Packaging structure integrated with multiple light-emitting chips

Abstract

The utility model relates to a packaging structure integrated with multiple light-emitting chips. The packaging structure integrated with the multiple light-emitting chips comprises a substrate; the rewiring layer is located above the substrate, the surface, away from the substrate, of the rewiring layer is provided with a sunken structure, and the inner diameter of the sunken structure is gradually increased from the substrate to the direction away from the substrate; the light-emitting chips comprise light-emitting surfaces and back surfaces opposite to the light-emitting surfaces, the light-emitting chips are located in the sunken structures of the rewiring layer, and the back surfaces of at least part of the light-emitting chips are attached to the side walls of the sunken structures; the light-emitting chip is electrically connected with the substrate through the rewiring layer. According to the utility model, not only is the aperture problem caused by independent packaging of a single light-emitting chip solved, but also shadows are reduced, the light-emitting uniformity of the packaging structure is improved, and the light-emitting effect is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a packaging structure integrating multiple light-emitting chips. Background Art

[0002] The packaging structure of the integrated light-emitting chip is to mount the light-emitting chip on the packaging substrate, so that the packaging structure has a light-emitting function. At present, the packaging structure of a single light-emitting chip is difficult to meet the user's demand for high brightness due to the low light-emitting power, so the packaging structure integrating multiple light-emitting chips came into being. The current packaging structure integrating multiple light-emitting chips includes a packaging substrate, a light-emitting chip mounted on the packaging substrate, and a circuit board (such as a PCB circuit board) for supplying power to the light-emitting chip. However, in the current packaging structure integrating multiple light-emitting chips, each light-emitting chip is packaged separately, so that there is a gap between adjacent light-emitting chips, so that there is a shadow between the bright spot halo and the light source when emitting light, affecting the light-emitting display effect. Moreover, the current packaging structure integrating multiple light-emitting chips has poor heat dissipation performance, which can easily cause the device to decay too quickly.

[0003] Therefore, how to improve the light-emitting effect of the packaging structure integrating multiple light-emitting chips and enhance the uniformity and brightness of the light is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The utility model provides a packaging structure integrating multiple light-emitting chips, which is used to improve the light-emitting effect of the packaging structure integrating multiple light-emitting chips and to increase the light-emitting brightness and light-emitting uniformity of the packaging structure.

[0005] According to some embodiments, the utility model provides a packaging structure integrating multiple light-emitting chips, including:

[0006] A rewiring layer is located above the substrate, a surface of the rewiring layer facing away from the substrate is provided with a concave structure, and an inner diameter of the concave structure gradually increases from the substrate to a direction away from the substrate;

[0007] A plurality of light-emitting chips, each of which comprises a light-emitting surface and a back surface opposite to the light-emitting surface, wherein the light-emitting chips are located in the recessed structure of the redistribution layer, and the back surfaces of at least some of the light-emitting chips are mounted on the inner sidewall of the recessed structure;

[0008] At least a portion of the light-emitting chips are electrically connected to the substrate through the redistribution layer.

[0009] In some embodiments, it also includes:

[0010] A transparent support block is located above the substrate, and the light-emitting surfaces of the plurality of light-emitting chips are mounted on the surface of the transparent support block. The inner side wall of the rewiring layer is distributed at least around the side of the transparent support block, and at least a part of the light-emitting chips are located between the transparent support block and the inner side wall of the recessed structure of the rewiring layer.

[0011] In some embodiments, the transparent support block includes a first surface facing the substrate, a second surface opposite to the first surface, and a side surface between the first surface and the second surface;

[0012] The first surface of the transparent support block is arranged in parallel with the second surface of the transparent support block, and the side surface of the transparent support block is obliquely intersected with the first surface of the transparent support block, and the transparent support block after mounting the light-emitting chip is adapted to the recessed structure of the rewiring layer.

[0013] In some embodiments, a portion of the light-emitting chips are mounted on the side of the transparent support block, and another portion of the light-emitting chips are mounted on the first surface of the transparent support block, and the multiple light-emitting chips located on the side of the transparent support block are distributed symmetrically around the center.

