Heat dissipation device for laser processing

Abstract

The utility model relates to the technical field of laser processing heat dissipation, and discloses a laser processing heat dissipation device which comprises a heat dissipation sleeve arranged outside a laser processing head in a sleeved mode, the two sides of the heat dissipation sleeve are movably connected with a first supporting arm and a second supporting arm respectively, and a heat dissipation ring is installed at the tail end of the first supporting arm. The tail end of the second support arm is fixed with the heat dissipation ring; the heat dissipation ring can be rapidly installed at the end of the laser machining head through the first supporting arm and the second supporting arm and makes contact with the surface of a workpiece preferentially, under linkage of the guide rod, the spring and the sliding block, the distance between the laser machining head and the heat dissipation ring can be changed, and it is guaranteed that the heat dissipation ring and the surface of the workpiece are kept in a tightly attached state in the laser machining process.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing heat dissipation, in particular to a laser processing heat dissipation device. Background Art

[0002] Laser cladding technology is a surface modification technology that uses laser processing. It is a high-tech technology involving multiple fields such as optics, electricity, computers, materials, chemistry, physics, and machinery. It is a new surface modification technology that has emerged with the development of high-power lasers. Laser cladding forming technology can directly manufacture parts or molds with certain functional characteristics, good organization, and density. It is involved in the processing and manufacturing of important parts in automobiles and aerospace, maintenance, production of complex and special-shaped parts, rapid mold manufacturing in research and development, and research and development and manufacturing of high-precision weapons in military enterprises. In the laser cladding process, the powder is ejected from the coaxial powder feeding nozzle and sent to the surface of the substrate. It absorbs the laser energy to melt and the substrate absorbs the energy to melt to form a molten pool. The nozzle runs according to the scanning path controlled by the computer. The powder delivered to the surface of the substrate by the powder feeder absorbs light energy and melts continuously, and then solidifies rapidly, thereby realizing molding manufacturing, surface repair, etc.

[0003] During the whole process, in order to ensure the cladding quality, the temperature of the substrate and the workpiece should not be too high during cladding. However, during laser cladding, the workpiece cannot be cooled by oil as in traditional processing, and the energy absorbed by the substrate and parts during the cladding process is too late to be dissipated. As the energy accumulates, the temperature rises higher and higher, which will cause the substrate to warp and affect the cladding accuracy. In addition, the increase in the workpiece temperature will also cause the parts to grow slowly in the Z-axis direction during the cladding process or even fail to collapse, which greatly affects the quality of laser cladding processing. Ensure that the workpiece and substrate are at a relatively suitable temperature to prevent the substrate from warping, and ensure that the growth along the Z-axis direction during the cladding process can be smooth and prevent collapse, thereby improving the forming quality.

[0004] Chinese patent application No.: 201710227675.3 discloses a cooling device for laser cladding. Although a water-cooling pipe is introduced to cool the laser processing head, the contact between the pipe and the laser head and the workpiece is not good, and the heat dissipation performance is poor. If the laser cladding workpiece processing cycle is long, the cooling effect on the substrate will be weakened. Utility Model Content

[0005] The utility model aims to provide a heat dissipation device for laser processing, aiming to solve the problem of poor heat dissipation effect on the laser processing head and the workpiece during the existing laser processing.

[0006] The utility model is implemented as follows: a heat dissipation device for laser processing comprises a heat dissipation sleeve sleeved on the outside of a laser processing head, a first arm and a second arm are movably connected on both sides of the heat dissipation sleeve, a heat dissipation ring is installed at the end of the first arm, and the end of the second arm is fixed to the heat dissipation ring;

[0007] The inner wall of the heat dissipation sleeve is evenly distributed with a plurality of guide grooves, a slider is slidably connected inside the guide groove, and a diagonal support rod is connected through the slider spring shaft, the end of the diagonal support rod is connected to a clamping bushing through a rotating shaft, a medium duct is penetrated through the clamping bushing and the heat dissipation ring, a telescopic sleeve is also sleeved on the outer side of the top of the heat dissipation sleeve, and a pressure ring acting on the top of the diagonal support rod is arranged on the inner side of the telescopic sleeve.

