Surface impurity removal device for semiconductor chip production

Abstract

The utility model discloses a surface impurity removal device for semiconductor chip production, which relates to the technical field of impurity removal devices and comprises a shell assembly, a clamping mechanism is arranged on the shell assembly in a sliding manner, and an adjusting mechanism is further fixedly arranged on the shell assembly. The clamping mechanism comprises a fixed block, a bidirectional screw rod, an adjusting block, a sliding block, a sliding groove, a fixed plate, a sliding plate, a first screw rod and an adjusting handle. According to the utility model, the clamping mechanism with the adjusting block and the adjusting handle is arranged, so that semiconductor chips with different sizes and thicknesses can be clamped and fixed by rotating the adjusting block and the adjusting handle during use; the situation that the impurity removal effect and the impurity removal efficiency are reduced due to the fact that the chip displaces due to the impact force of the ejector in the impurity removal operation or the chip is damaged due to the fact that the chip flies out of the impurity removal table is avoided, the adjusting mode is simple and convenient, and practicability is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of impurity removal devices, in particular to a surface impurity removal device for semiconductor chip production. Background Art

[0002] During the production process, many impurities usually adhere to the surface of semiconductor chips, which affect the working state of the semiconductor chips. Therefore, it is necessary to use a semiconductor chip surface impurity removal device to remove impurities from the semiconductor surface. The semiconductor chip surface impurity removal device uses a plasma mixed liquid injector to clean impurities on the surface of the semiconductor chip in a vacuum environment.

[0003] The utility model patent with the patent application publication number CN 217911168 U discloses a surface impurity removal device for semiconductor chip production, including a box body, a first motor is fixedly installed on the right inner surface of the box body near the upper end, a threaded rod is fixedly connected to the output end of the first motor, a moving block is threadedly connected to the outer cylindrical surface of the threaded rod, a second motor is fixedly installed on the lower inner surface of the moving block near the right side, a gear is fixedly connected to the output end of the second motor, a rack is meshedly connected to the outer surface of the gear, and a connecting block is fixedly connected to the outer surface of the lower end of the rack. The surface impurity removal device for semiconductor chip production has the advantages of being able to adjust the angle and position of the plasma mixture injector and purify the generated waste gas, solving the problem that the angle and position of the plasma mixture injector cannot be adjusted and the generated waste gas cannot be purified.

[0004] However, the above device still has some shortcomings in actual use. The most obvious one is that when the ejector is used to remove impurities from the chip, due to the small weight of the semiconductor chip and the lack of a device to fix the semiconductor chip, the semiconductor chip is easily displaced and falls off the placement plate due to the impact force during the removal process, which reduces the effect of the impurity removal and easily damages the semiconductor chip, causing losses, wasting production time and reducing the efficiency of impurity removal.

[0005] Therefore, it is necessary to invent a surface impurity removal device for semiconductor chip production to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a surface impurity removal device for semiconductor chip production to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a surface impurity removal device for semiconductor chip production, comprising a housing component, a clamping mechanism is slidably provided on the housing component, and an adjustment mechanism is also fixedly provided on the housing component;

[0008] The housing assembly comprises a housing body, a cleaning platform, a side plate and a sliding limit groove, wherein the cleaning platform is fixedly connected to the inner bottom of the housing body, the side plate is fixedly connected to the cleaning platform and is located above the cleaning platform, and the sliding limit groove is provided on the surface of the side plate;

[0009] The clamping mechanism includes a fixed block, a bidirectional screw, an adjusting block, a sliding block, a sliding groove, a fixed plate, a sliding plate, a first screw and an adjusting handle. The fixed block is provided with two, the two fixed blocks are fixedly connected to the side plates and are located on the outside of the side plates, the bidirectional screw is rotatably connected to the fixed block through a bearing and is located on the outside of the fixed block, the adjusting block is fixedly sleeved on the outside of the bidirectional screw, the sliding block is provided with two, the two sliding blocks are threadedly connected to the bidirectional screw and are located on the outside of the bidirectional screw, the sliding block is slidably connected to the side plate through a sliding limit groove, the sliding groove is opened on the surface of the sliding block, the fixed plate is fixedly connected to the sliding block and is located inside the sliding block, the first screw and the sliding block are rotatably connected through a bearing and are located inside the sliding groove, the sliding plate is threadedly connected to the first screw and is located inside the sliding groove, and the adjusting handle is fixedly connected to the first screw and is located on the outside of the first screw.