[0014] In some embodiments, the back side of the light-emitting chip mounted on the first surface of the transparent support block is flush with the surface of the rewiring layer facing the substrate, and the light-emitting chip is directly electrically connected to the substrate; or, the recessed structure of the rewiring layer also includes a recessed bottom surface, and the back side of the light-emitting chip mounted on the first surface of the transparent support block is electrically connected to the recessed bottom surface of the rewiring layer.

[0015] In some embodiments, it also includes:

[0016] A transparent cover plate is located on the second surface of the transparent support block, and a spherical lens array is protrudingly provided on the surface of the transparent cover plate facing away from the substrate.

[0017] In some embodiments, the transparent cover plate is a curved transparent cover plate, and a tangent line of the curved transparent cover plate is parallel to the light emitting chip located on a side surface of the transparent supporting block.

[0018] In some embodiments, it also includes:

[0019] A transparent adhesive film, the light-emitting surface of the light-emitting chip is adhered to the transparent adhesive film, and the light-emitting chip is fixed to the transparent supporting block through the transparent adhesive film.

[0020] In some embodiments, it also includes:

[0021] A plastic encapsulation layer is located above the substrate, the plastic encapsulation layer encapsulates the rewiring layer and the light-emitting chip, and a surface of the plastic encapsulation layer facing away from the substrate has an opening, and the transparent cover is located in the opening.

[0022] In some embodiments, it also includes:

[0023] The heat dissipation plate at least covers the side surface of the plastic sealing layer.

[0024] The packaging structure of integrated multiple light-emitting chips provided by the utility model is provided with a rewiring layer electrically connected to the substrate on the substrate, the surface of the rewiring layer facing away from the substrate is provided with a recessed structure, and multiple light-emitting chips are integrated inside the packaging structure, the light-emitting chips are located in the recessed structure of the rewiring layer, the backs of at least a portion of the light-emitting chips are attached to the inner sidewall of the recessed structure, and the multiple light-emitting chips are electrically connected to the substrate through the rewiring layer, which not only improves the luminous brightness of the packaging structure. Moreover, since the multiple light-emitting chips are packaged as one, the inner diameter of the recessed structure gradually increases from the substrate to the direction away from the substrate, that is, the recessed structure has an inclined inner sidewall, and at least a portion of the light-emitting chips are located on the inclined inner sidewall of the recessed structure, which not only solves the aperture problem caused by the independent packaging of a single light-emitting chip, but also reduces the shadow by making the light emitted by the light-emitting chip intersect through the inclined setting, thereby improving the uniformity of the light emission of the packaging structure and effectively improving the light-emitting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Attached Figure 1 It is a cross-sectional schematic diagram of a packaging structure integrating multiple light-emitting chips in a specific embodiment of the utility model;

[0026] Attached Figure 2 It is a schematic diagram of the arrangement of multiple light-emitting chips on a transparent adhesive film in a specific embodiment of the utility model;

[0027] Attached Figure 3 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after a transparent support block is formed on a carrier plate;

[0028] Attached Figure 4 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after the light-emitting chip is mounted on the transparent support block;

[0029] Attached Figure 5 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after a redistribution layer is formed;

[0030] Attached Figure 6 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after the redistribution layer is mounted on the substrate;

[0031] Attached Figure 7 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after the plastic sealing layer is formed;

[0032] Attached Figure 8 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after a transparent cover is formed. DETAILED DESCRIPTION

[0033] The specific implementation of the packaging structure of integrated multi-light-emitting chips provided by the utility model is described in detail below with reference to the accompanying drawings.

