Vacuum plastic uptake forming machine with cooling structure

Abstract

The utility model discloses a vacuum plastic uptake forming machine with a cooling structure. The vacuum plastic uptake forming machine comprises a plastic uptake forming shell and a cooling mechanism, an upper mold is mounted at the upper end of the blister forming shell, a hollow lower mold is arranged in the middle of the blister forming shell, hollow mold cores which are uniformly distributed are arranged on the top wall of the hollow lower mold in a penetrating manner, and air holes which are uniformly distributed are formed in the wall bodies of the hollow mold cores; the cooling mechanism comprises a curved cooling pipe and heat conducting pieces, the curved cooling pipe is arranged in the hollow lower mold, the uniformly distributed heat conducting pieces are arranged on the inner wall of the curved cooling pipe in a penetrating mode, the upper ends of the heat conducting pieces make contact with the wall bodies of the adjacent hollow mold cores, and a single chip microcomputer is arranged on the left side of the plastic uptake forming shell. According to the vacuum plastic uptake forming machine with the cooling structure, the cooling speed of plastic after vacuum adsorption forming is improved in the mode of transferring and absorbing heat of a water body and accelerating the cold-heat exchange speed of gas, and the vacuum plastic uptake forming machine with the cooling structure is convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum forming, in particular to a vacuum vacuum forming machine with a cooling structure. Background Art

[0002] Vacuum forming is also called vacuum thermoplastic forming. This forming process mainly uses the vacuum suction force generated by a vacuum pump to heat and soften thermoplastic plastic sheets such as PVC, PET, PETG, APTT, PP, PE, PS, etc., through a mold to form vacuum covers of various shapes, or attach them to the surfaces of products of various shapes. Some vacuum forming machines include a box body, a plastic film plate is fixedly installed inside the box body; a heating component is fixedly installed inside the box body; a controller is installed on an outer wall of the box body. The utility model starts a servo motor to drive the L-shaped swing arm to slide inside the sliding groove frame, presses the U-shaped frame, and drives one end of the U-shaped frame The two fixed pressure plates slide downward in the two guide grooves and the two guide columns respectively. During the sliding process, the two elastic springs are pressed to make the two pressure plates move downward at a uniform speed until the two pressure plates contact and fix the top of the plastic part placed on the top outside the heating box, thereby fixing the plastic part to prevent its position from moving. In the subsequent vacuum forming process, the plastic part is prevented from moving and affecting the vacuum forming effect. However, the device heats and softens the plastic and then forms it through vacuum adsorption. At this time, the plastic itself has a certain temperature. In order to prevent the plastic formed by vacuum adsorption from deforming itself, the plastic needs to be cooled statically. This method is time-consuming and needs to be improved. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the existing defects and provide a vacuum plastic suction molding machine with a cooling structure. The device absorbs heat from water and accelerates the speed of heat exchange of gas, thereby improving the cooling speed of plastic after vacuum adsorption molding. It is easy to use and can effectively solve the problems in the background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a vacuum plastic forming machine with a cooling structure, comprising a plastic forming shell and a cooling mechanism;

[0005] Blister forming shell: an upper mold is installed on its upper end, a hollow lower mold is arranged in the middle of the blister forming shell, the top wall of the hollow lower mold is penetrated by evenly distributed hollow mold cores, and evenly distributed air holes are opened on the wall of the hollow mold core;

[0006] Cooling mechanism: It includes a curved cooling tube and a heat conducting sheet. The curved cooling tube is arranged inside the hollow lower mold. The inner wall of the curved cooling tube is penetrated by evenly distributed heat conducting sheets. The upper ends of the heat conducting sheets are in contact with the wall of the adjacent hollow mold core. The device absorbs heat through water transfer and accelerates the speed of heat exchange of gas, thereby improving the cooling speed of the plastic after vacuum adsorption molding. It is easy to use.

[0007] Furthermore, a single chip microcomputer is arranged on the left side of the blister formed shell, and an input end of the single chip microcomputer is electrically connected to an external power supply, so that the electrical components can be conveniently controlled.

