Open type vapor chamber and electronic equipment thereof

Abstract

In order to solve the problems that the total heat dissipation capacity of an existing closed type two-phase vapor chamber to the environment is still limited to the performance of a traditional thermal interface material and a radiator, and the heat dissipation effect is low, the utility model provides an open type vapor chamber and electronic equipment. The open type uniform temperature plate comprises a shell with an opening in one end, a moisture absorption layer, a hydrophobic breathable layer and a capillary core layer are arranged in the shell, the hydrophobic breathable layer is arranged between the moisture absorption layer and the capillary core layer, and the face, away from the hydrophobic breathable layer, of the capillary core layer faces the opening. According to the open type vapor chamber, a working medium (water) in the capillary core layer can directly enter air, so that efficient heat dissipation of the environment is achieved, and water vapor can be recycled from the air through the laminated structure of the capillary core layer, the hydrophobic breathable layer and the moisture absorption layer.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to an open temperature equalizing plate and electronic equipment thereof. Background Art

[0002] In the field of thermal management of microelectronic devices, the main heat is often concentrated in limited hotspots. The heat needs to be diffused in time to achieve efficient thermal management. Commonly used heat diffusion devices generally use solid materials with high thermal conductivity, such as copper sheets, graphite sheets, etc. The two-phase temperature plate, often referred to as VC (from the English Vapor Chamber) in the industry, uses two-phase flow heat and mass transfer heat dissipation technology. Compared with simple solid thermal conductive materials, it has the advantages of higher thermal conductivity and better temperature uniformity. It has become one of the effective ways to solve the heat dissipation of high heat flux density electronic devices in the current electronics industry.

[0003] The structure of the existing closed two-phase temperature plate is as follows: Figure 1 As shown, the two-phase temperature plate is composed of a sealed cavity 103, a capillary core 104, and a packaged vapor-phase medium 107 and a liquid-phase medium 105. When heat is applied to the hot spot 106 at the bottom of the two-phase temperature plate, the liquid-phase medium 105 evaporates as the heat increases to form a vapor-phase medium 107. The vapor rises to the top of the sealed cavity 103. The temperature of the thermal interface material 102 and the heat sink 101 is lower than that of the vapor. The vapor at the top of the sealed cavity 103 will condense and flow back into the capillary core 104 to form a cycle. The condensed liquid will re-form the liquid-phase medium 105. At the same time, the thermal interface material 102 and the heat sink 101 will exchange heat with the environment to achieve the purpose of heat dissipation. The excellent thermal diffusion capacity of the two-phase temperature plate comes from the ability of the vapor-phase medium 107 in the sealed cavity 103 to carry a large amount of latent heat of vaporization for lateral transmission.

[0004] The above-mentioned existing closed two-phase heat spreader only achieves uniform heat distribution, and the total heat dissipation capacity to the environment is still limited to the performance of the traditional thermal interface material 102 and the heat sink 101, and the heat dissipation effect is low. When the existing heat spreader is used to cool electronic products, especially for electronic products that cannot use fans, the heat dissipation capacity of passive heat dissipation mechanisms such as natural convection and thermal radiation is very limited. When using the traditional two-phase heat spreader, the heat dissipation effect is low and the temperature reduction of the electronic products is low. Utility Model Content

[0005] The technical problem to be solved by the present invention is as follows: the total heat dissipation capacity of the existing closed two-phase temperature equalizing plate to the environment is still limited to the performance of traditional thermal interface materials and heat sinks, and the heat dissipation effect is low. The present application provides an open temperature equalizing plate and its electronic equipment.

[0006] On the one hand, the present application provides an open temperature equalizing plate, comprising a shell with an opening at one end, wherein a hygroscopic layer, a hydrophobic breathable layer and a capillary core layer are arranged in the shell, wherein the hydrophobic breathable layer is arranged between the hygroscopic layer and the capillary core layer, and the capillary core layer has a side facing away from the hydrophobic breathable layer toward the opening.