[0008] Preferably, connectors are provided on both sides of the end of the heat dissipation sleeve, and the ends of the first arm and the second arm are respectively connected through two connector shafts.

[0009] Preferably, the upper ends of the first arm and the second arm are vertically arranged, and the lower ends of the first arm and the second arm are inclinedly arranged.

[0010] Preferably, a slot is provided on one side of the heat dissipation ring close to the second arm, and an armature is embedded in the slot. A magnetic plate corresponding to the armature is installed at the lower end of the second arm, and the magnetic plate is embedded in the slot.

[0011] Preferably, a guide rod is provided inside the guide groove, and a spring is sleeved outside the guide rod, and the upper and lower parts of the spring respectively contact with the bottom of the slider and the bottom inner wall of the guide groove.

[0012] Preferably, a heat exchange tube is arranged inside the clamping bushing, the heat exchange tube is made of a copper tube, and the upper and lower parts of the copper tube are respectively connected in series with the medium conduit;

[0013] A second heat-conducting patch is embedded in the clamping bushing near the axial direction of the heat-dissipating sleeve. The second heat-conducting patch is made of silicone grease, and the other end of the second heat-conducting patch is in contact with the surface of the heat exchange tube.

[0014] Preferably, a first thermally conductive patch is embedded in the bottom of the heat dissipation ring, and the material of the first thermally conductive patch is silicone grease.

[0015] The utility model discloses a heat dissipation device for laser processing, which has the following beneficial effects:

[0016] 1. The first and second thermal conductive patches made of silicone grease and the heat exchange tube made of brass are used to optimize the heat dissipation effect, ensure efficient heat exchange efficiency, improve the heat dissipation efficiency during laser processing, and prevent thermal expansion, thermal deformation and thermal damage caused by overheating during laser processing.

[0017] 2. The clamping bushing, diagonal support rod and telescopic sleeve are linked to ensure that the clamping bushing can be opened and close to the surface of the laser processing head, which is easy to load and unload, allowing users to easily replace and clean. This helps to extend the service life of the equipment and maintain its performance.

[0018] 3. The heat dissipation ring can be quickly installed on the end of the laser processing head through the first arm and the second arm, and it will contact the workpiece surface first. Under the linkage of the guide rod, spring and slider, the distance between the laser processing head and the heat dissipation ring can be changed to ensure that the heat dissipation ring and the workpiece surface remain in close contact during the laser processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of a heat dissipation device for laser processing provided by an embodiment of the utility model;

[0020] Figure 2 This is a heat dissipation device for laser processing provided by the embodiment of the utility model Figure 1 Schematic diagram of the AA section along the arrow direction;

[0021] Figure 3 It is a schematic diagram of the bottom structure of a heat dissipation device for laser processing provided by an embodiment of the utility model.

[0022] Marking Description:

[0023] 1. Heat dissipation sleeve; 2. Connector; 3. First arm; 4. Second arm; 5. Heat dissipation ring; 6. Clamping bushing; 7. Telescopic sleeve; 8. Medium conduit;

[0024] 11. Guide groove;

[0025] 41. Magnetic plate;

[0026] 51. The first thermal conductive patch;

[0027] 61. second heat-conducting patch; 62. guide rod; 63. spring; 64. slider; 65. diagonal support rod; 66. heat exchange tube;

[0028] 71. Pressure ring. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0030] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on the present utility model. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0031] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0032] In this embodiment:

[0033] Reference Figure 1-3 As shown, a preferred embodiment of the utility model is provided.

