Display mother board, display panel and display module

Abstract

The embodiment of the utility model provides a display mother board, a display panel and a display module, relates to the technical field of display, and is used for reducing the risk of short circuit of signal lines. The display mother board comprises a display area, a frame area located on at least one side of the display area and a cutting area located on the side, away from the display area, of the frame area. The frame area is provided with a plurality of binding terminals arranged along a first direction; the cutting area is provided with a plurality of patch cords arranged in the first direction, one end of each patch cord is correspondingly connected with the corresponding binding terminal, and the other end of each patch cord extends in the direction away from the display area; wherein the widths of the at least one patch cord are different in the second direction; the maximum width of the patch cord is smaller than or equal to the width of the binding terminal; wherein the second direction intersects with the first direction, the width of the patch cord is the size of the patch cord in the first direction, and the width of the binding terminal is the size of the binding terminal in the first direction. The display mother board is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display motherboard, a display panel and a display module. Background Art

[0002] Organic Light Emitting Diode (OLED) display panel has many advantages such as self-luminescence, ultra-thinness, fast response speed, high contrast, and wide viewing angle. It is a display panel that has received widespread attention. Utility Model Content

[0003] The purpose of the embodiments of the present disclosure is to provide a display motherboard, a display panel and a display module, which are used to reduce the risk of short circuit of the adapter wires during laser cutting of the module segments.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a display motherboard is provided, which includes: a display area, a frame area located on at least one side of the display area, and a cutting area located on a side of the frame area away from the display area. The frame area is provided with a plurality of binding terminals arranged along a first direction; the cutting area is provided with a plurality of adapter wires arranged along the first direction, one end of the adapter wire is correspondingly connected to the binding terminal, and the other end of the adapter wire extends in a direction away from the display area; wherein, along the second direction, the width of at least one adapter wire is different; and the maximum width of the adapter wire is less than or equal to the width of the binding terminal; wherein the second direction intersects with the first direction, the width of the adapter wire is the size of the adapter wire in the first direction, and the width of the binding terminal is the size of the binding terminal in the first direction.

[0006] In the above display motherboard, the width of a portion of the adapter wire along the second direction is reduced, and the spacing between adjacent adapter wires is increased in the portion where the width of the adapter wire is reduced, so that the risk of short-circuiting the adapter wires can be reduced during laser cutting of the module section. Moreover, since the width of some adapter wires is reduced, the laser energy required during cutting can be relatively reduced, which reduces the degree of thermal damage in the cutting area and effectively alleviates the problem of short-circuiting adjacent adapter wires.

[0007] In some embodiments, the adapter line includes a first adapter section, a second adapter section, and a third adapter section which are connected in sequence; the first adapter section is connected to the binding terminal, and the third adapter section is connected to the connecting wire; the width of at least part of the second adapter section is smaller than the width of the first adapter section, and smaller than the width of the third adapter section.

[0008] In some embodiments, along the second direction, widths of the second transition sections are equal.

[0009] In some embodiments, along the second direction, the second transition section includes: a first section and a second section, the first end of the first section is connected to the first transition section, the second end of the first section is connected to the second end of the second section, and the first end of the second section is connected to the third transition section; along the direction from the first end of the first section to the second end of the first section, the width of the first section decreases; along the direction from the first end of the second section to the second end of the second section, the width of the second section decreases.

[0010] In some embodiments, the rate of change of the width reduction of the first segment remains unchanged along the direction from the first end of the first segment to the second end of the first segment; and the rate of change of the width reduction of the second segment remains unchanged along the direction from the first end of the second segment to the second end of the second segment.

[0011] In some embodiments, along the direction from the first end of the first segment to the second end of the first segment, the first segment includes a plurality of first sub-segments connected in sequence, and the width of the first sub-segment relatively far away from the first transition segment is smaller than the width of the first sub-segment relatively close to the first transition segment; along the direction from the first end of the second segment to the second end of the second segment, the second segment includes a plurality of second sub-segments connected in sequence, and the width of the second sub-segment relatively far away from the third transition segment is smaller than the width of the second sub-segment relatively close to the third transition segment.

[0012] In some embodiments, along the second direction, the second transfer segment of the transfer line includes: multiple third sub-segments and multiple fourth sub-segments that are alternately arranged and connected; the width of each third sub-segment in the multiple third sub-segments is greater than the width of any fourth sub-segment in the multiple fourth sub-segments.

[0013] In some embodiments, the width of each segment of the third sub-segment is equal, and the width of each segment of the fourth sub-segment is equal.

[0014] In some embodiments, the width of each segment of the third sub-segment is equal; along the second direction, the second transition segment has a middle position, and along the direction from the first transition segment of the transition line to the middle position, the width of the fourth sub-segment relatively far away from the first transition segment is smaller than the width of the fourth sub-segment relatively close to the first transition segment; along the direction from the third transition segment of the transition line to the middle position, the width of the fourth sub-segment relatively far away from the third transition segment is smaller than the width of the fourth sub-segment relatively close to the third transition segment.

[0015] In some embodiments, the display motherboard includes: multiple layers of conductive layers and multiple layers of insulating layers arranged alternately; the cutting area includes: a first area, a second area and a third area, the first transfer section of the transfer line is located in the first area, the second transfer section of the transfer line is located in the second area, and the third transfer section of the transfer line is located in the third area; wherein the insulating layer of the first area includes: an organic film layer and / or an inorganic film layer; the insulating layer of the second area includes: an inorganic film layer; the insulating layer of the third area includes: an organic film layer and / or an inorganic film layer.

[0016] In some embodiments, the display motherboard includes: a plurality of conductive layers and an inorganic insulating layer located between every two adjacent conductive layers in the plurality of conductive layers; wherein at least one pair of two adjacent transfer lines are located in different conductive layers.

[0017] In some embodiments, the multiple adapter wires include: multiple first-class adapter wires and multiple second-class adapter wires; the multiple first-class adapter wires and the multiple second-class adapter wires are located in different conductive layers; along the first direction, the multiple adapter wires are divided into multiple adapter wire groups arranged side by side, and each of the multiple adapter wire groups includes: one first-class adapter wire among the multiple first-class adapter wires and one second-class adapter wire among the multiple second-class adapter wires.

[0018] In some embodiments, the multi-layer conductive layer includes: at least one gate metal layer and at least one source-drain metal layer; the first type of patch cord is located at any one of the at least one gate metal layer, and the second type of patch cord is located at any one of the at least one source-drain metal layer. Or, the multi-layer conductive layer includes: at least two gate metal layers; the first type of patch cord is located at any one of the at least two gate metal layers, and the second type of patch cord is located at a gate metal layer other than the gate metal layer where the first type of patch cord is located. Or, the multi-layer conductive layer includes: at least two source-drain metal layers; the first type of patch cord is located at any one of the at least two source-drain metal layers, and the second type of patch cord is located at a source-drain metal layer other than the source-drain metal layer where the first type of patch cord is located.

[0019] In some embodiments, the plurality of said patch cords further include a plurality of third-category patch cords; the plurality of third-category patch cords and the plurality of first-category patch cords and the plurality of second-category patch cords are located on different conductive layers; the patch cord grouping further includes: a third-category patch cord among the plurality of third-category patch cords.

[0020] In some embodiments, in one of the patch cord groups, the third-type patch cord is located on a side of the second-type patch cord away from the first-type patch cord.

[0021] In some embodiments, the first transition segment includes: a first gate metal layer, a first source-drain metal layer, and a second source-drain metal layer arranged in sequence, a first insulating layer is arranged between two adjacent first transition segments, and the first insulating layer covers the edge of the first transition segment. The second transition segment includes: a first gate metal layer and a first insulating layer arranged in sequence, and the first insulating layer covers the second transition segment.

[0022] In some embodiments, the first transition section further includes a third source-drain metal layer and a second insulating layer disposed on a side of the second source-drain metal layer away from the first source-drain metal layer, and the second insulating layer is located between two adjacent first transition sections and exposes the third source-drain metal layer.

