Wafer taking and placing tweezers
By designing the surface contact clamping head for wafer pick-and-place tweezers, the compression and slip problems caused by small contact area in the prior art are solved, and more stable clamping and higher fault tolerance are achieved.
Patent Information
- Application Number
- CN202421936360.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-08-09
AI Technical Summary
In the prior art, the contact area between the tweezers head and the wafer is small, resulting in strong pressure, which can easily cause compression or scratches to the wafer surface, and unstable clamping, which can easily lead to smooth wafer dissolution.
Design a wafer pick-and-place tweezers, whose clamping head can contact the wafer surface, increase the stress area and reduce the pressure at the contact area. The clamping arm and clamping head are contacted by removable connections, and arcuate steps are provided on the contact surface to enhance the limiting effect.
Through the surface contact design, the risk of crushing and scratching on the wafer surface is reduced, the stability and friction of clamping are enhanced, the possibility of wafer smoothness is reduced, and the fault tolerance and production yield of manually clamped wafers are improved.
Smart Images
Figure CN222874291U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of mechanical tools, and in particular to a wafer picking and placing tweezers. Background Art
[0002] In the production and testing of semiconductors, wafers sometimes need to be moved. Due to the limited number of wafers involved in the engineering research and development stage, the movement frequency is relatively low, and the space requirements and overall cost of fully automatic wafer transfer equipment are relatively high, so manual transfer of wafers is often required. In actual work, a common practice is that the operator uses tweezers to clamp the edge of the wafer, then transfers the wafer to the target position and puts it down.
[0003] However, in the prior art, the contact between the tweezers head and the wafer is mostly point contact or surface contact, and the contact area is usually small, so it may cause a large pressure to be generated at the contact part between the tweezers and the wafer surface, which is easy to cause crushing or scratching of the wafer surface, and in severe cases, it may even cause the wafer to be crushed, affecting the yield of wafer production. In addition, when clamping the wafer, the small contact area is easy to cause the wafer to shake, which not only increases the difficulty of operation, but also affects the stability of clamping, and may even cause the wafer and the tweezers head to slip, causing contamination or even complete damage to the wafer. Utility Model Content
[0004] The purpose of the embodiment of the present application is to provide a wafer picking and placing tweezers, which can form surface contact with the wafer surface when clamping the wafer, thereby increasing the force-bearing area, reducing the pressure at the contact point, and helping to reduce the possibility of compression or scratches on the wafer surface.
[0005] The present application provides a wafer picking and placing tweezers, comprising a clamping arm and a clamping head. The clamping arm comprises an upper clamping arm and a lower clamping arm, the two ends of the upper clamping arm are respectively an A1 end and an A2 end, and the two ends of the lower clamping arm are respectively a B1 end and a B2 end. The A1 end of the upper clamping arm and the B1 end of the lower clamping arm are fixedly connected, and the A2 end of the upper clamping arm and the B2 end of the lower clamping arm are both free ends. The clamping head comprises an upper clamping head and a lower clamping head, the upper clamping head is arranged at the A2 end of the upper clamping arm, and the lower clamping head is arranged at the B2 end of the lower clamping arm, and the sides of the upper clamping head and the lower clamping head close to each other are both arranged as planes.
[0006] When in use, the edge of the wafer is placed between the upper clamping head and the lower clamping head, and the upper clamping arm and the lower clamping arm are pinched together, so that the upper clamping head and the lower clamping head are close to each other and respectively fit the upper and lower surfaces of the wafer to form surface contact, thereby clamping the wafer. After the pinching force on the upper clamping arm and the lower clamping arm is removed, the upper clamping head and the lower clamping head are moved away from each other.
[0007] In an implementable solution, the upper clamping head includes an upper connecting portion and an upper extension portion connected to the upper connecting portion, and the lower clamping head includes a lower connecting portion and a lower extension portion connected to the lower connecting portion. The upper connecting portion is detachably connected to the A2 end of the upper clamping arm, and the lower connecting portion is detachably connected to the B2 end of the lower clamping arm. An upper contact surface is provided on the lower side of the upper extension portion, and a lower contact surface is provided on the upper side of the lower extension portion, and both the upper contact surface and the lower contact surface are flat. When in use, the upper contact surface of the upper extension portion and the lower contact surface of the lower extension portion are respectively attached to the upper and lower surfaces of the wafer and form surface contact.
