Organic light-emitting display module and display

Abstract

The utility model discloses an organic light-emitting display module and a display. The organic light-emitting display module comprises an organic light-emitting display chip and a circuit board which are electrically connected. The organic light-emitting display module further comprises a plurality of heat dissipation holes penetrating through the circuit board, and the heat dissipation holes are overlapped with the organic light-emitting display chip in the thickness direction of the organic light-emitting display module. The aperture of one side, close to the organic light-emitting display chip, of each radiating hole is larger than that of one side, away from the organic light-emitting display chip, of each radiating hole. According to the organic light-emitting display module, the plurality of heat dissipation holes penetrating through the circuit board are formed in the circuit board area overlapped with the organic light-emitting display chip in the thickness direction of the organic light-emitting display module, heat generated by the organic light-emitting display chip can be dissipated out through the heat dissipation holes, effective heat dissipation of the organic light-emitting display chip is further achieved, and the service life of the organic light-emitting display module is prolonged. The aperture of the side, close to the organic light-emitting display chip, of the heat dissipation hole is larger than that of the side, away from the organic light-emitting display chip, of the heat dissipation hole, so that the heat dissipation efficiency of the heat dissipation hole is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, and in particular to an organic light emitting display module and a display. Background Art

[0002] The organic light emitting display chip in the organic light emitting display module will generate heat during long-term use, which may easily cause product damage, display problems, etc., so the organic light emitting display chip needs to be cooled.

[0003] In traditional processes, the connection between the organic light emitting display chip and the circuit board is usually achieved by providing glue between the two. However, during use, the glue between the organic light emitting display chip and the circuit board will affect the effective heat dissipation of the organic light emitting display chip. Utility Model Content

[0004] The utility model provides an organic light emitting display module and a display, so as to solve the problem that it is difficult to achieve effective heat dissipation of the existing organic light emitting display chip.

[0005] In a first aspect, an embodiment of the utility model provides an organic light-emitting display module, the organic light-emitting display module comprising an organic light-emitting display chip and a circuit board electrically connected;

[0006] The organic light emitting display module further comprises a plurality of heat dissipation holes penetrating the circuit board, and along the thickness direction of the organic light emitting display module, the heat dissipation holes overlap with the organic light emitting display chip;

[0007] The diameter of the heat dissipation hole at a side close to the organic light emitting display chip is larger than the diameter of the heat dissipation hole at a side away from the organic light emitting display chip.

[0008] Optionally, the diameter of the heat dissipation hole gradually decreases along the direction where the circuit board is away from the organic light emitting display chip.

[0009] Optionally, any position on the wall of the heat dissipation hole satisfies the following definition:

[0010] P+0.5*ρ*v 2 +ρ*g*h=C;

[0011] Among them, P represents the pressure of the fluid at that position, ρ represents the density of the fluid, v represents the flow velocity of the fluid at that position, g is the acceleration of gravity, h is the height of the position, and C is a constant.

[0012] Optionally, the organic light emitting display chip includes a first display sub-section and a second display sub-section;

[0013] The circuit board includes a first circuit board section and a second circuit board section;

[0014] The second display sub-section at least partially surrounds the first display sub-section, the second circuit board sub-section at least partially surrounds the first circuit board sub-section, and along the thickness direction of the organic light emitting display module, the first display sub-section overlaps with the first circuit board sub-section, and the second display sub-section overlaps with the second circuit board sub-section;

[0015] The plurality of heat dissipation holes include a plurality of first heat dissipation holes and a plurality of second heat dissipation holes, the first heat dissipation holes penetrate the first circuit board section, and the second heat dissipation holes penetrate the second circuit board section;

[0016] Within a unit area, the sum of the opening areas of the plurality of first heat dissipation holes is greater than the sum of the opening areas of the plurality of second heat dissipation holes; the opening area is the opening area of ​​the heat dissipation hole on a side close to the organic light-emitting display chip, or the opening area of ​​the heat dissipation hole on a side away from the organic light-emitting display chip.

[0017] Optionally, the distribution density of the plurality of first heat dissipation holes is greater than the distribution density of the plurality of second heat dissipation holes;

[0018] And / or, the opening area of ​​the first heat dissipation hole is larger than the opening area of ​​the second heat dissipation hole.

