Display panel and lamp panel thereof

Abstract

The utility model provides a display panel and a lamp panel thereof. The lamp panel comprises a control circuit board and lamp beads. The control circuit board comprises a board body and a bonding pad arranged on the board body. The lamp bead comprises an injection molding body, a light source and a pin. The injection molding body is provided with a light-emitting surface. The light source is arranged in the injection molding body. One end of the pin is located in the injection molding body and used for being electrically connected with the light source, and the other end of the pin is provided with a connecting part which is located outside the injection molding body and used for being electrically connected with the control circuit board. The area of the connecting part is larger than that of the bonding pad, and the connecting part can be attached to the bonding pad and the board body and is fixedly connected with the bonding pad and the board body. In the lamp panel, by increasing the area of the connecting part of the pin, the area of the connecting part is larger than that of the bonding pad, so that when the connecting part is used for being electrically connected with the control circuit board, the connecting part can be connected and fixed with the bonding pad and the panel body at the same time, and the stress area between the connecting part and the control circuit board is increased; therefore, the connection strength of the lamp bead and the control circuit board is enhanced, and the thrust of the lamp bead is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of display, in particular to a display panel and a light board thereof. Background Art

[0002] With the widespread application of light emitting diode (LED) display panels, people have higher and higher requirements for their quality and performance. In the production process of LED display panels, the thrust standard of the lamp beads is very important, which will directly affect the quality and performance of the LED display panels. Among them, solder paste is often used to solder the lamp bead pins to the pads on the PCB (printed circuit board) to achieve the fixation of the lamp bead and the PCB board.

[0003] Taking the LED display panel with a dot pitch of P2-P3 as an example, the following problems often exist: the size of the lamp bead pins and the pads on the PCB board are consistent, and the thrust of the conventional solder paste used is about 2kg. The LED display panel formed by soldering the lamp bead pins to the pads on the PCB board through solder paste is insufficient to meet the thrust requirements of the LED display panel in special usage scenarios, and easily causes the lamp beads to fall off. Utility Model Content

[0004] The utility model aims to provide a display panel with larger lamp bead thrust and a lamp board thereof.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] According to one aspect of the present application, the present application provides a light board, comprising:

[0007] A control circuit board, comprising a board body and a solder pad disposed on the board body;

[0008] A lamp bead comprises an injection molded body, a light source and a pin, wherein the injection molded body is formed with a light-emitting surface; the light source is arranged inside the injection molded body; one end of the pin is located inside the injection molded body and is used to be electrically connected to the light source, and the other end of the pin is provided with a connecting portion, which is located outside the injection molded body and is used to be electrically connected to the control circuit board, the area of ​​the connecting portion is larger than the area of ​​the soldering pad, and the connecting portion can be attached to the soldering pad and the board body, and is connected and fixed to the soldering pad and the board body.

[0009] In some embodiments, the connecting portion completely covers the surface of the pad.

[0010] In some embodiments, there are multiple pins, and the multiple pins are arranged at intervals. There are multiple soldering pads, and the multiple soldering pads are arranged corresponding to the connecting parts of the pins. The spacing between the edges of two adjacent connecting parts is consistent with the spacing between the edges of two adjacent soldering pads.

[0011] In some embodiments, the area of ​​the connecting portion is 1.3 to 1.5 times the area of ​​the pad.

[0012] In some embodiments, an epoxy solder paste layer is disposed on the pad.

[0013] In some embodiments, the epoxy solder paste layer protrudes out of the surface of the board;

[0014] A first siphon gap is formed between the injection molding body and the plate body, which is used to siphon the liquid epoxy resin formed after the epoxy solder paste layer is melted to fill the first siphon gap and form a first reinforcement layer. The first reinforcement layer is located between the injection molding body and the plate body, and the first reinforcement layer is used to fix the injection molding body and the plate body.

[0015] In some embodiments, a second siphon gap is formed between the connecting portion and the board body, which is used to siphon liquid epoxy resin formed after the epoxy solder paste layer is melted to fill the second siphon gap and form a second reinforcement layer. The second reinforcement layer is located between the connecting portion and the board body, and the second reinforcement layer is used to fix the connecting portion to the board body.