[0008] In an implementable solution, the junction of the upper extension and the upper connecting portion forms an upper step, and the junction of the lower extension and the lower connecting portion forms a lower step. When the upper clamping arm and the lower clamping arm are pinched together, the upper step and the lower step cooperate with each other, and the upper contact surface and the lower contact surface are close to and fit each other.
[0009] In an implementable solution, the side wall of the upper step and the side wall of the lower step are both configured to be arc-shaped, and the concave side of the arc faces away from the clamping arm.
[0010] In an implementable solution, the A2 end of the upper clamping arm is provided with an upper buckle, the upper clamping head is provided with an upper matching buckle, and the A2 end of the upper clamping arm forms a buckle connection with the upper connecting portion. The B2 end of the lower clamping arm is provided with a lower buckle, the lower clamping head is provided with a lower matching buckle, and the B2 end of the lower clamping arm forms a buckle connection with the lower connecting portion.
[0011] In an practicable solution, the wafer pick-and-place tweezers further include an upper threaded rod and a lower threaded rod. The A2 end of the upper clamping arm is provided with an upper threaded hole, the upper connecting portion is provided with an upper mating threaded hole matching therewith, and the upper threaded rod sequentially passes through the upper threaded hole and the upper mating threaded hole to form a threaded connection. The B2 end of the lower clamping arm is provided with a lower threaded hole, the lower connecting portion is provided with a lower mating threaded hole matching therewith, and the lower threaded rod sequentially passes through the lower threaded hole and the lower mating threaded hole to form a threaded connection.
[0012] In one feasible solution, a soft buffer layer for increasing friction is provided on the upper contact surface and / or the lower contact surface.
[0013] In an practicable solution, the clamping arm has a gripping axis, which passes through the middle position between the pinching point of the upper clamping arm and the pinching point of the lower clamping arm, and passes through the connection between the A1 end of the upper clamping arm and the B1 end of the lower clamping arm. After the upper contact surface and the lower contact surface clamp the wafer, the plane where the wafer is located forms a preset angle with the gripping axis, so that the end of the wafer away from the clamping head is higher than the end close to the clamping head.
[0014] In an implementable solution, after the upper clamping arm and the lower clamping arm are pinched, the front end boundary of the lower contact surface exceeds the front end boundary of the upper contact surface.
[0015] In an implementable solution, a gripping portion is provided on the clamping arm, and a recessed portion that fits the finger and a pattern with an anti-slip effect are provided on the gripping portion.
[0016] Compared with the prior art, the beneficial effects of this application include at least:
[0017] The present application provides a wafer pick-up and placement tweezers, whose clamping head can form a surface contact with the surface of the wafer. Compared with the point contact or line contact formed by traditional tweezers, this design increases the force-bearing area, reduces the pressure at the contact part, and helps to reduce possible crushing or scratches on the wafer surface. In addition, the surface contact can also enhance the clamping stability and increase the friction between the clamping head 2 and the wafer surface, thereby helping to reduce the shaking during the clamping process, thereby reducing the possibility of the wafer slipping. Therefore, the wafer pick-up and placement tweezers of the present application help to improve the fault tolerance of manually clamping wafers and reduce the fragmentation rate of wafers.
[0018] Furthermore, the wafer pick-up and placement tweezers provided by the present application can replace the clamping head or clamping arm more conveniently, which can adapt to the use habits of different operators and improve the comfort of operators, thereby better preventing accidents in the clamping process, and can also adapt to the clamping requirements of different wafers. In addition, the wafer pick-up and placement tweezers provided by the present application are provided with a step structure with an arc-shaped side wall at the contact part with the edge of the wafer, which can have a certain limiting effect on the wafer and help ensure that the center of gravity of the wafer is located on the extension line of the clamping arm, thereby reducing the possibility of the wafer slipping. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 A side view of a first type of wafer picking and placing tweezers according to an embodiment of the present application;
[0021] Figure 2 A side view of a second type of wafer picking and placing tweezers according to an embodiment of the present application;
[0022] Figure 3 A top view of wafer pick-and-place tweezers with a clamping arm and a clamping head connected by a snap-fit connection;
[0023] Figure 4 A top view of wafer pick-and-place tweezers with a clamping arm and a clamping head connected by threads;
[0024] Figure 5 Top view of the lower gripping head of the wafer pick-and-place tweezers.