[0019] Optionally, the organic light emitting display module further includes a plurality of bonding structures;

[0020] The organic light emitting display chip comprises a third display sub-section and a fourth display sub-section;

[0021] The circuit board includes a third circuit board section and a fourth circuit board section;

[0022] The plurality of bonding structures include a plurality of first bonding substructures and a plurality of second bonding substructures;

[0023] The fourth display subsection at least partially surrounds the third display subsection, and the fourth circuit board subsection at least partially surrounds the third circuit board subsection; the third display subsection is bonded to the third circuit board subsection via a plurality of the first bonding substructures, and the fourth display subsection is bonded to the fourth circuit board subsection via a plurality of the second bonding substructures;

[0024] Within a unit area, the sum of the bonding areas of the plurality of the second bonding substructures is greater than the sum of the bonding areas of the plurality of the first bonding substructures;

[0025] The plurality of heat dissipation holes include a plurality of third heat dissipation holes and a plurality of fourth heat dissipation holes, the third heat dissipation holes penetrate the third circuit board section, and the fourth heat dissipation holes penetrate the fourth circuit board section;

[0026] Within a unit area, the sum of the opening areas of the plurality of fourth heat dissipation holes is greater than the sum of the opening areas of the plurality of third heat dissipation holes; the opening area is the opening area of ​​the heat dissipation hole on a side close to the organic light-emitting display chip, or the opening area of ​​the heat dissipation hole on a side away from the organic light-emitting display chip.

[0027] Optionally, the distribution density of the plurality of fourth heat dissipation holes is greater than the distribution density of the plurality of third heat dissipation holes;

[0028] And / or, an opening area of ​​the fourth heat dissipation hole is larger than an opening area of ​​the third heat dissipation hole.

[0029] Optionally, the diameter D1 of the heat dissipation hole satisfies 1mm≤D1≤2mm.

[0030] Optionally, the organic light emitting display module further includes a heat dissipation layer arranged on the side wall of the heat dissipation hole;

[0031] The heat conductivity coefficient of the heat dissipation layer is greater than the heat conductivity coefficient of the circuit board.

[0032] In a second aspect, an embodiment of the present invention provides an organic light emitting display, which includes the organic light emitting display module as described in the first aspect.

[0033] The technical solution of the embodiment of the utility model is that a plurality of heat dissipation holes penetrating the circuit board are arranged on the circuit board overlapping with the organic light-emitting display chip along the thickness direction of the organic light-emitting display module, so that the heat generated by the organic light-emitting display chip can be dissipated through the heat dissipation holes, thereby realizing effective heat dissipation of the organic light-emitting display chip. By setting the aperture of the heat dissipation hole close to the organic light-emitting display chip to be larger than the aperture of the heat dissipation hole away from the organic light-emitting display chip, the flow rate of the fluid (hot air with the heat generated by the organic light-emitting display chip) in the heat dissipation hole away from the organic light-emitting display chip can be greater than the flow rate of the fluid in the heat dissipation hole close to the organic light-emitting display chip, thereby forming a high-flow rate and low-pressure area on the side of the heat dissipation hole away from the organic light-emitting display chip, that is, on the side of the heat dissipation hole close to the external air, so that the hot air with the heat generated by the organic light-emitting display chip will continuously flow into the high-flow rate and low-pressure area, and then flow into the external air, which is conducive to improving the heat dissipation efficiency of the heat dissipation hole.

[0034] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 A schematic diagram of the structure of an organic light emitting display module provided by an embodiment of the utility model;

[0037] Figure 2 for Figure 1 A schematic cross-sectional structure diagram of an organic light emitting display module along a cross-sectional line AA' is provided;

[0038] Figure 3 A schematic diagram of the structure of a heat dissipation hole provided in an embodiment of the utility model;

[0039] Figure 4 A schematic diagram of the structure of another organic light emitting display module provided by an embodiment of the utility model;

[0040] Figure 5 A schematic diagram of the structure of another organic light emitting display module provided by an embodiment of the utility model;

[0041] Figure 6 A schematic structural diagram of an organic light emitting display provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0043] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only used to illustrate the relative positional relationship between each component or component, and does not particularly limit the specific installation orientation of each component or component.

[0044] Figure 1 A schematic diagram of the structure of an organic light emitting display module provided by an embodiment of the utility model, Figure 2 for Figure 1 A schematic cross-sectional structure diagram of an organic light-emitting display module along a cross-sectional line AA' is provided, referring to Figure 1 and Figure 2 The organic light emitting display module 100 in the embodiment of the utility model includes an organic light emitting display chip 10 and a circuit board 20 which are electrically connected. The organic light emitting display module 100 also includes a plurality of heat dissipation holes 30 penetrating the circuit board 20. The heat dissipation holes 30 overlap with the organic light emitting display chip 10 along the thickness direction of the organic light emitting display module 100. The aperture of the heat dissipation hole 30 close to the organic light emitting display chip 10 is larger than the aperture of the heat dissipation hole 30 away from the organic light emitting display chip 10.

