Surface-mounted packaging structure of Mini or Micro LED

Abstract

The utility model provides a Mini or Micro LED surface mount packaging structure, comprising a substrate and LED chips, the front side surface of the substrate is provided with a plurality of placing grooves used for placing the LED chips, the substrate is provided with a plurality of heat dissipation holes, the LED chips are packaged into a whole through pouring sealant in each placing groove, the periphery of each placing groove is provided with a plurality of through holes, and the through holes are communicated with the LED chips. A rubber column matched with the through hole is arranged on the rear side face of the LED chip, the rubber column penetrates through the through hole and is fixed at the through hole, and an epoxy resin layer is packaged outside the LED chip. The beneficial effects of the utility model are that under the cooperation of the rubber columns and the through holes, the fixity of the LED chips is increased, and the problem of warping of the LED chips is reduced; and the epoxy resin layer is encapsulated outside the LED chip, so that the waterproof property and the anti-corrosion property are provided.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED packaging, in particular to a surface-mount packaging structure of Mini or Micro LED. Background Art

[0002] One packaging structure of Mini or Micro LED is COB packaging, which is the direct packaging of LED chips on the circuit board. At present, this type of LED surface mount packaging structure is generally only fixed with potting glue, which is prone to board warping problems; LED chips have poor waterproof properties, which reduces their service life. Utility Model Content

[0003] Based on the problems arising in the above background, the purpose of the utility model is to provide a surface mount packaging structure of Mini or Micro LED, which effectively improves the problem of board warping after packaging, enhances its waterproof and corrosion resistance, and improves its service life.

[0004] The technical solution of the utility model is: a surface-mount packaging structure of Mini or Micro LED, including a substrate and an LED chip, wherein a plurality of placement grooves for placing LED chips are provided on the front side of the substrate, and a plurality of heat dissipation holes are provided on the substrate, the LED chip is packaged into one body in each placement groove by potting glue, a plurality of through holes are provided around the placement groove, a glue column matching the through hole is provided on the rear side of the LED chip, the glue column passes through the through hole and is fixed at the through hole, and an epoxy resin layer is encapsulated on the outside of the LED chip.

[0005] Furthermore, the substrate is an aluminum nitride ceramic substrate, on which circuits and pads are printed.

[0006] Furthermore, the LED chip is a three-primary-color SMD LED of red, green and blue.

[0007] Furthermore, the LED chip is electrically connected to the aluminum nitride ceramic substrate via a connecting wire.

[0008] Furthermore, a mounting hole is provided on the substrate.

[0009] Furthermore, the glue column is a semi-cured glue film, which is passed through the front side of the substrate during installation and is fixed on the rear surface of the substrate by high-temperature molding. The glue column is epoxy glue or silicone glue with a low expansion coefficient.

[0010] The advantages and positive effects of the utility model are: by adopting the above technical solution, with the cooperation of the glue column and the perforation, the fixation of the LED chip is increased and the problem of board warping is reduced; the epoxy resin layer encapsulating the outside of the LED chip provides pull-up waterproofness and corrosion resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0012] Figure 2 It is a schematic diagram of the structure of the substrate.

[0013] In the figure: DETAILED DESCRIPTION

[0014] like Figure 1-2 As shown, the technical solution of the utility model is: a surface-mount packaging structure of Mini or Micro LED, including a substrate 1 and an LED chip 2. The front side of the substrate 1 is provided with a plurality of placement grooves 3 for placing the LED chip 2, and the substrate 1 is provided with a plurality of heat dissipation holes 4, which play a role in heat dissipation for the substrate 1. The LED chip 2 is packaged into one body in each placement groove 3 by potting glue, and a plurality of perforations 5 are provided around the placement groove 3. A glue column 6 matching the perforation 5 is provided on the rear side of the LED chip 1. The glue column 6 passes through the perforation 5 and is fixed at the perforation 5. It is fixed under the joint action of the glue column 6 and the potting glue, which effectively reduces the occurrence of board warping, improves the epoxy resin layer 7 encapsulated on the outside of the LED chip 2, and has good waterproofness, corrosion resistance and UV resistance.

[0015] In this embodiment, the substrate 1 is an aluminum nitride ceramic substrate, and circuits and pads are printed on the substrate 1 .

[0016] In this embodiment, the LED chip 2 is a three-primary-color SMD LED of red, green and blue.

[0017] In this embodiment, the LED chip 2 is electrically connected to the aluminum nitride ceramic substrate 1 via a connecting wire.

[0018] In this embodiment, the substrate 1 is provided with mounting holes to facilitate its installation.

[0019] In this embodiment, the glue column 6 is a semi-cured glue film, and the glue column is epoxy glue or silicone glue with a low expansion coefficient.

[0020] The working process and principle of this embodiment: during installation, the glue column 6 of the LED chip 2 is passed through the front side of the through hole 55 of the substrate 1, and is fixed on the rear surface of the substrate 1 by high-temperature molding. At the same time, each LED chip 2 is encapsulated in the placement groove 3 by potting glue.

[0021] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A surface mount packaging structure for Mini or Micro LED, characterized in that: It includes a substrate and an LED chip. The front side of the substrate is provided with a plurality of placement grooves for placing LED chips, and the substrate is provided with a plurality of heat dissipation holes. The LED chip is packaged into one body in each placement groove by potting glue. A plurality of through holes are provided around the placement groove. A glue column matching the through hole is provided on the rear side of the LED chip. The glue column passes through the through hole and is fixed at the through hole, and an epoxy resin layer is encapsulated on the outside of the LED chip.

2. A surface mount packaging structure for Mini or Micro LED according to claim 1, characterized in that: The substrate is an aluminum nitride ceramic substrate, on which circuits and pads are printed.

3. The surface mount packaging structure of Mini or Micro LED according to claim 1, characterized in that: The LED chip is a SMD LED with three primary colors: red, green and blue.

4. The surface mount packaging structure of Mini or Micro LED according to claim 1, characterized in that: The LED chip is electrically connected to the aluminum nitride ceramic substrate through a connecting wire.

5. The surface mount packaging structure of Mini or Micro LED according to claim 1, characterized in that: The base plate is provided with a mounting hole.

6. The surface mount packaging structure of Mini or Micro LED according to claim 1, characterized in that: The glue column is a semi-cured glue film, which is epoxy glue or silicone glue with a low expansion coefficient.

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