[0023] In some embodiments, the cutting area is further provided with a plurality of unit test terminals, and the unit test terminals are correspondingly connected to the adapter wires; the unit test terminals are used to connect to a test structure to perform a display test on the display motherboard.

[0024] On the other hand, a display panel is provided, comprising: a display area, a frame area located on at least one side of the display area, and a sub-cutting area located on a side of the frame area away from the display area, wherein the frame area is provided with a plurality of binding terminals arranged along a first direction; the sub-cutting area is provided with a plurality of sub-switch wires arranged along the first direction, one end of the sub-switch wire is correspondingly connected to the binding terminal, and the other end of the sub-switch wire extends in a direction away from the display area; wherein, along the second direction, there is a difference in width of at least one of the sub-switch wires, and the maximum width of the sub-switch wire is less than or equal to the width of the binding terminal; wherein the second direction intersects with the first direction, the width of the sub-switch wire is the size of the sub-switch wire in the first direction, and the width of the binding terminal is the size of the binding terminal in the first direction.

[0025] In some embodiments, the sub-transfer line includes a first transfer segment and a sub-second transfer segment, one end of the first transfer segment is connected to the binding terminal, the other end of the first transfer segment is connected to one end of the sub-second transfer segment, and the other end of the sub-second transfer segment extends away from the display area; the width of at least part of the sub-second transfer segment is smaller than the width of the first transfer segment.

[0026] The above-mentioned display panel has the same structure and beneficial technical effects as the display motherboard provided in some of the above-mentioned embodiments, which will not be described in detail here.

[0027] In another aspect, a display module is provided. The display module comprises: a display panel as described in any of the above embodiments. The display module further comprises a flexible circuit board, the flexible circuit board comprises a plurality of leads, and the plurality of leads are correspondingly connected to a plurality of binding terminals located in a frame area of ​​the display panel.

[0028] The above-mentioned display module has the same structure and beneficial technical effects as the display panels provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, etc.

[0030] Figure 1 A structural diagram corresponding to the preparation of a display module according to some embodiments of the present disclosure;

[0031] Figure 2 Based on Figure 1 The provided enlarged view of the motherboard at A;

[0032] Figure 3 Based on Figure 2 The provided enlarged view of the motherboard at B;

[0033] Figure 4 Based on Figure 3 An enlarged view of the C portion of the provided display motherboard;

[0034] Figure 5 is a structural diagram of a display motherboard according to some embodiments of the present disclosure;

[0035] Figure 6 Based on Figure 5 An enlarged view of the motherboard at D is provided;

[0036] Figure 7 is a structural diagram of a patch cord according to some embodiments of the present disclosure;

[0037] Figure 8 is another structural diagram of a patch cord according to some embodiments of the present disclosure;

[0038] Fig. 9 is another structural diagram of a patch cord according to some embodiments of the present disclosure;

[0039] Fig.10is another structural diagram of a patch cord according to some embodiments of the present disclosure;

[0040] Fig.11 is another structural diagram of a patch cord according to some embodiments of the present disclosure;

[0041] Fig.12 A diagram showing a film layer arrangement structure of a display motherboard according to some embodiments of the present disclosure;

[0042] Fig.13A for Figure 6 A cross-sectional view of the first transition section along section line EE is shown;

[0043] Fig. 13B for Figure 6 Another cross-sectional view of the first transition section shown along the section line EE;

[0044] Fig.14 for Figure 6 A cross-sectional view of the connecting wires of the display motherboard along the section line GG shown;

[0045] Fig.15 for Figure 6 A cross-sectional view of the adapter cable of the display motherboard along the section line FF is shown;

[0046] Fig.16 Based on Figure 5 Another enlarged view of the provided display motherboard at D;

[0047] Fig.17 for Fig.16 A cross-sectional view of the adapter cable of the provided display motherboard along the section line HH;

[0048] Fig.18 Based on Figure 5 A further enlarged view of a portion D of the provided display motherboard;

[0049] Fig.19 for Fig.18 A cross-sectional view of the adapter cable of the provided display motherboard along the cross-sectional line KK;

[0050] Fig. 20 Based on Figure 5 A further enlarged view of a portion D of the provided display motherboard;

[0051] Fig.21 for Fig. 20 A cross-sectional view of the adapter cable of the provided display motherboard along the section line LL;

[0052] Fig. 22 Based on Figure 5 A further enlarged view of a portion D of the provided display motherboard;

[0053] Fig.23 for Fig. 22 A cross-sectional view of the adapter cable of the provided display motherboard along the section line MM;

[0054] Fig.24 Based on Figure 5 A further enlarged view of a portion D of the provided display motherboard;

[0055] Fig.25 for Fig.24 A cross-sectional view of the adapter cable of the provided display motherboard along the section line NN;

[0056] Fig.26 is a structural diagram of a display module according to some embodiments of the present disclosure;

[0057] Fig. 27 Based on Fig.26 An enlarged view of the Q portion of the display module is provided;

[0058] Fig.28 Based on Fig.26 Another enlarged view of Q of the display module is provided. DETAILED DESCRIPTION

[0059] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0060] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0061] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0062] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0063] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0064] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0065] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0066] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0067] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0068] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0069] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0070] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0071] In some embodiments, Figure 1 As shown, the process of preparing the display module 300 may include three process stages: a substrate cutting stage, a panel testing stage, and a module stage.

[0072] In the substrate cutting section, the packaged substrate 1000 is cut into a plurality of display motherboards 200 . Each display motherboard 200 is used to form a display panel 100 .

[0073] like Figure 1 and Figure 2 As shown, Figure 2 for Figure 1 The enlarged view of the display motherboard 200 at A is shown. Each display motherboard 200 includes a display area 10, a frame area 20 located on at least one side of the display area 10, and a cutting area 30 located on a side of the frame area 20 away from the display area 10.

[0074] like Figure 2and Figure 3 As shown, Figure 3 for Figure 2 An enlarged view of the display motherboard 200 at B is shown. The embodiment of the present disclosure is exemplified by the frame area 20 surrounding the display area 10. The frame area 20 at the lower side of the display area 10 has a binding area 11, and the binding area 11 is provided with a plurality of binding terminals 12, and the plurality of binding terminals 12 are correspondingly connected to the circuits of the display area 10 and the frame area 20. For example, the circuit of the display area 10 includes: a pixel driving circuit, etc., and the circuit of the frame area 20 includes: a GOA (Gate on Array, array substrate row driving) circuit, etc. The circuits of the display area 10 and the frame area 20 are used to drive the display area 10 to realize the display function.

[0075] The cutting area 30 may be provided with a plurality of patch cords 21, one end of which is connected to a plurality of binding terminals 12, for example, a plurality of patch cords 21 are connected to a plurality of binding terminals 12 in a one-to-one correspondence. The cutting area 30 is also provided with a plurality of connected connecting wires 31 and a plurality of unit test terminals 33. The other end of the plurality of patch cords 21 is connected to a plurality of connecting wires 31, for example, a plurality of patch cords 21 are connected to a plurality of connecting wires 31 in a one-to-one correspondence.

[0076] That is to say, the plurality of adapter wires 21 are used to realize the connection between the plurality of unit test terminals 33 and the circuits of the display area 10 and the frame area 20 .

[0077] Exemplarily, in the panel test section, by inputting a DC or AC signal on the multiple unit test terminals 33, the signal is transmitted to the circuits of the display area 10 and the frame area 20 through the multiple binding terminals 12 of the binding area 11 to realize the display of the display area 10, so as to detect the display condition of the display area 10. The purpose of the panel test is to detect the display problem of the display area 10, and prevent the display motherboard 200 with poor display from flowing into the next process.

[0078] For example, in the cutting area 30 , an electrostatic release unit 32 connected between the plurality of connecting wires 31 and the plurality of unit test terminals 33 is further provided. The electrostatic release unit 32 can effectively prevent static electricity from affecting the display of the display area 10 .