[0034] This specific embodiment provides a packaging structure integrating multiple light-emitting chips, Figure 1 Schematic diagram of the cross-section of the packaging structure of the integrated multi-light-emitting chip in the specific implementation mode of the utility model. Figure 1 As shown, the packaging structure of the integrated multi-light-emitting chip includes:

[0035] substrate 10;

[0036] A rewiring layer 12 is located above the substrate, and a concave structure is provided on the surface of the rewiring layer 12 facing away from the substrate 10, wherein the inner diameter of the concave structure gradually increases from the substrate to a direction away from the substrate;

[0037] A plurality of light-emitting chips 13, each of which comprises a light-emitting surface and a back surface opposite to the light-emitting surface, wherein the light-emitting chips 13 are located in the recessed structure of the redistribution layer 12, and at least a portion of the light-emitting chips 13 are mounted on the inner sidewall of the recessed structure;

[0038] At least a portion of the light-emitting chips are electrically connected to the substrate through the redistribution layer.

[0039] Specifically, the substrate 10 includes a top surface and a bottom surface that are relatively distributed. A circuit layer is arranged in the substrate 10. A plurality of lead solder balls 11 are arranged on the bottom surface of the substrate 10, and the lead solder balls 11 are electrically connected to the circuit layer in the substrate 10. The rewiring layer 12 is located on the top surface of the substrate 10. The rewiring layer 12 includes a dielectric layer and metal wiring located in the dielectric layer. The metal wiring is electrically connected to the circuit layer in the substrate 10 through an electrical connection bump 14 below the rewiring layer 12. The concave structure is arranged on the side of the rewiring layer 12 that is away from the substrate 10, and the concave structure extends from the surface of the rewiring layer 12 that is away from the substrate 10 to the inside of the rewiring layer 12. A plurality of light-emitting chips 13 are arranged in the concave structure of the rewiring layer 12. Each of the light-emitting chips 13 includes a light-emitting surface and a back surface that are relatively distributed. The light-emitting chip 13 emits a light signal to the outside through the light-emitting surface. The back surfaces of at least a portion of the light-emitting chips 13 are electrically connected to the rewiring layer 12, so as to realize electrical connection between the light-emitting chips 13 and the substrate 10 through the rewiring layer 12. In one example, the inner diameter of the recessed structure gradually increases from the substrate to the direction away from the substrate (for example, the direction in which the substrate 10 points to the rewiring layer 12), that is, the recessed structure can be a bowl-shaped groove, and the recessed structure at least includes an inner side wall obliquely intersecting with the top surface of the substrate 10, that is, the recessed structure has an inclined inner side wall. In one example, the recessed structure is a through structure, that is, the recessed structure penetrates the rewiring layer 12 in a direction perpendicular to the top surface of the substrate 10. In another example, the recessed structure also includes a recessed bottom surface, that is, the recessed structure does not penetrate the rewiring layer 12 in a direction perpendicular to the top surface of the substrate 10. The multiple described in this specific embodiment refers to more than two.

[0040] In this specific embodiment, the electrical connection between the light-emitting chip 13 and the substrate 10 is realized through the rewiring layer 12, which not only can integrate multiple light-emitting chips 13 inside the packaging structure, so that the luminous brightness of the packaging structure is improved, but also because the multiple light-emitting chips 13 are packaged as one, and the back of the light-emitting chip is attached to the inner side wall of the recessed structure and the bottom surface of the recessed structure, so that the light-emitting surfaces of the multiple light-emitting chips 13 emit light in the same direction, thereby improving the luminous brightness of the packaging structure integrating multiple light-emitting chips, and solving the aperture problem caused by the independent packaging of a single light-emitting chip. At the same time, because the inner side wall of the recessed structure of the rewiring layer 13 is tilted relative to the substrate 10, the light-emitting chip 13 located on the inner side wall of the recessed structure is tilted relative to the substrate 10, so that the light emitted by the light-emitting chip intersects and reduces shadows, improves the uniformity of the light emission of the packaging structure, and effectively improves the light-emitting effect.

[0041] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0042] A transparent support block 16 is located above the substrate 10, and the light-emitting surfaces 13 of the plurality of light-emitting chips are mounted on the surface of the transparent support block 16. The inner side wall of the redistribution layer 12 is distributed at least around the side of the transparent support block 16, and at least a portion of the light-emitting chips 13 are located between the transparent support block 16 and the inner side wall of the recessed structure.

