ceramic capacitors A are connected in parallel, they are connected to form a ceramic capacitor group through the welding sheet A. After the single ceramic capacitors B are connected in parallel, they are connected to form a ceramic capacitor group through the welding sheet C. The ceramic capacitor group is connected in series with the ceramic capacitor group. The soft lead A and the soft lead B are respectively connected to the welding sheet B and the welding sheet C to form a combined ceramic capacitor module. The combined ceramic capacitor module is assembled into the shell, and the electrodes are led out through the soft lead A and the soft lead B.
[0007] Preferably, the shell is a rectangular parallelepiped structure, the front and rear surfaces are arranged as arc surfaces, the lower bottom surface is arranged with a mounting hole, the upper bottom surface is arranged with a shell cover plate, and the inner surface is arranged with an insulating layer.
[0008] Preferably, the soft lead wire A and the soft lead wire B are respectively passed through the lead wire hole A and the lead wire hole B and then sealed.
[0009] Preferably, the single ceramic capacitor A and the single ceramic capacitor B are ceramic capacitors of size 6560 and above.
[0010] Preferably, the dielectric capacitor A and the single ceramic capacitor B are assembled in a series-parallel hybrid manner.
[0011] Preferably, the welding sheet A, welding sheet B and welding sheet C are tin-plated nickel sheets or tin-plated copper sheets.
[0012] Preferably, the insulating layer is a polyimide film.
[0013] The beneficial effects of the utility model are: adopting the technical solution of the utility model, through the mixed connection mode of multiple ceramic capacitors in series and parallel, the welding piece is assembled in the rectangular shell of the capacitor by soldering, and the electrode is led out by welding with soft lead wires, which not only improves the capacitance and withstand voltage value of the capacitor, but also optimizes the assembly process, and solves the problems of poor mechanical stress resistance, welding point detachment and ceramic cracks of large-size products of 6560 and above after assembly. At the same time, the capacitor shell adopts an arc design to increase the heat dissipation area and effectively reduce the risk of failure caused by heating of the capacitor; the capacitor aluminum alloy shell is designed with mounting holes, which is more convenient for installation and reduces the risk of ceramic capacitor cracking and failure caused by uneven or excessive temperature during the installation and welding process. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a cross-sectional view of the ceramic capacitor of the utility model;
[0015] Figure 2 It is an exploded view of the ceramic capacitor of the utility model;
[0016] Figure 3 This is a schematic diagram of the structure of the ceramic capacitor of the utility model;
[0017] In the figure: 1-single ceramic capacitor A; 2-single ceramic capacitor B; 3-welding piece A; 4-welding piece B; 5-welding piece C; 6-soft lead A; 7-soft lead B; 8-housing; 10-pin A; 11-pin B; 13-lead hole A; 14-lead hole B; 16-insulating layer; 17-cover; 18-ceramic capacitor group A; 19-ceramic capacitor group B. DETAILED DESCRIPTION
[0018] The present invention will be further described below with reference to the accompanying drawings and specific examples:
[0019] The technical solution of the utility model is further described below, but the scope of protection required is not limited to the description.
[0020] See also Figures 1 to 3 shown.
[0021] like Figure 1 As shown, a capacitor includes a single ceramic capacitor A1, a single ceramic capacitor B2, a welding sheet A3, a welding sheet B4, a welding sheet C5, a soft lead A6, a soft lead B7 and a shell 8. After several single ceramic capacitors A1 are connected in parallel, they are connected to form a ceramic capacitor group A18 through the welding sheet A3. After the single ceramic capacitors B2 are connected in parallel, they are connected to form a ceramic capacitor group B19 through the welding sheet C5. The ceramic capacitor group A18 is connected in series with the ceramic capacitor group B19. The welding between the single ceramic capacitors is performed by reflow soldering. After the assembly is performed in a series-parallel mixed manner, an insulating layer is placed inside the shell 8, and the assembled capacitor module is installed in the shell 8.
