Frequency converter shell and frequency converter

Abstract

The utility model discloses a frequency converter housing and a frequency converter, comprising a pedestal and a cover cap, the inner cavity of the pedestal is provided with a heat radiation channel, the cover cap is internally provided with a mainboard accommodating cavity, the heat radiation channel is internally connected with a heat radiator, the heat radiation side of the pedestal is connected with a heat radiation window cover, the heat radiation window cover is respectively connected with the cover cap and the pedestal, and the heat radiation window cover is connected with the mainboard accommodating cavity. A plurality of window cover positioning pieces are arranged on the side, close to the heat dissipation channel, of the heat dissipation window cover, a radiator fan is connected between the window cover positioning pieces, and a wire passing notch is formed in the base; a main board heat dissipation window is formed in the heat dissipation side of the cover cap, a detachable heat dissipation buckle plate is connected to the main board heat dissipation window, a plurality of buckle plate positioning pieces are arranged on the side, close to the main board containing cavity, of the heat dissipation buckle plate, and a main board fan is connected between the buckle plate positioning pieces. According to the utility model, a double-fan cooperative heat dissipation system is adopted, the problem of high current-carrying heating of a miniaturized frequency converter is effectively solved, meanwhile, rapid positioning and installation of the radiator fan and the mainboard fan can be realized, and the later maintenance and replacement process is remarkably simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of frequency converters, in particular to a frequency converter housing and a frequency converter. Background Art

[0002] The frequency converter is an electric power control device that uses frequency conversion technology and microelectronics technology to control the motor by changing the frequency of the motor's working power supply.

[0003] During the operation of the inverter, due to the high-frequency on and off of power semiconductor devices (such as IGBT, MOSFET), power loss will be generated. This part of the loss is dissipated in the form of heat. The greater the load current of the motor driven by the inverter, the greater the current in the power devices and related circuits inside the inverter, which leads to more heat generation. Therefore, in order to effectively dissipate the heat generated by the inverter, air cooling is one of the most common heat dissipation methods and is widely used in small and medium power inverters. Air cooling is to install a fan inside or outside the inverter to force air flow and accelerate the heat dissipation.

[0004] At present, the cooling fan on the inverter is installed on the inverter housing by fasteners. This installation method not only requires the inverter housing to be designed with a fan positioning and installation structure, which increases the inverter assembly process, but also is inconvenient for the later maintenance and inspection of the cooling fan. Moreover, as the inverter develops towards miniaturization and high current carrying, a single cooling fan is difficult to meet the heat dissipation needs of the inverter. How to improve the heat dissipation capacity of the inverter during operation is an important direction for the current research and development of miniaturized inverters. Summary of the invention

[0005] In order to solve the above problems, the utility model provides a frequency converter housing and a frequency converter.

[0006] In a first aspect of the utility model, an inverter housing is provided, comprising a base and a cover connected to the base, the inner cavity of the base is provided with a heat dissipation channel, the cover is provided with a mainboard accommodating cavity inside, the heat dissipation channel is communicated with the mainboard accommodating cavity, a radiator is connected in the heat dissipation channel, a heat dissipation window cover is connected to the heat dissipation side of the base, the heat dissipation window cover covers the heat dissipation channel in its entirety, the heat dissipation window cover is respectively connected to the cover and the base, a plurality of window cover positioning members are provided on the side of the heat dissipation window cover close to the heat dissipation channel, a radiator fan is connected between the window cover positioning members, and a wire passing slot is provided on the base; a mainboard heat dissipation window is provided on the heat dissipation side of the cover, a detachable heat dissipation buckle plate is connected to the mainboard heat dissipation window, a plurality of buckle plate positioning members are provided on the side of the heat dissipation buckle plate close to the mainboard accommodating cavity, a mainboard fan is connected between the buckle plate positioning members.

[0007] According to a preferred embodiment of the present application, the window cover positioning parts are respectively arranged on both sides and the upper end surface of the radiator fan, the window cover positioning parts include a window cover positioning arm, the window cover positioning arm is provided with a window cover positioning barb at one end close to the heat dissipation channel, and the window cover positioning arm is provided with a window cover limiting portion at one end away from the heat dissipation channel, the radiator fan is limited between the window cover positioning barb and the window cover limiting portion, and the window cover positioning barb includes a window cover guide slope and a window cover positioning end face.

