Intelligent heat dissipation switch for data center

Abstract

The utility model discloses an intelligent heat dissipation switch for a data center, which relates to the technical field of switches, and comprises a shell, a shell cover is fixed at an opening on the upper side of the shell through screws, a plurality of fans are fixedly embedded on the front side end face of the shell, and a dust filtering plate is fixedly embedded on the rear side end face of the shell. A cold guide plate is fixed to the lower side of the end, close to the fan, of the shell through screws, a plurality of air cooling plates are fixed to the upper side of the cold guide plate, the air cooling plates all extend into the shell, a plurality of hoops are fixed to the lower side of the cold guide plate, water cooling pipes are connected between the hoops, and a dustproof net and a dust filtering plate can prevent external dust from falling into the shell; the multiple fans are arranged on one side of the shell side by side, when the fans operate, airflow can evenly penetrate through the interior of the shell, a CPU, an internal storage and other chips in the switch can be comprehensively cooled, heat dissipation dead angles are reduced, and the switch can be fully cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of switches, in particular to an intelligent heat dissipation switch for a data center. Background Art

[0002] A switch is a network device that connects different devices and forwards data packets between them. When the switch is working, electronic components such as CPU, memory and other chips will generate heat, which is normal. However, working under high load for a long time will cause the switch to generate more heat. If the heat dissipation design of the switch is not enough to cope with the heat it generates, it may cause the device to overheat. Overheating may cause the performance of the switch's hardware components to decline, which in turn affects the stability and speed of the network connection, and even causes damage to key components such as the CPU. In general, heat dissipation holes are opened on the switch, which can significantly improve the heat dissipation efficiency and prevent internal components from being damaged due to overheating, thereby extending the service life of the device and improving performance stability. These holes promote effective air circulation, but the heat dissipation holes may make it easier for dust to enter the switch. Regular cleaning is required to avoid dust clogging and component damage, and the heat dissipation effect depends on the ventilation conditions of the environment.

[0003] Chinese patent announcement number CN218006825U discloses a heat dissipation switch, which is provided with fans on the inner walls on both sides of the cavity, and air inlets and air outlets are respectively opened on both sides of the body, the air inlet is connected to the air inlet on one of the fans, and the air outlet is connected to the air outlet on the other fan, the fan close to the air inlet draws cold air from the outside of the body, and the fan close to the air outlet extracts the hot air in the cavity and blows it to the outside of the body, forming air flow, effectively playing a heat dissipation effect, and avoiding damage to electrical components in the cavity due to overheating, the air inlet and the air outlet can be detachably connected with a heat dissipation plate, and the air inlet can also be detachably connected with a filter plate, which effectively plays a role in resisting dust, ensuring the use effect of the switch, thereby ensuring the service life of the switch, the above technology uses the fan to inhale cold air from the outside of the body to cool the switch, but if the external environment temperature is high or the air quality is poor, it will cause a decrease in the heat dissipation effect, and cannot provide a continuous and effective cooling effect. For this reason, the utility model discloses an intelligent heat dissipation switch for a data center to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide an intelligent heat dissipation switch for a data center to solve the problem that the traditional switch proposed in the above background technology uses a fan to draw cold air from the outside of the body to cool the switch, but if the external ambient temperature is high or the air quality is poor, the heat dissipation effect will be reduced and a continuous and effective cooling effect cannot be provided.

[0005] To achieve the above purpose, the utility model solves the above technical problems as follows:

[0006] An intelligent heat dissipation switch for a data center comprises a shell, a shell cover is screwed to the upper open portion of the shell, a plurality of fans are fixedly embedded on the front end surface of the shell, a dust filter plate is fixedly embedded on the rear end surface of the shell, a cooling plate is screwed to the lower side of one end of the shell close to the fan, a plurality of air-cooling plates are fixed to the upper side of the cooling plate, the air-cooling plates all extend into the shell, a plurality of clamps are fixed to the lower side of the cooling plate, and water-cooling pipes are connected between the plurality of clamps.

[0007] As a further solution of the utility model, the air cooling plate, the clamp and the cooling plate are all made of copper material, and the air cooling plate and the clamp are welded and fixed to the cooling plate to form an integrated structure.

