MCU surface component assembling and welding production line

Abstract

The utility model provides an MCU (microprogrammed control unit) surface component assembling and welding production line, which relates to the technical field of auto spare part production and comprises a first vibration disc placing table, a second vibration disc placing table and a third vibration disc placing table, a part feeding robot assembly is arranged at the end, away from the first vibration disc containing table, of the first feeding secondary positioning assembly, and a first robot front end suction nozzle assembly is arranged on one side of the first vibration disc containing table. According to the utility model, the regulator on the base can be used for receiving an operation instruction sent by a scanning terminal to control the start and stop of the motor, so that the rotating plate rotates around the regulator, and after the rotating plate rotates to a proper angle, the motor stops working, and the lifter is used for lifting to control the mechanical claw, so that the mechanical claw is operated; by means of the operation mode, one-to-one operation of parts needing to be machined and produced can be achieved more conveniently and meticulously, and therefore the practicability of the parts in the actual using process is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile parts production, in particular to an MCU surface component assembly and welding production line. Background Art

[0002] The MCU panel assembly and welding production line is a production line used to assemble and weld the microcontroller unit (MCU) panel components. This production line usually includes multiple workstations, each of which is responsible for different assembly and welding processes. On this production line, workers will assemble different components together and fix them together through welding processes to complete the production of the final MCU panel components.

[0003] However, in the prior art, the existing MCU surface component assembly welding production line is generally operated by assembly line workers, and the microcontroller unit is a very small component. During the production process, the workers need to concentrate highly on welding it, which makes it easier for the workers to get fatigued under the state of high concentration for a long time, and eventually leads to the problem of unqualified parts production, thereby reducing its practicality in actual use. Therefore, we provide a MCU surface component assembly welding production line. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings in the prior art and provide an MCU surface component assembly welding production line.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an MCU surface component assembly welding production line, characterized in that it comprises a first vibration plate placement table, a first feeding secondary positioning component is arranged at one end of the first vibration plate placement table, a component feeding robot component is arranged at one end of the first feeding secondary positioning component away from the first vibration plate placement table, a first robot front end suction nozzle component is arranged at one side of the first vibration plate placement table, a second vibration plate placement table is arranged in the first robot front end suction nozzle component, a second feeding secondary positioning component is arranged at one end of the first robot front end suction nozzle component, a robot receiving box is arranged at one end of the first robot front end suction nozzle component, a second robot front end suction nozzle component is arranged at one side of the robot receiving box, and a welding head abrasive belt grinding component is arranged directly in front of the assembly line of the second robot front end suction nozzle component;

[0006] One end of the welding head abrasive belt grinding assembly is provided with an MCU surface component assembly 3x speed chain assembly, and the end of the MCU surface component assembly 3x speed chain assembly away from the welding head abrasive belt grinding assembly is provided with an assembly resistance welding double speed chain right elevator, and the end of the assembly resistance welding double speed chain right elevator away from the MCU surface component assembly 3x speed chain assembly is provided with a solder paste component CCD camera, and a positioning plate fixture conveying assembly is provided directly behind the second robot front end nozzle assembly assembly line;

[0007] An MCU sheet resistor 1 station welding head assembly is arranged on the outer surface of the first feeding secondary positioning assembly, a component assembly positioning plate is arranged on one side of the MCU sheet resistor 1 station welding head assembly, a third robot front end suction nozzle assembly is arranged on the side of the component assembly positioning plate away from the MCU sheet resistor 1 station welding head assembly, a third feeding secondary positioning assembly is arranged on the top of the third robot front end suction nozzle assembly, a long component clip feeding assembly is arranged in the third feeding secondary positioning assembly, a positioning plate discharge box is arranged opposite to the long component clip feeding assembly, a tooling plate is arranged on one side of the positioning plate discharge box, and a The first MCU face thread column dispenser, the bottom of the first MCU face thread column dispenser is provided with an AP face component assembly 3x speed chain component, one end of the AP face component assembly 3x speed chain component is provided with an assembly resistance welding speed chain left elevator, one side of the first MCU face thread column dispenser is provided with a second MCU face thread column dispenser, the rear side of the third feeding secondary positioning component is provided with a third vibration plate placement table, the back of the AP face component assembly 3x speed chain component is provided with an MCU face component assembly rack, and the side of the MCU face component assembly 3x speed chain component away from the second feeding secondary positioning component is provided with an XZ robot.