[0008] According to a preferred embodiment of the present application, window cover positioning holes are respectively provided on both sides of the heat dissipation window cover, and the heat dissipation window cover is connected to the base by fasteners that pass through the base and the window cover positioning holes in sequence, and a window cover buckle is provided on the top of the heat dissipation window cover, and the window cover buckle includes a window cover elastic part, and a window cover positioning part and a window cover unlocking part are provided on the side of the window cover elastic part close to the cover cover, a window cover positioning groove is provided between the window cover positioning part and the window cover unlocking part, and the bottom of the cover cover is connected to the window cover positioning groove.

[0009] According to a preferred solution of the present application, a limiting protrusion is provided at the bottom of the base, and the limiting protrusion is directly opposite to the heat dissipation window cover.

[0010] According to a preferred solution of the present application, a heat dissipation gap is provided between the radiator fan and the radiator.

[0011] According to a preferred solution of the present application, the gusset plate positioning piece is respectively located on both sides of the mainboard fan, the gusset plate positioning piece includes a gusset plate positioning arm, and the gusset plate positioning arm is provided with a gusset plate positioning barb at one end close to the mainboard accommodating cavity, and the mainboard fan is limited between the gusset plate positioning barb and the heat dissipation gusset plate, and a limiting plate is connected to the heat dissipation gusset plate, and the limiting plate is located on the upper and lower end surfaces of the mainboard fan.

[0012] According to a preferred solution of the present application, buckle plate buckles are provided on both sides of the heat dissipation buckle plate, and the buckle plate buckles include a buckle plate elastic part, and a buckle plate positioning part and a buckle plate unlocking part are provided on the side of the buckle plate elastic part close to the frame of the mainboard heat dissipation window, and a buckle plate positioning groove is provided between the buckle plate positioning part and the buckle plate unlocking part, and the frame of the mainboard heat dissipation window is connected to the buckle plate positioning groove.

[0013] According to a preferred embodiment of the present application, the heat dissipation window cover and the heat dissipation buckle plate are arranged on the same side.

[0014] According to a preferred solution of the present application, heat dissipation holes are provided on the heat dissipation window cover and the heat dissipation buckle plate.

[0015] In a second aspect of the present invention, a frequency converter is provided, which adopts the above-mentioned frequency converter housing.

[0016] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:

[0017] In this technical solution, the inverter housing is provided with a heat dissipation channel and a mainboard accommodating cavity. A radiator is connected to the heat dissipation channel to conduct the heat generated by the mainboard in the mainboard accommodating cavity. A radiator fan and a mainboard fan are respectively arranged on the heat dissipation sides of the heat dissipation channel and the mainboard accommodating cavity. Directional forced air cooling is performed on the heat dissipation channel and the mainboard accommodating cavity respectively, forming a dual-path dual-fan collaborative heat dissipation system, which effectively addresses the high-current heating problem of miniaturized inverters.

[0018] In this technical solution, the heat dissipation window cover and heat dissipation buckle plate in the inverter housing respectively use window cover positioning parts and buckle plate positioning parts to replace traditional fasteners, thereby realizing rapid positioning and installation of the radiator fan and the mainboard fan, eliminating the complex housing structure design, and reducing the complexity of the assembly process. When maintaining the fan, there is no need to disassemble the entire housing, only the heat dissipation window cover or the heat dissipation buckle plate needs to be removed separately, which significantly simplifies the subsequent maintenance and replacement process. At the same time, a wire passing slot is opened on the base to optimize the cable layout of the fan, avoid cables blocking the air duct, and reduce the cable sorting steps during assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a three-dimensional diagram of the inverter housing according to an embodiment of the utility model.

[0020] Figure 2 This is an exploded view of the base, heat dissipation window cover and radiator fan of an embodiment of the utility model.

[0021] Figure 3 This is an exploded view of the cover, heat dissipation plate and mainboard fan of the embodiment of the utility model.

[0022] Figure 4 This is a three-dimensional diagram of a heat dissipation window cover according to an embodiment of the utility model.