[0079] like Figure 4 As shown, Figure 4 for Figure 3The enlarged view of the display motherboard 200 at C is shown. In the module section, a laser cutting process is used to cut along the cutting line L of the cutting area 30 to remove the portion of the display motherboard 200 that is away from the cutting line L and the frame area 20, that is, the portion 30A of the cutting area 30 that is located away from the cutting line L and the frame area 20. The display area 10, the frame area 20 of the display motherboard 200 and the portion 30B of the cutting area 30 that is located near the cutting line L and the frame area 20 form a display panel 100 (as shown in FIG. Figure 1 shown).

[0080] Afterwards, the circuit board is connected to the display panel 100 to form a display module 300. The circuit board is provided with a circuit for sending various control signals to the display panel 100. For example, the circuit includes: a source driver IC, a TCON chip (Timing Controller) and a power chip. The circuit board includes, for example, a flexible circuit board 301. The circuit board is connected to the display panel 100 by connecting a plurality of leads 3011 (such as Fig. 27 ) and the binding terminal 12 (as shown in FIG. Figure 3 As shown) are connected one by one.

[0081] However, since the spacing d1 between adjacent adapter wires 21 is small, during the laser cutting process of the module section, particles generated by cutting the adapter wires 21, burns, peeling and cracks of the film layer where the adapter wires 21 are located, etc. may cause short circuits between adjacent adapter wires 21. In addition, since the width d2 of the adapter wires 21 is relatively wide, a larger laser energy is required during cutting, and a larger laser energy may cause greater thermal damage to the cutting line L, which is more likely to cause short circuits between adjacent adapter wires 21, thereby affecting the display quality of the display panel 100.

[0082] Based on this, Figure 1 , Figure 5 and Figure 6 As shown, Figure 6 for Figure 5 The enlarged view of the display motherboard 200 at D shown in the figure, the embodiment of the present disclosure provides a display motherboard 200, the display motherboard 200 includes a display area 10, a frame area 20 located at least on one side of the display area 10, and a cutting area 30 located in the frame area 20 away from the display area 10. Among them, the frame area 20 is provided with a plurality of binding terminals 12 arranged along the first direction X, and the cutting area 30 is provided with a plurality of adapter wires 21 arranged along the first direction X, one end of the adapter wire 21 is correspondingly connected to the binding terminal 12, and the other end of the adapter wire 21 extends in a direction away from the display area 10.

[0083] For example, the embodiment of the present disclosure is illustrated by taking the frame area 20 surrounding the display area 10 , but the embodiment of the present disclosure is not limited thereto. For example, the frame area 20 may be located on one side of the display area 10 .

[0084] Exemplarily, the first direction X is as follows Figure 6 As shown in the horizontal direction, the border area 20 and the cutting area 30 are as shown in FIG. Figure 6 Arranged in the vertical direction as shown, for example Figure 6 The vertical direction shown is the second direction Y. A plurality of binding terminals 12 are arranged in a lateral direction of the frame area 20, a plurality of adapter wires 21 and a plurality of connecting wires 31 are arranged in a lateral direction of the cutting area 30, and a binding terminal 12, a adapter wire 21 and a connecting wire 31 are connected in a longitudinal direction to form a wire for transmitting a DC or AC signal, so as to transmit a DC or AC signal to the circuits of the display area 10 and the frame area 20, so as to detect the display condition of the display area 10.

[0085] Exemplarily, the first direction X is perpendicular to the second direction Y. It should be noted that the longitudinal direction may be perpendicular to the first direction X. Figure 6 The second direction Y shown has a certain angle, for example, the angle is an acute angle.

[0086] For example, Figure 3 As shown, the cutting area 30 is also provided with a plurality of unit test terminals 33 , which are correspondingly connected to the connecting wires 31 , and are used to connect a test structure (not shown in the figure) to perform a display test on the display motherboard 200 .

[0087] In some examples, such as Figure 6 As shown, along the second direction Y, the width d2 of at least one adapter wire 21 is different; and the maximum width d20 of the adapter wire 21 is less than or equal to the width d3 of the binding terminal; wherein, the width d2 of the adapter wire 21 is the size of the adapter wire 21 in the first direction X, and the width d3 of the binding terminal 12 is the size of the binding terminal 12 in the first direction X.

[0088] like Figure 4 The embodiment shown provides a transfer line 21 of the display motherboard 200, and the width d2 of the transfer line 21 remains consistent along the second direction Y. Moreover, the width d2 of the transfer line 21 is substantially consistent with the width d3 of the binding terminal 12, and the width d2 of the transfer line 21 is substantially consistent with the width d4 of the connecting wire 31, that is, d2=d3=d4.

[0089] like Figure 6As shown, along the second direction Y, the width d2 of the jumper wire 21 varies, and the maximum width d20 of the jumper wire 21 is less than or equal to the width d3 of the bonding terminal. That is, the width d2 of a part of the jumper wire 21 along the second direction Y is reduced. Namely, compared with the jumper wire 21 as shown in Figure 4 As shown, by reducing the width d2 of a part of the jumper wire 21, the spacing d1 between adjacent jumper wires 21 increases in the part where the width d2 of the jumper wire 21 is reduced. During the laser cutting process in the module section, the risk of short - circuit of the jumper wire 21 can be reduced.

[0090] Moreover, since the width d2 of a part of the jumper wire 21 is reduced, during cutting, the laser energy required can be relatively reduced, slowing down the degree of thermal damage in the cutting area 30 and effectively alleviating the problem of short - circuit between adjacent jumper wires 21.

[0091] In some embodiments, as Figure 6 As shown, the jumper wire 21 includes a first jumper segment 21a, a second jumper segment 21b, and a third jumper segment 21c connected in sequence. The first jumper segment 21a is connected to the bonding terminal 12, and the third jumper segment 21c is connected to the connecting wire 31. At least part of the width d22 of the second jumper segment 21b is less than the width d21 of the first jumper segment 21a and less than the width d23 of the third jumper segment 21c, that is, d22 < d21 and d22 < d23.

[0092] Exemplarily, the width d21 of the first jumper segment 21a is basically the same as the width d23 of the third jumper segment 21c. The width d21 of the first jumper segment 21a is basically the same as the width d3 of the bonding terminal. The width d23 of the third jumper segment 21c is basically the same as the width d4 of the connecting wire 31, that is, d21 = d23 = d3 = d4. For example, the width d21 of the first jumper segment 21a and the width d23 of the third jumper segment 21c are both equal to the maximum width d20 of the jumper wire 21, that is, d21 = d23 = d20. Moreover, the width d22 of the second jumper segment 21b is less than the maximum width d20 of the jumper wire 21, that is, d22 < d20.

[0093] That is to say, along the second direction Y, the width d2 of the jumper wire 21 is reduced at the second jumper segment 21b. During the laser cutting process of the jumper wire 21 in the module section, since the position of the cutting track L can be located in the area where the second jumper segment 21b is located, by reducing the width d22 of the second jumper segment 21b, the spacing d1 between adjacent second jumper segments 21b increases. Therefore, the risk of short - circuit between adjacent jumper wires 21 caused by particles generated during the cutting of the jumper wire 21, burns, peeling, and cracks in the film layer where the jumper wire 21 is located can be reduced.

[0094] Moreover, by setting the width d22 of the second transition section 21b to be smaller than the width d21 of the first transition section 21a and smaller than the width d23 of the third transition section 21c, that is, d22 < d21 and d22 < d23. During cutting, less laser energy is required, reducing the degree of thermal damage in the cutting area 30 and effectively alleviating the problem of short - circuiting of adjacent connection lines 21.