[0016] In some embodiments, the distance of the second wick gap is smaller than the distance of the first wick gap.

[0017] In some embodiments, a welding layer is provided between the connecting portion and the pad, the welding layer is used to fix the connecting portion and the pad by welding, and the second reinforcement layer is provided on the outer peripheral side of the welding layer.

[0018] According to another aspect of the present application, the present application also provides a display panel, including a back panel and a light board as described in any one of the above items, wherein the light board is connected and fixed to the back panel.

[0019] It can be seen from the above technical solution that the utility model has at least the following advantages and positive effects:

[0020] In the lamp board of the present application, the area of ​​the connecting part of the pin is increased so that the area of ​​the connecting part is larger than the area of ​​the pad. In this way, when the connecting part is used to electrically connect with the control circuit board, the connecting part can be connected and fixed to the pad and the board body at the same time, thereby increasing the force-bearing area between the connecting part and the control circuit board, thereby enhancing the connection strength between the lamp bead and the control circuit board, and increasing the thrust of the lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure before the lamp board is formed in this embodiment.

[0022] Figure 2 It is a structural schematic diagram of the lamp board in the present embodiment in a preliminary fixed state.

[0023] Figure 3 yes Figure 2 Partial cross-sectional view at AA in the middle.

[0024] Figure 4 Schematic diagram of the structure of the light board in this embodiment.

[0025] Figure 5 yes Figure 4 Enlarged structural diagram at B in the middle.

[0026] Figure 6 yes Figure 4 Partial cross-sectional view at CC.

[0027] The following are the descriptions of the reference numerals:

[0028] 1. Control circuit board; 11. Board body; 12. Solder pad;

[0029] 2. lamp beads; 21. injection molding body; 22. light source; 23. pins; 231. connecting part; 232. power supply part;

[0030] 31. first siphon gap; 32. second siphon gap;

[0031] 4. Epoxy solder paste layer; 41. First reinforcement layer; 42. Second reinforcement layer; 43. Soldering layer. DETAILED DESCRIPTION

[0032] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially for illustrative purposes rather than for limiting the present invention.

[0033] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indications of directions or positional relationships (such as up, down, left, right, front and back, etc.) are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions also change accordingly.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] The present application provides a lamp board that can be used for a display panel. The present application simplifies and optimizes the connection method between the lamp beads and the control circuit board, aiming to improve the connection strength between the lamp beads and the control circuit board, thereby increasing the thrust of the lamp beads.

[0036] The specific embodiments of the light board of the present application are described in detail below with reference to the accompanying drawings.

[0037] Figure 1 This is a schematic diagram of the structure before the lamp board is formed in this embodiment. Figure 2 This is a schematic diagram of the structure of the lamp board in the initial fixed state in this embodiment. Figure 3 for Figure 2 Partial cross-sectional view at AA in the middle, Figure 4 is a schematic diagram of the structure of the light board in this embodiment, Figure 5 yes Figure 4 Enlarged structural diagram at B in the middle. Figure 6 for Figure 4 Partial cross-sectional view at CC.

[0038] refer to Figure 1 to Figure 6 The lamp board includes a control circuit board 1 and a lamp bead 2. The control circuit board 1 includes a board body 11 and a soldering pad 12 arranged on the board body 11. The lamp bead 2 includes an injection molding body 21, a light source 22 and a pin 23. The injection molding body 21 is formed with a light-emitting surface. The light source 22 is arranged inside the injection molding body 21. One end of the pin 23 is located inside the injection molding body 21 and is used to be electrically connected to the light source 22. The other end of the pin 23 is provided with a connecting portion 231. The connecting portion 231 is located outside the injection molding body 21 and is used to be electrically connected to the control circuit board 1. The area of ​​the connecting portion 231 is larger than the area of ​​the soldering pad 12, and it can be attached to the soldering pad 12 and the board body 11 and connected and fixed to the soldering pad 12 and the board body 11.

[0039] In the above-mentioned lamp board, by increasing the area of ​​the connecting portion 231 of the pin 23, the area of ​​the connecting portion 231 is made larger than the area of ​​the pad 12. In this way, when the connecting portion 231 is used to electrically connect with the control circuit board 1, the connecting portion 231 can be connected and fixed to the pad 12 and the board body 11 at the same time, thereby increasing the force-bearing area between the connecting portion 231 and the control circuit board 1, thereby enhancing the connection strength between the lamp bead 2 and the control circuit board 1 and increasing the thrust of the lamp bead 2.