[0045] Exemplary, reference Figure 1 The size of the chip mounting area on the circuit board 20 that overlaps with the organic light-emitting display chip 10 is 23 mm×25 mm. The chip mounting area is provided with 12 heat dissipation holes 30 arranged in a 4×3 array. Specifically, along the short side direction of the chip mounting area, i.e. Figure 1 In the direction Y shown, the chip mounting area includes four rows of heat dissipation holes arranged in sequence, each row of heat dissipation holes includes three heat dissipation holes 30, and the spacing between two adjacent rows of heat dissipation holes is 3 mm. Figure 1 In the direction X shown, the chip mounting area includes three columns of heat dissipation holes arranged in sequence, each column of heat dissipation holes includes four heat dissipation holes 30, and the spacing between two adjacent columns of heat dissipation holes is 5 mm.

[0046] It should be noted that the embodiment of the utility model does not limit the size, number and arrangement of the heat dissipation holes 30, and those skilled in the art can set them according to actual conditions.

[0047] Exemplary, reference Figure 2 The organic light-emitting display chip 10 is electrically connected to the circuit board 20 and can be mounted on the chip mounting area of ​​the circuit board 20 through the bonding structure 40. The bonding structure 40 can be made of structural adhesive. It should be noted that along the thickness direction of the organic light-emitting display module 100, that is, Figure 2 In a direction parallel to the direction Z shown, the chip mounting area of ​​the circuit board 20 overlaps with the organic light emitting display chip 10. The organic light emitting display chip 10 generates heat during operation. The heat generated by the organic light emitting display chip 10 can be dissipated to the outside air through a plurality of heat dissipation holes arranged in the chip mounting area and penetrating the circuit board 20, thereby achieving effective heat dissipation of the organic light emitting display chip 10 and avoiding the situation in which the organic light emitting display module 100 displays abnormally or even burns due to the accumulation of heat between the organic light emitting display chip 10 and the circuit board 20 and the inability to dissipate it.

[0048] In order to further improve the heat dissipation efficiency of the heat dissipation hole 30, the embodiment of the utility model also improves the heat dissipation hole 30. Compared with cylindrical heat dissipation holes with the same aperture, the embodiment of the utility model sets the aperture of the heat dissipation hole 30 close to the organic light emitting display chip 10 to be larger than the aperture of the heat dissipation hole 30 away from the organic light emitting display chip 10, so that the flow rate of the fluid (hot air with the heat generated by the organic light emitting display chip 10) in the heat dissipation hole 30 away from the organic light emitting display chip 10 is greater than the flow rate of the fluid in the heat dissipation hole 30 close to the organic light emitting display chip 10, thereby forming a high flow rate and low pressure area on the side of the heat dissipation hole 30 away from the organic light emitting display chip 10, that is, the side of the heat dissipation hole close to the external air. In this way, the hot air with the heat generated by the organic light emitting display chip 10 will continuously flow into the high flow rate and low pressure area, and then flow into the external air, which is conducive to improving the heat dissipation efficiency of the heat dissipation hole 30.

[0049] The technical solution of the embodiment of the utility model is that a plurality of heat dissipation holes 30 penetrating the circuit board 20 are provided on the circuit board 20 overlapping with the organic light emitting display chip 10 along the thickness direction of the organic light emitting display module 100, so that the heat generated by the organic light emitting display chip 10 can be dissipated through the heat dissipation holes 30, thereby achieving effective heat dissipation of the organic light emitting display chip 10. By setting the aperture of the heat dissipation hole 30 close to the organic light emitting display chip 10 to be larger than the aperture of the heat dissipation hole 30 away from the organic light emitting display chip 10, the flow rate of the fluid (hot air with the heat generated by the organic light emitting display chip 10) in the heat dissipation hole 30 away from the organic light emitting display chip 10 can be greater than the flow rate of the fluid in the heat dissipation hole 30 close to the organic light emitting display chip 10, thereby forming a high flow rate and low pressure area on the side of the heat dissipation hole 30 away from the organic light emitting display chip 10, that is, on the side of the heat dissipation hole 30 close to the external air, so that the hot air with the heat generated by the organic light emitting display chip 10 will continuously flow into the high flow rate and low pressure area, and then flow into the external air, which is conducive to improving the heat dissipation efficiency of the heat dissipation hole 30.