[0007] Preferably, a waterproof and breathable layer is provided on the side of the capillary core layer away from the hydrophobic and breathable layer, and the side of the waterproof and breathable layer away from the capillary core layer is connected to the atmosphere;

[0008] The side of the waterproof and breathable layer away from the capillary core layer faces the opening; or the outer periphery of the waterproof and breathable layer abuts against the inner edge of the opening, and the side of the waterproof and breathable layer away from the capillary core layer extends out of the opening.

[0009] Preferably, a vapor transfer layer is further provided between the capillary core layer and the waterproof breathable layer, the vapor transfer layer comprises at least one cavity, the cavity is respectively connected with the waterproof breathable layer and the capillary core layer, and each of the cavities is connected with each other.

[0010] Preferably, a plurality of columns are arranged at intervals in the vapor transport layer, one end of each column abuts against a side of the capillary core layer away from the hydrophobic breathable layer, and each column extends from the capillary core layer toward the waterproof breathable layer.

[0011] Preferably, the waterproof and breathable layer is a porous structure for allowing water vapor to pass through.

[0012] Preferably, the outer side of the shell has a heat conducting portion, and the heat conducting portion is arranged on a side of the shell away from the opening.

[0013] Preferably, the opening is arranged on the first side surface of the shell, the heat conducting part is arranged on the second side surface of the shell, the first side surface and the second side surface are arranged opposite to each other, one side of the hygroscopic layer abuts against the inner wall of the second side surface of the shell, and the projection of the hygroscopic layer on the second side surface covers the heat conducting part.

[0014] Preferably, a hygroscopic material is provided in the hygroscopic layer, and the hygroscopic material includes one or more of hygroscopic hydrogel, hygroscopic MOF, and hygroscopic inorganic salt material.

[0015] Preferably, the shell is made of heat conductive material.

[0016] In a second aspect, the present application provides an electronic device, including a heating device and the open temperature vapor chamber described above, wherein the open temperature vapor chamber is connected to the heating device.

[0017] The open-type heat balancing plate provided by the present application can form water vapor in the capillary core layer by absorbing the heat inside the shell and diffuse into the air, thereby achieving the effect of cooling; the hygroscopic layer absorbs the moisture in the air according to the pressure difference and condenses in the capillary core layer to form a layer of water film, thereby realizing the recovery of water vapor from the air, replenishing the reduced water in the capillary core layer, and ensuring the sustainable cooling of the heat balancing plate; the hydrophobic breathable layer arranged between the hygroscopic layer and the capillary core layer can only allow water vapor to pass through, which can effectively prevent the water in the capillary core layer from flowing into the hygroscopic layer, ensuring that the capillary core layer has enough water, and realizing the effective cooling of the heat balancing plate. Compared with the prior art, the open-type heat balancing plate provided by the present application can directly allow the working medium (water) in the capillary core layer to enter the air, thereby achieving efficient heat dissipation to the environment, and the laminated structure of the capillary core layer, the hydrophobic breathable layer, and the hygroscopic layer can realize the recovery of water vapor from the air. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the existing temperature equalizing plate structure;

[0019] Figure 2 This is a schematic diagram of the structure of the temperature equalizing plate in Example 1 provided by the present application;

[0020] Figure 3 This is a schematic diagram of the structure of the temperature equalizing plate in Example 2 provided in the present application;

[0021] Figure 4 is a graph showing the change of hot spot temperature over time in Example 1 and Comparative Example 1;

[0022] Figure 5 is a graph showing the change of hot spot temperature over time in Example 2 and Comparative Example 1;

[0023] Among them, 101, heat sink; 102, thermal interface material; 103, sealed cavity; 104, capillary wick; 105, liquid phase working fluid; 106, heating point; 107, vapor phase working fluid; 201, waterproof and breathable layer; 202, capillary wick layer; 203, hydrophobic and breathable layer; 204, hygroscopic layer; 205, shell; 206, heat conduction part; 207, vapor migration layer. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0025] In order to illustrate the technical solution of the present utility model, specific embodiments are provided below for illustration.