[0095] Furthermore, by setting the width d21 of the first transition section 21a to be greater than the width d22 of the second transition section 21b, the overlapping area when the first transition section 21a is connected to the bonding terminal 12 can be increased. By setting the width d23 of the third transition section 21c to be greater than the width d22 of the second transition section 21b, the overlapping area when the third transition section 21c is connected to the connection wire 31 can be increased, thus ensuring the stability of DC or AC signal transmission.

[0096] In some embodiments, as Figure 7 shown, along the second direction Y, the width d22 of the second transition section 21b is equal.

[0097] That is to say, the width d22 of the second transition section 21b is smaller than the width d21 of the first transition section 21a, the width d22 of the second transition section 21b is smaller than the width d23 of the third transition section 21c, and along the second direction Y, the width d22 of the second transition section 21b remains consistent.

[0098] By reducing the width d22 of the second transition section 21b, the spacing d1 between adjacent second transition sections 21b increases. Therefore, the risk of short - circuiting between adjacent connection lines 21 caused by particles generated during cutting of the connection lines 21, burns, peeling, and cracks in the film layer where the connection lines 21 are located can be reduced. During cutting, less laser energy is required, reducing the degree of thermal damage in the cutting area 30 and effectively alleviating the problem of short - circuiting of adjacent connection lines 21.

[0099] In some embodiments, as Figure 8 and Fig. 9 shown, along the second direction Y, the second transition section 21b includes: a first segment 21b1 and a second segment 21b2. The first end M1 of the first segment 21b1 is connected to the first transition section 21a, the second end M2 of the first segment 21b1 is connected to the second end Q2 of the second segment 21b2, and the first end Q1 of the second segment 21b2 is connected to the third transition section 21c. Along the direction Y1 from the first end M1 to the second end M2 of the first segment 21b1, the width d22 of the first segment 21b1 decreases; along the direction Y2 from the first end Q1 to the second end Q2 of the second segment 21b2, the width d22 of the second segment 21b2 decreases.

[0100] That is to say, as Figure 8 and Fig. 9 As shown, along the direction Y1 from the first end M1 of the first segment 21b1 to the second end M2 of the first segment 21b1, the width d22 of the second transition segment 21b varies. Along the direction Y2 from the first end Q1 of the second segment 21b2 to the second end Q2 of the second segment 21b2, the width d22 of the second transition segment 21b varies.

[0101] In some examples, such as Figure 8 As shown, along the direction Y1 from the first end M1 of the first segment 21b1 to the second end M2 of the first segment 21b1, the rate of change of the width d22 of the first segment 21b1 is constant; along the direction Y2 from the first end Q1 of the second segment 21b2 to the second end Q2 of the second segment 21b2, the rate of change of the width d22 of the second segment 21b2 is constant. That is, along the direction Y1, the width d22 of the first segment 21b1 decreases uniformly at a certain rate of change. Along the direction Y2, the width d22 of the second segment 21b2 decreases uniformly at a certain rate of change.

[0102] Exemplarily, the rate of change of the width d22 of the first section 21b1 can be equal to the rate of change of the width d22 of the second section 21b2. The connection point T between the second end M2 of the first section 21b1 and the second end Q2 of the second section 21b2 can be the position where the width d22 of the second transfer section 21b is the smallest. When the cutting path L is located in the area where the second end M2 of the first section 21b1 and the second end Q2 of the second section 21b2 are connected, a smaller laser energy can be used to reduce the degree of thermal damage to the cutting area 30, effectively alleviating the problem of short circuit of adjacent transfer lines 21.

[0103] In some examples, such as Fig. 9 As shown, along the direction Y1 from the first end M1 of the first segment 21b1 to the second end M2 of the first segment 21b1, the first segment 21b1 includes a plurality of first sub-segments 22a connected in sequence, and the width d22 of the first sub-segment 22a relatively far from the first transition segment 21a is smaller than the width d22 of the first sub-segment 22a relatively close to the first transition segment 21a. Along the direction Y2 from the first end Q1 of the second segment 21b2 to the second end Q2 of the second segment 21b2, the second segment 21b2 includes a plurality of second sub-segments 22b connected in sequence, and the width d22 of the second sub-segment 22b relatively far from the third transition segment 21c is smaller than the width d22 of the second sub-segment 22b relatively close to the third transition segment 21c.

[0104] For example, Fig. 9As shown, along the direction Y1 from the first end M1 of the first segment 21b1 to the second end M2 of the first segment 21b1, the first segment 21b1 includes two connected first sub-segments 22a, namely the first sub-segment 22aa and the first sub-segment 22ab, and the first sub-segment 22aa is closer to the first transition segment 21a than the first sub-segment 22ab. The width d22b of the first sub-segment 22ab relatively far from the first transition segment 21a is smaller than the width d22a of the first sub-segment 22aa relatively close to the first transition segment 21a, that is, d22b <d22a。

[0105] Along the direction Y2 from the first end Q1 of the second segment 21b2 to the second end Q2 of the second segment 21b2, the second segment 21b2 includes two connected second sub-segments 22b, namely the second sub-segment 22b1 and the second sub-segment 22b2, and the second sub-segment 22b1 is closer to the third transition segment 21c than the second sub-segment 22b2. The width d222 of the second sub-segment 22b2 relatively far from the third transition segment 21c is smaller than the width d221 of the second sub-segment 22b1 relatively close to the third transition segment 21c, that is, d222 <d221。

[0106] Exemplarily, the width d22b of the connected first sub-segment 22ab is equal to the width d222 of the second sub-segment 22b2, that is, d22b = d222. The width d22a of the first sub-segment 22aa is equal to the width d221 of the second sub-segment 22b1, that is, d22a = d221. Moreover, the length h1 of the first sub-segment 22aa in the second direction Y is equal to the length h2 of the second sub-segment 22b1, that is, h1 = h2.

[0107] The difference in width d22 of the second transition sections 21b along the second direction Y can increase the spacing d1 between adjacent second transition sections 21b, thereby reducing the risk of short circuits between adjacent transition lines 21 caused by particles generated by cutting the transition lines 21, burns, peeling and cracks on the film layer where the transition lines 21 are located. During cutting, less laser energy is required, which reduces the degree of thermal damage to the cutting area 30 and effectively alleviates the problem of short circuits between adjacent transition lines 21.

[0108] In some embodiments, Fig.10 and Fig.11 As shown, along the second direction Y, the second transfer segment 21b of the transfer line 21 includes: multiple third sub-segments 23 and multiple fourth sub-segments 24 that are alternately arranged and connected; the width d30 of each third sub-segment 23 in the multiple third sub-segments 23 is greater than the width d40 of any fourth sub-segment 24 in the multiple fourth sub-segments 24.

[0109] The alternating arrangement of multiple third sub-segments 23 and multiple fourth sub-segments 24 means that one fourth sub-segment 24 is arranged between every two third sub-segments 23 ; and one third sub-segment 23 is arranged between every two fourth sub-segments 24 .

[0110] In some examples, such as Fig.10 As shown, the second transition section 21b includes: a third subsection 231, a third subsection 232, a third subsection 233, a fourth subsection 241, a fourth subsection 242, a fourth subsection 243 and a fourth subsection 244. The fourth subsection 241, the third subsection 231, the fourth subsection 242, the third subsection 232, the fourth subsection 243, the third subsection 233 and the fourth subsection 244 are sequentially connected to form the second transition section 21b.

[0111] The width d30 of each third sub-segment 23 is greater than the width d40 of any fourth sub-segment 24, that is, d30>d40. For example, the width d30 of the third sub-segment 23 may be equal to the width d21 of the first transition segment 21a, and the width d30 of the third sub-segment 23 may be equal to the width d23 of the third transition segment 21c, that is, d30=d21=d23>d40.

[0112] By setting the second transfer section 21b to include multiple fourth sub-segments 24, the width d40 of the fourth sub-segments 24 is reduced, and the spacing d1 between adjacent fourth sub-segments 24 is increased, so the risk of short circuit between adjacent transfer lines 21 caused by particles generated by cutting the transfer lines 21, burning, peeling and cracks of the film layer where the transfer lines 21 are located can be reduced. During cutting, the laser energy required can be less, the degree of thermal damage to the cutting area 30 is reduced, and the problem of short circuit between adjacent transfer lines 21 is effectively alleviated.