[0023] Figure 5 This is a three-dimensional diagram of the heat dissipation buckle plate according to an embodiment of the utility model.

[0024] Figure 6 It is a side view of the inverter housing of an embodiment of the utility model.

[0025] Figure 7 for Figure 6 Partial cross-sectional view along AA.

[0026] Figure 8 for Figure 6 Partial cross-sectional view along BB. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Example 1

[0029] Combined with Figure 1 To Attachment Figure 8 The technical scheme of the utility model is an inverter housing, comprising a base 1 and a cover 2 connected to the base 1, the inner cavity of the base 1 is provided with a heat dissipation channel 11, the cover 2 is provided with a mainboard accommodating cavity 21, the heat dissipation channel 11 is communicated with the mainboard accommodating cavity 21, the heat dissipation channel 11 is connected with a radiator 3, the heat dissipation side of the base 1 is connected with a heat dissipation window cover 4, the heat dissipation window cover 4 covers the heat dissipation channel 11 in full cross section, the heat dissipation window cover 4 is respectively connected to the cover 2 and the base 1, a side of the heat dissipation window cover 4 close to the heat dissipation channel 11 is provided with a plurality of window cover positioning members 41, a radiator fan 5 is connected between the window cover positioning members 41, and a wire passing slot 12 is provided on the base 1; a mainboard heat dissipation window 22 is provided on the heat dissipation side of the cover 2, a detachable heat dissipation buckle plate 6 is connected to the mainboard heat dissipation window 22, a side of the heat dissipation buckle plate 6 close to the mainboard accommodating cavity 21 is provided with a plurality of buckle plate positioning members 61, and a mainboard fan 7 is connected between the buckle plate positioning members 61.

[0030] In this embodiment, the inverter housing is provided with a heat dissipation channel 11 and a mainboard accommodating cavity 21. A radiator 3 is connected to the heat dissipation channel 11 for conducting the heat generated by the mainboard in the mainboard accommodating cavity 21. A radiator fan 5 and a mainboard fan 7 are respectively provided on the heat dissipation sides of the heat dissipation channel 11 and the mainboard accommodating cavity 21. Directional forced air cooling is performed on the heat dissipation channel 11 and the mainboard accommodating cavity 21 respectively, forming a dual-path dual-fan collaborative heat dissipation system, which effectively addresses the high-current heating problem of miniaturized inverters.

[0031] In this embodiment, the radiator 3 is connected to the heat dissipation channel 11. In order to improve the heat dissipation efficiency of the radiator 3, the heat dissipation window cover 4 covers the heat dissipation channel 11 with a full cross-section, so that the radiator fan 5 can provide sufficient air circulation to the heat dissipation channel 11.

[0032] In this embodiment, the heat dissipation window cover 4 and the heat dissipation buckle plate 6 in the inverter housing respectively adopt window cover positioning members 41 and buckle plate positioning members 61 to replace traditional fasteners, so as to realize the rapid positioning and installation of the radiator fan 5 and the mainboard fan 7, eliminate the complex housing structure design (such as threaded holes, brackets, etc.), reduce the complexity of the assembly process, and there is no need to disassemble the entire housing when maintaining the fan. It is only necessary to remove the heat dissipation window cover 4 or the heat dissipation buckle plate 6 separately, which significantly simplifies the subsequent maintenance and replacement process. At the same time, a wire passing slot 12 is opened on the base 1 to optimize the cable layout of the fan, avoid cables blocking the air duct, and reduce the cable sorting steps during assembly.

[0033] In this embodiment, as shown in the attached Figure 2 and attached Figure 4 As shown, the window cover positioning member 41 is respectively arranged on both sides and the upper end surface of the radiator fan 5, and the window cover positioning member 41 includes a window cover positioning arm 411. The end of the window cover positioning arm 411 close to the heat dissipation channel 11 is provided with a window cover positioning hook 412, and the end of the window cover positioning arm 411 away from the heat dissipation channel 11 is provided with a window cover limiting portion 413. The radiator fan 5 is limited between the window cover positioning hook 412 and the window cover limiting portion 413, and the window cover positioning hook 412 includes a window cover guide inclined surface 414 and a window cover positioning end surface 415.