[0008] As a further solution of the utility model, the air-cooling plates are parallel to each other, and the gap between adjacent air-cooling plates is no more than 0.5 cm.

[0009] As a further solution of the utility model, the water cooling pipe has a serpentine structure, and threaded interfaces are provided at both ends of the water cooling pipe.

[0010] As a further solution of the utility model, a rectangular opening is provided in the middle of the dust filter plate, and a plurality of baffles are fixedly connected between inner walls on both sides of the rectangular opening.

[0011] As a further solution of the utility model, a dustproof net is fixedly embedded in the flow passage of the fan on a side away from the shell.

[0012] As a further solution of the utility model, a matching slot is provided on the lower side of the shell corresponding to the air cooling plate, and legs are fixedly connected to the four corners of the lower side of the shell, and positioning holes are provided on the legs.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The data center uses an intelligent heat dissipation switch. The dust screen and dust filter plate can prevent external dust from falling into the shell, effectively ensuring the safe operation of the switch. Multiple fans are arranged in parallel on one side of the shell. When the fans are running, the airflow can evenly pass through the inside of the shell, which can fully cool down the CPU, memory and other chips in the switch, reduce the heat dissipation dead angle, and help to fully cool down the switch;

[0015] 2. The data center uses intelligent heat dissipation switches. Both ends of the water cooling pipe are connected to the cold water pipeline. The cold water flows through the water cooling pipe, which can absorb the heat of the clamp, the cold plate and the air cooling plate, and reduce the temperature of the air cooling plate. At the same time, the fan introduces the outside air into the shell. The airflow flows through the narrow area between the air cooling plates. The airflow itself can be quickly absorbed by the air cooling plate, which can effectively adjust the airflow temperature. The lower the airflow temperature, the better the heat dissipation effect, which can effectively reduce the operating temperature of the switch;

[0016] 3. The data center uses an intelligent heat dissipation switch, the cold plate is screwed to the lower side of the shell and welded to the upper side of the cold plate, and the air cooling plate extends into the shell through the slot, which simplifies the assembly steps of the cold plate and the air cooling plate. In addition, multiple clamps are welded on the lower side of the cold plate, which can facilitate the embedding of the water cooling pipe into the clamp, simplifying the assembly steps of the water cooling pipe, with a simple structure and quick assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0018] Figure 1 The utility model is a three-dimensional structure of an intelligent heat dissipation switch for a data center Figure 1 ;

[0019] Figure 2 The utility model is a three-dimensional structure of an intelligent heat dissipation switch for a data center Figure 2 ;

[0020] Figure 3 This is a top view of a shell of an intelligent heat dissipation switch for a data center according to the utility model;

[0021] Figure 4 This is a structural diagram of a water cooling pipe in an intelligent heat dissipation switch for a data center according to the utility model;

[0022] Figure 5 This is a structural diagram of a cold conduction plate in an intelligent heat dissipation switch for a data center according to the utility model;

[0023] Figure 6 This is a structural diagram of a clamp in an intelligent heat dissipation switch for a data center according to the utility model.

[0024] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0025] 1. Shell; 11. Slot; 12. Support foot; 13. Positioning hole; 2. Shell cover; 3. Fan; 31. Dust screen; 4. Dust filter plate; 41. Rectangular opening; 42. Baffle; 5. Cooling plate; 51. Air cooling plate; 52. Clamp; 6. Water cooling pipe; 61. Threaded interface. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the embodiments.

[0027] See also Figure 1-6 The utility model provides an intelligent heat dissipation switch for a data center, comprising a housing 1, wherein a housing cover 2 is fixed by screws at an upper opening of the housing 1;

[0028] Specifically, the shell cover 2 can close the upper part of the shell 1 to prevent dust, water droplets and other foreign objects from entering the interior of the switch, and protect the internal components from pollution and damage. By fixing with screws, the shell cover 2 can be easily removed and installed, which is convenient for maintenance and upgrading of the interior of the switch.

[0029] Furthermore, the four corners of the lower side of the housing 1 are fixedly connected with supporting legs 12, and the supporting legs 12 are provided with positioning holes 13;

[0030] Specifically, the positioning holes 13 can be used to install additional fixings or fasteners to ensure the accurate position of the switch on the rack or work surface, which is convenient for installation and maintenance. The support feet 12 provide a stable support point for the switch to ensure that the device is placed stably on the work surface or rack to reduce vibration and movement.