[0043] Specifically, if Figure 1 As shown, the transparent support block 16 is located above the rewiring layer 12, and is used to support the multiple light-emitting chips 13 mounted on its surface to fix the light-emitting chips 13. The transparent support block 16 allows the light signal emitted by the light-emitting chip 13 to pass through. The light signal emitted by the light-emitting chip 13 is emitted after passing through the transparent support block 16. The inner side wall of the recessed structure of the rewiring layer 12 is distributed at least around the side of the transparent support block 16, and at least a part of the number of the light-emitting chips 13 is located between the transparent support block 16 and the inner side wall of the recessed structure of the rewiring layer 12, so that not only the connection path between the light-emitting chip 13 and the rewiring layer 12 can be shortened, but also the space on the substrate 10 can be fully utilized, so that the interior of the packaging structure of the integrated multi-light-emitting chip is more compact, which helps to further reduce the size of the packaging structure of the integrated multi-light-emitting chip. In one example, the material of the transparent support block 16 can be transparent glue.

[0044] In some embodiments, the transparent support block 16 includes a first surface facing the substrate 10, a second surface opposite to the first surface, and a side surface between the first surface and the second surface;

[0045] The first surface of the transparent support block 16 is arranged parallel to the second surface of the transparent support block 16, and the side surface of the transparent support block 16 is obliquely intersected with the first surface of the transparent support block. After the light-emitting chip 13 is mounted, the transparent support block 16 is adapted to the recessed structure in the rewiring layer 12.

[0046] Specifically, the transparent support block 16 includes a first surface facing the substrate 10, a second surface opposite to the first surface, and a side surface located between the first surface and the second surface, and the side surface of the transparent support block 16 is tilted relative to the first surface of the transparent support block 16, thereby ensuring that the light-emitting chip 13 mounted on the side surface of the transparent support block 16 is tilted relative to the light-emitting chip 13 mounted on the first surface of the transparent support block 16, which helps to reduce the loss of light signals and improve the light output rate.

[0047] In some embodiments, a portion of the light-emitting chips 13 are mounted on the side of the transparent support block 16, and another portion of the light-emitting chips 13 are mounted on the first surface of the transparent support block 16, and the multiple light-emitting chips 13 located on the side of the transparent support block 16 are distributed symmetrically around the center.

[0048] For example, if Figure 1 As shown, the size of the second surface of the transparent support block 16 is larger than the size of the first surface, so that the transparent support block 16 is an inverted truncated cone or a frustum, so as to improve the structural stability of the transparent support block 16. The plurality of light-emitting chips 13 are distributed on the first surface of the transparent support block 16 and the side of the transparent support block 16, so as to make full use of the space on the substrate 10 and further improve the space utilization rate in the packaging structure. The plurality of light-emitting chips 13 located on the side of the transparent support block 16 are distributed symmetrically around the center, for example, the plurality of light-emitting chips 13 located on the side of the transparent support block 16 are distributed symmetrically around the light-emitting chip 13 located on the first surface of the transparent support block 16, so as to further improve the light-emitting uniformity of the packaging structure of the integrated multi-light-emitting chip.

[0049] In some embodiments, the back side of the light-emitting chip 13 mounted on the first surface of the transparent support block 16 is flush with the surface of the rewiring layer 12 facing the substrate, and the light-emitting chip 13 is directly electrically connected to the substrate 10; or, the recessed structure of the rewiring layer 12 also includes a recessed bottom surface, and the back side of the light-emitting chip 13 mounted on the first surface of the transparent support block 16 is electrically connected to the recessed bottom surface of the rewiring layer 12.

[0050] In one example, the back surface of the light emitting chip 13 mounted on the first surface of the transparent support block 16 is flush with the surface of the rewiring layer 12 facing the substrate 10, the back surface of the light emitting chip 13 located on the side surface of the transparent support block 16 is electrically connected to the rewiring layer 12, and the light emitting chip 13 located on the first surface of the transparent support block 16 can be electrically connected to the rewiring layer 12 through the side surface of the light emitting chip 13, or can be directly electrically connected to the substrate. By setting the back surface of the light emitting chip 13 mounted on the first surface of the transparent support block 16 to be flush with the surface of the rewiring layer 12 facing the substrate 10, it helps to reduce the size of the packaging structure.