[0010] Preferably, the shell assembly also includes a baffle, an air purification device, a ventilation pipe and a vacuum pump, the baffle is fixedly connected to the shell body and is located inside the shell body, the air purification device is fixedly connected to the shell body and is located outside the shell body, the ventilation pipe is fixedly connected above the air purification device and passes through the shell body, and the vacuum pump is fixedly connected to the shell body and is located outside the shell body.

[0011] Preferably, the adjustment mechanism includes a rotating motor, a second screw, a mounting block, a mounting plate, a telescopic motor, a U-shaped baffle, a protrusion, a rotating rod and a plasma mixing injector.

[0012] Preferably, the rotating motor is fixedly connected to the shell body and is located inside the shell body, one end of the second screw is fixedly connected to the rotating motor and is located outside the rotating motor, the other end of the second screw is rotatably connected to the shell body through a bearing, the mounting block is threadedly connected to the second screw and is located outside the second screw, the mounting plate is fixedly connected to the mounting block and is located below the mounting block, the telescopic motor is fixedly connected to the mounting plate and is located outside the mounting plate, the U-shaped baffle is fixedly connected to the output end of the telescopic motor, the protrusion is fixedly connected to the mounting block and is located below the mounting block, the rotating rod is rotatably connected to the protrusion through a pin shaft and is located below the protrusion, and the plasma mixing injector is fixedly connected below the rotating rod.

[0013] Technical effects and advantages of the utility model:

[0014] The utility model is provided with a clamping mechanism with an adjusting block and an adjusting handle, so that when in use, the semiconductor chips of different sizes and thicknesses can be clamped and fixed by rotating the adjusting block and the adjusting handle, thereby avoiding the chip displacement due to the impact force of the ejector during the impurity removal operation, thereby reducing the impurity removal effect and efficiency, or the chip flying out of the impurity removal table and causing the chip to be damaged. The adjustment method is simple and convenient, and is more practical.

[0015] The utility model is provided with an adjustment mechanism, so that when performing impurity removal operations, the position of the mounting block can be adjusted by rotating the motor so that the plasma mixed liquid injector can be moved to a suitable position, and the injection angle of the plasma mixed liquid injector can be adjusted by the telescopic motor, thereby improving the impurity removal efficiency and effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view of the internal structure of the utility model.

[0017] Figure 2 It is a schematic diagram of the overall structure of the utility model.

[0018] Figure 3 It is a schematic diagram of the clamping mechanism of the utility model.

[0019] Figure 4 It is a side view of the clamping mechanism of the utility model.

[0020] Figure 5 It is a schematic diagram of the adjustment mechanism of the utility model.

[0021] Figure 6 It is a cross-sectional view of the adjustment mechanism of the utility model.

[0022] In the figure: 1. Shell assembly; 11. Shell body; 12. De-impurity table; 13. Side panel; 14. Sliding limit groove; 15. Baffle; 16. Air purification device; 17. Ventilation pipe; 18. Vacuum pump; 2. Clamping mechanism; 21. Fixed block; 22. Bidirectional screw; 23. Adjusting block; 24. Sliding block; 25. Sliding groove; 26. Fixed plate; 27. Sliding plate; 28. First screw; 29. ​​Adjusting handle; 3. Adjusting mechanism; 31. Rotating motor; 32. Second screw; 33. Mounting block; 34. Mounting plate; 35. Telescopic motor; 36. U-shaped baffle; 37. Bump; 38. Rotating rod; 39. Plasma mixture injector. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The utility model provides Figure 1-6 A surface impurity removal device for semiconductor chip production shown in the figure comprises a housing component 1, a clamping mechanism 2 is slidably arranged on the housing component 1, and an adjustment mechanism 3 is also fixedly arranged on the housing component 1;

[0025] More specifically, the housing assembly 1 includes a housing body 11, a cleaning table 12, a side plate 13, a sliding limit groove 14, a baffle 15, an air purification device 16, a ventilation pipe 17 and a vacuum pump 18. The cleaning table 12 is fixedly connected to the inner bottom of the housing body 11, the side plate 13 is fixedly connected to the cleaning table 12 and is located above the cleaning table 12, the sliding limit groove 14 is provided on the surface of the side plate 13, the baffle 15 is fixedly connected to the housing body 11 and is located inside the housing body 11, the air purification device 16 is fixedly connected to the housing body 11 and is located outside the housing body 11, the ventilation pipe 17 is fixedly connected above the air purification device 16 and passes through the housing body 11, and the vacuum pump 18 is fixedly connected to the housing body 11 and is located outside the housing body 11;