[0040] refer to Figure 1The control circuit board 1 includes a board body 11 and a solder pad 12 disposed on the board body 11 .

[0041] An ink layer is provided on the surface of the board 11 to protect the circuit and prevent corrosion.

[0042] In this embodiment, there are multiple solder pads 12 , and the multiple solder pads 12 are distributed on the board 11 in an array form.

[0043] An epoxy solder paste layer 4 is provided on the pad 12. In this embodiment, the shape and size of the epoxy solder paste layer 4 are consistent with the shape and size of the pad 12, and protrude from the surface of the plate body 11, and are used to achieve preliminary fixation of the lamp bead 2 and the control circuit board 1. In this embodiment, the epoxy solder paste is in a semi-solidified paste state, which is a mixed material, and its mixed components include tin powder particles, flux, and epoxy resin.

[0044] In this embodiment, the epoxy solder paste layer 4 is preset on the board 11 through a printing process.

[0045] refer to Figure 1 to Figure 6 The lamp bead 2 used in this embodiment can be an LED lamp bead 2 with a square cross-section.

[0046] The lamp bead 2 includes an injection molded body 21 , a light source 22 and a pin 23 .

[0047] In this embodiment, the injection molded body 21 is in a square structure.

[0048] The light source 22 is disposed inside the injection molded body 21. The injection molded body 21 is formed with a light emitting surface for emitting light emitted by the light source 22.

[0049] One end of the pin 23 is located in the injection molded body 21 and is used for electrically connecting to the light source 22 .

[0050] The other end of the pin 23 is provided with a connecting portion 231 . The connecting portion 231 is located outside the injection molded body 21 and is used for being electrically connected to the control circuit board 1 .

[0051] Specifically, the pin 23 includes a power supply portion 232 and a connection portion 231. One end of the power supply portion 232 extends into the injection molded body 21 and is electrically connected to the light source 22, and the other end of the power supply portion 232 extends out of the injection molded body 21 or is flush with the end surface of the injection molded body 21 and is connected to the connection portion 231, so that the connection portion 231 is located on the outer side of the injection molded body 21 away from the light emitting surface.

[0052] In this embodiment, the power supply portion 232 and the connection portion 231 are respectively in a plate shape.

[0053] Furthermore, the end surface of the connecting portion 231 facing away from the injection molded body 21 is matched with the surface of the plate body 11 provided with the welding pad 12 .

[0054] In this embodiment, the area of ​​the connecting portion 231 is larger than the area of ​​the pad 12, so that the connecting portion 231 can be attached to the pad 12 and the board body 11 at the same time, and connected and fixed to the pad 12 and the board body 11. The connection between the connecting portion 231 and the pad 12 is used to realize the electrical connection between the pin 23 and the light source 22.

[0055] The connection portion 231 completely covers the surface of the pad 12 to ensure the complete connection between the connection portion 231 and the pad 12 , thereby ensuring the stability of the electrical connection between the light source 22 and the control circuit board 1 .

[0056] In this embodiment, the area of ​​the connection portion 231 is 1.3 to 1.5 times the area of ​​the pad 12 .

[0057] refer to Figure 2 , Figure 3 When the lamp bead 2 is initially connected to the control circuit board 1 through the connecting portion 231, the connecting portion 231 of the lamp bead 2 is temporarily adhered to the solder pad 12 through the semi-solidified epoxy solder paste layer 4 to initially fix the relative position between the lamp bead 2 and the control circuit board 1.

[0058] In addition, due to the arrangement that the epoxy solder paste layer 4 on the solder pad 12 protrudes out of the surface of the board body 11, a first siphon gap 31 is formed between the injection molded body 21 and the board body 11. The first siphon gap 31 is used to siphon the liquid epoxy resin formed after the epoxy solder paste layer 4 is melted to fill the first siphon gap 31, and form a first reinforcement layer 41 between the injection molded body 21 and the board body 11 to achieve a completely fixed connection between the injection molded body 21 and the board body 11, thereby reinforcing the connection strength between the lamp bead 2 and the control circuit board 1.