[0026] On the one hand, if Figure 2As shown, an embodiment of the present application provides an open temperature equalizing plate, including a shell 205 with an opening at one end, wherein a hygroscopic layer 204, a hydrophobic breathable layer 203 and a capillary core layer 202 are arranged in the shell 205, and the hydrophobic breathable layer 203 is arranged between the hygroscopic layer 204 and the capillary core layer 202, and the capillary core layer 202 has a side facing away from the hydrophobic breathable layer 203 toward the opening.

[0027] Specifically, the shell 205 is a structure with an open end, the temperature equalizing plate structure is an open structure, the capillary core layer 202 faces the opening on one side away from the hydrophobic breathable layer 203, and the pressure inside the hygroscopic layer 204 is lower than the pressure in the atmosphere. Under the action of the pressure difference, the hygroscopic layer 204 absorbs water vapor in the atmosphere and condenses on the surface of the capillary core layer 202. This process continues spontaneously until the entire capillary core layer 202 is covered with a layer of water film, thereby isolating the hygroscopic effect of the hygroscopic layer 204 on the inside of the shell 205.

[0028] When the shell 205 contacts the heating device, the shell 205 starts to heat up, and the hygroscopic layer 204 contains some water. The water absorbs part of the heat and evaporates to form water vapor. The hydrophobic breathable layer 203 allows the water vapor to pass through. The water vapor passes through the hydrophobic breathable layer 203 and reaches the capillary core layer 202. The water in the capillary core layer 202 contacts the water vapor that passes through the hydrophobic breathable layer 203 and absorbs heat to form water vapor, which diffuses into the air. At the same time, the heat transmitted from the hygroscopic layer 204 reaches the capillary core layer 202, and the water in the water film of the capillary core layer 202 absorbs heat to form water vapor, thereby reducing the heat inside the shell 205 and achieving a cooling effect.

[0029] When the moisture content of the water film in the capillary core layer 202 decreases, the hygroscopic layer 204 cannot be blocked from absorbing moisture inside the shell 205, and the hygroscopic layer 204 repeats the hygroscopic work. Because the internal pressure of the hygroscopic layer 204 is lower than the pressure in the atmosphere, under the action of the pressure difference, the hygroscopic layer 204 reabsorbs water vapor in the atmosphere and condenses on the surface of the capillary core layer 202 until the entire capillary core layer 202 is covered with a layer of water film.

[0030] The hydrophobic breathable layer 203 is arranged between the hygroscopic layer 204 and the capillary core layer 202. The hydrophobic breathable layer 203 can only allow water vapor to pass through, so the moisture in the air can pass through the hygroscopic layer 204 and condense on the capillary core layer 202 to form a water film, and the water in the water film cannot pass through the hydrophobic breathable layer 203 to reach the hygroscopic layer 204, thereby ensuring that the capillary core layer 202 has enough moisture to absorb the heat inside the shell 205 to achieve a cooling effect.

[0031] The open temperature equalizing plate provided in the present application can form water vapor in the capillary core layer 202 by absorbing the heat outside the shell 205 and diffuse into the air, thereby achieving the effect of cooling; the hygroscopic layer 204 absorbs moisture in the air according to the pressure difference and condenses in the capillary core layer 202 to form a layer of water film, so as to recover water vapor from the air, replenish the reduced water in the capillary core layer 202, and ensure the sustainable cooling of the temperature equalizing plate; the hydrophobic and breathable layer 203 is arranged between the hygroscopic layer 204 and the capillary core layer 202, and the hydrophobic and breathable layer 203 can only allow water vapor to pass through, which can effectively prevent the water in the capillary core layer 202 from flowing into the hygroscopic layer 204, thereby ensuring that the capillary core layer 202 has enough water to achieve effective cooling of the temperature equalizing plate. Compared with the prior art, in the open temperature equalizing plate provided in the present application, the working medium (water) in the capillary core layer 202 can directly enter the air, thereby realizing efficient heat dissipation to the environment. The laminated structure of the capillary core layer 202, the hydrophobic breathable layer 203, and the hygroscopic layer 204 can realize the recovery of water vapor from the air.