[0026] like Figure 3-4 As shown, the clamping mechanism 2 includes a fixed block 21, a bidirectional screw 22, an adjusting block 23, a sliding block 24, a sliding groove 25, a fixed plate 26, a sliding plate 27, a first screw 28 and an adjusting handle 29. The fixed block 21 is provided with two, and the two fixed blocks 21 are fixedly connected to the side plate 13 and are located on the outside of the side plate 13. The bidirectional screw 22 is rotatably connected to the fixed block 21 through a bearing and is located on the outside of the fixed block 21. The adjusting block 23 is fixedly sleeved on the outside of the bidirectional screw 22. The sliding block 24 is provided with two, and the two sliding blocks 24 are connected to the fixed block 21. The bidirectional screw 22 is threadedly connected and is located on the outside of the bidirectional screw 22. The sliding block 24 is slidingly connected to the side plate 13 through the sliding limit groove 14. The sliding groove 25 is opened on the surface of the sliding block 24. The fixed plate 26 is fixedly connected to the sliding block 24 and is located inside the sliding block 24. The first screw 28 is rotationally connected to the sliding block 24 through a bearing and is located inside the sliding groove 25. The sliding plate 27 is threadedly connected to the first screw 28 and is located inside the sliding groove 25. The adjustment handle 29 is fixedly connected to the first screw 28 and is located on the outside of the first screw 28.

[0027] The housing assembly 1 further comprises a baffle 15, an air purification device 16, a ventilation pipe 17 and a vacuum pump 18. The baffle 15 is fixedly connected to the housing body 11 and is located inside the housing body 11. The air purification device 16 is fixedly connected to the housing body 11 and is located outside the housing body 11. The ventilation pipe 17 is fixedly connected above the air purification device 16 and passes through the housing body 11. The vacuum pump 18 is fixedly connected to the housing body 11 and is located outside the housing body 11. By providing a clamping mechanism with an adjustment block 23 and an adjustment handle 29, semiconductor chips of different sizes and thicknesses can be clamped and fixed by rotating the adjustment block 23 and the adjustment handle 29 during use, thereby avoiding the reduction of the cleaning effect and cleaning efficiency due to the impact force of the ejector when performing the cleaning operation, or the chip flying out of the cleaning table 12 to cause the chip to be damaged. The adjustment method is simple and convenient, and more practical.

[0028] like Figure 5-6 As shown, the adjustment mechanism 3 includes a rotating motor 31, a second screw 32, a mounting block 33, a mounting plate 34, a telescopic motor 35, a U-shaped baffle 36, a protrusion 37, a rotating rod 38 and a plasma mixing injector. The rotating motor 31 is fixedly connected to the housing body 11 and is located inside the housing body 11. One end of the second screw 32 is fixedly connected to the rotating motor 31 and is located outside the rotating motor 31. The other end of the second screw 32 is rotatably connected to the housing body 11 through a bearing. The mounting block 33 is threadedly connected to the second screw 32 and is located outside the second screw 32. The mounting plate 34 is fixedly connected to the mounting block 33 and is located below the mounting block 33. The telescopic motor 35 It is fixedly connected to the mounting plate 34 and is located outside the mounting plate 34, the U-shaped baffle 36 is fixedly connected to the output end of the telescopic motor 35, the protrusion 37 is fixedly connected to the mounting block 33 and is located below the mounting block 33, the rotating rod 38 is rotatably connected to the protrusion 37 through a pin shaft and is located below the protrusion 37, and the plasma mixing injector is fixedly connected below the rotating rod 38. By providing an adjustment mechanism 3, the position of the mounting block 33 can be adjusted by rotating the motor 31 during the impurity removal operation so that the plasma mixed liquid injector 39 is moved to a suitable position, and the injection angle of the plasma mixed liquid injector 39 can be adjusted by the telescopic motor 35, thereby improving the impurity removal efficiency and effect.