[0034] In the above embodiment, the window cover limiting portion 413 is provided to limit the radiator fan 5 on the heat dissipation window cover 4 and to keep a certain distance between the radiator fan 5 and the heat dissipation port of the heat dissipation window cover 4 .

[0035] In this embodiment, as shown in the attached Figure 2 , Attachment Figure 4 and attached Figure 8 As shown, window cover positioning holes 42 are respectively opened on both sides of the heat dissipation window cover 4, and the heat dissipation window cover 4 is connected to the base 1 through the fasteners 13 that pass through the base 1 and the window cover positioning holes 42 in sequence, and a window cover buckle 43 is provided on the top of the heat dissipation window cover 4, and the window cover buckle 43 includes a window cover elastic part 431, and a window cover positioning part 432 and a window cover unlocking part 433 are provided on the side of the window cover elastic part 431 close to the cover 2, and a window cover positioning groove 434 is provided between the window cover positioning part 432 and the window cover unlocking part 433, and the bottom of the cover 2 is connected to the window cover positioning groove 434. The lower end of the heat dissipation window cover 4 is fixed to the base 1 by a fastener, and the upper end of the heat dissipation window cover 4 is connected to the bottom of the cover 2 by the window cover buckle 43. When the radiator fan 5 needs to be inspected, it is only necessary to unscrew the fastener 13 and press the window cover unlocking part 433 to remove the heat dissipation window cover 4 together with the radiator fan 5.

[0036] In this embodiment, a limiting protrusion 14 is provided at the bottom of the base 1, and the limiting protrusion 14 is opposite to the heat dissipation window cover 4. The limiting protrusion 14 is used to position the heat dissipation window cover 4 in the depth of the base 1 to improve assembly efficiency.

[0037] In this embodiment, a heat dissipation interval is provided between the radiator fan 5 and the radiator 3 to prevent the high temperature of the radiator 3 from directly contacting the radiator fan 5 .

[0038] In this embodiment, as shown in the attached Figure 3 and attached Figure 5 As shown, the gusset plate positioning member 61 is located on both sides of the mainboard fan 7, and the gusset plate positioning member 61 includes a gusset plate positioning arm 611. The gusset plate positioning arm 611 is provided with a gusset plate positioning barb 612 at one end close to the mainboard accommodating cavity 21. The mainboard fan 7 is limited between the gusset plate positioning barb 612 and the heat dissipation gusset plate 6. The gusset plate positioning barb 612 includes a gusset plate guiding inclined surface 613 and a gusset plate positioning end surface 614. The heat dissipation gusset plate 6 is connected with a limiting plate 62, and the limiting plate 62 is located on the upper and lower end surfaces of the mainboard fan 7. The limiting plate 62 limits the shaking of the mainboard fan 7 in the vertical direction, and the gusset plate positioning member 61 limits the shaking of the mainboard fan 7 in the horizontal direction. In another embodiment, the limiting plate 62 can also be replaced by the gusset plate positioning member 61.

[0039] In this embodiment, as shown in the attached Figure 3 , Attachment Figure 5 and attached Figure 7 As shown, the heat dissipation gusset 6 is provided with gusset buckles 63 on both sides, and the gusset buckles 63 include gusset elastic parts 631, and the gusset elastic parts 631 are provided with gusset positioning parts 632 and gusset unlocking parts 633 on one side close to the frame of the mainboard heat dissipation window 22, and a gusset positioning groove 634 is provided between the gusset positioning part 632 and the gusset unlocking part 633, and the frame of the mainboard heat dissipation window 22 is connected to the gusset positioning groove 634. When the mainboard fan 7 needs to be repaired, it is only necessary to press the gusset unlocking parts 633 on both sides of the heat dissipation gusset 6, and the heat dissipation gusset 6 together with the mainboard fan 7 can be removed together.

[0040] In this embodiment, the heat dissipation window cover 4 and the heat dissipation buckle plate 6 are arranged on the same side.

[0041] In this embodiment, the heat dissipation window cover 4 is provided with a window cover heat dissipation hole 44 , and the heat dissipation buckle plate is provided with a buckle plate heat dissipation hole 64 .

