High-integration high-speed VPX module capable of being subjected to back insertion and wiring

By designing the installation slots and cavity of the small module on the mid-layer board of the VPX module, the problems of low space utilization and poor heat dissipation after the integration of the VPX module are solved, and high integration and good heat dissipation effect are achieved.

CN222869263UActive Publication Date: 2025-05-13成都玖锦科技有限公司
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Patent Information

Application Number
CN202421646870.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-12
Publication Date
2025-05-13
Estimated Expiration
2034-07-12

AI Technical Summary

Technical Problem

The existing VPX modules have low space utilization and poor heat dissipation after integration.

Method used

A high-integrated high-speed VPX module with back plug and wiring is designed. By setting up multiple small module installation slots on the mid-layer board, the general VPX standard is adopted to increase the scalability and flexibility of the module, and a first cavity and a second cavity are arranged on the mid-layer board to improve heat dissipation effect.

Benefits of technology

High integration and good space utilization are achieved, while the stability and reliability of the module are improved by optimizing the heat dissipation design.

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Abstract

The utility model discloses a high-integration high-speed VPX module capable of being subjected to back insertion and wiring, which comprises an upper cover, a lower cover and a middle-layer plate, and is characterized in that the middle-layer plate is arranged between the upper cover and the lower cover and is connected with the upper cover and the lower cover, and the middle-layer plate is provided with a first cavity and a second cavity; and a plurality of small module mounting grooves are formed in one side, deviating from the first cavity and the second cavity, of the middle-layer plate. According to the utility model, the problem that the space utilization rate is low after the existing VPX module is integrated can be solved.
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Description

Technical Field

[0001] The present application relates to the field of electronic equipment facilities, and in particular to a high-speed VPX module that can be back-plugged and wired and is highly integrated. Background Art

[0002] The existing VPX standard modules only need to meet the requirements of normal heat dissipation of heat-generating devices and avoidance of protruding devices. In general, the interface basically uses a connector to connect the cable. The VPX module has multiple small modules built in, and these multiple small modules are interconnected. They need to dissipate heat during operation. However, due to the limitations of its structure, the existing VPX module has poor heat dissipation effect and low space utilization after integration.

[0003] The above contents are only used to assist in understanding the technical solution of the present application and do not constitute an admission that the above contents are prior art. Utility Model Content

[0004] The main purpose of the present application is to provide a high-speed VPX module that can be back-plugged and wired and is highly integrated, aiming to solve the problem of low space utilization after the existing VPX module is integrated.

[0005] To achieve the above-mentioned objectives, the present application provides a high-speed VPX module that is back-pluggable and wired, and is highly integrated, comprising an upper cover, a lower cover, and a middle layer board, wherein the middle layer board is arranged between the upper cover and the lower cover and is connected to the upper cover and the lower cover, and a first cavity and a second cavity are arranged on the middle layer board, and a plurality of small module mounting grooves are arranged on the side of the middle layer board that is away from the first cavity and the second cavity.

[0006] Optionally, the middle layer board is further provided with a debugging interface, a working status interface and two output interfaces, wherein the debugging interface, the working status interface and the two output interfaces are sequentially arranged on one side of the middle layer board.

[0007] Optionally, connecting plates are provided on both sides of the middle plate, and the lower cover is connected to the middle plate via the connecting plates.

[0008] Optionally, the upper cover includes an upper cover body and an upper connecting plate, wherein the upper cover body is provided with an installation cavity; the upper connecting plate is arranged on the periphery of the upper cover body, and a plurality of upper connecting holes are arranged at intervals on the upper connecting plate, and the upper cover is bolted to the middle plate through the plurality of upper connecting holes.

[0009] Optionally, two first input interfaces and one first output interface are respectively provided on one side of the upper cover body.

[0010] Optionally, the lower cover includes a lower cover body and a plurality of dividing strips, wherein the plurality of dividing strips are arranged on a side of the lower cover body facing the middle plate, and the plurality of dividing strips divide the lower cover body into four chambers.

[0011] Optionally, the back-insertable and wireable high-integrated high-speed VPX module further includes a locking bar, wherein the locking bar is fixed to both sides of the lower cover and connected to the middle board.

[0012] Optionally, three first small modules are arranged between the upper cover and the middle layer board, wherein the three first small modules are all connected to the side of the middle layer board facing the upper cover; three second small modules are arranged between the lower cover and the middle layer board, wherein the three second small modules are all connected to the side of the middle layer board facing the lower cover.