[0029] Working principle of this utility model:

[0030] During actual use, the operator first rotates the adjustment handle 29 according to the size of the semiconductor chip to be cleaned, and the adjustment handle 29 drives the first screw 28 to rotate, and the movement of the screw drives the sliding plate 27 to slide in the sliding groove 25 until the sliding plate 27 slides to a suitable position. At this time, the operator places the semiconductor chip on the fixed plate 26 and the sliding plate 27 below, and then rotates the adjustment block 23 to drive the bidirectional screw 22 to rotate, and the rotation of the bidirectional screw 22 drives the two sliding blocks 24 to move towards each other until the two sets of fixed plates 26 and sliding plates 27 clamp and fix the semiconductor chip to facilitate the cleaning operation, and then the operator turns on the rotating motor 31 to drive the second screw 32 to rotate, and the second screw 32 drives the mounting block 33 to move until it moves to a suitable position, and then the operator turns on the telescopic motor 35, and the telescopic motor 35 drives the U-shaped baffle 36 to move, and the U-shaped baffle 36 drives the rotating rod 38 to rotate to adjust the injection angle of the plasma mixed liquid injector 39.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A surface impurity removal device for semiconductor chip production, characterized in that: It comprises a housing component (1), a clamping mechanism (2) is slidably arranged on the housing component (1), and an adjustment mechanism (3) is also fixedly arranged on the housing component (1); The housing assembly (1) comprises a housing body (11), a cleaning platform (12), a side plate (13) and a sliding limit groove (14); the cleaning platform (12) is fixedly connected to the inner bottom of the housing body (11); the side plate (13) is fixedly connected to the cleaning platform (12) and is located above the cleaning platform (12); and the sliding limit groove (14) is provided on the surface of the side plate (13); The clamping mechanism (2) comprises a fixed block (21), a bidirectional screw (22), an adjusting block (23), a sliding block (24), a sliding groove (25), a fixed plate (26), a sliding plate (27), a first screw (28) and an adjusting handle (29). The fixed block (21) is provided with two, the two fixed blocks (21) are fixedly connected to the side plate (13) and are located outside the side plate (13), the bidirectional screw (22) is rotatably connected to the fixed block (21) through a bearing and is located outside the fixed block (21), the adjusting block (23) is fixedly sleeved on the outside of the bidirectional screw (22), the sliding block (24) is provided with two, the two sliding blocks (24) The sliding block (24) is connected to the bidirectional screw (22) by threading and is located outside the bidirectional screw (22); the sliding block (24) is connected to the side plate (13) by sliding through the sliding limit groove (14); the sliding groove (25) is formed on the surface of the sliding block (24); the fixing plate (26) is connected to the sliding block (24) by threading and is located inside the sliding block (24); the first screw (28) is connected to the sliding block (24) by bearings and is located inside the sliding groove (25); the sliding plate (27) is connected to the first screw (28) by threading and is located inside the sliding groove (25); the adjusting handle (29) is connected to the first screw (28) by threading and is located outside the first screw (28).

2. The surface impurity removal device for semiconductor chip production according to claim 1, characterized in that: The housing assembly (1) further comprises a baffle (15), an air purification device (16), a ventilation pipe (17) and a vacuum pump (18); the baffle (15) is fixedly connected to the housing body (11) and is located inside the housing body (11); the air purification device (16) is fixedly connected to the housing body (11) and is located outside the housing body (11); the ventilation pipe (17) is fixedly connected above the air purification device (16) and passes through the housing body (11); and the vacuum pump (18) is fixedly connected to the housing body (11) and is located outside the housing body (11).

3. The surface impurity removal device for semiconductor chip production according to claim 2, characterized in that: The regulating mechanism (3) comprises a rotating motor (31), a second screw rod (32), a mounting block (33), a mounting plate (34), a telescopic motor (35), a U-shaped baffle (36), a convex block (37), a rotating rod (38) and a plasma mixing injector.

4. The surface impurity removal device for semiconductor chip production according to claim 3, characterized in that: The rotating motor (31) is fixedly connected to the housing body (11) and is located inside the housing body (11); one end of the second screw rod (32) is fixedly connected to the rotating motor (31) and is located outside the rotating motor (31); the other end of the second screw rod (32) is rotatably connected to the housing body (11) via a bearing; the mounting block (33) is threadedly connected to the second screw rod (32) and is located outside the second screw rod (32); the mounting plate (34) is fixedly connected to the mounting block (33) and is located outside the second screw rod (32); Below the mounting block (33), the telescopic motor (35) is fixedly connected to the mounting plate (34) and is located outside the mounting plate (34); the U-shaped baffle (36) is fixedly connected to the output end of the telescopic motor (35); the protrusion (37) is fixedly connected to the mounting block (33) and is located below the mounting block (33); the rotating rod (38) is rotatably connected to the protrusion (37) via a pin shaft and is located below the protrusion (37); and the plasma mixing injector is fixedly connected below the rotating rod (38).

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