[0032] In some embodiments, a waterproof and breathable layer 201 is disposed on the side of the capillary core layer 202 away from the hydrophobic and breathable layer 203, and the side of the waterproof and breathable layer 201 away from the capillary core layer 202 is connected to the atmosphere;

[0033] The side of the waterproof breathable layer 201 away from the capillary core layer 202 faces the opening; or, the outer periphery of the waterproof breathable layer 201 abuts against the inner edge of the opening, and the side of the waterproof breathable layer 201 away from the capillary core layer 202 extends out of the opening.

[0034] Specifically, the waterproof and breathable layer 201 is arranged on the side of the capillary core layer 202 facing the open end. The waterproof and breathable layer 201 is the appearance surface of the temperature equalizing plate. The waterproof and breathable layer 201 allows water vapor to pass through but also has protective functions such as waterproof, dustproof and wear-resistant, which can prevent the capillary core layer 202, the hydrophobic breathable layer 203 and the hygroscopic layer 204 inside the shell 205 from being damaged.

[0035] The side of the waterproof and breathable layer 201 facing away from the capillary core layer 202 is connected to the atmosphere. Water vapor in the air can reach the capillary core layer 202 through the waterproof and breathable layer 201, and condense on the surface of the capillary core layer 202 to form a water film; at the same time, water vapor in the capillary core layer 202 can pass through the waterproof and breathable layer 201 and diffuse into the atmosphere, achieving the effect of rapid cooling and heat dissipation.

[0036] Specifically, the structure of the waterproof breathable layer 201 and the shell 205 includes at least the following three types: the first type is that the waterproof breathable layer 201 is arranged inside the shell 205, and the side of the waterproof breathable layer 201 away from the capillary core layer 202 faces the opening; the second type is that the outer periphery of the waterproof breathable layer 201 abuts against the inner edge of the opening, and the side of the waterproof breathable layer 201 away from the capillary core layer 202 extends out of the opening. Figure 2 The third type is that the outer periphery of the waterproof breathable layer 201 covers the outer wall of the opening, and the waterproof breathable layer 201 covers the opening of the shell 205.

[0037] In some embodiments, the waterproof breathable layer 201 is a porous structure for water vapor to pass through.

[0038] Specifically, the waterproof and breathable layer 201 has a porous structure to facilitate the passage of water vapor.

[0039] In some embodiments, the waterproof breathable layer 201 is made of chemical fiber woven fabric, artificial leather, porous glass or porous ceramic.

[0040] Specifically, the material of the waterproof and breathable layer 201 should have a hydrophobic pore structure that allows water vapor to pass through while also having protective functions such as being waterproof, dustproof, and wear-resistant.

[0041] In some embodiments, the outer side of the housing 205 has a heat conducting portion 206 , and the heat conducting portion 206 is disposed on a side of the housing 205 away from the opening.

[0042] The heat conducting portion 206 is disposed on a side of the housing 205 away from the opening. Figure 2 As shown, assuming that the opening is set at the top of the shell 205, the heat conducting part 206 can be set on the outside of the side of the shell 205, and the heat conducting part 206 can also be set on the outside of the bottom of the shell 205. No matter where the heat conducting part 206 is located in the shell 205, the temperature equalizing plate of the present application has the effect of cooling and dissipating heat.