[0008] Furthermore, evenly distributed electro-hydraulic push rods are provided on the upper side of the vacuum forming shell, the input ends of the electro-hydraulic push rods are electrically connected to the output ends of the single-chip microcomputer, and the telescopic ends of the electro-hydraulic push rods are fixedly connected to the upper side of the upper mold to control the upper mold of the vacuum forming machine.

[0009] Furthermore, a ceramic heating plate is provided inside the upper mold, and an input end of the ceramic heating plate is electrically connected to an output end of the single-chip microcomputer to heat and soften the plastic hard sheet in the vacuum forming machine.

[0010] Furthermore, the cooling mechanism also includes a liquid outlet pipe, a liquid inlet pipe, a water tank and a water pump. The water tank is arranged on the rear side of the vacuum formed shell. The left rear end of the curved cooling tube passes through the rear wall of the vacuum formed shell and is provided with a liquid inlet pipe. The right rear end of the curved cooling tube passes through the rear wall of the vacuum formed shell and is provided with a liquid outlet pipe. The lower ends of the liquid inlet pipe and the liquid outlet pipe are both connected to the water tank. The lower end of the liquid inlet pipe is connected in series with a water pump. The input end of the water pump is electrically connected to the output end of the single-chip microcomputer to transport cooling water to the vacuum formed plastic.

[0011] Furthermore, the cooling mechanism also includes heat dissipation fins, and the heat dissipation fins are all arranged through the rear wall of the water tank to release the heat absorbed by the water to the outside.

[0012] Furthermore, an air pipe is penetrated through the bottom wall of the hollow lower mold, a vacuum pump is installed inside the blister molding shell, a pressure relief pipe is penetrated through the upper end of the air pipe, a solenoid valve is connected in series in the middle of the pressure relief pipe, and the input ends of the vacuum pump and the solenoid valve are electrically connected to the output ends of the single-chip microcomputer to control the vacuum adsorption and pressure relief of the vacuum blister molding machine.

[0013] Furthermore, evenly distributed induced draft fans are provided on the right side of the blister shell, and input ends of the induced draft fans are electrically connected to output ends of the single-chip microcomputer, thereby further improving the cooling and molding speed of the vacuum blister molding machine by accelerating the speed of gas heat exchange.

[0014] Compared with the prior art, the beneficial effects of the utility model are: the vacuum plastic forming machine with a cooling structure has the following advantages:

[0015] 1. After the plastic is initially formed by vacuum adsorption, the single-chip microcomputer starts the water pump, and the water pump transports the cooling water in the water tank to the curved cooling tube through the liquid inlet pipe. The softened plastic's own heat is exchanged with the cooling water in the curved cooling tube through heat transfer along the hollow mold core and the heat conducting plate, thereby cooling the plastic by water and improving the vacuum forming speed of the device. The water that absorbs heat flows back to the water tank along the liquid outlet pipe and releases its own heat to the external air environment through the heat dissipation fins. The vacuum forming machine with a cooling structure improves the cooling speed of the plastic after vacuum adsorption forming by absorbing heat through water transfer, and is easy to use.

[0016] 2. After the plastic is initially shaped by vacuum adsorption, the single-chip microcomputer starts the induced draft fan. The induced draft fan speeds up the air flow rate on the softened plastic surface, increases the heat exchange rate between the vacuum adsorption-molded plastic and the air in the atmosphere, and further accelerates the cooling and molding speed of the vacuum adsorption-molded plastic itself. The vacuum blister molding machine with a cooling structure increases the cooling speed of the plastic after vacuum adsorption molding by accelerating the speed of gas heat exchange, and is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the rear structure of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the curved cooling pipe of the utility model.