[0008] As a preferred embodiment, the second loading secondary positioning component includes a base, an adjuster is provided on the base, a motor is provided in the adjuster, a rotating plate is provided at one end of the adjuster, a rotator is provided at the end of the rotating plate away from the adjuster, a working component is provided on the outer surface of the rotator, a lifter is provided at one end of the working component, and a mechanical claw is provided at one end of the lifter.

[0009] As a preferred embodiment, the bottom of the base is fixedly connected to the second vibration plate placement table, the regulator is fixedly connected to the base, one end of the motor is docked on the regulator, one end of the rotating plate is limited on the regulator for rotation adjustment, one end of the rotator is docked on the regulator for rotation adjustment, the working component is nested in the outer surface of the rotator, the outer surface of the lifter is limited on the working component for lifting and lowering adjustment, and the top of the mechanical claw is docked on the lifter.

[0010] As a preferred embodiment, the first loading secondary positioning component is fixedly connected to one end of the first vibration disk placing table, the component loading robot component is fixedly connected to one end of the first loading secondary positioning component away from the first vibration disk placing table, the first robot front end suction nozzle component is docked on one side of the first vibration disk placing table, the outer surface of the second vibration disk placing table is nested in the first robot front end suction nozzle component, the second loading secondary positioning component is fixedly connected to one end of the first robot front end suction nozzle component, the robot receiving box is fixedly connected to one end of the first robot front end suction nozzle component, and the second robot front end suction nozzle component is docked on one side of the robot receiving box.

[0011] As a preferred embodiment, the welding head abrasive belt grinding assembly fixing column is directly in front of the second robot front end suction nozzle assembly assembly line, the MCU surface component assembly 3x speed chain assembly is docked at one end of the welding head abrasive belt grinding assembly, the assembly resistance welding speed chain right elevator is fixedly connected to the end of the MCU surface component assembly 3x speed chain assembly away from the welding head abrasive belt grinding assembly, the spot welding paste component CCD camera is docked at the end of the assembly resistance welding speed chain right elevator away from the MCU surface component assembly 3x speed chain assembly, and the positioning plate jig conveying assembly is fixed directly behind the second robot front end suction nozzle assembly assembly line.

[0012] As a preferred embodiment, the MCU surface resistor 1 station welding head assembly is docked on the outer surface of the first feeding secondary positioning assembly, the component assembly positioning plate is fixed on one side of the MCU surface resistor 1 station welding head assembly, the third robot front end suction nozzle assembly is fixed on the side of the component assembly positioning plate away from the MCU surface resistor 1 station welding head assembly, and the third feeding secondary positioning assembly is docked on the top of the third robot front end suction nozzle assembly.

[0013] As a preferred embodiment, the outer surface of the long component clip feeding assembly is nested in the third feeding secondary positioning assembly, the positioning plate discharge box is fixedly connected to the opposite side of the long component clip feeding assembly, the tooling plate is fixedly connected to one side of the positioning plate discharge box, the first MCU surface threaded column dispenser is fixed on the tooling plate, and the AP surface component assembly 3x speed chain assembly is docked at the bottom of the first MCU surface threaded column dispenser.

[0014] As a preferred embodiment, the left elevator for assembling the resistance welding speed chain is limited at one end of the AP surface component assembly 3x speed chain assembly, the second MCU surface threaded column dispenser is fixed on one side of the first MCU surface threaded column dispenser, the third vibration plate placement table is fixed on the rear side of the third feeding secondary positioning assembly, the MCU surface component assembly frame is fixed on the back of the AP surface component assembly 3x speed chain assembly, and the bottom end of the XZ manipulator is fixedly connected to the positioning plate jig conveying assembly.

[0015] Compared with the prior art, the advantages and positive effects of the utility model are:

[0016] The utility model can control the start and stop of the motor by receiving the operation instructions sent by the scanning terminal through the regulator on the base, so that the rotating plate can rotate around the regulator. After rotating to a suitable angle, the motor is stopped and the lifter is allowed to lift and control the mechanical claw to operate it. This operation method can realize one-to-one operation of parts that need to be processed and produced more conveniently and meticulously, thereby improving its practicality in actual use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The utility model provides a structural schematic diagram of an MCU surface component assembly welding production line.