[0031] Furthermore, a plurality of fans 3 are fixedly embedded on the front end surface of the housing 1, and a dustproof net 31 is fixedly embedded in the flow passage of the fan 3 away from the housing 1;

[0032] Specifically, the fan 3 generates airflow by rotating, which helps to introduce cold air into the interior of the switch and exhaust hot air, forming effective air flow, helping to dissipate the heat generated by the internal components of the switch and maintaining the equipment running at an appropriate temperature. Multiple fans 3 can provide a larger air volume and more uniform heat dissipation. The main function of the dust net 31 is to filter the air sucked into the fan 3 to prevent particles such as dust and impurities from entering the fan 3 and the interior of the switch to avoid contamination and damage to internal components. By blocking larger particles, the dust net 31 can reduce the wear of the fan 3 blades and extend the service life of the fan 3. At the same time, dust accumulation may lead to poor heat dissipation and may even cause circuit short circuits or other failures. The dust net 31 helps to reduce these risks.

[0033] Furthermore, a dust filter plate 4 is fixedly embedded on the rear end surface of the housing 1, a rectangular opening 41 is provided in the middle of the dust filter plate 4, and a plurality of blocking bars 42 are fixedly connected between the inner walls on both sides of the rectangular opening 41;

[0034] Specifically, the baffle 42 helps to evenly distribute the air exhausted through the rectangular opening 41, thereby improving the heat dissipation efficiency and preventing some larger foreign objects from entering the switch through the rectangular opening 41. Together with the dustproof net 31, double protection can be formed. It is worth noting that the spacing between adjacent baffles 42 cannot be too large to prevent large particles of dust and other impurities from passing through the dust filter plate 4 and entering the switch.

[0035] Furthermore, a cooling plate 5 is screwed to the lower side of one end of the housing 1 close to the fan 3, and the cooling plate 51, the clamp 52 and the cooling plate 5 are all made of copper material, and the cooling plate 51 and the clamp 52 are welded and fixed to the cooling plate 5 as an integrated structure;

[0036] Specifically, the air-cooling plate 51 has a larger area, providing more surface area for contact with the air, thereby improving the heat dissipation efficiency. The cold plate 5 helps to improve the heat dissipation efficiency. It can quickly transfer the heat of the air blown by the fan 3 to the water cooling system, and the fixed position of the cold plate 5 is close to the fan 3, so that the air-cooling plate 51 is located between the electronic components and the fan 3. The airflow generated by the fan 3 can pass through the air-cooling plate 51 and be heat exchanged, which can effectively reduce the temperature of the airflow. The cold air has a higher heat exchange capacity and can more effectively absorb the heat generated by the electronic components. Copper is a high thermal conductivity material. Using copper to make the air-cooling plate 51, the clamp 52 and the cold plate 5 can quickly transfer heat from the heat source (such as CPU, memory, etc.) to the heat dissipation structure. Welding and fixing them into an integrated structure can improve the structural stability and durability of the components, reduce structural looseness caused by vibration or thermal expansion during equipment operation, and welding and fixing can reduce contact thermal resistance to ensure that heat is transferred more efficiently between components.

[0037] Furthermore, a plurality of air cooling plates 51 are fixed on the upper side of the cooling plate 5, the air cooling plates 51 are parallel to each other, and the gap between adjacent air cooling plates 51 is not greater than 0.5 cm;

[0038] Specifically, by keeping the air-cooling plates 51 parallel to each other and controlling the gap, the airflow through the air-cooling plates 51 can be optimized, ensuring uniform air flow and improving heat exchange efficiency. The smaller gap between the air-cooling plates 51 helps heat conduction because heat can be quickly transferred through the air between adjacent air-cooling plates 51.