[0025] In the figure: 1, clamping arm; 2, clamping head; 3, holding part; 101, upper clamping arm; 102, lower clamping arm; 201, upper clamping head; 202, lower clamping head; 211, upper connecting part; 212, lower connecting part; 221, upper extension part; 222, lower extension part; 231, upper contact surface; 232, lower contact surface; 241, upper step; 242, lower step. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0028] like Figure 1-Figure 4 As shown, the present application provides a wafer pick-and-place tweezers, including a clamping arm 1 and a clamping head 2. Wherein, the clamping arm 1 includes an upper clamping arm 101 and a lower clamping arm 102, the two ends of the upper clamping arm 101 are respectively an A1 end and an A2 end, and the two ends of the lower clamping arm 102 are respectively a B1 end and a B2 end. The A1 end of the upper clamping arm 101 and the B1 end of the lower clamping arm 102 are fixedly connected, and the A2 end of the upper clamping arm 101 and the B2 end of the lower clamping arm 102 are both free ends. The clamping head 2 includes an upper clamping head 201 and a lower clamping head 202, the upper clamping head 201 is arranged at the A2 end of the upper clamping arm 101, and the lower clamping head 202 is arranged at the B2 end of the lower clamping arm 102. The sides of the upper clamping head 201 and the lower clamping head 202 that are close to each other are both set as planes.
[0029] When in use, the edge of the wafer is placed between the upper clamping head 201 and the lower clamping head 202, and the upper clamping arm 101 and the lower clamping arm 102 are pinched together, so that the upper clamping head 201 and the lower clamping head 202 are close to each other and respectively fit the upper and lower surfaces of the wafer to form surface contact, thereby clamping the wafer. An elastic member can be arranged between the upper clamping arm 101 and the lower clamping arm 103, and the two ends of the elastic member are respectively connected to the upper clamping arm 101 and the lower clamping arm 103. When the upper clamping arm 101 and the lower clamping arm 102 are pinched together, the elastic member is in a compressed state. After the pinching force on the upper clamping arm 101 and the lower clamping arm 102 is removed, the elastic member applies a force to move away from each other to the upper clamping head 201 and the lower clamping head 202, so that the two automatically move away from each other, thereby allowing the wafer pick-up and placement tweezers to conveniently leave the wafer.
[0030] When clamping the wafer, the clamping head 2 can form a surface contact with the wafer surface. Compared with the point contact or line contact formed by traditional tweezers, this design increases the force area, reduces the pressure at the contact point, and helps to reduce possible crushing or scratches on the wafer surface. In addition, the surface contact can also enhance the clamping stability and increase the friction between the clamping head 2 and the wafer surface, thereby helping to reduce the shaking during the clamping process, thereby reducing the possibility of the wafer slipping. Therefore, the wafer pick-up and placement tweezers of the present application help to improve the fault tolerance of manually clamping wafers and reduce the fragmentation rate of wafers.
[0031] In one embodiment, if Figure 1-Figure 4As shown, the upper clamping head 201 includes an upper connecting portion 211 and an upper protruding portion 221 connected to the upper connecting portion 211, and the lower clamping head 202 includes a lower connecting portion 212 and a lower protruding portion 222 connected to the lower connecting portion 212. The upper connecting portion 211 is detachably connected to the A2 end of the upper clamping arm 101, and the lower connecting portion 212 is detachably connected to the B2 end of the lower clamping arm 102. An upper contact surface 231 is provided on the lower side of the upper protruding portion 221, and a lower contact surface 232 is provided on the upper side of the lower protruding portion 222, and both the upper contact surface 231 and the lower contact surface 232 are flat. When in use, the upper contact surface 231 of the upper protruding portion 221 and the lower contact surface 232 of the lower protruding portion 222 are respectively attached to the upper and lower surfaces of the wafer and form surface contact. Due to the detachable connection, the clamping arm 1 or the clamping head 2 can be replaced more conveniently. A plurality of clamping arms 1 of different shapes and sizes can be prepared to meet different needs. For example, a plurality of clamping arms of different lengths or widths can be prepared to meet the usage habits of different operators, improve the comfort of operators, and thus better prevent accidents during the clamping process. In addition, a plurality of clamping heads 2 of different shapes and sizes can be prepared to meet the clamping needs of different wafers. For example, since wafers exist in a variety of sizes, their respective edge widths and back-gold areas are also different, the shape and size of the upper extension 221 and the lower extension 222 can be designed according to the specific wafer specifications, thereby preparing a plurality of clamping heads 2 to adapt to different wafers. It should be ensured that all clamping arms 1 and clamping heads 2 use connection structures that can be matched with each other in form and size to achieve relatively free component replacement.