[0021] In the figure: 1 plastic forming shell, 2 single chip microcomputer, 3 electro-hydraulic push rod, 4 upper mold, 5 ceramic heating plate, 6 hollow lower mold, 7 hollow core, 8 cooling mechanism, 81 curved cooling pipe, 82 heat conducting plate, 83 liquid outlet pipe, 84 liquid inlet pipe, 85 water tank, 86 cooling fins, 87 water pump, 9 air pipe, 10 vacuum pump, 11 pressure relief pipe, 12 solenoid valve, 13 induced draft fan. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4 , this embodiment provides a technical solution: a vacuum blister forming machine with a cooling structure, comprising a blister forming shell 1 and a cooling mechanism 8;

[0024] The blister forming shell 1: an upper mold 4 is installed on its upper end, a hollow lower mold 6 is provided in the middle of the blister forming shell 1, the top wall of the hollow lower mold 6 is penetrated by evenly distributed hollow mold cores 7, and evenly distributed air holes are opened on the wall of the hollow mold core 7. A single-chip microcomputer 2 is provided on the left side of the blister forming shell 1, and the input end of the single-chip microcomputer 2 is electrically connected to an external power supply. Evenly distributed electro-hydraulic push rods 3 are provided on the upper side of the blister forming shell 1, and the input ends of the electro-hydraulic push rods 3 are electrically connected to the output ends of the single-chip microcomputer 2. The telescopic ends of the electro-hydraulic push rods 3 are fixedly connected to the upper side of the upper mold 4. A ceramic heating plate 5 is arranged inside, and the input end of the ceramic heating plate 5 is electrically connected to the output end of the single chip computer 2. An air pipe 9 is penetrated through the bottom wall of the hollow lower mold 6. A vacuum pump 10 is installed inside the blister forming shell 1. A pressure relief pipe 11 is penetrated through the upper end of the air pipe 9. A solenoid valve 12 is connected in series in the middle of the pressure relief pipe 11. The input ends of the vacuum pump 10 and the solenoid valve 12 are electrically connected to the output end of the single chip computer 2. An evenly distributed induced draft fan 13 is arranged on the right side of the blister forming shell 1. The input ends of the induced draft fan 13 are electrically connected to the output end of the single chip computer 2. The device is used for vacuum blister forming. When molding, first place the flat plastic hard sheet on the upper side of the hollow mold core 7, then the single chip microcomputer 2 starts the electro-hydraulic push rod 3 so that its telescopic end drives the upper mold 4 to move vertically downward to extrude the plastic hard sheet, and at the same time the single chip microcomputer 2 starts the ceramic heating plate 5 to heat and soften the plastic hard sheet, then the single chip microcomputer 2 starts the vacuum pump 10, and the vacuum pump 10 passes through the air pipe 9 and the hollow lower mold 6 so that the air holes of the hollow mold core 7 vacuum absorb and mold the softened plastic hard sheet, then the single chip microcomputer 2 starts the electro-hydraulic push rod 3 so that its telescopic end drives the upper mold 4 to move upward and reset, and at the same time the single chip microcomputer 2 starts The induced draft fan 13 accelerates the air flow rate on the softened plastic surface, improves the heat exchange rate between the vacuum adsorption formed plastic and the air in the atmosphere, and further accelerates the cooling and forming speed of the vacuum adsorption formed plastic itself. After the plastic is vacuum adsorption formed, the single chip computer 2 opens the solenoid valve 12 to release the pressure on the hollow lower mold 6, so as to facilitate the removal of the formed plastic from the hollow lower mold 6. The vacuum blister forming machine with a cooling structure accelerates the heat exchange rate of the gas, thereby improving the cooling speed of the plastic after vacuum adsorption forming, and is easy to use.