[0042] Example 2

[0043] Combined with Figure 1 To Attachment Figure 8The technical solution of the utility model is a frequency converter, which adopts the frequency converter housing described in Example 1.

[0044] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0045] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0046] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An inverter housing, comprising a base and a cover connected to the base, wherein the inner cavity of the base is provided with a heat dissipation channel, the inner part of the cover is provided with a mainboard accommodating cavity, the heat dissipation channel is communicated with the mainboard accommodating cavity, and a radiator is connected in the heat dissipation channel, characterized in that: A heat dissipation window cover is connected to the heat dissipation side of the base, and the heat dissipation window cover covers the heat dissipation channel in full cross-section, and the heat dissipation window cover is respectively connected to the cover and the base, and a plurality of window cover positioning parts are provided on the side of the heat dissipation window cover close to the heat dissipation channel, and a radiator fan is connected between the window cover positioning parts, and a wire passing slot is provided on the base; a mainboard heat dissipation window is provided on the heat dissipation side of the cover, and a detachable heat dissipation buckle plate is connected to the mainboard heat dissipation window, and a plurality of buckle plate positioning parts are provided on the side of the heat dissipation buckle plate close to the mainboard accommodating cavity, and a mainboard fan is connected between the buckle plate positioning parts.

2. The inverter housing according to claim 1, characterized in that: The window cover positioning parts are respectively arranged on both sides and the upper end surface of the radiator fan, and the window cover positioning parts include a window cover positioning arm. The end of the window cover positioning arm close to the heat dissipation channel is provided with a window cover positioning hook, and the end of the window cover positioning arm away from the heat dissipation channel is provided with a window cover limiting part. The radiator fan is limited between the window cover positioning hook and the window cover limiting part, and the window cover positioning hook includes a window cover guide inclined surface and a window cover positioning end surface.

3. The inverter housing according to claim 2, characterized in that: Window cover positioning holes are respectively provided on both sides of the heat dissipation window cover, and the heat dissipation window cover is connected to the base by fasteners that pass through the base and the window cover positioning holes in sequence. A window cover buckle is provided on the top of the heat dissipation window cover, and the window cover buckle includes a window cover elastic part, and a window cover positioning part and a window cover unlocking part are provided on the side of the window cover elastic part close to the cover cover, a window cover positioning groove is provided between the window cover positioning part and the window cover unlocking part, and the bottom of the cover cover is connected to the window cover positioning groove.

4. The inverter housing according to claim 2, characterized in that: A limiting protrusion is provided at the bottom of the base, and the limiting protrusion faces the heat dissipation window cover.

5. The inverter housing according to claim 2, characterized in that: A heat dissipation interval is provided between the radiator fan and the radiator.

6. The inverter housing according to claim 1, characterized in that: The gusset plate positioning piece is respectively located on both sides of the motherboard fan, and the gusset plate positioning piece includes a gusset plate positioning arm. The gusset plate positioning arm is provided with a gusset plate positioning hook at one end close to the motherboard accommodating cavity. The motherboard fan is limited between the gusset plate positioning hook and the heat dissipation gusset plate. The gusset plate positioning hook includes a gusset plate guide slope and a gusset plate positioning end face. A limiting plate is connected to the heat dissipation gusset plate, and the limiting plate is located on the upper and lower end faces of the motherboard fan.

7. The inverter housing according to claim 6, characterized in that: Buckle plate buckles are provided on both sides of the heat dissipation buckle plate, and the buckle plate buckles include a buckle plate elastic part. A buckle plate positioning part and a buckle plate unlocking part are provided on the side of the buckle plate elastic part close to the frame of the mainboard heat dissipation window. A buckle plate positioning groove is provided between the buckle plate positioning part and the buckle plate unlocking part, and the frame of the mainboard heat dissipation window is connected to the buckle plate positioning groove.

8. A frequency converter housing according to any one of claims 1 to 7, characterized in that: The heat dissipation window cover and the heat dissipation buckle plate are arranged on the same side.

9. A frequency converter housing according to any one of claims 1 to 7, characterized in that: The heat dissipation window cover and the heat dissipation buckle plate are both provided with heat dissipation holes.

10. A frequency converter, characterized in that: The inverter housing according to any one of claims 1 to 9 is adopted.

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