[0043] It should be noted that the heat conducting part 206 can also be composed of one heat conducting point, two heat conducting points, three heat conducting points or more than three heat conducting points; the heat conducting part 206 can be composed of one heat conducting surface, two heat conducting surfaces, three heat conducting surfaces or more than three heat conducting surfaces.

[0044] In some preferred embodiments, the opening is arranged on the first side of the shell 205, the heat conducting part 206 is arranged on the second side of the shell 205, the first side and the second side are arranged opposite to each other, one side of the hygroscopic layer 204 abuts against the inner wall of the second side of the shell 205, and the projection of the hygroscopic layer 204 on the second side covers the heat conducting part 206.

[0045] Specifically, the hygroscopic layer 204 is arranged near the heat conducting part 206, and the projection of the hygroscopic layer 204 on the second side covers the heat conducting part 206. When the heat conducting part 206 conducts heat to the shell 205, the hygroscopic layer 204 can absorb the heat first, and the water in the hygroscopic layer 204 can absorb the heat to play a cooling role.

[0046] like Figure 2 As shown, the first side is Figure 2 The top surface of the middle shell 205 and the second side surface are Figure 2 The bottom surface of the middle shell 205; the hygroscopic layer 204 is arranged on the bottom surface of the shell 205. When the hygroscopic layer 204 absorbs water vapor in the air, the capillary core layer 202 near the opening first contacts the water vapor in the air and condenses to form a water film in the capillary core layer 202, which makes up for the problem of water loss caused by the water in the capillary core layer 202 absorbing heat, so that the temperature equalizing plate can realize that the working medium (water) in the capillary core layer 202 can be directly replenished from the atmosphere, thereby realizing the recovery of water vapor from the air.

[0047] In some embodiments, a hygroscopic material is disposed in the hygroscopic layer 204, and the hygroscopic material includes one or more of a hygroscopic hydrogel, a hygroscopic MOF, and a hygroscopic inorganic salt material.

[0048] Specifically, the hygroscopic material can absorb moisture in the air and condense to form a water film on the capillary core layer 202, thereby recovering water vapor from the air and providing sufficient moisture for heat dissipation.

[0049] In some embodiments, the hydrophobic breathable layer 203 is a hydrophobic breathable membrane, and the material of the hydrophobic breathable membrane is PP membrane, PTFE membrane or PVDF membrane.

[0050] The hydrophobic breathable layer 203 is a thin film that allows water vapor to pass through but does not allow liquid water to pass through.

[0051] In some embodiments, the housing 205 is made of thermally conductive material.

[0052] Specifically, the shell 205 has a high thermal conductivity and is a watertight container capable of accommodating the above-mentioned layers of structure, and can provide certain mechanical support for the entire assembly according to specific application scenarios.

[0053] It can be a copper plate, an aluminum plate, or a plastic with high thermal conductivity.

[0054] In some embodiments, the shell 205 is made of metal, alloy, thermally conductive plastic, metal nitride, metal oxide, silicon carbide, boron nitride, silicon oxide or silicon nitride.

[0055] Specifically, the metal material includes copper, aluminum, titanium, stainless steel, etc.; the metal nitride includes aluminum nitride, etc.; the metal oxide includes aluminum oxide, zinc oxide, etc.

[0056] It should be noted that the present application does not limit the size and structure of the opening of the shell 205, as long as the moisture absorption layer 204 can absorb moisture from the air.

[0057] like Figure 3 As shown, the present application provides another embodiment. On the basis of the above embodiment, a vapor migration layer 207 is added between the waterproof and breathable layer 201 and the capillary core layer 202, and the rest of the structure is the same as that of the embodiment, as follows.

[0058] In another embodiment, a vapor migration layer 207 is further provided between the capillary core layer 202 and the waterproof breathable layer 201 , and the vapor migration layer 207 includes at least one cavity, which is respectively connected to the waterproof breathable layer 201 and the capillary core layer 202 , and each cavity is connected to each other.