[0034] The heat dissipation device for laser processing of this embodiment comprises a heat dissipation sleeve 1 sleeved on the outside of the laser processing head, and the first arm 3 and the second arm 4 are movably connected to the two sides of the heat dissipation sleeve 1, and the end of the first arm 3 is installed with a heat dissipation ring 5, and the end of the second arm 4 is fixed to the heat dissipation ring 5;

[0035] The inner wall of the heat dissipation sleeve 1 is evenly distributed with a plurality of guide grooves 11, the inside of the guide groove 11 is slidably connected with a slider 64, and a diagonal support rod 65 is connected to the slider 64 through a spring shaft, and the end of the diagonal support rod 65 is connected to a clamping bushing 6 through a rotating shaft, and a medium duct 8 is penetrated through the inside of the clamping bushing 6 and the heat dissipation ring 5. A telescopic sleeve 7 is also sleeved on the outside of the top of the heat dissipation sleeve 1, and a pressure ring 71 acting on the top of the diagonal support rod 65 is provided on the inner side of the telescopic sleeve 7.

[0036] Wherein, connectors 2 are provided on both sides of the end of the heat dissipation sleeve 1, and the ends of the first arm 3 and the second arm 4 are respectively connected by the two rotating shafts of the connectors 2, so that the first arm 3 and the second arm 4 can be opened outward or brought together through the connector 2, the upper ends of the first arm 3 and the second arm 4 are vertically arranged, and the lower ends of the first arm 3 and the second arm 4 are inclinedly arranged, and a slot is provided on the side of the heat dissipation ring 5 close to the second arm 4, and an armature is embedded in the slot, and a magnetic attraction plate 41 corresponding to the armature is installed at the lower end of the second arm 4, and the magnetic attraction plate 41 is embedded in the slot, and the magnetic attraction setting can quickly enable the first arm 3 and the second arm 4 to support the heat dissipation ring 5, so that the heat dissipation ring 5 acts on the surface of the workpiece, and when the workpiece surface does not need to be cooled, it is only necessary to open the first arm 3 and the second arm 4 to both sides along the connector 2;

[0037] At the same time, a first heat-conducting patch 51 is embedded at the bottom of the heat dissipation ring 5. The material of the first heat-conducting patch 51 is silicone grease. The first heat-conducting patch 51 conducts the heat on the surface of the workpiece to the medium conduit 8 to exchange heat with the coolant, so as to dissipate the heat on the surface of the workpiece at the processing location during the laser processing process.

[0038] Furthermore, a guide rod 62 is provided inside the guide groove 11, and a spring 63 is sleeved outside the guide rod 62. The upper and lower parts of the spring 63 respectively contact the bottom of the slider 64 and the inner wall of the bottom of the guide groove 11. Under the action of the spring 63, the slider 64 is pushed up, and the diagonal support rod 65 on the slider 64 contacts the inner wall of the pressure ring 71, so that the diagonal support rod 65 is rotated counterclockwise along the connection of the spring axis of the slider 64, so that the plurality of clamping bushings 6 in the heat dissipation sleeve 1 are in an open state. When the laser processing head is inserted into the heat dissipation sleeve 1, the telescopic sleeve 7 is pulled out upward to separate the pressure ring 71 from the diagonal support rod 65. Under the action of the spring axis, the clamping bushing 6 is clamped on the outside of the laser processing head;

[0039] It is worth noting that a heat exchange tube 66 is arranged inside the clamping bushing 6. The heat exchange tube 66 is made of a copper tube, and the upper and lower parts of the copper tube are respectively connected in series with the medium conduit 8. The clamping bushing 6 is embedded with a second heat conductive patch 61 in the axial direction close to the heat dissipation sleeve 1. The second heat conductive patch 61 is made of silicone grease, and the other end of the second heat conductive patch 61 is in contact with the surface of the heat exchange tube 66, ensuring that cooling water can be introduced into the heat exchange tube 66 through the medium conduit 8, and perform heat exchange operation with the heat conducted from the second heat conductive patch 61;

[0040] Since the second thermally conductive patch 61 is embedded in the surface of the clamping bushing 6, the second thermally conductive patch 61 protrudes compared to the surface of the clamping bushing 6. When the clamping bushing 6 is clamped on the outside of the laser processing head, the end of the laser processing head has a protruding edge that is tightly attached to the lower end of the second thermally conductive patch 61. This allows the heat dissipation ring 5 to preferentially adhere to the surface of the workpiece as the truss moves downward, and as the laser processing head continues to move downward, it drives the slider 64 to compress the spring 63, ensuring that there is a certain degree of mobility between the laser processing head and the heat dissipation ring 5, and ensuring that the heat dissipation ring 5 remains in close contact with the surface of the workpiece during laser processing.