[0025] Cooling mechanism 8: It includes a curved cooling pipe 81 and a heat conducting sheet 82. The curved cooling pipe 81 is arranged inside the hollow lower mold 6. The inner wall of the curved cooling pipe 81 is penetrated by evenly distributed heat conducting sheets 82. The upper ends of the heat conducting sheets 82 are in contact with the wall of the adjacent hollow core 7. The cooling mechanism 8 also includes a liquid outlet pipe 83, a liquid inlet pipe 84, a water tank 85 and a water pump 87. The water tank 85 is arranged on the rear side of the blister forming shell 1. The left rear end of the curved cooling pipe 81 passes through the rear wall of the blister forming shell 1 and is provided with a liquid inlet pipe 84. The right rear end of the curved cooling pipe 81 passes through the rear wall of the blister forming shell 1 and is provided with a liquid outlet pipe 83. The lower ends of the liquid inlet pipe 84 and the liquid outlet pipe 83 are both connected to the water tank 85. The lower end of the liquid inlet pipe 84 is connected in series with a water pump 87. The input end of the water pump 87 is electrically connected to the output end of the single-chip microcomputer 2. Structure 8 also includes heat dissipation fins 86, which are all arranged through the rear wall of the water tank 85. After the plastic is initially formed by vacuum absorption, the single-chip computer 2 starts the water pump 87, and the water pump 87 transports the cooling water in the water tank 85 to the curved cooling tube 81 through the liquid inlet pipe 84. The softened plastic's own heat is exchanged with the cooling water in the curved cooling tube 81 through the heat transfer method along the hollow mold core 7 and the heat conductive sheet 82, thereby water-cooling the plastic and improving the vacuum absorption molding speed of the device. The water that absorbs heat flows back to the water tank 85 along the liquid outlet pipe 83, and releases its own heat to the external air environment through the heat dissipation fins 86. The vacuum absorption molding machine with a cooling structure improves the cooling speed of the plastic after vacuum absorption molding by absorbing heat transfer from the water body, and is easy to use.

[0026] The working principle of a vacuum plastic suction molding machine with a cooling structure provided by the utility model is as follows: when using the device for vacuum plastic suction molding, first place a flat plastic hard sheet on the upper side of a hollow mold core 7, then the single chip microcomputer 2 starts the electro-hydraulic push rod 3 so that its telescopic end drives the upper mold 4 to move vertically downward to extrude the plastic hard sheet, and at the same time the single chip microcomputer 2 starts the ceramic heating plate 5 to heat and soften the plastic hard sheet, then the single chip microcomputer 2 starts the vacuum pump 10, and the vacuum pump 10 uses the air pipe 9 and the hollow lower mold 6 so that the air holes of the hollow mold core 7 perform vacuum adsorption molding on the softened plastic hard sheet, then the single chip microcomputer 2 starts the electro-hydraulic push rod 3 so that its telescopic end drives the upper mold 4 to move upward and reset, then the single chip microcomputer 2 starts the water pump 87, and the water pump 87 pumps the cooling water in the water tank 85 into the curved cooling pipe 81 through the liquid inlet pipe 84. The heat of the softened plastic is transferred along the hollow mold core 7 and the heat conductive sheet 82 to exchange heat with the cooling water in the curved cooling tube 81 through heat transfer, thereby cooling the plastic with water and improving the vacuum suction molding speed of the device. The water that absorbs heat flows back to the water tank 85 along the liquid outlet pipe 83, and releases its own heat to the external air environment through the heat dissipation fins 86. At the same time, the single-chip microcomputer 2 starts the induced draft fan 13. The induced draft fan 13 runs to accelerate the air flow speed on the surface of the softened plastic, thereby increasing the heat exchange speed between the vacuum adsorption molded plastic and the air in the atmosphere, and further accelerating the cooling molding speed of the vacuum adsorption molded plastic itself. After the plastic is vacuum adsorption molded, the single-chip microcomputer 2 opens the solenoid valve 12 to relieve the pressure on the hollow lower mold 6, so as to facilitate the removal of the molded plastic from the hollow lower mold 6.