[0059] In addition, a second siphon gap 32 is formed between the connecting portion 231 and the board body 11, and the second siphon gap 32 is used to siphon the liquid epoxy resin formed after the epoxy solder paste layer 4 is melted to fill the second siphon gap 32, and a second reinforcement layer 42 is formed between the connecting portion 231 and the board body 11 to achieve a completely fixed connection between the connecting portion 231 and the board body 11, and to strengthen the connection strength between the lamp bead 2 and the control circuit board 1.

[0060] In this embodiment, the distance of the second siphon gap 32 is smaller than that of the first siphon gap 31 , that is, by reducing the gap distance between the connecting portion 231 and the plate body 11 , the second siphon gap 32 has a greater siphon effect.

[0061] In practical application, refer to Figure 4 , Figure 5 , Figure 6In the process of heating the epoxy solder paste layer 4, since the melting point of the epoxy resin is lower than the melting point of the tin powder particles, that is, in the heating process, the epoxy resin will melt into a liquid state before the tin powder particles, and the liquid epoxy resin will flow relative to the pad 12 and separate from the tin powder particles. Under the siphon effect of the second siphon gap 32 and the first siphon gap 31, the liquid epoxy resin gradually fills into the second siphon gap 32 and gradually fills into the first siphon gap 31. With the continuous heating process, after the temperature reaches the TG point, the liquid epoxy resin will gradually solidify, and form a first reinforcement layer 41 in the first siphon gap 31 and a second reinforcement layer 42 in the second siphon gap 32, respectively. Since the second siphon gap 32 has a greater siphon effect, it is easier for liquid epoxy resin to enter the narrower second siphon gap 32, so that the second reinforcement layer 42 formed by the epoxy resin filling the second siphon gap 32 after curing will have a larger area, increasing the surface area in contact with the connecting portion 231 and the board body 11, so as to increase the force-bearing area of ​​the part of the connecting portion 231 that exceeds the solder pad 12 and is fixed to the board body 11, thereby strengthening the connection strength between the lamp bead 2 and the control circuit board 1, and can further increase the thrust of the lamp bead 2 after curing.

[0062] In this embodiment, a welding layer 43 is provided between the connection portion 231 and the pad 12 . The welding layer 43 is used to weld and fix the connection portion 231 and the pad 12 . The second reinforcement layer 42 is provided on the outer peripheral side of the welding layer 43 .

[0063] Specifically, continue to refer to Figure 4 , Figure 5 , Figure 6 As the temperature continues to rise, the tin powder particles will melt to form tin liquid, and due to the obstruction of the first reinforcement layer 41, the second reinforcement layer 42 and the ink layer on the board 11 located on the periphery of the pad 12, the tin liquid can only flow within the range of the pad 12. After the tin powder particles are completely melted, the heating is stopped, and after cooling, the tin liquid solidifies between the connecting portion 231 and the pad 12, thereby achieving a fixed connection between the connecting portion 231 and the pad 12.

[0064] That is, in this embodiment, the soldering layer 43 is a tin layer.

[0065] Compared with the prior art, the process of adding glue dispensing and baking in the process of producing LED display panels is often used to enhance the thrust of the lamp beads 2, that is, reinforcing glue is added between the lamp beads 2 and the lamp beads 2, so that the reinforcing glue covers the pins 23 of the lamp beads 2 and penetrates the bottom of the lamp beads 2. After the glue dispensing process is completed, the glue is cured by baking to increase the thrust of the lamp beads 2.

[0066] The present embodiment simplifies and optimizes the connection method between the lamp bead 2 and the control circuit board 1, that is, the present embodiment optimizes the structure of the connecting portion 231 of the pin 23, uses the epoxy solder paste layer 4 to preliminarily fix the lamp bead 2, and then directly heats the epoxy solder paste layer 4 to separate the components of the epoxy solder paste layer 4 due to melting, thereby completely fixing the connecting portion 231 of the lamp bead 2 to the board body 11 and the solder pad 12 respectively, and completely fixing the injection molded body 21 of the lamp bead 2 to the board body 11 to complete the fixation of the lamp bead 2 to the control circuit board 1. This method can greatly improve the connection strength between the lamp bead 2 and the control circuit board 1, thereby increasing the thrust of the lamp bead 2, without the need to increase the investment in operating costs such as glue, dispensing equipment, baking equipment and transportation required in the prior art, which can greatly control and save costs.