[0113] In some embodiments, Fig.10 As shown, the width d30 of each third sub-segment 23 is equal, and the width d40 of each fourth sub-segment is equal.

[0114] Exemplarily, the second transition segment 21b includes three third sub-segments 23, namely: the third sub-segment 231, the third sub-segment 232 and the third sub-segment 233, and the width d30 of the third sub-segment 231, the third sub-segment 232 and the third sub-segment 233 is consistent. The second transition segment 21b includes four fourth sub-segments, namely: the fourth sub-segment 241, the fourth sub-segment 242, the fourth sub-segment 243 and the fourth sub-segment 244, and the width d40 of the fourth sub-segment 241, the fourth sub-segment 242, the fourth sub-segment 243 and the fourth sub-segment 244 is consistent.

[0115] In some embodiments, Fig.11As shown, the widths d30 of each third sub - segment 23 are equal. Along the second direction Y, the second transition segment 21b has a middle position U. Along the direction from the first transition segment 21a of the transition line 21 to the middle position U, the width d40 of the fourth sub - segment 24 relatively farther from the first transition segment 21a is less than the width d40 of the fourth sub - segment 24 relatively closer to the first transition segment 21a. Along the direction from the third transition segment 21c of the transition line 21 to the middle position U, the width d40 of the fourth sub - segment 24 relatively farther from the third transition segment 21c is less than the width d40 of the fourth sub - segment 24 relatively closer to the third transition segment 21c.

[0116] It should be noted that the middle position U can be understood as that along the second direction Y, the dimensions from the middle position U to both ends of the second transition segment 21b are equal.

[0117] It can be understood that along the direction from the first transition segment 21a of the transition line 21 to the middle position U, it is the same direction as the above - mentioned direction Y1 from the first end M1 to the second end M2 of the first segment 21b1 of the second transition segment 21b. Along the direction from the third transition segment 21c of the transition line 21 to the middle position U, it is the same direction as the above - mentioned direction Y2 from the first end Q1 to the second end Q2 of the second segment 21b2 of the second transition segment 21b.

[0118] Exemplarily, along the direction from the first transition segment 21a of the transition line 21 to the middle position U, the fourth sub - segment 242 is farther from the first transition segment 21a than the fourth sub - segment 241, and the width d41 of the fourth sub - segment 242 is less than the width d42 of the fourth sub - segment 242, that is, d42 < d41. Along the direction from the third transition segment 21c of the transition line 21 to the middle position U, the fourth sub - segment 243 is farther from the third transition segment 21c than the fourth sub - segment 244, and the width d43 of the fourth sub - segment 243 is less than the width d44 of the fourth sub - segment 244, that is, d43 < d44.

[0119] Exemplarily, the width d42 of the fourth sub - segment 242 and the width d43 of the fourth sub - segment 243 can be equal, that is, d42 = d43. The width d41 of the fourth sub - segment 242 and the width d44 of the fourth sub - segment 244 can be equal, that is, d41 = d44.

[0120] By setting the widths of multiple fourth sub-segments 24 to be different, that is, the width d40 of a part of the fourth sub-segments 24 is further reduced relative to the width d40 of another part of the fourth sub-segments 24, the spacing d1 of the fourth sub-segments 24 with further reduced width d40 increases, thereby reducing the risk of short circuits between adjacent adapter wires 21 caused by particles generated by cutting the adapter wires 21, burns, peeling and cracks of the film layer where the adapter wires 21 are located. During cutting, the laser energy required can be less, reducing the degree of thermal damage to the cutting area 30, and effectively alleviating the problem of short circuits between adjacent adapter wires 21.

[0121] In some embodiments, Figure 6 As shown, the display motherboard 200 includes an organic film layer. Due to the poor adhesion of the organic film layer, the organic film layer is easily separated from its adjacent film layer. When cutting along the cutting line L using a laser cutting process, in order to prevent the organic film layer on the cutting line L from peeling off during the laser cutting process, the organic film layer is not provided in a part of the cutting area 30.

[0122] In order to facilitate understanding of the structural diagram of the film layer arrangement of the cutting area 30 , the structural diagram of the film layer arrangement of the display motherboard 200 is introduced below.

[0123] For example, Fig.12 As shown, the display motherboard 200 includes a stacked substrate 40, a first gate insulating layer 51, a first gate metal layer 52, a second gate insulating layer 53, a second gate metal layer 54, a first insulating layer 61, a first source-drain metal layer 62, a first passivation layer 63, a second source-drain metal layer 64, a second passivation layer 65, a third source-drain metal layer 66, a planarization layer 67, a pixel defining layer 68, a first non-polar insulating layer 70, and a touch metal layer 71. Among them, the first gate metal layer 52, the second gate metal layer 54, the first source-drain metal layer 62, the second source-drain metal layer 64, the third source-drain metal layer 66, and the touch metal layer 71 are conductive layers. The first gate insulating layer 51, the second gate insulating layer 53, the first insulating layer 61, the first passivation layer 63, the second passivation layer 65, the planarization layer 67, the pixel defining layer 68, and the first non-polar insulating layer 70 are insulating layers.

[0124] It is understandable that the above film layer structure is only used as an example in this document. In some other embodiments of the present application, the display motherboard 200 may include more or fewer film layers. For example, it may include fewer or more gate metal layers, for example, it may also include a third gate metal layer. For example, it may include fewer or more source and drain metal layers, for example, four source and drain metal layers, or it may include fewer or more passivation layers, or it may include fewer or more planarization layers.

[0125] Exemplarily, the materials of the first gate insulating layer 51, the second gate insulating layer 53, the first insulating layer 61, the first passivation layer 63 and the second passivation layer 65 include inorganic materials, for example, the inorganic materials include silicon nitride (SiNx), silicon oxide (SiOx) and silicon oxynitride (SiNxOy), etc., that is, the first gate insulating layer 51, the second gate insulating layer 53, the first insulating layer 61, the first passivation layer 63 and the second passivation layer 65 are inorganic film layers. The arrangement of the inorganic film layer in some embodiments of the present disclosure is not limited thereto.

[0126] Exemplarily, the material of the planarization layer 67 and the pixel definition layer 68 includes an organic material, for example, the organic material includes polyimide, that is, the planarization layer 67 and the pixel definition layer 68 are organic film layers. The arrangement of the organic film layer in some embodiments of the present disclosure is not limited thereto.

[0127] For example, Fig.13A and Fig. 13B As shown, Fig.13A for Figure 6 The cross-sectional view of the first transition section 21a shown along the section line EE, Fig. 13B for Figure 6 Another cross-sectional view of the first transition segment 21a along the cross-sectional line EE is shown. The first transition segment 21a includes: a first gate metal layer 52, a first source-drain metal layer 62, and a second source-drain metal layer 64 arranged in sequence, a first insulating layer 61 is arranged between two adjacent first transition segments 21a, and the first insulating layer 61 covers the edge of the first transition segment 21a.

[0128] like Fig.15 As shown, the second transition segment 21 b includes: a first gate metal layer 52 and a first insulating layer 61 which are arranged in sequence, and the first insulating layer 61 covers the second transition segment 21 b.

[0129] like Fig.13A As shown, the first transition segment 21a further includes a third source-drain metal layer 66 and a second insulating layer 69 arranged on a side of the second source-drain metal layer 64 away from the first source-drain metal layer 62 . The second insulating layer 69 is located between two adjacent first transition segments 21a and exposes the third source-drain metal layer 66 .