[0032] In one embodiment, if Figure 1 , Figure 2 and Figure 5 As shown, the junction of the upper extension 221 and the upper connecting portion 211 forms an upper step 241, and the junction of the lower extension 222 and the lower connecting portion 212 forms a lower step 242. When the upper clamping arm 101 and the lower clamping arm 102 are pinched together, the upper step 241 and the lower step 242 cooperate with each other, and the upper contact surface 231 and the lower contact surface 232 are close to each other and fit together. The upper extension 221 and the lower extension 222 both extend downward, so that the clamping head 2 forms a sinking effect, which can improve the operator's comfort and help enhance the stability of clamping. In addition, due to the formation of the step structure, it can have a certain limiting effect on the wafer when clamping the wafer, which helps to prevent the wafer from sliding to the inside of the clamping arm 1.
[0033] In one embodiment, if Figure 1 , Figure 2 and Figure 5As shown, the side walls of the upper step 241 and the lower step 242 are both set to be arc-shaped, and the concave side of the arc faces away from the clamping arm 1. The edge of the step structure is set to be arc-shaped and ensured to match the edge shape of the target wafer. Compared with the straight edge of the step structure, this design can form a larger contact surface and have a certain limiting effect on the wafer, thereby better preventing the wafer from moving to both sides. In addition, when the step structure matches the edge shape of the wafer, the center position of the wafer is on the extension line of the clamping arm 1, so it can better ensure that the weight of the wafer is evenly distributed on both sides of the wafer picking and placing tweezers, reducing the possibility of the wafer slipping to one side due to sinking.
[0034] In one embodiment, if Figure 1-Figure 3 As shown, the A2 end of the upper clamping arm 101 is provided with an upper buckle, the upper clamping head 201 is provided with an upper matching buckle matched therewith, and the A2 end of the upper clamping arm 101 forms a buckle connection with the upper connecting portion 211. The B2 end of the lower clamping arm 102 is provided with a lower buckle, the lower clamping head 202 is provided with a lower matching buckle matched therewith, and the B2 end of the lower clamping arm 102 forms a buckle connection with the lower connecting portion 212. The buckle connection has the advantages of fast connection speed, simple operation, compact structure, etc., and because the buckle structure is fixedly arranged on the original structure, there is no need to introduce new movable parts, so the reliability and stability are more outstanding, and the product appearance can be made neater and more beautiful.
[0035] In one embodiment, if Figure 4 As shown, the wafer pick-and-place tweezers also include an upper threaded rod and a lower threaded rod. The A2 end of the upper clamping arm 101 is provided with an upper threaded hole, and the upper connecting portion 211 is provided with an upper mating threaded hole matched therewith, and the upper threaded rod sequentially passes through the upper threaded hole and the upper mating threaded hole to form a threaded connection. The B2 end of the lower clamping arm 102 is provided with a lower threaded hole, and the lower connecting portion 212 is provided with a lower mating threaded hole matched therewith, and the lower threaded rod sequentially passes through the lower threaded hole and the lower mating threaded hole to form a threaded connection.
[0036] In addition to the snap connection and threaded connection, other connection methods may be selected between the clamping arm 1 and the clamping head 2, such as a fixed pin connection, a magnetic connection or a sleeve connection, etc., and no excessive restrictions are imposed here.