[0018] Figure 2 The utility model provides an enlarged schematic diagram of the local structure of an MCU surface component assembly welding production line.

[0019] Legend:

[0020] 1. First vibration plate placement table; 2. First loading secondary positioning assembly; 3. Component loading robot assembly; 4. First robot front end nozzle assembly; 5. Second vibration plate placement table; 6. Second loading secondary positioning assembly; 8. Spot solder paste component CCD camera; 9. Assemble resistance welding double speed chain right elevator; 10. MCU surface component assembly 3 times speed chain assembly; 11. Welding head abrasive belt grinding assembly; 12. Second robot front end nozzle assembly; 13. Robot receiving box; 14. XZ manipulator; 15. Positioning plate fixture conveying assembly ; 16. MCU surface resistor 1 station welding head assembly; 17. Parts assembly positioning plate; 18. The third robot front end nozzle assembly; 19. The third feeding secondary positioning assembly; 20. Positioning plate discharge box; 21. Long component clip feeding assembly; 22. Tooling plate; 23. The first MCU surface thread column dispenser; 24. AP surface component assembly 3 times speed chain assembly; 25. Assembly resistance welding speed chain left elevator; 26. The second MCU surface thread column dispenser; 27. MCU surface component assembly rack; 28. The third vibration plate placement table;

[0021] 61. Base; 62. Regulator; 63. Motor; 64. Rotating plate; 65. Rotator; 66. Working component; 67. Lifter; 68. Mechanical claw. DETAILED DESCRIPTION

[0022] In order to more clearly illustrate the overall concept of the present invention, a detailed description is given below in combination with the accompanying drawings by way of examples.

[0023] It should be noted that many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0024] In addition, in the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] In the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. However, if it is indicated as a direct connection, it means that the two connected bodies are not connected through an intermediate structure, but are connected to form a whole only through a connecting structure. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0026] In the present utility model, unless otherwise clearly specified and limited, the first feature "above" or "below" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0027] Example 1

[0028] like Figure 1-2As shown, the utility model provides a technical solution: an MCU surface component assembly welding production line, comprising: a first vibration plate placement table 1, a first feeding secondary positioning component 2 is arranged at one end of the first vibration plate placement table 1, a component feeding robot component 3 is arranged at one end of the first feeding secondary positioning component 2 away from the first vibration plate placement table 1, a first robot front end suction nozzle component 4 is arranged on one side of the first vibration plate placement table 1, a second vibration plate placement table 5 is arranged in the first robot front end suction nozzle component 4, and a second feeding secondary positioning component 6 is arranged at one end of the first robot front end suction nozzle component 4;

[0029] A robot receiving box 13 is provided at one end of the first robot front end suction nozzle assembly 4, a second robot front end suction nozzle assembly 12 is provided on one side of the robot receiving box 13, a welding head abrasive belt grinding assembly 11 is provided directly in front of the assembly line of the second robot front end suction nozzle assembly 12, an MCU surface component assembly 3x speed chain assembly 10 is provided at one end of the welding head abrasive belt grinding assembly 11, an assembly resistance welding speed chain right elevator 9 is provided at one end of the MCU surface component assembly 3x speed chain assembly 10 away from the welding head abrasive belt grinding assembly 11, and a solder paste component CCD camera 8 is provided at one end of the assembly resistance welding speed chain right elevator 9 away from the MCU surface component assembly 3x speed chain assembly 10;

[0030] A positioning plate fixture conveying assembly 15 is arranged directly behind the second robot front end suction nozzle assembly 12 assembly line, an MCU sheet resistor 1 station welding head assembly 16 is arranged on the outer surface of the first feeding secondary positioning assembly 2, a component assembly positioning plate 17 is arranged on one side of the MCU sheet resistor 1 station welding head assembly 16, a third robot front end suction nozzle assembly 18 is arranged on the side of the component assembly positioning plate 17 away from the MCU sheet resistor 1 station welding head assembly 16, and a third feeding secondary positioning assembly 18 is arranged on the top of the third robot front end suction nozzle assembly 18. Component 19, a long component clip feeding component 21 is arranged in the third feeding secondary positioning component 19, a positioning plate discharge box 20 is arranged opposite to the long component clip feeding component 21, a tooling plate 22 is arranged on one side of the positioning plate discharge box 20, a first MCU surface thread column dispenser 23 is arranged on the tooling plate 22, an AP surface component assembly 3x speed chain component 24 is arranged at the bottom of the first MCU surface thread column dispenser 23, and an AP surface component assembly 3x speed chain component 24 is arranged at one end of the AP surface component assembly 3x speed chain component 24. An assembly resistance welding speed chain left elevator 25 is arranged;