[0130] For example, Fig.14 As shown, Fig.14 for Figure 6 The cross-sectional view of the connecting wire 31 of the display motherboard 200 shown is along the section line GG. The connecting wire 31 is located in the third source-drain metal layer 66, which is not limited to this in some embodiments of the present disclosure. The connecting wire 31 can also be located in at least one of the first gate metal layer 52, the second gate metal layer 54, the first source-drain metal layer 62 and the second source-drain metal layer 64. The cutting area 30 where the connecting wire 31 is located includes an organic film layer such as a planarization layer 67 and a pixel defining layer 68.

[0131] For example, Fig.15 As shown, Fig.15 for Figure 6 The cross-sectional view of the transfer line 21 (second transfer section 21b) of the display motherboard 200 along the cross-sectional line FF is shown. The transfer line 21 is located in the first gate metal layer 52, which is not limited to this in some embodiments of the present disclosure. The cutting area 30 where the second transfer section 21b is located does not include organic film layers such as the planarization layer 67 and the pixel definition layer 68.

[0132] That is to say, Figure 6 As shown, in the cutting area 30 , the organic film layer has a boundary N1 and a boundary N2 , and no organic film layer is disposed in the region between the boundary N1 and the boundary N2 .

[0133] For example, Figure 6 As shown, the cutting area 30 includes a first area 201 located on the side of the boundary N1 toward the binding area 11, the first area 201 is provided with an organic film layer, and the first transition section 21a is located in the first area 201. The cutting area 30 also includes a second area 202 located between the boundary N1 and the boundary N2, the material of the film layer of the second area 202 does not include an organic material, that is, the second area 202 is not provided with an organic film layer, and the second transition section 21b is located in the second area 202. The cutting area 30 also includes a third area 203 located on the side of the boundary N2 away from the binding area 11, the third area 203 is provided with an organic film layer, and the third transition section 21c is located in the third area 203.

[0134] That is, the insulating layer of the first area 201 includes an organic film layer and an inorganic film layer, the insulating layer of the third area 203 includes an organic film and an inorganic film layer, and the insulating layer of the second area 202 includes an inorganic film layer. That is, the insulating layer of the second area 202 does not include an organic film layer.

[0135] Since the film layer in the second area 202 does not include an organic film layer, peeling of the film layer during cutting can be effectively prevented.

[0136] In some examples, such as Figure 6 As shown, the width d2 of the patch cord 21 can be reduced from the boundary of the organic film layer. That is, in the second direction Y from the binding area 11 to the cutting area 30, the width d2 of the patch cord 21 is reduced from the boundary N1 of the organic film layer. In the second direction Y from the cutting area 30 to the binding area 11, the width d2 of the patch cord 21 is reduced from the boundary N2 of the organic film layer.

[0137] Exemplarily, the cutting line L may be located between the boundary N1 and the boundary N2 where no organic film layer is set. By setting the width d2 of the portion of the adapter line 21 between the boundary N1 and the boundary N2 to be reduced so that the area where the width d2 of the adapter line 21 is reduced overlaps with the area where the cutting line L is located, it can be effectively ensured that the width d2 of the adapter line 21 in the area where the cutting line L is located is small, and the distance d1 between adjacent adapter lines 21 is large, thereby reducing the risk of short-circuiting the adapter line 21.

[0138] In some embodiments, Fig.12 , Fig.16 and Fig.17 As shown, Fig.17 for Fig.16 The cross-sectional view of the transfer line 21 (second transfer section 21b) of the display motherboard 200 along the cross-sectional line HH is shown. The display motherboard 200 includes: a plurality of conductive layers and an inorganic insulating layer located between each two adjacent conductive layers in the plurality of conductive layers. Wherein, each two adjacent transfer lines 21 are located in different conductive layers.

[0139] It should be noted that Figure 6 , Fig.16 , Fig.18 , Fig. 20 , Fig. 22 and Fig.24 1 and 2 are enlarged views obtained at point D of the display motherboard 200 corresponding to six structures respectively.

[0140] In some examples, the multi-layer conductive layer includes: at least one gate metal layer and at least one source-drain metal layer, the first type of switching line 211 is located at any layer of the at least one gate metal layer, and the second type of switching line 212 is located at any layer of the at least one source-drain metal layer.

[0141] For example, Fig.12 As shown, the conductive layer includes: two gate metal layers and three source-drain metal layers. The two gate metal layers are respectively: a first gate metal layer 52 and a second gate metal layer 54, and the three source-drain metal layers are respectively: a first source-drain metal layer 62, a second source-drain metal layer 64 and a third source-drain metal layer 66. The inorganic insulating layer includes: a first gate insulating layer 51, a second gate insulating layer 53, a first insulating layer 61, a first passivation layer 63 and a second passivation layer 65.

[0142] In some examples, such as Fig.16 and Fig.17As shown, the multiple patch cords 21 include: multiple first-class patch cords 211 and multiple second-class patch cords 212; the multiple first-class patch cords 211 and the multiple second-class patch cords 212 are located in different conductive layers; along the first direction X, the multiple patch cords 21 are divided into multiple patch cord groups 210 arranged side by side, and each patch cord group 210 in the multiple patch cord groups 210 includes: one first-class patch cord 211 among the multiple first-class patch cords 211 and one second-class patch cord 212 among the multiple second-class patch cords 212.

[0143] For example, Fig.16 and Fig.17 As shown, the first type of patch cord 211 is located at the first gate metal layer 52, and the second type of patch cord 212 is located at the third source-drain metal layer 66. The first type of patch cord 211 and the second type of patch cord 212 are arranged alternately, that is, a second type of patch cord 212 is arranged between each two adjacent first type of patch cords 211, and a first type of patch cord 211 is arranged between each two adjacent second type of patch cords 212. An adjacent first type of patch cord 211 and a second type of patch cord 212 form a patch cord group 210, and a plurality of patch cord groups 210 are evenly arranged along the first direction X.

[0144] In some examples, such as Fig.18 and Fig.19 As shown, Fig.19 for Fig.18 The cross-sectional view of the transfer line 21 (second transfer section 21b) of the display motherboard 200 along the cross-sectional line KK is shown. The multi-layer conductive layer includes: at least two gate metal layers; the first type of transfer line 211 is located at any one of the at least two gate metal layers, and the second type of transfer line 212 is located at a gate metal layer other than the gate metal layer where the first type of transfer line 211 is located.

[0145] Exemplarily, the multi-layer conductive layer includes two gate metal layers, which are respectively a first gate metal layer 52 and a second gate metal layer 54. The first type of switching line 211 is located in the first gate metal layer 52, and the second type of switching line 212 is located in the second gate metal layer 54.

[0146] In some examples, such as Fig.12 , Fig. 20 and Fig.21 As shown, Fig.21 for Fig. 20 The cross-sectional view of the adapter 21 (second adapter section 21b) of the display motherboard 200 along the cross-sectional line LL is shown. The multi-layer conductive layer includes: at least two source-drain metal layers; the first type of adapter 211 is located at any one of the at least two source-drain metal layers, and the second type of adapter 212 is located at a source-drain metal layer other than the source-drain metal layer where the first type of adapter 211 is located.

[0147] Exemplarily, the multi-layer conductive layer includes: three source-drain metal layers, which are: a first source-drain metal layer 62, a second source-drain metal layer 64, and a third source-drain metal layer 66. The first type of adapter 211 is located in the first source-drain metal layer 62, and the second type of adapter 212 is located in the second source-drain metal layer 64.

[0148] In some embodiments, Fig. 22 and Fig.23 As shown, Fig.23 for Fig. 22 The cross-sectional view of the adapter 21 (second adapter section 21b) of the display motherboard 200 along the section line MM is shown. The plurality of adapters 21 also include a plurality of third-type adapters 213. The plurality of third-type adapters 213 are located on different conductive layers from the plurality of first-type adapters 211 and the plurality of second-type adapters 212. The adapter group 210 also includes: a third-type adapter 213 among the plurality of third-type adapters 213.