[0022] The shell 8 is a rectangular parallelepiped structure, with the front and back surfaces set as curved surfaces, the lower bottom surface set with a flat bottom surface of the pins with four mounting holes, the upper bottom surface set with a shell cover 17, and the inner surface set with an insulating layer 16. The curved shell is made of aluminum alloy, which increases the heat dissipation area and effectively reduces the risk of failure caused by heating of the capacitor; the inside of the shell 8 uses a high-temperature resistant polyimide film applied to the inner surface as an insulating layer; the capacitor aluminum alloy shell 8 is designed with mounting holes, which is more convenient for installation and reduces the risk of cracking and failure of the ceramic body of the ceramic capacitor due to uneven or excessive temperature during the installation and welding process.
[0023] The soft lead wire A6 and the soft lead wire B7 are welded on the welding sheet by manual welding to form a combined ceramic capacitor module, which is assembled into the housing 8, and the electrodes are led out through the soft lead wire A6 and the soft lead wire B7. This not only improves the capacitance and withstand voltage of the capacitor, but also optimizes the assembly process, and solves the problems of poor mechanical stress resistance, welding point shedding, and ceramic body cracks after assembly of large-size products of 6560 and above.
[0024] The soft lead wires A6 and B7 are respectively passed through the lead wire hole A13 and the lead wire hole B14 and then sealed by epoxy resin potting. After drying, the cover plate 17 is covered.
[0025] The single ceramic capacitor A1 and the single ceramic capacitor B2 are large-size ceramic capacitors of model 6560 and above.
[0026] The dielectric capacitor A1 and the single ceramic capacitor B2 are assembled in a series-parallel hybrid manner.
[0027] The soft lead wire A6 and the soft lead wire B7 are copper core high temperature and high pressure resistant silicone wires.
[0028] The welding sheet A3, welding sheet B4 and welding sheet C5 are tin-plated nickel sheets or tin-plated copper sheets.
[0029] The insulating layer 16 is a high temperature resistant polyimide film.
Claims
1. A capacitor, characterized in that: The invention comprises a single ceramic capacitor A (1), a single ceramic capacitor B (2), a welding sheet A (3), a welding sheet B (4), a welding sheet C (5), a soft lead A (6), a soft lead B (7) and a housing (8). A plurality of single ceramic capacitors A (1) are connected in parallel and connected to form a ceramic capacitor group A (18) through the welding sheet A (3). The single ceramic capacitors B (2) are connected in parallel and connected to form a ceramic capacitor group B (19) through the welding sheet C (5). The ceramic capacitor group A (18) and the ceramic capacitor group B (19) are connected in series. The soft lead A (6) and the soft lead B (7) are respectively connected to the welding sheet B (4) and the welding sheet C (5) to form a combined ceramic capacitor module. The combined ceramic capacitor module is assembled into the housing (8), and electrodes are led out through the soft lead A (6) and the soft lead B (7).
2. A capacitor according to claim 1, characterized in that: The shell (8) is a rectangular parallelepiped structure, with front and rear surfaces arranged as arc surfaces, a mounting hole arranged on the lower bottom surface, a shell cover plate (17) arranged on the upper bottom surface, and an insulating layer (16) arranged on the inner surface.
3. A capacitor according to claim 1, characterized in that: The soft lead wire A (6) and the soft lead wire B (7) are respectively passed through the lead wire hole A (13) and the lead wire hole B (14) and then sealed.
4. A capacitor according to claim 1, characterized in that: The single ceramic capacitor A (1) and the single ceramic capacitor B (2) are ceramic capacitors of size 6560 and above.
5. A capacitor according to claim 1, characterized in that: The dielectric capacitor A (1) and the single ceramic capacitor B (2) are assembled in a series-parallel hybrid manner.
6. A capacitor according to claim 1, characterized in that: The welding sheet A (3), welding sheet B (4) and welding sheet C (5) are tin-plated nickel sheets or tin-plated copper sheets.
7. A capacitor according to claim 2, characterized in that: The insulating layer (16) is a polyimide film.
Citation Information
Patent Citations
Connection in series -parallel ceramic dielectric capacitor group
CN208271746U
Cited By
High-voltage multi-core ceramic capacitor and preparation method thereof
CN120878463A