Circuit board copper foil pasting device
By designing a copper foil adhesive device for circuit board manufacturing, the material suction assembly and calibration adjustment mechanism ensure complete flat contact between the copper foil and the circuit board, and uniform adhesive bonding is achieved through the pressing mechanism, the bubble or wrinkle problems caused by incomplete flat contact between the copper foil and the substrate are solved, and the adhesion efficiency and quality are improved.
Patent Information
- Application Number
- CN202421625467.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-10
AI Technical Summary
During the circuit board manufacturing process, incomplete flat contact between the copper foil and the substrate and uneven pressure distribution may lead to bubbles or wrinkles, reducing the efficiency of the conductive layer and leading to poor electrical connections.
A circuit board copper foil adhesive device is designed, and the copper foil is absorbed and tightened by material suction assembly, combined with the first guide member, the first spring and the calibration and adjustment mechanism to ensure that the circuit board and the copper foil are completely flat, and uniformly pasting and pressing are achieved through the pressing mechanism.
Through this device, the emergence of bubbles or wrinkles is avoided, the efficiency and quality of the copper foil of the circuit board is improved, and it is suitable for the circuit board needs of different specifications.
Smart Images

Figure CN222869153U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of circuit board production, in particular to a circuit board copper foil pasting device. Background Art
[0002] The conductive layer of the circuit board is the basis for the installation of electronic components and circuit connection. It is usually composed of copper foil covered on a non-conductive substrate. During the manufacturing process, the copper foil is usually fixed to the substrate by pasting and pressing. Mechanical pressure, hot pressing or cold pressing is used to ensure a strong bond between the copper foil and the substrate. During the pasting process, the copper foil may not be in completely flat contact with the substrate or the pressure distribution may be uneven, resulting in bubbles or wrinkles, which will reduce the efficiency of the conductive layer and may cause poor electrical connections.
[0003] In view of the above problems, a circuit board copper foil pasting device is developed. Utility Model Content
[0004] In order to overcome the shortcomings that the copper foil and the substrate are not in completely flat contact or the pressure distribution is uneven, bubbles or wrinkles may be generated, the efficiency of the conductive layer may be reduced, and poor electrical connection may be caused, the utility model provides a circuit board copper foil pasting device.
[0005] The technical solution of the utility model is as follows: A circuit board copper foil pasting device includes an installation frame, two first guide members are slidably connected to the four corners of the installation frame, a first spring is connected between the first guide members and the installation frame, a suction component is connected between every two of the first guide members, a line is connected between two adjacent suction components, and calibration adjustment mechanisms are provided on the left and right sides and the rear side of the installation frame.
[0006] As a further preferred embodiment, the calibration adjustment mechanism includes an adjusting member, the adjusting member is slidably connected to the left and right sides and the rear side of the lower part of the installation frame, the adjusting member is connected to a second guide member, the second guide member and the installation frame are slidably connected, a second spring is connected between the second guide member and the installation frame, a knob is rotatably connected to the adjusting member, the knob is threadedly connected to a locking assembly, and the locking assembly is threadedly connected to the installation frame.
[0007] As a further preferred embodiment, a pressing mechanism is also included, which includes a third guide member, four of which are slidably connected to the lower middle side of the installation frame, third springs are connected between the third guide members and the installation frame, and pressing blocks are connected between the third guide members.
[0008] As a further preferred solution, it also includes a handle, and the handle is installed on the upper sides of the left and right parts of the installation frame.
[0009] As a further preferred solution, it also includes air pipes, and the upper side of the rear portion of the installation frame is connected to the air pipes which are symmetrical on the left and right.
[0010] As a further preferred solution, the four third guide members enable the pressing block to be subjected to a more uniform force, which is beneficial to ensuring the copper foil pasting effect.
[0011] By adopting the above technical solution, the beneficial effects of the utility model are:
[0012] 1. The utility model utilizes a suction component to absorb and tighten the copper foil, and sets a first guide, a first spring and a calibration adjustment mechanism to clamp and calibrate the circuit board according to its size, so that the circuit board and the copper foil are completely flat, avoiding bubbles or wrinkles, thereby improving the copper foil pasting effect of the circuit board, and adapting to the copper foil pasting needs of circuit boards of different specifications.
[0013] 2. The utility model sets a pressing mechanism. After the calibration of the copper foil and the circuit board is completed, the copper foil and the circuit board are pressed to complete the pasting operation of the circuit board copper foil. The four evenly distributed third guide members make the pressing block more evenly stressed, which is conducive to ensuring the pasting effect of the copper foil. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.
[0015] Figure 2 It is a schematic diagram of a first partial cross-sectional three-dimensional structure of the utility model.
[0016] Figure 3 It is a schematic diagram of a second partial cross-sectional three-dimensional structure of the utility model.
[0017] Figure 4 It is a partial cross-sectional three-dimensional structural schematic diagram of the calibration and adjustment mechanism of the utility model.
[0018] Figure 5 It is a partial cross-sectional three-dimensional structural schematic diagram of the pressing mechanism of the utility model.