[0067] In this embodiment, there are a plurality of pins 23 , and the plurality of pins 23 are arranged at intervals. Specifically, the plurality of pins 23 are distributed at intervals along the circumference of the injection molding body 21 , and the pins 23 are arranged corresponding to the pads 12 .

[0068] In addition, the spacing between the edges of two adjacent connecting parts 231 is consistent with the spacing between the edges of two adjacent soldering pads 12, so that when the connecting part 231 of each pin 23 of the lamp bead 2 is initially fitted with the corresponding soldering pad 12, the edge of each connecting part 231 close to the adjacent connecting part 231 is flush with the edge of the corresponding soldering pad 12, so that each connecting part 231 forms a second siphon gap 32 only between the end away from the adjacent connecting part 231 and the board body 11, and the part of the injection molded body 21 located between the two adjacent connecting parts 231 forms a first siphon gap 31 with the board body 11, so that the first siphon gap 31 and the second siphon gap 32 are independent of each other without interference, so as to ensure the siphon effect of the first siphon gap 31 and the second siphon gap 32, and ensure that the epoxy resin layer formed by the epoxy resin filled in the second siphon gap 32 after curing has a larger area, so as to increase the force-bearing area of ​​the part of the connecting part 231 that exceeds the soldering pad 12 and is fixed to the board body 11.

[0069] In this embodiment, there are multiple lamp beads 2 , which are distributed on the board 11 in an array, and each pin 23 of each lamp bead 2 corresponds to a soldering pad 12 .

[0070] The assembly process of the above light board is as follows:

[0071] refer to Figure 2 , Figure 3 First, with the connection part 231 of the pin 23 of the lamp bead 2 facing the control circuit board 1, and with each pin 23 corresponding to a solder pad 12, the connection part 231 of the lamp bead 2 and the epoxy solder paste layer 4 on the corresponding solder pad 12 are preliminarily mounted and fixed until all the lamp beads 2 and the control circuit board 1 are mounted.

[0072] refer to Figure 4 , Figure 5 , Figure 6 , the epoxy solder paste layer 4 is heated. During the heating process, the epoxy resin melts into liquid state before the tin powder particles. Under the siphon effect of the second siphon gap 32 and the first siphon gap 31, the liquid epoxy resin gradually fills into the second siphon gap 32 and gradually fills into the first siphon gap 31. When the temperature reaches the TG point, the epoxy resin solidifies. Since the second siphon gap 32 has a greater siphon effect, it is convenient for the liquid epoxy resin to enter the narrower second siphon gap 32, so that the epoxy resin layer formed by the epoxy resin filled in the second siphon gap 32 after solidification has a larger area, increasing the surface area in contact with the connecting portion 231 and the board body 11, so as to increase the force bearing area of ​​the part of the connecting portion 231 that exceeds the pad 12 and is fixed to the board body 11, thereby strengthening the connection strength between the lamp bead 2 and the control circuit board 1, and further increasing the thrust of the lamp bead 2 after solidification.

[0073] As the temperature continues to rise, the tin powder particles will melt to form tin liquid, and due to the obstruction of the first reinforcement layer 41, the second reinforcement layer 42 and the ink layer on the board body 11, the tin liquid can only flow within the range of the pad 12. After the tin powder particles are completely melted, the heating is stopped, and the tin liquid is cooled and solidified between the connecting portion 231 and the pad 12, thereby achieving a fixed connection between the connecting portion 231 and the pad 12, that is, the assembly of the lamp board is completed.