[0027] It is worth noting that the single chip microcomputer 2 disclosed in the above embodiment can adopt MSP430, the electro-hydraulic push rod 3 can adopt DYTZ-1000, the ceramic heating plate 5 can adopt MCH ceramic heating plate, the water pump 87 can adopt mzr-11557, the vacuum pump 10 can adopt XD-020, the solenoid valve 12 can adopt ZQDF-3Y-40, and the induced draft fan 13 can adopt F4-72. The single chip microcomputer 2 controls the operation of the electro-hydraulic push rod 3, the ceramic heating plate 5, the water pump 87, the vacuum pump 10, the solenoid valve 12 and the induced draft fan 13, all of which adopt the methods commonly used in the prior art.

[0028] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A vacuum forming machine with a cooling structure, characterized in that: It comprises a vacuum-formed shell (1) and a cooling mechanism (8); The blister molded shell (1) has an upper mold (4) installed at its upper end, a hollow lower mold (6) is provided in the middle of the blister molded shell (1), the top wall of the hollow lower mold (6) is penetrated by evenly distributed hollow mold cores (7), and evenly distributed air holes are opened on the wall of the hollow mold core (7); The cooling mechanism (8) comprises a curved cooling tube (81) and a heat conducting sheet (82), wherein the curved cooling tube (81) is arranged inside the hollow lower mold (6), and the inner wall of the curved cooling tube (81) is penetrated by evenly distributed heat conducting sheets (82), and the upper ends of the heat conducting sheets (82) are in contact with the wall of the adjacent hollow mold core (7).

2. The vacuum forming machine with a cooling structure according to claim 1, characterized in that: A single-chip microcomputer (2) is provided on the left side of the blister-formed shell (1), and an input end of the single-chip microcomputer (2) is electrically connected to an external power supply.

3. The vacuum forming machine with a cooling structure according to claim 2, characterized in that: The upper side of the vacuum-molded shell (1) is provided with evenly distributed electro-hydraulic push rods (3), the input ends of the electro-hydraulic push rods (3) are electrically connected to the output ends of the single-chip computer (2), and the telescopic ends of the electro-hydraulic push rods (3) are fixedly connected to the upper side of the upper mold (4).

4. The vacuum forming machine with a cooling structure according to claim 2, characterized in that: A ceramic heating plate (5) is provided inside the upper mold (4), and an input end of the ceramic heating plate (5) is electrically connected to an output end of the single chip computer (2).

5. The vacuum forming machine with a cooling structure according to claim 2, characterized in that: The cooling mechanism (8) further comprises a liquid outlet pipe (83), a liquid inlet pipe (84), a water tank (85) and a water pump (87); the water tank (85) is arranged on the rear side of the blister-molded shell (1); the left rear end of the curved cooling pipe (81) passes through the rear wall of the blister-molded shell (1) and is provided with a liquid inlet pipe (84); the right rear end of the curved cooling pipe (81) passes through the rear wall of the blister-molded shell (1) and is provided with a liquid outlet pipe (83); the lower ends of the liquid inlet pipe (84) and the liquid outlet pipe (83) are both connected to the water tank (85); the lower end of the liquid inlet pipe (84) is connected in series with a water pump (87); the input end of the water pump (87) is electrically connected to the output end of the single-chip computer (2).

6. The vacuum forming machine with a cooling structure according to claim 5, characterized in that: The cooling mechanism (8) further comprises heat dissipation fins (86), and the heat dissipation fins (86) are all arranged through the rear wall of the water tank (85).

7. The vacuum forming machine with a cooling structure according to claim 2, characterized in that: An air pipe (9) is provided through the bottom wall of the hollow lower mold (6), a vacuum pump (10) is installed inside the vacuum forming shell (1), a pressure relief pipe (11) is provided through the upper end of the air pipe (9), a solenoid valve (12) is connected in series in the middle of the pressure relief pipe (11), and the input ends of the vacuum pump (10) and the solenoid valve (12) are both electrically connected to the output end of the single chip computer (2).

8. The vacuum forming machine with a cooling structure according to claim 2, characterized in that: The right side of the vacuum-formed shell (1) is provided with evenly distributed induced draft fans (13), and the input ends of the induced draft fans (13) are electrically connected to the output ends of the single-chip computer (2).

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