[0031] A second MCU surface threaded column glue dispenser 26 is arranged on one side of the first MCU surface threaded column glue dispenser 23, a third vibration disk placement table 28 is arranged on the rear side of the third feeding secondary positioning component 19, an MCU surface component assembly rack 27 is arranged on the back of the AP surface component assembly 3x speed chain component 24, an XZ manipulator 14 is arranged on the side of the MCU surface component assembly 3x speed chain component 10 away from the second feeding secondary positioning component 6, the first feeding secondary positioning component 2 is fixedly connected to one end of the first vibration disk placement table 1, and the component feeding robot component 3 is fixedly connected to the end of the first feeding secondary positioning component 2 away from the first vibration disk placement table 1;

[0032] The first robot front end suction nozzle assembly 4 is docked on one side of the first vibration plate placement table 1, the outer surface of the second vibration plate placement table 5 is nested in the first robot front end suction nozzle assembly 4, the second feeding secondary positioning assembly 6 is fixedly connected to one end of the first robot front end suction nozzle assembly 4, the robot receiving box 13 is fixedly connected to one end of the first robot front end suction nozzle assembly 4, the second robot front end suction nozzle assembly 12 is docked on one side of the robot receiving box 13, the welding head abrasive belt grinding assembly 11 is fixed in front of the second robot front end suction nozzle assembly 12 assembly line, the MCU surface component assembly 3x speed chain assembly 10 is docked at one end of the welding head abrasive belt grinding assembly 11, and the assembly resistance welding speed chain right elevator 9 is fixedly connected to the MCU surface component assembly 3x speed chain assembly 10 away from one end of the welding head abrasive belt grinding assembly 11;

[0033] The spot solder paste component CCD camera 8 is docked at one end of the right elevator 9 of the assembly resistor welding speed chain away from the MCU surface component assembly 3 speed chain assembly 10, the positioning plate fixture conveying assembly 15 is fixed to the rear of the second robot front end suction nozzle assembly 12 assembly line, the MCU surface resistor 1 station welding head assembly 16 is docked at the outer surface of the first feeding secondary positioning assembly 2, the component assembly positioning plate 17 is fixed on one side of the MCU surface resistor 1 station welding head assembly 16, the third robot front end suction nozzle assembly 18 is fixed on the side of the component assembly positioning plate 17 away from the MCU surface resistor 1 station welding head assembly 16, the third feeding secondary positioning assembly 19 is docked at the top of the third robot front end suction nozzle assembly 18, and the outer surface of the long component clip feeding assembly 21 is nested in the third feeding secondary positioning assembly 19;

[0034] The positioning plate discharge box 20 is fixedly connected to the opposite side of the long component clip feeding assembly 21, the tooling plate 22 is fixedly connected to one side of the positioning plate discharge box 20, the first MCU surface threaded column dispenser 23 is fixed on the tooling plate 22, the AP surface component assembly 3x speed chain assembly 24 is docked at the bottom of the first MCU surface threaded column dispenser 23, the assembly resistance welding speed chain left elevator 25 is limited at one end of the AP surface component assembly 3x speed chain assembly 24, the second MCU surface threaded column dispenser 26 is fixed on one side of the first MCU surface threaded column dispenser 23, the third vibration plate placement table 28 is fixed on the rear side of the third feeding secondary positioning assembly 19, the MCU surface component assembly frame 27 is fixed on the back of the AP surface component assembly 3x speed chain assembly 24, and the bottom end of the XZ robot 14 is fixedly connected to the positioning plate fixture conveying assembly 15.

[0035] In this embodiment, first, the third robot front-end suction nozzle assembly 18 is fixed to one side of the component assembly positioning plate 17, at the position of the MCU surface resistor 1 station welding head assembly 16. Then, the third feeding secondary positioning assembly 19 is docked on the top of the third robot front-end suction nozzle assembly 18 to realize the transmission and positioning of the components. Next, the outer surface of the long component clip feeding assembly 21 is nested in the third feeding secondary positioning assembly 19 to ensure the stability of the components. Subsequently, the positioning plate discharge box 20 is fixedly connected to the opposite side of the long component clip feeding assembly 21 to form a path for the transmission of components.