[0050] On the basis of the above embodiment, to ensure that the bonding structure 40 does not affect the heat dissipation of the heat dissipation hole 30 by entering the heat dissipation hole, the bonding structure 40 may be arranged along the thickness direction of the organic light emitting display module 100 without overlapping with the heat dissipation hole 30 .

[0051] Based on the above embodiments, Figure 3 A schematic diagram of a heat dissipation hole provided in an embodiment of the utility model, referring to Figure 2 and Figure 3 , along the direction in which the circuit board 20 is away from the organic light-emitting display chip 10 , the aperture of the heat dissipation hole 30 gradually decreases.

[0052] According to the continuity principle, that is, in a closed flow tube, the flow velocity of the fluid is inversely proportional to the cross-sectional area through which it flows, it can be known that in the direction away from the organic light-emitting display chip 10 along the circuit board 20, that is, Figure 2 In the direction Z shown, the aperture of the heat dissipation hole 30 gradually decreases, and the flow rate of the fluid (hot air) in the heat dissipation hole 30 gradually increases. According to the Bernoulli principle, that is, under the condition of constant height flow, the greater the flow rate, the smaller the pressure. It can be known that along the direction of the circuit board 20 away from the organic light-emitting display chip 10, the pressure in the heat dissipation hole 30 will gradually decrease, and the hot air in the low flow rate and high pressure area of ​​the heat dissipation hole 30 will continue to accelerate and flow into the high flow rate and low pressure area, which is conducive to promoting the heat dissipation of the hot air in the heat dissipation hole 30 to the external air, and can further improve the heat dissipation efficiency of the heat dissipation hole 30.

[0053] Continue to refer Figure 3 , the aperture D1 of the heat dissipation hole 30 satisfies 1mm≤D1≤2mm.

[0054] Exemplary, reference Figure 3 The heat dissipation hole 30 is a circular hole, the diameter of the heat dissipation hole 30 closest to the organic light emitting display chip 10 is 1 mm, and the diameter of the heat dissipation hole 30 farthest from the organic light emitting display chip 10 is 2 mm. It is understandable that if the diameter of the heat dissipation hole 30 is too small, the heat dissipation efficiency of the heat dissipation hole 30 will be affected, and if the diameter of the heat dissipation hole 30 is too large, the stability of the circuit board 20 will be affected. The embodiment of the utility model sets the diameter of the heat dissipation hole 30 to 1 mm-2 mm, which can ensure that the heat dissipation hole 30 has a high heat dissipation efficiency without affecting the stability of the circuit board 20.

[0055] Based on the above embodiments, continue to refer to Figure 2 , any position on the wall of the heat dissipation hole 30 satisfies the following restrictions:

[0056] P+0.5*ρ*v 2 +ρ*g*h=C.

[0057] Among them, P represents the pressure of the fluid at that position, ρ represents the density of the fluid, v represents the flow velocity of the fluid at that position, g is the acceleration of gravity, h is the height of the position, and C is a constant.

[0058] Exemplarily, the fluid in the heat dissipation hole 30 satisfies the Bernoulli equation, that is, P+0.5*ρ*v2+ρ*g*h=C. The Bernoulli principle corresponding to the Bernoulli equation is: in the flow process of an ideal fluid, the sum of the kinetic energy, potential energy and pressure potential energy at any position is a constant, that is, the greater the flow rate, the smaller the pressure. By setting the fluid in the heat dissipation hole 30 to satisfy the Bernoulli principle that the greater the flow rate, the smaller the pressure, the transmission rate of the hot air in the heat dissipation hole 30 can be increased, which is conducive to promoting the dissipation of the hot air in the heat dissipation hole 30 to the external air, and then it is conducive to improving the heat dissipation efficiency of the heat dissipation hole 30.

[0059] It should be noted that the height of the position represented by h is specifically the vertical height of the position relative to a reference plane. Usually, this reference plane can be sea level or ground surface, depending on the specific situation.