[0059] Specifically, the steam transfer layer 207 is arranged between the capillary core layer 202 and the waterproof breathable layer 201, and a cavity is arranged in the steam transfer layer 207. When the shell 205 absorbs external heat, the water on the surface of the capillary core layer 202 absorbs heat and evaporates to form water vapor, and the water vapor moves to the steam transfer layer 207. There are high-temperature areas and low-temperature areas in the cavity. The water vapor in the steam transfer layer 207 will flow from the high-temperature area to the low-temperature area, accelerating the cooling, improving the cooling rate and heat diffusion. At the same time, a small amount of water vapor diffuses from the steam transfer layer 207 to the waterproof breathable layer 201, and diffuses from the waterproof breathable layer 201 to the atmosphere.

[0060] Specifically, a steam transfer layer 207 is provided between the capillary core layer 202 and the waterproof breathable layer 201. The water in the capillary core layer 202 can form water vapor by absorbing the heat outside the shell 205, and the water vapor diffuses to the steam transfer layer 207. The steam transfer layer 207 includes at least one cavity, and each cavity is interconnected to facilitate the flow of water vapor in the cavity. The water vapor can flow horizontally or in the same direction as the extension direction of the steam transfer layer 207 to a place with lower temperature to condense, thereby realizing efficient heat diffusion and improving the cooling rate.

[0061] The cavity in the vapor transfer layer 207 is connected with the waterproof breathable layer 201 and the capillary core layer 202 respectively, which means that the side of the cavity facing the capillary core layer 202 is connected with the capillary core layer 202, so that the water vapor on the surface of the capillary core layer 202 can directly enter the cavity, and the side of the cavity facing the waterproof breathable layer 201 is connected with the waterproof breathable layer 201, so that part of the water vapor in the cavity can enter the waterproof breathable layer 201 and pass through the waterproof breathable layer 201 into the atmosphere; at the same time, it is also beneficial for the hygroscopic layer 204 to absorb moisture in the air according to the pressure difference, and the moisture passes through the cavity of the waterproof breathable layer 201 and the vapor transfer layer 207, and condenses on the surface of the capillary core layer 202 to form a layer of water film.

[0062] In another embodiment, a plurality of columns are spaced apart in the vapor migration layer 207 , one end of each column abuts against a side of the capillary core layer 202 away from the hydrophobic breathable layer 203 , and each column extends from the capillary core layer 202 toward the waterproof breathable layer 201 .

[0063] Specifically, the interior of the steam transfer layer 207 may have only one cavity, or the interior of the steam transfer layer 207 may contain two or more cavities. A plurality of columns are arranged in the steam transfer layer 207, such as two columns are arranged in the steam transfer layer 207, and a cavity is formed between the two columns; when more than two columns are arranged in the steam transfer layer 207 to form a plurality of cavities, the number of columns may be set according to actual needs to obtain different numbers of cavities. When water vapor diffuses into the steam transfer layer 207, the steam transfer layer 207 contains a plurality of cavities, and the water vapor can flow from the high temperature area to the low temperature area in the plurality of cavities, which can quickly cool down, improve the heat diffusion efficiency, increase the cooling rate of the temperature evaporating plate, and enhance the cooling effect.

[0064] Specifically, the present application does not limit the structure and material of the column, such as the cross-sectional shape of the column can be a polygon or a figure formed by a combination of arcs and straight lines, etc. For example, the column can be a cylinder, a cuboid, a cube, an n-sided prism (n is greater than or equal to 3), an m-sided prism (m is greater than or equal to 3), a sphere, a pyramid, etc.

[0065] A plurality of columns are arranged at intervals in the steam migration layer 207, one end of the column abuts against the side of the capillary core layer 202 away from the hydrophobic breathable layer 203, and the column extends from the capillary core layer 202 toward the waterproof breathable layer 201, and there is a situation where one end of the column abuts against the capillary core layer 202 and the other end of the column abuts against the waterproof breathable layer 201. The plurality of columns arranged in the steam migration layer 207 are arranged at intervals so that there are a plurality of gaps in the steam migration layer 207, and there is a gap between every two columns, so that water vapor can flow from the high temperature area to the low temperature area.