[0037] In one embodiment, a soft buffer layer (not shown in the figure) for increasing friction is provided on the upper contact surface 231 and / or the lower contact surface 232. The buffer layer is used to increase the contact area between the upper contact surface 231 and / or the lower contact surface 232 and the wafer surface, and to increase the friction at the contact portion. The buffer layer can be made of rubber, silicone, polyurethane elastic or other polymer materials, and there are no excessive restrictions here. When clamping the wafer, the buffer layer can undergo a certain elastic deformation, so as to better fit on the wafer surface and increase the contact area. Under the influence of the buffer layer material and the contact area, the friction between the clamping head 2 and the wafer surface will be improved to a certain extent, thereby enhancing the stability of the clamping.
[0038] In one embodiment, if Figure 1 and Figure 2 As shown, the clamping arm 1 has a gripping axis, which passes through the middle position between the kneading point of the upper clamping arm 101 and the kneading point of the lower clamping arm 102, and passes through the connection between the A1 end of the upper clamping arm 101 and the B1 end of the lower clamping arm 102. After the upper contact surface 231 and the lower contact surface 232 clamp the wafer, the plane where the wafer is located forms a preset angle with the gripping axis, so that the end of the wafer away from the clamping head 2 is higher than the end close to the clamping head 2. After adopting this design, even if the operator causes the clamping head 2 to sink to a certain extent when clamping the wafer, it can ensure that the end of the wafer away from the clamping head 2 will not sink, thereby avoiding the wafer from slipping in the direction away from the clamping head 2 to a certain extent. Therefore, this design helps to reduce the requirements for operators and improve the fault tolerance of manually clamping wafers.
[0039] In one embodiment, if Figure 1-Figure 4 As shown, after pinching the upper clamping arm 101 and the lower clamping arm 102, the front end of the lower contact surface 232 exceeds the front end of the upper contact surface 231, which is used to provide better bottom support for the wafer and prevent the upper surface of the wafer from being damaged. In the actual production and testing process, since there is a circuit structure in the internal area of the upper surface of the wafer, it is necessary to impose certain restrictions on the extension length of the upper contact surface 231 to ensure that the upper contact surface 231 only contacts the edge area of the wafer without affecting the circuit structure. Accordingly, the width of the upper contact surface 231 can be increased to ensure that it has sufficient contact area with the wafer. Since there is no such restriction on the lower surface of the wafer, a larger extension length can be set for the lower contact surface 232 to increase the contact area with the wafer, thereby providing a better lifting effect for the wafer and making the wafer clamping more stable.
[0040] In one embodiment, if Figure 1-Figure 4As shown, the clamping arm 1 is provided with a gripping portion 3, and the gripping portion 3 is provided with a recessed portion that fits the finger and a pattern with an anti-slip effect. The gripping portion 3 helps to enhance the comfort of the operator, facilitates the operator to better control the force and increase the friction between the hand and the wafer picking and placing tweezers, thereby enhancing the stability of the clamping to a certain extent.
[0041] In one embodiment, the upper clamping arm 101 and the lower clamping arm 103 are telescopic structures (not shown in the figure), for example, the upper clamping arm 101 and the lower clamping arm 103 can be composed of multiple segments, and each segment can be nested or telescopic to change the overall length, so as to adapt to different operation scenarios or operator needs. In addition, other telescopic designs can also be used, and there is no excessive restriction here.
[0042] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wafer pick-and-place tweezers, characterized in that: include: The clamping arm (1) comprises an upper clamping arm (101) and a lower clamping arm (102); the two ends of the upper clamping arm (101) are respectively an A1 end and an A2 end, and the two ends of the lower clamping arm (102) are respectively an B1 end and a B2 end; the A1 end of the upper clamping arm (101) and the B1 end of the lower clamping arm (102) are fixedly connected, and the A2 end of the upper clamping arm (101) and the B2 end of the lower clamping arm (102) are both free ends; The clamping head (2) comprises an upper clamping head (201) and a lower clamping head (202); the upper clamping head (201) is arranged at the A2 end of the upper clamping arm (101), and the lower clamping head (202) is arranged at the B2 end of the lower clamping arm (102); the sides of the upper clamping head (201) and the lower clamping head (202) close to each other are both arranged as planes; When in use, the edge of the wafer is placed between the upper clamping head (201) and the lower clamping head (202), and the upper clamping arm (101) and the lower clamping arm (102) are pinched together so that the upper clamping head (201) and the lower clamping head (202) are close to each other and respectively adhere to the upper and lower surfaces of the wafer to form surface contact, thereby clamping the wafer; after the pinching force on the upper clamping arm (101) and the lower clamping arm (102) is removed, the upper clamping head (201) and the lower clamping head (202) are moved away from each other.