[0051] In another example, the rewiring layer 12 is not only distributed around the side of the transparent support block 16, but also distributed between the substrate 10 and the light-emitting chip 13 on the first surface of the transparent support block 16, that is, the recessed structure does not penetrate the rewiring layer 12, so that all the light-emitting chips 13 are located between the rewiring layer 12 and the transparent support block 16, and the backs of all the light-emitting chips 13 are electrically connected to the rewiring layer 12, so that not only can the multiple light-emitting chips 13 be electrically connected through the rewiring layer 12, but also the wiring density of the rewiring layer 12 can be adjusted so that the wiring density of the rewiring layer 12 can match both the light-emitting chip 13 and the substrate 10, thereby further improving the electrical connection performance of the packaging structure of the integrated multi-light-emitting chip and helping to simplify the manufacturing process of the packaging structure of the integrated multi-light-emitting chip.

[0052] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0053] The transparent cover plate 17 is located on the second surface of the transparent support block 16 , and a spherical lens array 20 is protrudingly provided on the surface of the transparent cover plate 17 facing away from the substrate 10 .

[0054] Specifically, the transparent cover plate 17 is located on the second surface of the transparent support block 16, and the transparent cover plate 17 is simultaneously covered on the plurality of light-emitting chips 13, and the light-emitting surfaces of the plurality of light-emitting chips 13 are all facing the transparent cover plate 17. Among them, the light-emitting surfaces of the plurality of light-emitting chips 13 are all facing the transparent cover plate 17, which means that the light signal emitted by each light-emitting chip 13 is emitted to the outside through the transparent cover plate 17. The transparent cover plate 17 in this specific embodiment refers to a cover plate that allows the light signal emitted by the light-emitting chip 13 to pass through. In one example, the transparent cover plate is a glass cover plate. By protruding the spherical lens array 20 on the surface of the transparent cover plate 17 away from the substrate 10, the light signal emitted by the light-emitting chip 13 at least on the side of the transparent support block 16 is emitted through the spherical lens matrix 20, so as to control the emission direction of the light signal emitted by the light-emitting chip 13, and avoid the light signal emitted by the light-emitting chip 13 on the opposite sides of the transparent support block 16 from generating glare due to convergence.

[0055] In some embodiments, the transparent cover plate 17 is a curved transparent cover plate, and the tangent line of the curved transparent cover plate 17 is parallel to the light-emitting chip 13 located on the side of the transparent support block 16, so as to further improve the light-emitting effect of the integrated multi-light-emitting chip packaging structure and avoid the formation of light spots.

[0056] Attached Figure 2 FIG. 1 is a schematic diagram of the arrangement of multiple light-emitting chips on a transparent adhesive film in a specific embodiment of the present invention. Figure 1 and Figure 2 As shown, the packaging structure of the integrated multi-light-emitting chip further includes:

[0057] A transparent adhesive film 15 , to which the light-emitting surface of the light-emitting chip 13 is adhered, and the light-emitting chip 13 is fixed to the transparent supporting block 16 through the transparent adhesive film 15 .

[0058] Specifically, the light signal emitted by the light emitting chip 13 can pass through the transparent adhesive film 15. The transparent adhesive film 15 can be a double-sided adhesive film, so that one side of the transparent adhesive film 15 is adhered to the light emitting surface of the light emitting chip 13, and the other side is adhered to the transparent support block 16. In one example, the transparent adhesive film 15 is continuously covered on the light emitting surfaces of the plurality of light emitting chips 13, thereby protecting the light emitting surfaces of the plurality of light emitting chips 13 at the same time. In another example, the plurality of transparent adhesive films 15 are covered one by one on the light emitting surfaces of the plurality of light emitting chips 13, thereby protecting the light emitting surface of each light emitting chip 13 respectively.