[0013] Optionally, a PCB board and a back-insertion high-speed connector are further provided between the lower cover and the middle layer board, and the PCB board and the back-insertion high-speed connector are connected to a side of the middle layer board facing the lower cover.

[0014] Optionally, the thickness of the middle plate is a, the thickness of the upper cover is b, the thickness of the lower cover is c, a>b and a>c.

[0015] The embodiment of the present application proposes a high-speed VPX module that is back-pluggable and wireable and highly integrated. By designing multiple small module installation slots of standard sizes on the middle board, the scalability and flexibility of the module are increased. These small module installation slots adopt the universal VPX standard, so that various small modules that meet the standard can be easily installed on the middle board. In this way, users can flexibly configure and expand the functions of the module according to actual needs, and the space utilization rate is high; moreover, a first cavity and a second cavity are set on the middle board, and all small modules are integrated on the middle board, so that they maintain a certain distance from the upper cover and the lower cover, which is conducive to the heat dissipation of the module during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the three-dimensional structure of an upper cover of a high-speed VPX module that can be back-plugged and wired and is highly integrated provided in an embodiment of the present application;

[0017] Figure 2 A schematic diagram of the three-dimensional structure of a middle-layer board of a high-speed VPX module that can be back-plugged and wired and has high integration provided in an embodiment of the present application;

[0018] Figure 3 for Figure 2 A schematic diagram of the structure from another perspective;

[0019] Figure 4 for Figure 3 AA section view;

[0020] Figure 5A schematic diagram of the three-dimensional structure of a lower cover of a high-speed VPX module that can be back-plugged and wired and is highly integrated provided in an embodiment of the present application;

[0021] Figure 6 for Figure 5 Schematic diagram of the structure from another perspective.

[0022] Among them, 1. upper cover; 101. upper cover body; 102. upper connecting plate; 103. upper connecting hole; 104. first input interface; 105. first output interface; 2. lower cover; 201. lower cover body; 202. dividing strip; 3. middle plate; 301. first cavity; 302. second cavity; 303. small module installation slot; 304. debugging interface; 305. working status interface; 306. output interface; 307. connecting plate.

[0023] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0026] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0028] See also Figure 1 to Figure 5 The embodiment of the present application provides a back-pluggable and wired high-integrated high-speed VPX module, which may include an upper cover 1, a lower cover 2 and a middle-layer board 3, wherein the middle-layer board 3 is arranged between the upper cover 1 and the lower cover 2 and connected to the upper cover 1 and the lower cover 2, and a first cavity 301 and a second cavity 302 are arranged on the middle-layer board 3, and a plurality of small module mounting grooves 303 are arranged on the side of the middle-layer board 3 away from the first cavity 301 and the second cavity 302.

[0029] In this embodiment, the middle board 3 is carefully designed and optimized to further improve the integration and reliability of the high-speed VPX module. Specifically, the middle board 3 is made of high-performance thermal conductive and insulating materials to ensure that the temperature of the module can be effectively controlled during high-load operation, while ensuring safe isolation between circuits. In addition, the first cavity 301 and the second cavity 302 on the middle board 3 are designed to be of different sizes and shapes to meet the installation requirements of small modules of different sizes and types.

[0030] It is worth mentioning that by designing a plurality of small module installation slots 303 of standard sizes on the middle board 3, the scalability and flexibility of the module are increased. These small module installation slots 303 adopt the universal VPX standard, so that various small modules that meet the standard can be easily installed on the middle board 3. In this way, users can flexibly configure and expand the functions of the modules according to actual needs, and the space utilization rate is high; moreover, the first cavity 301 and the second cavity 302 are set on the middle board, and all the small modules are integrated on the middle board 3, so that they are kept at a certain distance from the upper cover 1 and the lower cover 2, which is conducive to the heat dissipation of the modules during use.

[0031] In this embodiment, the above design not only achieves high integration of high-speed VPX modules, but also ensures the stability and reliability of the modules. At the same time, by adopting the standard VPX small module installation slot, the modules have good compatibility and scalability, providing users with more choices and convenience.

[0032] See also Figure 2 The middle board 3 is also provided with a debugging interface 304 , a working status interface 305 and two output interfaces 306 , wherein the debugging interface 304 , the working status interface 305 and the two output interfaces 306 are sequentially arranged on one side of the middle board 3 .

[0033] It should be noted that the design of the debugging interface 304 fully considers the convenience and safety of the module during the debugging process. The working status interface 305 is to facilitate users to monitor the working status of the module in real time. It can transmit the working status information of the module to an external display device or monitoring system through a simple connection method, so that users can understand the operation of the module at any time. This design greatly improves the reliability and ease of use of the module. The design of the two output interfaces 306 takes into account the data interaction between the module and the external device. They are respectively connected to the middle board 3 to ensure the stability and reliability of data transmission. At the same time, the output interface 306 also has high-speed transmission capability, which can meet the needs of the module in high-speed data transmission scenarios.