[0149] Exemplarily, the first type of patch cord 211 is located at the first source-drain metal layer 62, the second type of patch cord 212 is located at the second source-drain metal layer 64, and the third type of patch cord 213 is located at the third source-drain metal layer 66. For example, a first type of patch cord 211, a second type of patch cord 212, and a third type of patch cord 213 sequentially arranged in the first direction X constitute a patch cord group 210, that is, in a patch cord group 210, the third type of patch cord 213 is located at a side of the second type of patch cord 212 away from the first type of patch cord 211. Multiple patch cord groups 210 are evenly arranged along the first direction X.

[0150] In some examples, such as Fig.24 and Fig.25 As shown, Fig.25 for Fig.24 The cross-sectional view of the transfer line 21 (second transfer section 21b) of the display motherboard 200 along the section line NN is shown. The multi-layer conductive layer includes three gate metal layers, for example, the three gate metal layers are respectively: a first gate metal layer 52, a second gate metal layer 54 and a third gate metal layer 56. The first type of transfer line 211 is located in the first gate metal layer 52, the second type of transfer line 212 is located in the second gate metal layer 54, and the third type of transfer line 213 is located in the third gate metal layer 56.

[0151] like Fig.15 As shown, the transfer line 21 is located in the first gate metal layer 52, and the interval d1 between adjacent transfer lines 21 is the distance d5 between two adjacent transfer lines 21 in the first direction X, that is, d1=d5. Fig.15 , Fig.17 , Fig.19 , Fig.21 , Fig.23 and Fig.25 As shown, compared with two adjacent patch cords 21 being located in the same conductive layer, when two adjacent patch cords 21 are located in different conductive layers, the spacing d1 between the two adjacent patch cords 21 is greater than the distance d5 between the two adjacent patch cords 21 in the first direction X, that is, d1>d5. In other words, by setting each two adjacent patch cords 21 to be located in different conductive layers, the spacing d1 between the two adjacent patch cords 21 can be increased, thereby reducing the risk of short circuits between the patch cords 21 caused by cutting the patch cords 21.

[0152] like Figure 1 and Figure 6 As shown, an embodiment of the present disclosure further provides a display panel 100, which includes: a display area 10, a frame area 20 located at least on one side of the display area 10, and a sub-cutting area 102 located in the frame area 20 away from the display area 10, wherein the frame area 20 is provided with a plurality of binding terminals 12 arranged along the first direction X. The sub-cutting area 102 is provided with a plurality of sub-patch wires 21q arranged along the first direction X, one end of the sub-patch wire 21q is correspondingly connected to the binding terminal 12, and the other end of the sub-patch wire 21q extends in a direction away from the display area 10. Wherein, along the second direction Y, the width d2 of at least one sub-patch wire 21q is different, and the maximum width of the sub-patch wire 21q is less than or equal to the width d3 of the binding terminal 12; wherein the second direction Y intersects with the first direction X, the width d2 of the sub-patch wire 21q is the size of the sub-patch wire 21q in the first direction X, and the width d3 of the binding terminal 12 is the size of the binding terminal 12 in the first direction X.

[0153] It can be understood that the sub-cutting area 102 is the portion 30B of the cutting area 30 located on the cutting line L close to the frame area 20 , and the sub-connection line 21q is the portion of the connection line 21 located on the cutting line L close to the display area 10 .

[0154] That is to say, Figure 1 , Figure 6 and Fig.16 As shown, a laser cutting process is used to cut along the cutting line L of the cutting area 30 to remove the portion of the display motherboard 200 that is away from the cutting line L and the display area 10, that is, the portion of the cutting area 30 that is located on the cutting line L and away from the display area 10 is removed. The display area 10, the frame area 20, and the portion 30B (that is, the sub-cutting area 102) of the display motherboard 200 that is located on the cutting line L and close to the display area 10 form the display panel 100.

[0155] By setting the width d2 of at least one sub-patch line 21q to be different along the second direction Y, and the maximum width of the sub-patch line 21q being less than or equal to the width d3 of the binding terminal 12, that is, the width d2 of a portion of the sub-patch line 21q along the second direction Y is reduced, and the distance d1 between adjacent sub-patch lines 21q at the reduced width d2 is increased, the risk of short circuit between the sub-patch lines 21q can be reduced.

[0156] In some examples, such as Figure 6 As shown, the sub-adapter 21q includes a first adaptor section 21a and a sub-second adaptor section 21bq, one end of the first adaptor section 21a is connected to the binding terminal 12, the other end of the first adaptor section 21a is connected to one end of the sub-second adaptor section 21bq, and the other end of the sub-second adaptor section 21bq extends in a direction away from the display area 10. The width d22 of at least part of the sub-second adaptor section 21bq is smaller than the width d21 of the first adaptor section 21a.

[0157] That is, along the second direction Y, the width d2 of the sub-transition wire 21q is reduced at the sub-second transition section 21bq, thereby reducing the risk of short circuit between the sub-second transition sections 21bq.

[0158] For example, Fig.13A and Fig. 13B As shown, Fig.13A for Figure 6 The cross-sectional view of the first transition section 21a shown along the section line EE, Fig. 13B for Figure 6 Another cross-sectional view of the first transition segment 21a along the cross-sectional line EE is shown. The first transition segment 21a includes: a first gate metal layer 52, a first source-drain metal layer 62, and a second source-drain metal layer 64 arranged in sequence, a first insulating layer 61 is arranged between two adjacent first transition segments 21a, and the first insulating layer 61 covers the edge of the first transition segment 21a.

[0159] It can be understood that the film layer setting of the second transition section 21bq is the same as the film layer setting of the second transition section 21b. Fig.15 As shown, the second transition segment 21b includes: a first gate metal layer 52 and a first insulating layer 61 arranged in sequence, and the first insulating layer 61 covers the second transition segment 21b. Therefore, the sub-second transition segment 21bq includes: a first gate metal layer 52 and a first insulating layer 61 arranged in sequence, and the first insulating layer 61 covers the second transition segment 21b.

[0160] like Fig.13A As shown, the first transition segment 21a further includes a third source-drain metal layer 66 and a second insulating layer 69 arranged on a side of the second source-drain metal layer 64 away from the first source-drain metal layer 62 . The second insulating layer 69 is located between two adjacent first transition segments 21a and exposes the third source-drain metal layer 66 .

[0161] like Fig.26 and Fig. 27 As shown, the embodiment of the present disclosure further provides a display module 300, which includes the display panel 100 as described in any of the above embodiments, and a flexible circuit board 301. The flexible circuit board 301 includes a plurality of leads 3011, and the plurality of leads 3011 are correspondingly connected to a plurality of binding terminals 12 located in the frame area 20 of the display panel 100.

[0162] like Fig. 27 and Fig.28 As shown, from Fig.28 It can be seen that the relative position relationship between the flexible circuit board 301 and the frame area 20. The frame area 20 is provided with a plurality of signal lines 101, and the plurality of signal lines 101 are correspondingly connected to the plurality of binding terminals 12, and the plurality of signal lines 101 are used to connect to the circuits of the display area 10 and the frame area 20. The portion 30B of the cutting area 30 retains the portion 21D after the adapter line 21 is cut, and the portion 21D of the adapter line 21 is not directly connected to the lead 3011 of the flexible circuit board 301, and the lead 3011 of the flexible circuit board 301 is directly connected to the binding terminal 12. In other words, the flexible circuit board 301 and the frame area 20 have an overlapping area 10A, for example, there is a certain distance d50 between the overlapping area 10A and the plurality of signal lines 101 in the second direction Y. In the overlapping area 10A, the lead 3011 of the flexible circuit board 301 is correspondingly connected to the binding terminal 12.

[0163] The beneficial effects of the display module 300 described above are the same as the beneficial effects of the display panel 100 provided in some embodiments of the present disclosure, and will not be described in detail herein.