[0059] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0060] The plastic encapsulation layer 18 is located above the substrate 10 , and the plastic encapsulation layer 18 encapsulates the redistribution layer 12 and the light emitting chip 13 . The surface of the plastic encapsulation layer 18 facing away from the substrate 10 has an opening, and the transparent cover plate 17 is located in the opening.

[0061] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0062] The heat dissipation plate 19 at least covers the side surface of the plastic sealing layer 18 .

[0063] Specifically, by arranging the heat sink 19 on the side of the plastic packaging layer 18, the heat dissipation performance of the redistribution layer 12 and the light-emitting chip 13 is enhanced, the heat accumulation inside the packaging structure is reduced, and the problem of too fast light decay of the device due to poor heat dissipation is avoided. In one example, the material of the heat sink 19 can be a metal material with high thermal conductivity.

[0064] Figure 3-Figure 8 The method for forming the packaging structure of the integrated multi-light-emitting chip provided in this specific embodiment is shown, wherein the attached Figure 3 is a schematic cross-sectional view of a specific embodiment of the utility model after a transparent support block is formed on a carrier plate, Figure 4 is a cross-sectional schematic diagram of a specific embodiment of the utility model after the light-emitting chip is mounted on the transparent support block, Figure 5 is a schematic cross-sectional view of a specific embodiment of the utility model after forming a rewiring layer, Figure 6 is a cross-sectional schematic diagram of a specific embodiment of the utility model after the redistribution layer is mounted on the substrate, Figure 7 is a schematic cross-sectional view of a specific embodiment of the utility model after the plastic sealing layer is formed, Figure 8 2 is a schematic cross-sectional view of a specific embodiment of the present invention after forming a transparent cover. For example, a plurality of transparent support blocks 16 arranged at intervals are first formed on a carrier 30, such as Figure 3 As shown. The transparent support block 16 is used to support and fix the light emitting chip 13. Then, a plurality of the light emitting chips 13 are mounted on the surface of the transparent adhesive film 15, and the light emitting surface of the light emitting chip 13 faces the transparent adhesive film 15 to protect the light emitting surface of the light emitting chip 13. Then, the transparent adhesive film 15 with the light emitting chip 13 mounted thereon is mounted on the transparent support block 16, and the light emitting chip 13 is obtained. Figure 4 Next, a rewiring layer 12 is formed on the carrier 30, and the rewiring layer 12 is electrically connected to the light emitting chip 13 mounted on the transparent support block 16, as shown in FIG. Figure 5Afterwards, the rewiring layer 12 is mounted on the substrate 10 through the electrical connection bumps 14 through the cutting process, the flipping process and the ball planting process, as shown in FIG. Figure 6 Then, Figure 6 The structure shown in the figure is plastic-sealed, and a plastic-sealing layer 18 is formed on the substrate 10 to plastic-seale at least the rewiring layer 12 and the light-emitting chip 13, and the plastic-sealing layer 18 has an opening exposing the second surface of the transparent support block 16, as shown in FIG. Figure 7 A transparent cover plate 17 is mounted on the second surface of the transparent support block 16, and a spherical lens array 20 is protrudingly provided on the surface of the transparent cover plate 17 facing away from the substrate 10, as shown in FIG. Figure 8 Afterwards, a heat sink 19 is mounted on the side of the plastic sealing layer 18 to form a heat sink 19. Figure 1 The structure shown.

[0065] The packaging structure of integrated multiple light-emitting chips provided in this specific embodiment is provided with a rewiring layer electrically connected to the substrate on the substrate, the surface of the rewiring layer facing away from the substrate is provided with a recessed structure, and multiple light-emitting chips are integrated inside the packaging structure, the light-emitting chips are located in the recessed structure of the rewiring layer, the backs of at least some of the light-emitting chips are attached to the inner sidewall of the recessed structure, and the multiple light-emitting chips are electrically connected to the substrate through the rewiring layer, which not only improves the luminous brightness of the packaging structure. Moreover, since the multiple light-emitting chips are packaged as one, the inner diameter of the recessed structure gradually increases from the substrate to the direction away from the substrate, that is, the recessed structure has an inclined inner sidewall, and at least some of the light-emitting chips are located on the inclined inner sidewall of the recessed structure, which not only solves the aperture problem caused by the independent packaging of a single light-emitting chip, but also reduces the shadow by making the light emitted by the light-emitting chip intersect through the inclined setting, thereby improving the uniformity of the light emission of the packaging structure and effectively improving the light-emitting effect.