[0066] In another embodiment, a plurality of columns are spaced apart in the cavity of the vapor migration layer 207 .

[0067] Specifically, multiple columns are arranged in the cavity of the steam migration layer 207 at intervals. Water vapor flows in the cavity. There are gaps between each of the multiple columns, which increases the flow resistance of water vapor, facilitates rapid cooling of water vapor, and improves the heat dissipation effect of the temperature equalizer.

[0068] A plurality of columns are disposed in the cavity of the steam migration layer 207 and also play a role in supporting and maintaining the cavity structure.

[0069] Specifically, the material of the column is metal material, alloy material, thermal conductive plastic, metal nitride, metal oxide, silicon carbide, boron nitride, silicon oxide or silicon nitride.

[0070] Specifically, the metal material includes copper, aluminum, titanium, stainless steel, etc.; the metal nitride includes aluminum nitride, etc.; the metal oxide includes aluminum oxide, zinc oxide, etc.

[0071] The column may be etched from a whole piece of material, or the column may be a columnar structured material. In a second aspect, the present application provides an electronic device, comprising a heating device and the above-mentioned open-type temperature evaporating plate, wherein the open-type temperature evaporating plate is connected to the heating device.

[0072] Specifically, the open temperature vapor chamber is applied to electronic equipment and connected to the heating device, which can effectively cool the heating device and dissipate heat efficiently. At the same time, it can be recycled sustainably by recovering water vapor from the air.

[0073] The present application is further described below by way of examples.

[0074] Example 1

[0075] like Figure 2 As shown, the structure of the temperature homogenizing plate in this embodiment is as follows:

[0076] The shell 205 is open at the top, and the inside of the shell 205 is provided with a hygroscopic layer 204, a hydrophobic breathable layer 203, a capillary core layer 202 and a waterproof breathable layer 201 from bottom to top. The side of the waterproof breathable layer 201 away from the capillary core layer 202 is connected to the atmosphere.

[0077] Example 2

[0078] like Figure 3 As shown, the structure of the temperature homogenizing plate in this embodiment is as follows:

[0079] The top of the shell 205 is open, and the inside of the shell 205 is provided with a hygroscopic layer 204, a hydrophobic breathable layer 203, a capillary core layer 202, a vapor migration layer 207 and a waterproof breathable layer 201 from bottom to top. The side of the waterproof breathable layer 201 facing away from the vapor migration layer 207 is connected to the atmosphere.

[0080] A plurality of columns (more than two columns) are arranged in the steam migration layer 207, and interconnected cavities are formed between the columns, and steam can flow in the cavities.

[0081] Comparative Example 1

[0082] like Figure 1 As shown, the structure of the temperature equalizing plate of this comparative example is as follows:

[0083] The shell 205 includes a sealed cavity 103, in which a capillary wick 104, a liquid phase medium 105, and a vapor phase medium 107 are arranged from bottom to top, and a thermal interface material 102 and a heat sink 101 are arranged on the top of the sealed cavity 103; a heating point 106 is arranged outside the shell 205.

[0084] The temperature homogenizing plate samples prepared in the above-mentioned Examples 1-2 and Comparative Example 1 were used to perform a heat dissipation test simulating the heat dissipation scenario of the back panel of a mobile phone, wherein the sample size was 70×70 mm and the thickness was 1 mm; a heater was used to simulate a heat-generating electronic device, and constant power heating was applied, wherein Example 1 was uniform heating, and the size of the heater was consistent with the size of the sample, and Example 2 was centralized heating, and the size of the heater was smaller than the size of the sample (40×40 mm); the waterproof and breathable layer 201 in Examples 1-2 was facing the atmosphere and placed in a windless indoor environment, and the temperature changes were recorded.