[0036] Then, the tooling plate 22 is fixedly connected to one side of the positioning plate discharge box 20 to provide support for subsequent processes.

[0037] Next, the first MCU surface thread column glue dispenser 23 is fixed on the tooling plate 22 to provide a reference for the precise positioning of parts. Subsequently, the AP surface component assembly 3x speed chain assembly 24 is docked at the bottom of the first MCU surface thread column glue dispenser 23 to achieve the transmission and assembly of parts. Next, the left elevator 25 of the resistance welding speed chain is limited at one end of the AP surface component assembly 3x speed chain assembly 24 to ensure smooth transmission of parts.

[0038] Then, the second MCU surface threaded column glue dispenser 26 is fixed to one side of the first MCU surface threaded column glue dispenser 23 to prepare for the next process.

[0039] Finally, the third vibration plate placement table 28 is fixed to the rear side of the third feeding secondary positioning assembly 19, the MCU surface component assembly frame 27 is fixed to the back of the AP surface component assembly 3x speed chain assembly 24, and the bottom end of the XZ robot 14 is fixedly connected to the positioning plate fixture conveying assembly 15, realizing the automated production process of the entire production line.

[0040] Through the collaboration and transmission of various components, an efficient and precise production process of the assembly and welding production line of MCU surface parts is achieved.

[0041] Example 2

[0042] like Figure 1-2 As shown, the second feeding secondary positioning component 6 includes a base 61, an adjuster 62 is arranged on the base 61, a motor 63 is arranged in the adjuster 62, a rotating plate 64 is arranged at one end of the adjuster 62, a rotator 65 is arranged at the end of the rotating plate 64 away from the adjuster 62, a working component 66 is arranged on the outer surface of the rotator 65, a lifter 67 is arranged at one end of the working component 66, and a mechanical claw 68 is arranged at one end of the lifter 67. The bottom of the base 61 is fixedly connected to the second vibration disk placement table 5, the adjuster 62 is fixedly connected to the base 61, one end of the motor 63 is docked on the adjuster 62, one end of the rotating plate 64 is limited on the adjuster 62 for rotation adjustment, one end of the rotator 65 is docked on the adjuster 62 for rotation adjustment, the working component 66 is nested in the outer surface of the rotator 65, the outer surface of the lifter 67 is limited on the working component 66 for lifting and lowering adjustment, and the top of the mechanical claw 68 is docked on the lifter 67.

[0043] In this embodiment, the regulator 62 on the base 61 can control the start and stop of the motor 63 by receiving the operation instructions sent by the scanning terminal, so that the rotating plate 64 rotates around the regulator 62. After rotating to a suitable angle, the motor 63 is stopped and the lifter 67 is raised and lowered to control the mechanical claw 68 to operate it. This operation method can realize one-to-one operation of parts that need to be processed and produced more conveniently and meticulously, thereby improving its practicality in actual use.

[0044] Working principle:

[0045] like Figure 1-2 As shown, in the operation process of the MCU surface component assembly welding production line, first, the third robot front nozzle assembly 18 is fixed to one side of the component assembly positioning plate 17 to position the MCU surface resistor 1 station welding head assembly 16. Then, the third feeding secondary positioning assembly 19 is docked with the third robot front nozzle assembly 18 to realize the transmission and positioning of the components.

[0046] On the base 61, the regulator 62 receives the operation instructions from the scanning terminal, controls the start and stop of the motor 63, makes the rotating plate 64 rotate around the regulator 62, stops the motor 63 after reaching the appropriate angle, and controls the mechanical claw 68 through the lifter 67 to operate, realizing one-to-one operation of parts, which is convenient and meticulous.

[0047] Subsequently, the long component clip loading assembly 21 is nested in the third loading secondary positioning assembly 19 to ensure the stability of the components. The positioning plate discharge box 20 is connected to the opposite side of the long component clip loading assembly 21 to form a component transmission path.