[0060] Optional, reference Figure 3 The heat dissipation hole 30 includes a first heat dissipation subdivision 31, a second heat dissipation subdivision 32 and a third heat dissipation subdivision 33. The second heat dissipation subdivision 32 connects the first heat dissipation subdivision 31 and the third heat dissipation subdivision 33. The average pore size of the first heat dissipation subdivision 31 is larger than the average pore size of the second heat dissipation subdivision 32, and the average pore size of the second heat dissipation subdivision 32 is larger than the average pore size of the third heat dissipation subdivision 33. In the direction in which the circuit board 20 is away from the organic light-emitting display chip 10, the decreasing rate of the pore size of the second heat dissipation subdivision 32 is larger than the decreasing rate of the pore size of the first heat dissipation subdivision 31 and the decreasing rate of the pore size of the third heat dissipation subdivision 33.

[0061] Exemplarily, the heat dissipation hole 30 is a circular hole, the average pore size of the first heat dissipation division 31 is larger than the average pore size of the second heat dissipation division 32, and the average pore size of the second heat dissipation division 32 is larger than the average pore size of the third heat dissipation division 33. According to the continuity principle, it can be known that the flow rate of heat in the first heat dissipation division 31 is smaller than the flow rate of heat in the second heat dissipation division 32, and the flow rate of heat in the second heat dissipation division 32 is smaller than the flow rate of heat in the third heat dissipation division 33. According to the Bernoulli principle, it can be known that the pressure of heat in the first heat dissipation division 31 is larger than the pressure of heat in the second heat dissipation division 32, and the pressure of heat in the second heat dissipation division 32 is larger than the pressure of heat in the third heat dissipation division 33.

[0062] It is understandable that the pressure difference between the first heat dissipation subdivision 31 and the third heat dissipation subdivision 33 is relatively large. In order to avoid the heat dissipation hole 30 from being damaged due to the pressure difference, the embodiment of the utility model sets the aperture reduction rate of the second heat dissipation subdivision 32 to be greater than the aperture reduction rate of the first heat dissipation subdivision 31 and the aperture reduction rate of the third heat dissipation subdivision 33, so that the process of large pressure changes can be concentrated in the second heat dissipation subdivision 32. Because compared with the first heat dissipation subdivision 31 and the third heat dissipation subdivision 33, the second heat dissipation subdivision 32 located between the first heat dissipation subdivision 31 and the third heat dissipation subdivision 33 is more solid, and a large pressure change will not have a great impact on the second heat dissipation subdivision 32.

[0063] On the basis of the above embodiments, the heat dissipation holes in different areas may be arranged differently according to the heat generation difference in different areas of the display module, which is described in detail in the following embodiments.

[0064] Figure 4 A schematic diagram of another organic light emitting display module provided by an embodiment of the present invention, referring to Figure 4 , the organic light emitting display chip 10 includes a first display section 11 and a second display section 12. The circuit board 20 includes a first circuit board section 21 and a second circuit board section 22. The second display section 12 at least partially surrounds the first display section 11, and the second circuit board section 22 at least partially surrounds the first circuit board section 21. Along the thickness direction of the organic light emitting display module 100, the first display section 11 overlaps with the first circuit board section 21, and the second display section 12 overlaps with the second circuit board section 22. The plurality of heat dissipation holes 30 include a plurality of first heat dissipation holes 31 and a plurality of second heat dissipation holes 32. The first heat dissipation holes 31 penetrate the first circuit board section 21, and the second heat dissipation holes 32 penetrate the second circuit board section 22. Within a unit area, the sum of the opening areas of the plurality of first heat dissipation holes 31 is greater than the sum of the opening areas of the plurality of second heat dissipation holes 32. The opening area is the opening area of ​​the heat dissipation hole 30 close to the organic light emitting display chip 10, or the opening area of ​​the heat dissipation hole 30 away from the organic light emitting display chip 10.

[0065] Exemplary, reference Figure 4 , along the thickness direction of the organic light emitting display module 100, the first display section 11 overlaps with the first circuit board section 21, and the heat generated by the first display section 11 can be dissipated through the first heat dissipation holes 31 provided on the first circuit board section 21. Along the thickness direction of the organic light emitting display module 100, the second display section 12 overlaps with the second circuit board section 22, and the heat generated by the second display section 12 can be dissipated through the second heat dissipation holes 32 provided on the second circuit board section 22.