[0041] The first thermal conductive patch 51 and the second thermal conductive patch 61 made of silicone grease and the heat exchange tube 66 made of brass are used to optimize the heat dissipation effect, ensure efficient heat exchange efficiency, improve the heat dissipation efficiency during laser processing, and prevent thermal expansion, thermal deformation and thermal damage caused by overheating during laser processing.

[0042] The clamping bushing 6, the diagonal support rod 65 and the telescopic sleeve 7 are linked to ensure that the clamping bushing 6 can be opened and closely attached to the surface of the laser processing head, and the loading and unloading is convenient and easy, so that the user can easily replace and clean the equipment. This helps to extend the service life of the equipment and maintain its performance.

[0043] The heat dissipation ring 5 can be quickly installed on the end of the laser processing head through the first support arm 3 and the second support arm 4, and it can contact the surface of the workpiece first. Under the linkage of the guide rod 62, the spring 63 and the slider 64, the distance between the laser processing head and the heat dissipation ring 5 can be changed to ensure that the heat dissipation ring 5 and the workpiece surface remain in close contact during the laser processing.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device for laser processing, characterized in that: It comprises a heat dissipation sleeve sleeved on the outside of the laser processing head, wherein the first arm and the second arm are movably connected to each other on both sides of the heat dissipation sleeve, a heat dissipation ring is installed at the end of the first arm, and the end of the second arm is fixed to the heat dissipation ring; The inner wall of the heat dissipation sleeve is evenly distributed with a plurality of guide grooves, a slider is slidably connected to the inside of the guide groove, and a diagonal support rod is connected through the slider spring shaft, the end of the diagonal support rod is connected to a clamping bushing through a rotating shaft, and a medium duct is penetrated through the inside of the clamping bushing and the heat dissipation ring, and a telescopic sleeve is also sleeved on the outside of the top of the heat dissipation sleeve, and a pressure ring acting on the top of the diagonal support rod is arranged on the inner side of the telescopic sleeve.

2. A heat dissipation device for laser processing as claimed in claim 1, characterized in that: Connectors are provided on both sides of the end of the heat dissipation sleeve, and the ends of the first arm and the second arm are respectively connected through the two connecting head rotating shafts.

3. A heat dissipation device for laser processing as claimed in claim 1, characterized in that: The upper ends of the first arm and the second arm are vertically arranged, and the lower ends of the first arm and the second arm are inclinedly arranged.

4. The heat dissipation device for laser processing according to claim 1, characterized in that: A slot is provided on one side of the heat dissipation ring close to the second arm, and an armature is embedded in the slot. A magnetic attraction plate corresponding to the armature is installed at the lower end of the second arm, and the magnetic attraction plate is embedded in the slot.

5. The heat dissipation device for laser processing according to claim 1, characterized in that: A guide rod is arranged inside the guide groove, and a spring is sleeved outside the guide rod. The upper and lower parts of the spring respectively contact with the bottom of the slider and the inner wall of the bottom of the guide groove.

6. The heat dissipation device for laser processing according to claim 1, characterized in that: A heat exchange tube is arranged inside the clamping bushing, the heat exchange tube is made of a copper tube, and the upper and lower parts of the copper tube are respectively connected in series with the medium conduit; A second heat-conducting patch is embedded in the clamping bushing near the axial direction of the heat-dissipating sleeve. The second heat-conducting patch is made of silicone grease, and the other end of the second heat-conducting patch is in contact with the surface of the heat exchange tube.

7. The heat dissipation device for laser processing according to claim 1, characterized in that: A first heat-conducting patch is embedded at the bottom of the heat dissipation ring, and the material of the first heat-conducting patch is silicone grease.

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