Device for processing diamond micropores by laser-assisted wet etching

Abstract

The utility model discloses a device for processing diamond micropores through laser-assisted wet etching. The device comprises a processing platform, a liquid container, a laser scanning system, an ultrasonic generating device and an auxiliary heating device, the processing platform is used for fixing a diamond sheet; the liquid container is arranged on the processing platform; the liquid container is filled with corrosive liquid, and the diamond sheet subjected to phase change is immersed in the corrosive liquid of the liquid container; the liquid container is filled with corrosive liquid, and the diamond sheet subjected to phase change is immersed in the corrosive liquid of the liquid container; the ultrasonic generating device and the auxiliary heating device are respectively used for carrying out ultrasonic treatment and auxiliary heating on the corrosive liquid in the liquid container so as to accelerate chemical reaction and removal of graphite, so that micropores are formed in the surface of the diamond sheet. The diamond drilling efficiency is remarkably improved, and the time cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of laser-assisted wet etching, in particular to a laser-assisted wet etching device for processing diamond micropores. Background Art

[0002] Diamond is widely used in optical devices, electronic components, cutting tools and other fields due to its extremely high hardness and excellent physical and chemical properties. However, the high hardness of diamond also makes it extremely difficult to process, especially when drilling micro holes. Traditional mechanical processing methods face extremely high time costs and tool wear problems.

[0003] In recent years, the development of laser technology has provided new possibilities for diamond processing. In particular, picosecond lasers can achieve fine processing of materials due to their extremely short pulse width and high peak power. During the process of diamond processing with picosecond lasers, the diamond in the laser irradiated area will undergo a phase change to form graphite. This phase-changed graphite area is more likely to participate in chemical reactions, making further wet etching possible. Utility Model Content

[0004] The purpose of the utility model is to provide a laser-assisted wet etching device for processing diamond micropores, so as to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.

[0005] The utility model adopts the following technical solutions to achieve the above utility model objectives:

[0006] The utility model provides a laser-assisted wet etching device for processing diamond micropores, comprising a processing platform, a liquid container, a laser scanning system, an ultrasonic generating device and an auxiliary heating device;

[0007] The processing platform is used to fix the diamond slice, and the liquid container is arranged on the processing platform;

[0008] The laser scanning system is used to perform laser irradiation on the diamond slice on the processing platform, so that the diamond slice in the irradiated area is phase-transformed into graphite;

[0009] The liquid container contains a corrosive liquid, and the diamond slice after phase change is immersed in the corrosive liquid in the liquid container;

[0010] The ultrasonic generating device and the auxiliary heating device are used for ultrasonically treating and auxiliary heating the corrosive liquid in the liquid container respectively, so as to accelerate the chemical reaction and removal of graphite, thereby forming micropores on the surface of the diamond slice.

[0011] Further, the laser scanning system includes a laser and an optical path scanning system;

[0012] The laser is used to emit a pulsed laser beam, and the laser beam is scanned on the surface of the diamond slice on the processing platform through the optical path scanning system to form a microhole array.

[0013] Furthermore, the laser is an infrared picosecond laser.

[0014] Furthermore, the pulse width of the infrared femtosecond laser is less than 10 picoseconds and the power density is greater than 10^9 W / cm 2 .

[0015] Furthermore, the optical path scanning system comprises a reflector, a galvanometer and a field mirror arranged in sequence along the laser optical path;

[0016] The reflecting mirror, the galvanometer mirror and the field mirror are located above the processing platform.

[0017] Furthermore, the auxiliary heating device is a heating tube, and the heating end of the heating tube extends into the liquid container.

[0018] Furthermore, a bracket for fixing the diamond slice is provided on the processing platform.

[0019] Further, a machine vision system is included;

[0020] The machine vision system is located above the laser scanning system and is used for positioning the processing sample and the light beam.

[0021] Furthermore, the corrosive liquid in the liquid container is hydrofluoric acid or nitric acid solution.

[0022] The beneficial effects of the utility model are as follows:

[0023] Efficient processing: The combination of laser and chemical etching greatly improves the efficiency of diamond drilling.

[0024] Precise control: By adjusting the laser and etching parameters, the size and shape of the micropores can be precisely controlled.

[0025] Reduce costs: Reduce the wear and time cost of machining and improve the overall processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The present invention is a schematic structural diagram of a laser-assisted wet etching device for processing diamond micropores according to an embodiment of the present invention.

[0027] In the figure: 10, processing platform; 20, liquid container; 30, laser scanning system; 31, laser; 32, reflector; 33, galvanometer; 34, field lens; 40, ultrasonic generator; 50, auxiliary heating device; 60, diamond slice; 70, bracket; 80, machine vision system. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0029] like Figure 1 The device for processing diamond micropores by laser-assisted wet etching shown in the figure comprises a processing platform 10, a liquid container 20, a laser scanning system 30, an ultrasonic generator 40 and an auxiliary heating device 50; the processing platform 10 is used to fix a diamond slice 60, and the liquid container 20 is arranged on the processing platform 10; the laser scanning system 30 is used to perform laser irradiation on the diamond slice 60 on the processing platform 10, so that the diamond slice 60 in the irradiated area is phase-changed into graphite; the liquid container 20 contains a corrosive liquid, and the diamond slice 60 after the phase change is immersed in the corrosive liquid in the liquid container 20; the ultrasonic generator 40 and the auxiliary heating device 50 are respectively used to perform ultrasonic treatment and auxiliary heating on the corrosive liquid in the liquid container 20, so as to accelerate the chemical reaction and removal of graphite, thereby forming micropores on the surface of the diamond slice 60.