[0066] Continue to refer Figure 4 , the first display division 11 is located in the middle area of ​​the organic light emitting display chip 10, and the second display division 12 surrounds the first display division 11 and is located in the edge area of ​​the organic light emitting display chip 10. It can be understood that compared with the first display division 11 located in the middle area of ​​the organic light emitting display chip 10, the heat generated by the second display division 12 located in the edge area of ​​the organic light emitting display chip 10 is easier to dissipate. Therefore, in the embodiment of the utility model, the heat accumulated at the first display division 11 is greater than the heat accumulated at the second display division 12, and the heat distribution on the organic light emitting display chip 10 is uneven. In order to ensure the uniformity of heat distribution on the organic light emitting display chip 10, it is necessary to set the heat dissipation efficiency of the plurality of first heat dissipation holes 31 to be greater than the heat dissipation efficiency of the plurality of second heat dissipation holes 32. In the embodiment of the utility model, the heat dissipation efficiency of the plurality of first heat dissipation holes 31 is greater than the heat dissipation efficiency of the plurality of second heat dissipation holes 32 by setting the sum of the opening areas of the plurality of first heat dissipation holes 31 to be greater than the sum of the opening areas of the plurality of second heat dissipation holes 32 per unit area.

[0067] As a feasible implementation manner, the distribution density of the plurality of first heat dissipation holes 31 is greater than the distribution density of the plurality of second heat dissipation holes 32 , and / or the opening area of ​​the first heat dissipation holes 31 is greater than the opening area of ​​the second heat dissipation holes 32 .

[0068] Exemplary, reference Figure 4 The distribution density of the plurality of first heat dissipation holes 31 is greater than the distribution density of the plurality of second heat dissipation holes 32 , and the opening area of ​​the first heat dissipation holes 31 is greater than the opening area of ​​the second heat dissipation holes 32 .

[0069] In the embodiment of the utility model, the distribution density of the plurality of first heat dissipation holes 31 can be greater than the distribution density of the plurality of second heat dissipation holes 32, and / or the opening area of ​​the first heat dissipation holes 31 can be greater than the opening area of ​​the second heat dissipation holes 32, so that the sum of the opening areas of the plurality of first heat dissipation holes 31 per unit area is greater than the sum of the opening areas of the plurality of second heat dissipation holes 32, thereby achieving a heat dissipation efficiency of the plurality of first heat dissipation holes 31 greater than the heat dissipation efficiency of the plurality of second heat dissipation holes 32.

[0070] Figure 5 A schematic diagram of the structure of another organic light emitting display module provided in an embodiment of the present invention, referring to Figure 2 and Figure 5 , the organic light emitting display module 100 further includes a plurality of bonding structures 40. The organic light emitting display chip 10 includes a third display division 13 and a fourth display division 14. The circuit board 20 includes a third circuit board division 23 and a fourth circuit board division 24. The plurality of bonding structures 40 include a plurality of first bonding substructures 41 and a plurality of second bonding substructures 42. The fourth display division 14 at least partially surrounds the third display division 13, and the fourth circuit board division 24 at least partially surrounds the third circuit board division 23. The third display division 13 is bonded to the third circuit board division 23 through a plurality of first bonding substructures 41, and the fourth display division 14 is bonded to the fourth circuit board division 24 through a plurality of second bonding substructures 42. Within a unit area, the sum of the bonding areas of the plurality of second bonding substructures 42 is greater than the sum of the bonding areas of the plurality of first bonding substructures 41. The plurality of heat dissipation holes 30 include a plurality of third heat dissipation holes 33 and a plurality of fourth heat dissipation holes 34, the third heat dissipation holes 33 penetrate the third circuit board division 23, and the fourth heat dissipation holes 34 penetrate the fourth circuit board division 24. In a unit area, the sum of the opening areas of the plurality of fourth heat dissipation holes 34 is greater than the sum of the opening areas of the plurality of third heat dissipation holes 33. The opening area is the opening area of ​​the heat dissipation hole 30 close to the organic light emitting display chip 10, or the opening area of ​​the heat dissipation hole 30 away from the organic light emitting display chip 10.