[0034] See also Figure 2 , Figure 3 as well as Figure 4 , connecting plates 307 are provided on both sides of the middle plate 3, and the lower cover 2 is connected to the middle plate 3 through the connecting plates 307.

[0035] The design of the connecting plate 307 fully considers the structural stability and connection reliability of the module, ensuring that the connection between it and the middle plate 3 is firm and stable.

[0036] See also Figure 1 The upper cover 1 may include an upper cover body 101 and an upper connecting plate 102, wherein the upper cover body 101 is provided with a mounting cavity; the upper connecting plate 102 is arranged on the outer periphery of the upper cover body 101, and a plurality of upper connecting holes 103 are arranged at intervals on the upper connecting plate 102, and the upper cover 1 is bolted to the middle plate 3 through the plurality of upper connecting holes 103.

[0037] In this embodiment, the design of the upper cover 1 not only focuses on the stability of the structure, but also takes into account the convenience of installation. Specifically, the installation cavity of the upper cover body 101 provides enough space for the middle plate 3 to accommodate various small modules and interfaces. The multiple upper connection holes 103 on the upper connection plate 102 correspond to the corresponding holes on the middle plate 3, and the upper cover 1 and the middle plate 3 are firmly connected together by bolt connection. This connection method not only ensures the stability of the structure, but also facilitates the disassembly and maintenance of the module.

[0038] See also Figure 1 Two first input interfaces 104 and one first output interface 105 are respectively disposed on one side of the upper cover 101 .

[0039] The first input interface 104 is designed to receive data or instructions sent by an external device to ensure that the data can smoothly enter the high-speed VPX module for processing. At the same time, the first input interface 104 also uses high-performance interface technology to meet the needs of high-speed data transmission and ensure the integrity and real-time performance of the data. The first output interface 105 is used to output the data or results processed by the module to an external device to achieve two-way transmission and interaction of data. This design not only improves the versatility and scalability of the module, but also provides users with a more flexible and convenient user experience.

[0040] See also Figure 5 , Figure 6 The lower cover 2 may include a lower cover body 201 and a plurality of dividing strips 202 , wherein the plurality of dividing strips 202 are arranged on a side of the lower cover body 201 facing the middle plate 3 , and the plurality of dividing strips 202 divide the lower cover body 201 into four chambers.

[0041] Specifically, by setting a plurality of dividing strips 202 on the side of the lower cover 201 facing the middle board 3, the lower cover 201 is divided into four independent chambers, each of which can accommodate different small modules or interfaces. This design not only improves the heat dissipation performance of the module, but also reduces the electromagnetic interference between different modules, ensuring the stability and reliability of the module. At the same time, the plurality of dividing strips 202 also play a role in supporting and fixing the middle board 3, further enhancing the structural stability of the module.

[0042] It is worth noting that the size and shape of each chamber can be adjusted and optimized according to actual needs to adapt to the installation requirements of different small modules or interfaces.

[0043] Furthermore, the back-insertable and wireable high-integrated high-speed VPX module further includes locking strips, wherein the locking strips are fixed to both sides of the lower cover 2 and connected to the middle board 3 .

[0044] Among them, the locking strip is designed to ensure the overall structural stability and installation stability of the module. It is made of high-strength material and can withstand certain external pressure and impact to ensure that the module can work normally in harsh environments. The two ends of the locking strip are tightly connected to the two sides of the lower cover 2, and the middle part is connected to the middle plate 3 to form a stable support structure. This design not only enhances the module's anti-seismic ability, but also improves the module's heat dissipation performance, allowing the module to maintain a lower temperature when running at high load, thereby extending the module's service life.

[0045] Furthermore, three first small modules are arranged between the upper cover 1 and the middle layer board 3, wherein the three first small modules are all connected to the side of the middle layer board 3 facing the upper cover 1; three second small modules are arranged between the lower cover 2 and the middle layer board 3, wherein the three second small modules are all connected to the side of the middle layer board 3 facing the lower cover 2.

[0046] Among them, the design of these small modules further enhances the functionality and flexibility of the high-speed VPX module. Each small module has independent functions and interfaces, and can be flexibly configured and expanded according to user needs. In this embodiment, the three first small modules are respectively located between the upper cover 1 and the middle board 3, and they can be easily installed and removed through the small module installation slots 303 on the middle board 3. Similarly, the three second small modules are located between the lower cover 2 and the middle board 3, and are also installed and connected through the small module installation slots 303.