[0039] Furthermore, a plurality of clamps 52 are fixed to the lower side of the cooling plate 5, the water cooling pipe 6 is in a serpentine structure, and threaded interfaces 61 are provided at both ends of the water cooling pipe 6;

[0040] Specifically, the main function of the clamp 52 is to fix the water-cooling pipe 6 in an appropriate position to ensure good contact between the water-cooling pipe 6 and the cooling plate 5 and the air-cooling plate 51, thereby improving the heat conduction efficiency. The fixing effect of the clamp 52 enhances the structural stability of the entire water cooling system and prevents the water-cooling pipe 6 from shifting or falling off due to vibration during equipment operation. The clamp 52 may be made of a material with good thermal conductivity (such as copper), which helps to improve the conduction of heat from the air-cooling plate 51 to the water-cooling pipe 6. The water-cooling pipe 6 allows the coolant to have more time to absorb heat when flowing in the pipe, thereby improving the heat dissipation performance. The serpentine structure of the water-cooling pipe 6 increases the contact area with the cooling plate 5 and the air-cooling plate 51, thereby improving the heat exchange efficiency. The threaded interface 61 allows the water-cooling pipe 6 to be easily connected to other cooling system components, which is convenient for installation and maintenance, and the threaded interface 61 helps to achieve a good sealing effect to prevent coolant leakage.

[0041] Furthermore, the air cooling plates 51 extend into the interior of the housing 1, and a matching slot 11 is provided on the lower side of the housing 1 corresponding to the air cooling plates 51;

[0042] Specifically, the slot 11 provides a precise positioning point for the air cooling plate 51, ensuring that the air cooling plate 51 can be correctly installed in the shell 1 and fixed in an appropriate position, which can simplify the assembly process of the air cooling plate 51 and make the installation faster and more convenient. When the air cooling plate 51 or other internal components need to be maintained or replaced, the air cooling plate 51 can be easily removed or installed with the matching slot 11.

[0043] Working principle: The data center uses an intelligent heat dissipation switch. When in use, both ends of the water-cooling pipe 6 are connected to the cold water pipeline. Cold water flows through the water-cooling pipe 6, which can absorb the heat of the clamp 52, the cold guide plate 5 and the air-cooling plate 51, and reduce the temperature of the air-cooling plate 51. At the same time, the fan 3 introduces external air into the shell 1, and the air flow flows through the narrow area between the air-cooling plates 51. The heat of the air flow can be quickly absorbed by the air-cooling plate 51, which can effectively adjust the air flow temperature and reduce the operating temperature of the switch.

Claims

1. An intelligent heat dissipation switch for a data center, comprising a housing (1), characterized in that: A shell cover (2) is screwed to the open upper side of the shell (1); a plurality of fans (3) are fixedly embedded on the front end surface of the shell (1); a dust filter plate (4) is fixedly embedded on the rear end surface of the shell (1); a cooling plate (5) is screwed to the lower side of one end of the shell (1) close to the fan (3); a plurality of air cooling plates (51) are fixed to the upper side of the cooling plate (5); the air cooling plates (51) all extend into the interior of the shell (1); a plurality of clamps (52) are fixed to the lower side of the cooling plate (5); and a water cooling pipe (6) is connected between the plurality of clamps (52).

2. The intelligent heat dissipation switch for a data center according to claim 1, characterized in that: The air cooling plate (51), the clamp (52) and the cooling plate (5) are all made of copper material, and the air cooling plate (51) and the clamp (52) are welded and fixed to the cooling plate (5) to form an integrated structure.

3. The intelligent heat dissipation switch for a data center according to claim 1, characterized in that: The air cooling plates (51) are parallel to each other, and the gap between adjacent air cooling plates (51) is no greater than 0.5 cm.

4. The intelligent heat dissipation switch for a data center according to claim 1, characterized in that: The water cooling pipe (6) has a serpentine structure, and both ends of the water cooling pipe (6) are provided with threaded interfaces (61).

5. The intelligent heat dissipation switch for a data center according to claim 1, characterized in that: A rectangular opening (41) is provided in the middle of the dust filter plate (4), and a plurality of blocking bars (42) are fixedly connected between inner walls on both sides of the rectangular opening (41).

6. The intelligent heat dissipation switch for a data center according to claim 1, characterized in that: A dustproof net (31) is fixedly embedded in the flow passage of the fan (3) on the side away from the housing (1).

7. The intelligent heat dissipation switch for a data center according to claim 1, characterized in that: A matching slot (11) is provided on the lower side of the shell (1) corresponding to the air cooling plate (51), and legs (12) are fixedly connected to the four corners of the lower side of the shell (1), and positioning holes (13) are provided on the legs (12).

Images