[0071] Exemplary, reference Figure 5 , along the thickness direction of the organic light-emitting display module 100, the third display division 13 overlaps with the third circuit board division 23, and the heat generated by the third display division 13 can be dissipated through the third heat dissipation holes 33 provided on the third circuit board division 23. Along the thickness direction of the organic light-emitting display module 100, the fourth display division 14 overlaps with the fourth circuit board division 24, and the heat generated by the fourth display division 14 can be dissipated through the fourth heat dissipation holes 34 provided on the fourth circuit board division 24. A plurality of first bonding substructures 41 are provided between the third display division 13 and the third circuit board division 23, and the third display division 13 can be bonded to the third circuit board division 23 through the plurality of first bonding substructures 41. A plurality of second bonding substructures 42 are provided between the fourth display division 14 and the fourth circuit board division 24, and the fourth display division 14 can be bonded to the fourth circuit board division 24 through the plurality of second bonding substructures 42

[0072] Continue to refer Figure 5, within a unit area, the sum of the bonding areas of the plurality of second bonding substructures 42 is greater than the sum of the bonding areas of the plurality of first bonding substructures 41. Considering that the bonding structure 40 is an important factor affecting the effective heat dissipation of the organic light-emitting display chip 10, it can be understood that the heat generated by the fourth display division 14 of the organic light-emitting display chip 10 is less likely to be dissipated than the heat generated by the third display division 13 thereof. Therefore, in the embodiment of the utility model, the heat accumulated at the fourth display division 14 is greater than the heat accumulated at the third display division 13, and the heat distribution on the organic light-emitting display chip 10 is uneven. In order to ensure the uniformity of the heat distribution on the organic light-emitting display chip 10, it is necessary to set the heat dissipation efficiency of the plurality of fourth heat dissipation holes 34 to be greater than the heat dissipation efficiency of the plurality of third heat dissipation holes 33. In the embodiment of the utility model, the heat dissipation efficiency of the plurality of fourth heat dissipation holes 34 is greater than the heat dissipation efficiency of the plurality of third heat dissipation holes 33 by setting the sum of the opening areas of the plurality of fourth heat dissipation holes 34 to be greater than the sum of the opening areas of the plurality of third heat dissipation holes 33 within a unit area.

[0073] As a feasible implementation manner, the distribution density of the plurality of fourth heat dissipation holes 34 is greater than the distribution density of the plurality of third heat dissipation holes 33 , and / or the opening area of ​​the fourth heat dissipation holes 34 is greater than the opening area of ​​the third heat dissipation holes 33 .

[0074] Exemplary, reference Figure 5 The distribution density of the plurality of fourth heat dissipation holes 34 is greater than the distribution density of the plurality of third heat dissipation holes 33 , and the opening area of ​​the fourth heat dissipation holes 34 is greater than the opening area of ​​the third heat dissipation holes 33 .

[0075] In the embodiment of the utility model, the distribution density of the plurality of fourth heat dissipation holes 34 can be set to be greater than the distribution density of the plurality of third heat dissipation holes 33. And / or the opening area of ​​the fourth heat dissipation holes 34 is greater than the opening area of ​​the third heat dissipation holes 33, so that the sum of the opening areas of the plurality of fourth heat dissipation holes 34 per unit area is greater than the sum of the opening areas of the plurality of third heat dissipation holes 33, thereby achieving that the heat dissipation efficiency of the plurality of fourth heat dissipation holes 34 is greater than the heat dissipation efficiency of the plurality of third heat dissipation holes 33.

[0076] Optionally, the organic light emitting display module 100 further includes a heat dissipation layer disposed on the side wall of the heat dissipation hole 30 . The heat conductivity of the heat dissipation layer is greater than the heat conductivity of the circuit board 20 .

[0077] For example, compared with the technical solution of not setting a heat dissipation layer on the side wall of the heat dissipation hole 30, the utility model can further improve the heat dissipation efficiency of the heat dissipation hole 30 by setting a heat dissipation layer on the side wall of the heat dissipation hole 30, and setting the thermal conductivity coefficient of the heat dissipation layer to be greater than the thermal conductivity coefficient of the circuit board 20.

[0078] As a feasible implementation, the heat dissipation layer arranged on the side wall of the heat dissipation hole 30 can be formed by plating a layer of metal on the side wall of the heat dissipation hole 30. The metal can be silver. Silver has a high thermal conductivity coefficient and good thermal conductivity, which is beneficial to improving the heat dissipation efficiency of the heat dissipation hole 30.

[0079] Based on the same concept, Figure 6 A schematic diagram of the structure of an organic light emitting display provided by an embodiment of the utility model, referring to Figure 6 The embodiment of the utility model provides an organic light emitting display, which includes an organic light emitting display module 100 as in any of the above embodiments. Therefore, the organic light emitting display includes the technical features of the organic light emitting display module and has the beneficial effects of the organic light emitting display module. The same points can be referred to the above description.