[0048] Next, the tooling plate 22 is fixed to one side of the positioning plate discharge box 20 to provide support for subsequent processes. The first MCU surface thread column dispenser 23 is fixed to the tooling plate 22 to provide a reference for the precise positioning of parts. Subsequently, the AP surface component assembly 3x speed chain assembly 24 is docked at the bottom of the first MCU surface thread column dispenser 23 to achieve the transmission and assembly of parts.

[0049] The left elevator 25 for assembling the resistance welding double-speed chain is limited to one end of the AP surface component assembly 3x speed chain component 24 to ensure smooth transmission of parts. Next, the second MCU surface threaded column dispenser 26 is fixed to one side of the first MCU surface threaded column dispenser 23 to prepare for the next process. Finally, the third vibration plate placement table 28 is fixed to the rear side of the third feeding secondary positioning component 19, the MCU surface component assembly frame 27 is fixed to the back of the AP surface component assembly 3x speed chain component 24, and the bottom end of the XZ manipulator 14 is connected to the positioning plate fixture conveying component 15 to realize the automated production process of the entire production line. Through the collaboration and transmission of various components, the assembly and welding production line of MCU surface components realizes an efficient and precise production process.

[0050] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0051] The utility model is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

Claims

1. A MCU surface component assembly welding production line, characterized in that: The invention comprises a first vibration plate placement table (1), wherein a first feeding secondary positioning assembly (2) is arranged at one end of the first vibration plate placement table (1), a component feeding robot assembly (3) is arranged at one end of the first feeding secondary positioning assembly (2) away from the first vibration plate placement table (1), a first robot front end suction nozzle assembly (4) is arranged at one side of the first vibration plate placement table (1), a second vibration plate placement table (5) is arranged in the first robot front end suction nozzle assembly (4), a second feeding secondary positioning assembly (6) is arranged at one end of the first robot front end suction nozzle assembly (4), a robot receiving box (13) is arranged at one end of the first robot front end suction nozzle assembly (4), a second robot front end suction nozzle assembly (12) is arranged at one side of the robot receiving box (13), and a welding head abrasive belt grinding assembly (11) is arranged directly in front of the assembly line of the second robot front end suction nozzle assembly (12); One end of the welding head abrasive belt grinding component (11) is provided with an MCU surface component assembly 3-fold speed chain component (10), and one end of the MCU surface component assembly 3-fold speed chain component (10) away from the welding head abrasive belt grinding component (11) is provided with an assembly resistor welding double-speed chain right elevator (9), and one end of the assembly resistor welding double-speed chain right elevator (9) away from the MCU surface component assembly 3-fold speed chain component (10) is provided with a solder paste component CCD camera (8), and a positioning plate fixture conveying component (15) is provided directly behind the second robot front end suction nozzle component (12) assembly line, and an MCU surface resistor 1 station welding head component (16) is provided on the outer surface of the first feeding secondary positioning component (2); A component assembly positioning plate (17) is arranged on one side of the MCU sheet resistor 1 station welding head assembly (16); a third robot front end suction nozzle assembly (18) is arranged on the side of the component assembly positioning plate (17) away from the MCU sheet resistor 1 station welding head assembly (16); a third loading secondary positioning assembly (19) is arranged on the top of the third robot front end suction nozzle assembly (18); a long component clip loading assembly (21) is arranged in the third loading secondary positioning assembly (19); A positioning plate discharge box (20) is arranged opposite to the component clip loading assembly (21), a tooling plate (22) is arranged on one side of the positioning plate discharge box (20), a first MCU surface threaded column dispenser (23) is arranged on the tooling plate (22), an AP surface component assembly 3x speed chain assembly (24) is arranged at the bottom of the first MCU surface threaded column dispenser (23), and an assembly resistance welding double speed chain left elevator (25) is arranged at one end of the AP surface component assembly 3x speed chain assembly (24); A second MCU surface threaded column glue dispenser (26) is arranged on one side of the first MCU surface threaded column glue dispenser (23), a third vibration disk placement table (28) is arranged on the rear side of the third loading secondary positioning component (19), an MCU surface component assembly rack (27) is arranged on the back of the AP surface component assembly 3x speed chain component (24), and an XZ robot (14) is arranged on the side of the MCU surface component assembly 3x speed chain component (10) away from the second loading secondary positioning component (6).