[0085] The test results of the temperature change at the hot spot position of Example 1 and Comparative Example 1 are as follows: Figure 4 As shown, the test results of the temperature change at the hot spot position of Example 2 and Comparative Example 1 are as follows Figure 5 As shown. Figure 4 It can be seen that the temperature at the hot spot of the heat plate structure in Example 1 is reduced by about 6°C compared with that in Comparative Example 1. Figure 5 It can be seen that compared with Example 1, the heat dissipation temperature of the heat absorbing plate structure of Example 2 is about 13°C lower than that of the heat absorbing plate structure of Example 1. Figure 3 , 4 It can be seen that the heat dissipation effect of the temperature equalizing plate provided in the present application is good, the temperature reduction is obvious, and the temperature drops greatly. At the same time, a steam migration layer 207 is arranged between the waterproof and breathable layer 201 and the capillary core layer 202, and a cavity is arranged in the steam migration layer 207 for water vapor to flow from the high temperature zone to the low temperature zone, which accelerates the cooling, improves the heat dissipation effect, and has a significant cooling effect.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An open temperature equalizing plate, characterized in that: The invention comprises a shell with an opening at one end, wherein a hygroscopic layer, a hydrophobic breathable layer and a capillary core layer are arranged in the shell, wherein the hydrophobic breathable layer is arranged between the hygroscopic layer and the capillary core layer, and the capillary core layer has a side away from the hydrophobic breathable layer facing the opening.

2. The open temperature homogenizing plate according to claim 1, characterized in that: A waterproof and breathable layer is provided on the side of the capillary core layer away from the hydrophobic and breathable layer, and the side of the waterproof and breathable layer away from the capillary core layer is connected to the atmosphere; The side of the waterproof and breathable layer away from the capillary core layer faces the opening; or the outer periphery of the waterproof and breathable layer abuts against the inner edge of the opening, and the side of the waterproof and breathable layer away from the capillary core layer extends out of the opening.

3. The open temperature homogenizing plate according to claim 2, characterized in that: A vapor transfer layer is further arranged between the capillary core layer and the waterproof breathable layer. The vapor transfer layer includes at least one cavity. The cavity is respectively connected to the waterproof breathable layer and the capillary core layer, and each cavity is connected to each other.

4. The open temperature homogenizing plate according to claim 3, characterized in that: A plurality of columns are arranged at intervals in the vapor transport layer, one end of each column abuts against a side of the capillary core layer away from the hydrophobic breathable layer, and each column extends from the capillary core layer toward the waterproof breathable layer.

5. The open temperature homogenizing plate according to claim 2, characterized in that: The waterproof and breathable layer is a porous structure for water vapor to pass through.

6. The open temperature homogenizing plate according to claim 1, characterized in that: The outer side of the shell has a heat conducting portion, and the heat conducting portion is arranged on a side of the shell away from the opening.

7. The open temperature homogenizing plate according to claim 6, characterized in that: The opening is arranged on the first side surface of the shell, the heat conducting part is arranged on the second side surface of the shell, the first side surface and the second side surface are arranged opposite to each other, one side of the hygroscopic layer abuts against the inner wall of the second side surface of the shell, and the projection of the hygroscopic layer on the second side surface covers the heat conducting part.

8. The open temperature homogenizing plate according to claim 1, characterized in that: The hygroscopic layer is provided with a hygroscopic material, and the hygroscopic material includes one or more of hygroscopic hydrogel, hygroscopic MOF, and hygroscopic inorganic salt material.

9. The open temperature homogenizing plate according to claim 1, characterized in that: The shell is made of heat-conducting material.

10. An electronic device, characterized in that: It comprises a heating device and an open temperature averaging board as described in any one of claims 1 to 9, wherein the open temperature averaging board is connected to the heating device.

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