[0080] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. An organic light emitting display module, characterized in that: including an organic light emitting display chip and a circuit board electrically connected; The organic light emitting display module further comprises a plurality of heat dissipation holes penetrating the circuit board, and along the thickness direction of the organic light emitting display module, the heat dissipation holes overlap with the organic light emitting display chip; The diameter of the heat dissipation hole at a side close to the organic light emitting display chip is larger than the diameter of the heat dissipation hole at a side away from the organic light emitting display chip.

2. The organic light emitting display module according to claim 1, characterized in that: The diameter of the heat dissipation hole gradually decreases along the direction in which the circuit board moves away from the organic light emitting display chip.

3. The organic light emitting display module according to claim 1, characterized in that: Any position on the wall of the heat dissipation hole meets the following requirements: P+0.5*p*v 2 +ρ*g*h=C; Among them, P represents the pressure of the fluid at that position, ρ represents the density of the fluid, v represents the flow velocity of the fluid at that position, g is the acceleration of gravity, h is the height of the position, and C is a constant.

4. The organic light emitting display module according to claim 1, characterized in that: The organic light emitting display chip comprises a first display sub-section and a second display sub-section; The circuit board includes a first circuit board section and a second circuit board section; The second display sub-section at least partially surrounds the first display sub-section, the second circuit board sub-section at least partially surrounds the first circuit board sub-section, and along the thickness direction of the organic light emitting display module, the first display sub-section overlaps with the first circuit board sub-section, and the second display sub-section overlaps with the second circuit board sub-section; The plurality of heat dissipation holes include a plurality of first heat dissipation holes and a plurality of second heat dissipation holes, the first heat dissipation holes penetrate the first circuit board section, and the second heat dissipation holes penetrate the second circuit board section; Within a unit area, the sum of the opening areas of the plurality of first heat dissipation holes is greater than the sum of the opening areas of the plurality of second heat dissipation holes; the opening area is the opening area of ​​the heat dissipation hole on a side close to the organic light-emitting display chip, or the opening area of ​​the heat dissipation hole on a side away from the organic light-emitting display chip.

5. The organic light emitting display module according to claim 4, characterized in that: The distribution density of the plurality of first heat dissipation holes is greater than the distribution density of the plurality of second heat dissipation holes; And / or, the opening area of ​​the first heat dissipation hole is larger than the opening area of ​​the second heat dissipation hole.

6. The organic light emitting display module according to claim 1, characterized in that: The organic light emitting display module further includes a plurality of bonding structures; The organic light emitting display chip comprises a third display sub-section and a fourth display sub-section; The circuit board includes a third circuit board section and a fourth circuit board section; The plurality of bonding structures include a plurality of first bonding substructures and a plurality of second bonding substructures; The fourth display subsection at least partially surrounds the third display subsection, and the fourth circuit board subsection at least partially surrounds the third circuit board subsection; the third display subsection is bonded to the third circuit board subsection via a plurality of the first bonding substructures, and the fourth display subsection is bonded to the fourth circuit board subsection via a plurality of the second bonding substructures; Within a unit area, the sum of the bonding areas of the plurality of the second bonding substructures is greater than the sum of the bonding areas of the plurality of the first bonding substructures; The plurality of heat dissipation holes include a plurality of third heat dissipation holes and a plurality of fourth heat dissipation holes, the third heat dissipation holes penetrate the third circuit board section, and the fourth heat dissipation holes penetrate the fourth circuit board section; Within a unit area, the sum of the opening areas of the plurality of fourth heat dissipation holes is greater than the sum of the opening areas of the plurality of third heat dissipation holes; the opening area is the opening area of ​​the heat dissipation hole on a side close to the organic light-emitting display chip, or the opening area of ​​the heat dissipation hole on a side away from the organic light-emitting display chip.

7. The organic light emitting display module according to claim 6, characterized in that: The distribution density of the plurality of fourth heat dissipation holes is greater than the distribution density of the plurality of third heat dissipation holes; And / or, an opening area of ​​the fourth heat dissipation hole is larger than an opening area of ​​the third heat dissipation hole.

8. The organic light emitting display module according to claim 1, characterized in that: The diameter D1 of the heat dissipation hole satisfies 1mm≤D1≤2mm.

9. The organic light emitting display module according to claim 1, characterized in that: The organic light emitting display module further comprises a heat dissipation layer arranged on the side wall of the heat dissipation hole; The heat conductivity coefficient of the heat dissipation layer is greater than the heat conductivity coefficient of the circuit board.

10. An organic light emitting display, characterized in that: It comprises the organic light emitting display module as described in any one of claims 1 to 9.

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