[0047] These small modules can be various types of modules, such as signal processing modules, communication modules, control modules, etc. They can work alone or in conjunction with other modules to achieve more complex functions. By providing a plurality of small module installation slots 303 on the middle layer board 3, users can flexibly configure and combine small modules as needed to meet different application scenarios and requirements.

[0048] Furthermore, a PCB board and a back-insertion high-speed connector are provided between the lower cover 2 and the middle layer board 3 , and the PCB board and the back-insertion high-speed connector are connected to a side of the middle layer board 3 facing the lower cover 2 .

[0049] It should be noted that bosses are left on the sides and middle of the lower cover 2 for support, which effectively protects the PCB board; the middle part of the lower cover 2 is designed to accommodate the small module, and reinforcing ribs are left to ensure the strength of the lower cover 2 so that the lower cover 2 will not be deformed due to being too thin.

[0050] Among them, the introduction of PCB board and back-inserted high-speed connector brings higher integration and connection speed to the high-speed VPX module. As the basic carrier of the circuit, the rationality and stability of the design of the PCB board directly affect the performance of the entire module. In this embodiment, the setting of the PCB board ensures the stability and reliability of the circuit.

[0051] Furthermore, the thickness of the middle plate 3 is a, the thickness of the upper cover 1 is b, the thickness of the lower cover 2 is c, and a>b and a>c.

[0052] Such a design makes the middle board 3 the core part of the entire module, which not only carries the task of high-speed data transmission, but also connects various small modules and interfaces to ensure the smooth flow of data. The relatively thin upper cover 1 and lower cover 2 are mainly responsible for the external protection and structural support of the module, while reducing the occupation of internal space, making the entire module more compact and efficient.

[0053] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A high-speed VPX module that can be back-plugged and wired and is highly integrated, characterized in that: include: Upper cover (1); Lower cover (2); A middle layer plate (3) is arranged between the upper cover (1) and the lower cover (2) and is connected to the upper cover (1) and the lower cover (2); a first cavity (301) and a second cavity (302) are arranged on the middle layer plate (3); and a plurality of small module mounting grooves (303) are arranged on a side of the middle layer plate (3) facing away from the first cavity (301) and the second cavity (302).

2. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 1, characterized in that: The middle layer board (3) is also provided with a debugging interface (304), a working status interface (305) and two output interfaces (306), wherein the debugging interface (304), the working status interface (305) and the two output interfaces (306) are sequentially arranged on one side of the middle layer board (3).

3. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 1, characterized in that: Connecting plates (307) are provided on both sides of the middle plate (3), and the lower cover (2) is connected to the middle plate (3) via the connecting plates (307).

4. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 1, characterized in that: The upper cover (1) comprises: The upper cover body (101) is provided with a mounting cavity; An upper connecting plate (102) is arranged on the outer periphery of the upper cover body (101), and a plurality of upper connecting holes (103) are arranged at intervals on the upper connecting plate (102). The upper cover (1) is bolted to the middle plate (3) via the plurality of upper connecting holes (103).

5. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 4, characterized in that: Two first input interfaces (104) and one first output interface (105) are respectively arranged on one side of the upper cover body (101).

6. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 1, characterized in that: The lower cover (2) comprises: Lower cover body (201); A plurality of dividing strips (202) are arranged on a side of the lower cover (201) facing the middle plate (3), and the plurality of dividing strips (202) divide the lower cover (201) into four chambers.

7. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 1, characterized in that: The back-insertable and wire-connectable high-speed VPX module also includes: A locking strip is fixed to both sides of the lower cover (2) and connected to the middle plate (3).

8. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 1, characterized in that: Three first small modules are arranged between the upper cover (1) and the middle plate (3), wherein the three first small modules are all connected to a side of the middle plate (3) facing the upper cover (1); Three second small modules are arranged between the lower cover (2) and the middle plate (3), wherein the three second small modules are all connected to a side of the middle plate (3) facing the lower cover (2).

9. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 8, characterized in that: A PCB board and a back-insertion high-speed connector are also provided between the lower cover (2) and the middle layer board (3); the PCB board and the back-insertion high-speed connector are connected to a side of the middle layer board (3) facing the lower cover (2).

10. The back-pluggable and wireable high-integrated high-speed VPX module according to claim 1, characterized in that: The thickness of the middle plate (3) is a, the thickness of the upper cover (1) is b, and the thickness of the lower cover (2) is c, where a>b and a>c.