2. The wafer pick-and-place tweezers according to claim 1, characterized in that: The upper clamping head (201) comprises an upper connecting portion (211) and an upper extending portion (221) connected to the upper connecting portion (211); the lower clamping head (202) comprises a lower connecting portion (212) and a lower extending portion (222) connected to the lower connecting portion (212); The upper connecting portion (211) is detachably connected to the A2 end of the upper clamping arm (101), and the lower connecting portion (212) is detachably connected to the B2 end of the lower clamping arm (102); An upper contact surface (231) is arranged on the lower side of the upper protruding portion (221), and a lower contact surface (232) is arranged on the upper side of the lower protruding portion (222); the upper contact surface (231) and the lower contact surface (232) are both planes; when in use, the upper contact surface (231) of the upper protruding portion (221) and the lower contact surface (232) of the lower protruding portion (222) respectively adhere to the upper and lower surfaces of a wafer and form surface contact.
3. The wafer pick-and-place tweezers according to claim 2, characterized in that: An upper step (241) is formed at the junction of the upper protruding portion (221) and the upper connecting portion (211); a lower step (242) is formed at the junction of the lower protruding portion (222) and the lower connecting portion (212); When the upper clamping arm (101) and the lower clamping arm (102) are kneaded together, the upper step (241) and the lower step (242) cooperate with each other, and the upper contact surface (231) and the lower contact surface (232) approach and fit each other.
4. The wafer pick-and-place tweezers according to claim 3, characterized in that: The side wall of the upper step (241) and the side wall of the lower step (242) are both arranged in an arc shape, and the concave side of the arc faces away from the clamping arm (1).
5. The wafer pick-and-place tweezers according to claim 2, characterized in that: The A2 end of the upper clamping arm (101) is provided with an upper buckle, and the upper clamping head (201) is provided with an upper matching buckle that matches therewith, and the A2 end of the upper clamping arm (101) forms a buckle connection with the upper connecting portion (211); The B2 end of the lower clamping arm (102) is provided with a lower buckle, and the lower clamping head (202) is provided with a lower matching buckle that matches therewith, and the B2 end of the lower clamping arm (102) forms a buckle connection with the lower connecting portion (212).
6. The wafer pick-and-place tweezers according to claim 2, characterized in that: Also included are an upper threaded rod and a lower threaded rod; The A2 end of the upper clamping arm (101) is provided with an upper threaded hole, the upper connecting portion (211) is provided with an upper matching threaded hole matching therewith, and the upper threaded rod passes through the upper threaded hole and the upper matching threaded hole in sequence to form a threaded connection; The B2 end of the lower clamping arm (102) is provided with a lower threaded hole, and the lower connecting portion (212) is provided with a lower matching threaded hole matching therewith, and the lower threaded rod passes through the lower threaded hole and the lower matching threaded hole in sequence to form a threaded connection.
7. The wafer pick-and-place tweezers according to claim 3, characterized in that: A soft buffer layer for increasing friction is provided on the upper contact surface (231) and / or the lower contact surface (232).
8. The wafer pick-and-place tweezers according to claim 2, characterized in that: The clamping arm (1) has a gripping axis, which passes through the middle position between the pinching point of the upper clamping arm (101) and the pinching point of the lower clamping arm (102), and passes through the connection between the A1 end of the upper clamping arm (101) and the B1 end of the lower clamping arm (102); After the upper contact surface (231) and the lower contact surface (232) clamp the wafer, the plane where the wafer is located forms a preset angle with the holding axis, so that the end of the wafer away from the clamping head (2) is higher than the end close to the clamping head (2).
9. The wafer pick-and-place tweezers according to claim 3, characterized in that: After the upper clamping arm (101) and the lower clamping arm (102) are pinched, the front end boundary of the lower contact surface (232) exceeds the front end boundary of the upper contact surface (231).
10. The wafer pick-and-place tweezers according to claim 1, characterized in that: The clamping arm (1) is provided with a gripping portion (3), and the gripping portion (3) is provided with a recessed portion that fits the fingers and a pattern with an anti-slip effect.