2. The MCU surface component assembly welding production line according to claim 1, characterized in that: The second loading secondary positioning component (6) includes a base (61), an adjuster (62) is arranged on the base (61), a motor (63) is arranged in the adjuster (62), a rotating plate (64) is arranged at one end of the adjuster (62), a rotator (65) is arranged at the end of the rotating plate (64) away from the adjuster (62), a working component (66) is arranged on the outer surface of the rotator (65), a lifter (67) is arranged at one end of the working component (66), and a mechanical claw (68) is arranged at one end of the lifter (67).

3. The MCU surface component assembly welding production line according to claim 2, characterized in that: The bottom of the base (61) is fixedly connected to the second vibration plate placement table (5), the regulator (62) is fixedly connected to the base (61), one end of the motor (63) is docked on the regulator (62), one end of the rotating plate (64) is limited on the regulator (62) for rotation adjustment, one end of the rotator (65) is docked on the regulator (62) for rotation adjustment, the working component (66) is nested on the outer surface of the rotator (65), the outer surface of the lifter (67) is limited on the working component (66) for lifting adjustment, and the top of the mechanical claw (68) is docked on the lifter (67).

4. The MCU surface component assembly welding production line according to claim 1, characterized in that: The first loading secondary positioning component (2) is fixedly connected to one end of the first vibration disk placement table (1), the component loading robot component (3) is fixedly connected to one end of the first loading secondary positioning component (2) away from the first vibration disk placement table (1), the first robot front end suction nozzle component (4) is docked on one side of the first vibration disk placement table (1), the outer surface of the second vibration disk placement table (5) is nested in the first robot front end suction nozzle component (4), the second loading secondary positioning component (6) is fixedly connected to one end of the first robot front end suction nozzle component (4), the robot receiving box (13) is fixedly connected to one end of the first robot front end suction nozzle component (4), and the second robot front end suction nozzle component (12) is docked on one side of the robot receiving box (13).

5. The MCU surface component assembly welding production line according to claim 1, characterized in that: The welding head abrasive belt grinding assembly (11) fixing column is directly in front of the second robot front end suction nozzle assembly (12) assembly line, the MCU surface component assembly 3x speed chain assembly (10) is docked at one end of the welding head abrasive belt grinding assembly (11), the assembly resistance welding speed chain right elevator (9) is fixedly connected to the end of the MCU surface component assembly 3x speed chain assembly (10) away from the welding head abrasive belt grinding assembly (11), the spot welding paste component CCD camera (8) is docked at the end of the assembly resistance welding speed chain right elevator (9) away from the MCU surface component assembly 3x speed chain assembly (10), and the positioning plate fixture conveying assembly (15) is fixed directly behind the second robot front end suction nozzle assembly (12) assembly line.

6. The MCU surface component assembly welding production line according to claim 1, characterized in that: The MCU surface resistor 1 station welding head assembly (16) is docked on the outer surface of the first feeding secondary positioning assembly (2), the component assembly positioning plate (17) is fixed on one side of the MCU surface resistor 1 station welding head assembly (16), the third robot front end suction nozzle assembly (18) is fixed on the side of the component assembly positioning plate (17) away from the MCU surface resistor 1 station welding head assembly (16), and the third feeding secondary positioning assembly (19) is docked on the top of the third robot front end suction nozzle assembly (18).

7. The MCU surface component assembly welding production line according to claim 1, characterized in that: The outer surface of the long component clip loading assembly (21) is nested in the third loading secondary positioning assembly (19), the positioning plate discharge box (20) is fixedly connected to the opposite side of the long component clip loading assembly (21), the tooling plate (22) is fixedly connected to one side of the positioning plate discharge box (20), the first MCU surface threaded column dispenser (23) is fixed on the tooling plate (22), and the AP surface component assembly 3x speed chain assembly (24) is docked at the bottom of the first MCU surface threaded column dispenser (23).

8. The MCU surface component assembly welding production line according to claim 1, characterized in that: The left elevator (25) for assembling the resistance welding double-speed chain is limited at one end of the AP surface component assembly 3x speed chain component (24), the second MCU surface threaded column dispenser (26) is fixed on one side of the first MCU surface threaded column dispenser (23), the third vibration plate placement table (28) is fixed on the rear side of the third loading secondary positioning component (19), the MCU surface component assembly frame (27) is fixed on the back of the AP surface component assembly 3x speed chain component (24), and the bottom end of the XZ robot (14) is fixedly connected to the positioning plate fixture conveying component (15).

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