[0074] Compared with the method used in the prior art of adding the steps of dispensing and baking to reinforce the lamp bead 2, the present application simplifies and optimizes the connection method between the lamp bead 2 and the control circuit board 1. That is, the present embodiment optimizes the structure of the connecting portion 231 of the pin 23, uses the epoxy solder paste layer 4 to preliminarily fix the lamp bead 2, and then directly heats the epoxy solder paste layer 4 to separate the components of the epoxy solder paste layer 4 due to melting, thereby completely fixing the connecting portion 231 of the lamp bead 2 to the board body 11 and the solder pad 12 respectively, and completely fixing the injection molded body 21 of the lamp bead 2 to the board body 11 to complete the fixation of the lamp bead 2 to the control circuit board 1. This method can greatly improve the connection strength between the lamp bead 2 and the control circuit board 1, thereby increasing the thrust of the lamp bead 2, without the need to increase the investment in operating costs such as glue, dispensing equipment, baking equipment, and transportation required in the prior art, which can greatly control and save costs.

[0075] According to another aspect of the present application, the present application further provides a display panel, the display panel includes the light board as described above, and the display panel may further include a back panel, the light board is connected and fixed to the back panel.

[0076] It can be seen from the above technical solution that the utility model has at least the following advantages and positive effects:

[0077] In the lamp board of the present application, the area of ​​the connecting part of the pin is increased so that the area of ​​the connecting part is larger than the area of ​​the pad. In this way, when the connecting part is used to electrically connect with the control circuit board, the connecting part can be connected and fixed to the pad and the board body at the same time, thereby increasing the force-bearing area between the connecting part and the control circuit board, thereby enhancing the connection strength between the lamp bead and the control circuit board, and increasing the thrust of the lamp bead.

[0078] Although the utility model has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the utility model can be implemented in a variety of forms without departing from the spirit or essence of the utility model, it should be understood that the above-mentioned embodiments are not limited to any of the aforementioned details, but should be widely interpreted within the spirit and scope defined by the attached claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the attached claims.

Claims

1. A light board, characterized in that: include: A control circuit board, comprising a board body and a solder pad disposed on the board body; A lamp bead comprises an injection molded body, a light source and a pin, wherein the injection molded body is formed with a light-emitting surface; the light source is arranged inside the injection molded body; one end of the pin is located inside the injection molded body and is used to be electrically connected to the light source, and the other end of the pin is provided with a connecting portion, which is located outside the injection molded body and is used to be electrically connected to the control circuit board, the area of ​​the connecting portion is larger than the area of ​​the soldering pad, and the connecting portion can be attached to the soldering pad and the board body, and is connected and fixed to the soldering pad and the board body.

2. The light board according to claim 1, characterized in that: The connecting portion completely covers the surface of the pad.

3. The light board according to claim 2, characterized in that: There are multiple pins, and the multiple pins are arranged at intervals. There are multiple soldering pads, and the multiple soldering pads are arranged corresponding to the connecting parts of the pins. The spacing between the edges of two adjacent connecting parts is consistent with the spacing between the edges of two adjacent soldering pads.

4. The light board according to claim 1, characterized in that: The area of ​​the connecting portion is 1.3 to 1.5 times the area of ​​the pad.

5. The light board according to claim 1, characterized in that: An epoxy solder paste layer is provided on the soldering pad.

6. The light board according to claim 5, characterized in that: The epoxy solder paste layer protrudes out of the surface of the board; A first siphon gap is formed between the injection molding body and the plate body, which is used to siphon the liquid epoxy resin formed after the epoxy solder paste layer is melted to fill the first siphon gap and form a first reinforcement layer. The first reinforcement layer is located between the injection molding body and the plate body, and the first reinforcement layer is used to fix the injection molding body and the plate body.

7. The light board according to claim 6, characterized in that: A second siphon gap is formed between the connecting portion and the plate body, which is used to siphon the liquid epoxy resin formed after the epoxy solder paste layer is melted to fill the second siphon gap and form a second reinforcement layer. The second reinforcement layer is located between the connecting portion and the plate body, and the second reinforcement layer is used to fix the connecting portion to the plate body.

8. The light board according to claim 7, characterized in that: The distance of the second siphon gap is smaller than the distance of the first siphon gap.

9. The light board according to claim 7, characterized in that: A welding layer is provided between the connection portion and the pad, and the welding layer is used to fix the connection portion and the pad by welding. The second reinforcement layer is provided on the outer peripheral side of the welding layer.

10. A display panel, characterized in that: It comprises a back plate and a lamp board as claimed in any one of claims 1 to 9, wherein the lamp board is connected and fixed to the back plate.

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