[0019] Marked in the figure: 1: installation frame, 2: suction assembly, 3: first guide member, 4: first spring, 5: handle, 6: air pipe, 7: calibration adjustment mechanism, 71: adjustment member, 72: second guide member, 73: second spring, 74: knob, 75: locking assembly, 8: pressing mechanism, 81: pressing block, 82: third guide member, 83: third spring. DETAILED DESCRIPTION
[0020] The present invention is further described below in conjunction with specific embodiments. It should also be noted that, unless otherwise clearly specified and limited, terms such as: setting, installing, connecting, and connecting should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0021] Example 1
[0022] A circuit board copper foil pasting device, such as Figure 1-Figure 3 As shown, it includes an installation frame 1, two first guide members 3 are slidably connected to the four corners of the installation frame 1, first springs 4 are connected between the first guide members 3 and the installation frame 1, a suction component 2 is connected between every two first guide members 3, a line is connected between two adjacent suction components 2, handles 5 are installed on the upper sides of the left and right parts of the installation frame 1, left-right symmetrical air pipes 6 are connected to the upper side of the rear part of the installation frame 1, and calibration adjustment mechanisms 7 are provided on the left and right sides and the rear side of the installation frame 1.
[0023] like Figure 1-Figure 4 As shown, the calibration adjustment mechanism 7 includes an adjusting member 71, and the left and right sides and the rear side of the lower part of the installation frame 1 are slidably connected with the adjusting member 71, the adjusting member 71 is connected with a second guide member 72, the second guide member 72 and the installation frame 1 are slidably connected, and a second spring 73 is connected between the second guide member 72 and the installation frame 1, and the adjusting member 71 is rotatably connected with a knob 74, and the knob 74 is threadedly connected with a locking assembly 75, and the locking assembly 75 is threadedly connected to the installation frame 1.
[0024] The conductive layer of the circuit board is the basis for the installation of electronic components and circuit connection. It is usually composed of copper foil and covered on a non-conductive substrate. During the manufacturing process, the copper foil is usually fixed to the substrate by pasting and pressing. Mechanical pressure, hot pressing or cold pressing is used to ensure the strong adhesion between the copper foil and the substrate. The copper foil is placed at the bottom of the device, and the suction component 2 is turned on to absorb and tighten the copper foil. Then the circuit board is placed at the bottom of the device. The circuit board presses the suction component 2 upward, so that the suction component 2 moves upward according to the thickness of the circuit board, so that the first spring The spring 4 is compressed to meet the copper foil pasting requirements of circuit boards with different thicknesses. When the lengths or widths of the circuit boards are different, the knobs 74 are rotated respectively so that the locking components 75 lock the adjacent knobs 74. Then the locking components 75 are rotated, and the second spring 73 is compressed at the same time. The locking components 75 drive the second guide member 72 to slide on the mounting frame 1, and the adjusting member 71 moves in the same direction. When the locking components 75 are adjusted to a suitable position, the rotation of the locking components 75 is stopped, so as to adapt to circuit boards of different specifications, so that the circuit boards and the copper foil are completely flat, so as to perform the copper foil pasting operation of the circuit boards more accurately.
[0025] Example 2
[0026] On the basis of Example 1, Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, a pressing mechanism 8 is also included, and the pressing mechanism 8 includes a third guide member 82. Four third guide members 82 are slidably connected to the lower middle side of the installation frame 1. The four third guide members 82 make the pressing block 81 more evenly stressed, which is beneficial to ensuring the copper foil pasting effect. A third spring 83 is connected between the third guide member 82 and the installation frame 1, and a pressing block 81 is connected between the third guide members 82.
[0027] After the calibration of the copper foil and the circuit board is completed, the hot pressing switch is turned on and the pressing block 81 is pressed downward so that the copper foil is pressed against the circuit board. The four evenly distributed third guide members 82 make the pressing block 81 more evenly stressed, which is beneficial to ensure the copper foil pasting effect. At the same time, the third spring 83 is stretched along the third guide member 82. After the pasting is completed, the pressing block 81 is released, the third guide member 82 slides upward, and the third spring 83 is reset.
[0028] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.
Claims
1. A circuit board copper foil pasting device, characterized in that: The invention comprises an installation frame (1), wherein two first guide members (3) are slidably connected to the four corners of the installation frame (1), a first spring (4) is connected between the first guide members (3) and the installation frame (1), a suction assembly (2) is connected between every two of the first guide members (3), a line is connected between two adjacent suction assemblies (2), and calibration adjustment mechanisms (7) are arranged on the left and right sides and the rear side of the installation frame (1).
2. A circuit board copper foil pasting device according to claim 1, characterized in that: The calibration adjustment mechanism (7) comprises an adjustment member (71), the adjustment member (71) is slidably connected to the left and right sides and the rear side of the lower part of the installation frame (1), the adjustment member (71) is connected to a second guide member (72), the second guide member (72) and the installation frame (1) are slidably connected, a second spring (73) is connected between the second guide member (72) and the installation frame (1), the adjustment member (71) is rotatably connected to a knob (74), the knob (74) is threadedly connected to a locking assembly (75), and the locking assembly (75) is threadedly connected to the installation frame (1).
3. A circuit board copper foil pasting device according to claim 2, characterized in that: It also includes a pressing mechanism (8), the pressing mechanism (8) including a third guide member (82), four third guide members (82) are slidably connected to the lower middle side of the installation frame (1), third springs (83) are connected between the third guide members (82) and the installation frame (1), and pressing blocks (81) are connected between the third guide members (82).
4. A circuit board copper foil pasting device according to claim 1, characterized in that: It also includes a handle (5), and the handle (5) is installed on the upper sides of the left and right parts of the installation frame (1).
5. A circuit board copper foil pasting device according to claim 1, characterized in that: It also includes an air pipe (6), and the upper side of the rear portion of the installation frame (1) is connected to the air pipe (6) in a bilaterally symmetrical manner.
6. A circuit board copper foil pasting device according to claim 3, characterized in that four The third guide member (82) enables the pressing block (81) to be subjected to force more evenly, which is beneficial to ensuring the copper foil pasting effect.