[0030] Based on the above structure, the laser scanning system 30 includes a laser 31 and an optical path scanning system; the laser 31 is used to emit a pulsed laser beam, and scan the laser beam on the surface of the diamond slice 60 on the processing platform 10 through the optical path scanning system to form a microhole array.

[0031] Based on the above structure, the laser 31 uses an infrared picosecond laser, the pulse width of which is less than 10 picoseconds and the power density is greater than 10^9 W / cm 2 .

[0032] Based on the above structure, the optical path scanning system includes a reflector 32, a galvanometer 33 and a field lens 34 arranged in sequence along the laser optical path; the reflector 32, the galvanometer 33 and the field lens 34 are located above the processing platform 10, and the reflector 32 is at an angle of 45° with the horizontal direction, so that the laser beam output by the laser 31 can be vertically projected onto the galvanometer 33.

[0033] Based on the above structure, the auxiliary heating device 50 is a heating tube, the heating end of the heating tube extends into the liquid container 20, and the temperature range of the auxiliary heating is 30-70°C.

[0034] Based on the above structure, a bracket 70 for fixing the diamond slice 60 is provided on the processing platform 10 .

[0035] Based on the above structure, it also includes a machine vision system 80; the machine vision system 80 is located above the laser scanning system 30 and is used to position the processing sample and the light beam. Here, the machine vision system 80 uses auxiliary processing systems such as positioning cameras to cooperate with the galvanometer 33 to accurately adjust the position of the laser focus point with high precision.

[0036] Based on the above structure, the etching liquid in the liquid container 20 is selected from hydrofluoric acid or nitric acid solution, and the concentration of the hydrofluoric acid or nitric acid solution is in the range of 5%-30% to ensure the etching efficiency.

[0037] Based on the above structure, the frequency of ultrasonic treatment is 20-40kHz.

[0038] In this embodiment, a diamond slice 60 with a thickness of 0.5 mm is selected as the sample to be processed. First, the diamond slice 60 is fixed on the processing platform 10 and irradiated with a single-mode high-beam-quality picosecond laser beam. The laser pulse width is set to 8 picoseconds and the power density is 2x10^9 W / cm 2 The diamond flake 60 in the laser irradiated area undergoes a phase transformation into graphite.

[0039] Then, the diamond slice 60 was immersed in a 10% hydrofluoric acid solution, the solution temperature was maintained at 50° C., and ultrasonic treatment was performed at a frequency of 25 kHz. After 30 minutes of treatment, the graphite area was effectively removed, forming micropores with a diameter of 50 microns.

[0040] In this embodiment, a diamond slice 60 with a thickness of 1 mm is selected as the sample to be processed. First, the diamond slice 60 is fixed on the processing platform 10 and irradiated with a single-mode high-beam-quality picosecond laser beam. The laser pulse width is set to 5 picoseconds and the power density is 3x10^9 W / cm 2 The diamond flake 60 in the laser irradiated area undergoes a phase transformation into graphite.

[0041] Then, the diamond slice 60 was immersed in a 15% nitric acid solution, the solution temperature was maintained at 60° C., and ultrasonic treatment was performed at an ultrasonic frequency of 30 kHz. After 20 minutes of treatment, the graphite area was effectively removed, forming micropores with a diameter of 30 microns.

[0042] Through the implementation of the utility model, the drilling efficiency and precision of the diamond slice are significantly improved, and the utility model has a wide application prospect.

[0043] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A laser-assisted wet etching device for processing diamond micropores, characterized in that: It includes a processing platform, a liquid container, a laser scanning system, an ultrasonic generating device and an auxiliary heating device; The processing platform is used to fix the diamond slice, and the liquid container is arranged on the processing platform; The laser scanning system is used to perform laser irradiation on the diamond slice on the processing platform, so that the diamond slice in the irradiated area is phase-transformed into graphite; The liquid container contains a corrosive liquid, and the diamond slice after phase change is immersed in the corrosive liquid in the liquid container; The ultrasonic generating device and the auxiliary heating device are used for ultrasonically treating and auxiliary heating the corrosive liquid in the liquid container respectively, so as to accelerate the chemical reaction and removal of graphite, thereby forming micropores on the surface of the diamond slice.

2. The laser-assisted wet etching device for processing diamond micropores according to claim 1, characterized in that: The laser scanning system includes a laser and an optical path scanning system; The laser is used to emit a pulsed laser beam, and the laser beam is scanned on the surface of the diamond slice on the processing platform through the optical path scanning system to form a microhole array.

3. The laser-assisted wet etching device for processing diamond micropores according to claim 2, characterized in that: The laser is an infrared picosecond laser.

4. The laser-assisted wet etching device for processing diamond micropores according to claim 3, characterized in that: The pulse width of the infrared picosecond laser is less than 10 picoseconds and the power density is greater than 10^9 W / cm 2 .

5. The laser-assisted wet etching device for processing diamond micropores according to claim 2, characterized in that: The optical path scanning system comprises a reflector, a galvanometer and a field mirror arranged in sequence along the laser optical path; The reflecting mirror, the galvanometer mirror and the field mirror are located above the processing platform.

6. The laser-assisted wet etching device for processing diamond micropores according to claim 1, characterized in that: The auxiliary heating device is a heating tube, and the heating end of the heating tube extends into the liquid container.

7. The laser-assisted wet etching device for processing diamond micropores according to claim 1, characterized in that: The processing platform is provided with a bracket for fixing the diamond slice.

8. The laser-assisted wet etching device for processing diamond micropores according to claim 1, characterized in that: It also includes machine vision systems; The machine vision system is located above the laser scanning system and is used for positioning the processing sample and the light beam.

9. The laser-assisted wet etching device for processing diamond micropores according to claim 1, characterized in that: The corrosive liquid in the liquid container is selected from hydrofluoric acid or nitric acid solution.

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