[0164] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display motherboard, characterized in that: include: Display area; A frame area located at at least one side of the display area is provided with a plurality of binding terminals arranged along a first direction; A cutting area located at a side of the frame area away from the display area is provided with a plurality of adapter wires arranged along the first direction, one end of the adapter wires is correspondingly connected to the binding terminal, and the other ends of the plurality of adapter wires extend in a direction away from the display area; Among them, along the second direction, there is a difference in the width of at least one of the adapter wires, and the maximum width of the adapter wire is less than or equal to the width of the binding terminal; wherein the second direction intersects with the first direction, the width of the adapter wire is the size of the adapter wire in the first direction, and the width of the binding terminal is the size of the binding terminal in the first direction.

2. The display motherboard according to claim 1, characterized in that: The adapter line includes a first adapter section, a second adapter section and a third adapter section which are sequentially connected; the first adapter section is connected to the binding terminal, and the third adapter section extends in a direction away from the display area; The width of at least a portion of the second transition section is smaller than the width of the first transition section, and smaller than the width of the third transition section.

3. The display motherboard according to claim 2, characterized in that: Along the second direction, the widths of the second transition sections are equal.

4. The display motherboard according to claim 2, characterized in that: Along the second direction, the second transition section includes: a first section and a second section, the first end of the first section is connected to the first transition section, the second end of the first section is connected to the second end of the second section, and the first end of the second section is connected to the third transition section; The width of the first segment decreases along a direction from the first end of the first segment to the second end of the first segment; The width of the second segment decreases along a direction from the first end of the second segment to the second end of the second segment.

5. The display motherboard according to claim 4, characterized in that: Along the direction from the first end of the first segment to the second end of the first segment, the rate of change of the width reduction of the first segment remains constant; Along the direction from the first end of the second segment to the second end of the second segment, the rate of change of the reduction of the width of the second segment remains constant.

6. The display motherboard according to claim 4, characterized in that: Along the direction from the first end of the first segment to the second end of the first segment, the first segment includes a plurality of first sub-segments connected in sequence, and the width of the first sub-segment relatively far from the first transition segment is smaller than the width of the first sub-segment relatively close to the first transition segment; Along the direction from the first end to the second end of the second segment, the second segment includes a plurality of second sub-segments connected in sequence, and the width of the second sub-segment relatively far from the third transition segment is smaller than the width of the second sub-segment relatively close to the third transition segment.

7. The display motherboard according to claim 2, characterized in that: Along the second direction, the second transfer section of the transfer line includes: a plurality of third sub-segments and a plurality of fourth sub-segments which are alternately arranged and connected; A width of each of the plurality of third sub-segments is greater than a width of any fourth sub-segment of the plurality of fourth sub-segments.

8. The display motherboard according to claim 7, characterized in that: The width of each of the third sub-segments is equal, and the width of each of the fourth sub-segments is equal.

9. The display motherboard according to claim 7, characterized in that: The width of each third sub-segment is equal; Along the second direction, the second transition section has a middle position, and along the direction from the first transition section of the transition line to the middle position, the width of the fourth sub-segment relatively far from the first transition section is smaller than the width of the fourth sub-segment relatively close to the first transition section; Along the direction from the third transition section of the transition line to the middle position, the width of the fourth subsection relatively far from the third transition section is smaller than the width of the fourth subsection relatively close to the third transition section.

10. The display motherboard according to claim 2, characterized in that: include: Multiple conductive layers and multiple insulating layers are arranged alternately; The cutting area includes: a first area, a second area and a third area, the first transfer section of the transfer line is located in the first area, the second transfer section of the transfer line is located in the second area, and the third transfer section of the transfer line is located in the third area; The insulating layer in the first region includes an organic film layer and / or an inorganic film layer; the insulating layer in the second region includes an inorganic film layer; and the insulating layer in the third region includes an organic film layer and / or an inorganic film layer.

11. The display motherboard according to claim 1, characterized in that: include: A plurality of conductive layers and an inorganic insulating layer between every two adjacent conductive layers in the plurality of conductive layers; Wherein, at least one pair of two adjacent switching wires are located in different conductive layers.

12. The display motherboard according to claim 11, characterized in that: The plurality of patch cords include: a plurality of first-type patch cords and a plurality of second-type patch cords; the plurality of first-type patch cords and the plurality of second-type patch cords are located in different conductive layers; Along the first direction, the plurality of patch cords are divided into a plurality of patch cord groups arranged side by side, each of the plurality of patch cord groups comprising: a first type patch cord among the plurality of first type patch cords and a second type patch cord among the plurality of second type patch cords.

13. The display motherboard according to claim 12, characterized in that: The multi-layer conductive layer comprises: at least one gate metal layer and at least one source-drain metal layer; the first-type switching line is located at any one of the at least one gate metal layer, and the second-type switching line is located at any one of the at least one source-drain metal layer; or, The multi-layer conductive layer comprises: at least two gate metal layers; the first-type patch cord is located at any one of the at least two gate metal layers, and the second-type patch cord is located at a gate metal layer other than the gate metal layer where the first-type patch cord is located; or, The multi-layer conductive layer includes: at least two source-drain metal layers; the first type of adapter is located at any one of the at least two source-drain metal layers, and the second type of adapter is located at a source-drain metal layer other than the source-drain metal layer where the first type of adapter is located.

14. The display motherboard according to claim 12 or 13, characterized in that: The plurality of patch cords further include a plurality of third-type patch cords; the plurality of third-type patch cords and the plurality of first-type patch cords and the plurality of second-type patch cords are located in different conductive layers; The patch cord group further includes: a third-category patch cord among the plurality of third-category patch cords.

15. The display motherboard according to claim 14, characterized in that: In one of the patch cord groups, the third-type patch cord is located on a side of the second-type patch cord away from the first-type patch cord.

16. The display motherboard according to claim 2, characterized in that: The first transfer section comprises: a first gate metal layer, a first source-drain metal layer, and a second source-drain metal layer arranged in sequence, a first insulating layer is arranged between two adjacent first transfer sections, and the first insulating layer covers the edge of the first transfer section; The second transfer section includes: a first gate metal layer and a first insulating layer arranged in sequence, and the first insulating layer covers the second transfer section.

17. The display motherboard according to claim 16, characterized in that: The first transfer section further includes a third source-drain metal layer and a second insulating layer disposed on a side of the second source-drain metal layer away from the first source-drain metal layer. The second insulating layer is located between two adjacent first transfer sections and exposes the third source-drain metal layer.

18. The display motherboard according to claim 1, characterized in that: The cutting area is also provided with a plurality of unit test terminals, and the unit test terminals are correspondingly connected to the adapter wires; the unit test terminals are used to connect the test structure to perform display test on the display motherboard.

19. A display panel, characterized in that: include: Display area; A frame area located at at least one side of the display area is provided with a plurality of binding terminals arranged along a first direction; A sub-cutting area located at a side of the frame area away from the display area is provided with a plurality of sub-switch wires arranged along the first direction, one end of the sub-switch wire is correspondingly connected to the binding terminal, and the other end of the sub-switch wire extends in a direction away from the display area; Among them, along the second direction, there is a difference in the width of at least one of the sub-switch lines, and the maximum width of the sub-switch line is less than or equal to the width of the binding terminal; wherein the second direction intersects with the first direction, the width of the sub-switch line is the size of the sub-switch line in the first direction, and the width of the binding terminal is the size of the binding terminal in the first direction.

20. The display panel according to claim 19, characterized in that: The sub-adapter includes a first adaptor section and a sub-second adaptor section, one end of the first adaptor section is connected to the binding terminal, the other end of the first adaptor section is connected to one end of the sub-second adaptor section, and the other end of the sub-second adaptor section extends in a direction away from the display area; The width of at least part of the sub-second transition section is smaller than the width of the first transition section.

21. A display module, characterized in that: include: The display panel according to claim 19 or 20; A flexible circuit board comprises a plurality of leads, and the plurality of leads are correspondingly connected to a plurality of binding terminals located in a frame area of ​​the display panel.

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