[0066] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A packaging structure integrating multiple light-emitting chips, characterized in that: include: substrate; A rewiring layer is located above the substrate, a surface of the rewiring layer facing away from the substrate is provided with a concave structure, and an inner diameter of the concave structure gradually increases from the substrate to a direction away from the substrate; A plurality of light-emitting chips, each of which comprises a light-emitting surface and a back surface opposite to the light-emitting surface, wherein the light-emitting chips are located in the recessed structure of the redistribution layer, and the back surfaces of at least some of the light-emitting chips are mounted on the inner sidewall of the recessed structure; At least a portion of the light-emitting chips are electrically connected to the substrate through the redistribution layer.

2. The packaging structure of integrated multi-light-emitting chips according to claim 1, characterized in that: Also includes: A transparent support block is located above the substrate, and the light-emitting surfaces of the plurality of light-emitting chips are mounted on the surface of the transparent support block, and at least a portion of the light-emitting chips are located between the transparent support block and the inner side wall of the recessed structure.

3. The packaging structure of integrated multi-light-emitting chips according to claim 2, characterized in that: The transparent support block comprises a first surface facing the substrate, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; The first surface of the transparent support block is arranged in parallel with the second surface of the transparent support block, and the side surface of the transparent support block is obliquely intersected with the first surface of the transparent support block, and the transparent support block after the light-emitting chip is mounted is adapted to the recessed structure in the rewiring layer.

4. The packaging structure of integrated multi-light-emitting chips according to claim 3, characterized in that: A portion of the light-emitting chips are mounted on the side of the transparent support block, and another portion of the light-emitting chips are mounted on the first surface of the transparent support block, and the multiple light-emitting chips located on the side of the transparent support block are distributed symmetrically around the center.

5. The packaging structure of integrated multi-light-emitting chips according to claim 4, characterized in that: The back side of the light-emitting chip mounted on the first surface of the transparent support block is flush with the surface of the rewiring layer facing the substrate, and the light-emitting chip is directly electrically connected to the substrate; or, the recessed structure of the rewiring layer also includes a recessed bottom surface, and the back side of the light-emitting chip mounted on the first surface of the transparent support block is electrically connected to the recessed bottom surface of the rewiring layer.

6. The packaging structure of integrated multi-light-emitting chips according to claim 4, characterized in that: Also includes: A transparent cover plate is located on the second surface of the transparent support block, and a spherical lens array is protrudingly provided on the surface of the transparent cover plate facing away from the substrate.

7. The packaging structure of integrated multi-light-emitting chips according to claim 6, characterized in that: The transparent cover plate is a curved transparent cover plate, and a tangent line of the curved transparent cover plate is parallel to the light emitting chip located on a side surface of the transparent supporting block.

8. The packaging structure of integrated multi-light-emitting chips according to claim 4, characterized in that: Also includes: A transparent adhesive film, the light-emitting surface of the light-emitting chip is adhered to the transparent adhesive film, and the light-emitting chip is fixed to the transparent supporting block through the transparent adhesive film.

9. The packaging structure of integrated multi-light-emitting chips according to claim 7, characterized in that: Also includes: A plastic encapsulation layer is located above the substrate, the plastic encapsulation layer encapsulates the rewiring layer and the light-emitting chip, and a surface of the plastic encapsulation layer facing away from the substrate has an opening, and the transparent cover is located in the opening.

10. The packaging structure of integrated multi-light-emitting chips according to claim 9, characterized in that: Also includes: The heat dissipation plate at least covers the side surface of the plastic sealing layer.

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