Radio frequency interaction structure for standardized packaging device

Abstract

The utility model provides a radio frequency interaction structure for a standardized packaging device, which comprises a mounting box fixed at a cargo bearing position of the standardized packaging device, and a circuit board arranged in the mounting box. The cover plate is arranged on the top of the circuit board so that modulation of interaction signals of the radio frequency module RFID tag can be achieved through the pressure of the cover plate on the pressure sensing device on the circuit board, and therefore the real-time weight of goods in the packaging device can be fed back to the radio frequency interaction terminal in real time; therefore, the weight information of the goods is detected by sensing the wireless signal of the radio frequency interaction terminal, and the actual goods quantity in the standardized packaging device is calibrated and updated.

Description

Technical Field

[0001] The present application relates to the technical field of electric power material storage, and in particular to a radio frequency interaction structure for a standardized packaging device. Background Art

[0002] In the existing stereoscopic warehouse, the real-time storage status of each storage unit can only be retrieved through the warehouse management system according to its entry and exit records. For electrical equipment such as semi-circular flat iron clamps, semi-circular clamps, butterfly insulators, storage wiring, AC disk-type suspension porcelain insulators, iron accessories, etc., it is usually necessary to store several electrical devices of the same category in the same storage unit. When retrieving, it is necessary to extract one or several devices from the corresponding storage unit according to the updated entry and exit records in the system, or only cut a section of cable, and then re-enter the remaining materials in the storage unit. In other words, the prior art requires additional counting steps to ensure the accuracy of the number of materials returned to the warehouse in the system after the storage unit retrieves some of the goods out of the warehouse. In this process, it is often easy to fail to accurately count the specific number of materials returned to the warehouse due to compatibility issues between systems or untimely data exchange, resulting in the inability to accurately know the dynamics of materials in the corresponding area of ​​the warehouse. Utility Model Content

[0003] In order to solve the deficiencies of the prior art, the purpose of this application is to provide a radio frequency interaction structure for a standardized packaging device. This application integrates a radio frequency module and a pressure sensor device in the cargo support position of the standardized packaging device, and can sense the wireless signal of the radio frequency interaction terminal to detect the weight information of the cargo, thereby realizing the calibration and update of the actual quantity of cargo in the standardized packaging device.

[0004] To achieve the above-mentioned purpose, the present application provides a radio frequency interaction structure for a standardized packaging device, which includes: an installation box, which is fixed at the cargo supporting position of the standardized packaging device; a circuit board, which is arranged in the installation box, and the top of the circuit board is fixedly connected to the cover plate of the installation box, and the length and width dimensions of the cover plate and the circuit board are both smaller than the length and width dimensions of the internal accommodation space of the installation box; a radio frequency module, which is arranged on one side of the circuit board and has an RFID tag; a pressure sensing device, which is arranged on the other side of the circuit board and has a buffer gasket attached to its surface, and the pressure sensing device is abutted against the installation box or its cover plate through the buffer gasket.

[0005] Optionally, a radio frequency interaction structure for a standardized packaging device as described above, wherein a support screw is connected between the circuit board and the cover plate, a support gasket is sleeved on the support screw, and the support gasket is fixed between the circuit board and the cover plate to maintain a top plane of the circuit board and a bottom plane of the cover plate without direct contact.

[0006] Optionally, in any of the above described radio frequency interaction structures for standardized packaging devices, the thickness of the supporting gasket is greater than the thickness of the radio frequency module, or the thickness of the supporting gasket is not greater than the thickness of the buffer gasket.

[0007] Optionally, a radio frequency interaction structure for a standardized packaging device as described above, wherein the radio frequency module includes: an RFID tag, which is wirelessly connected to the radio frequency interaction terminal and electrically connected to the pressure sensing device; and a tag chip, which is electrically connected to the RFID tag and is arranged at the center of the RFID tag.

[0008] Optionally, a radio frequency interaction structure for a standardized packaging device as described above, wherein the RFID tag has two symmetrically arranged comb-like radiation structures, the two comb-like radiation structures respectively have a long strip-shaped connecting portion and a plurality of comb-tooth-shaped radiation structures arranged at intervals perpendicular to the connecting portion, and the tag chip is connected between the connecting portions of the two pairs of comb-like radiation structures.

[0009] Optionally, in the radio frequency interaction structure for a standardized packaging device as described above, a radio frequency modulation chip is also provided in the circuit board, which is electrically connected to the pressure sensor and simultaneously electrically connected to the RFID tag.

[0010] Optionally, a radio frequency interactive structure for a standardized packaging device as described above, wherein the standardized packaging device comprises: a base, a bottom of which is provided with a fork frame, and a surface of which is provided with a planar structure; a protective net, which is provided around the base and extends upward from the base surface to at least 1 / 2 of the height of the goods.

[0011] Optionally, a radio frequency interactive structure for a standardized packaging device as described above, wherein a supporting member is further provided on the surface of the base at the position where the goods are placed, and the supporting member is a long strip structure with a supporting groove provided on the top thereof, and a stopper is embedded in the supporting groove, and the stopper is connected between the supporting grooves to support the goods.

[0012] Optionally, in a radio frequency interaction structure for a standardized packaging device as described above, the mounting box is fixedly disposed in a supporting groove of a supporting member and is installed directly below a stopper, and the cover plate abuts against a lower surface of the stopper.

[0013] Compared with the existing solutions, this application has the following technical effects:

[0014] The radio frequency interaction structure for a standardized packaging device provided in the present application includes an installation box fixed at a cargo support position of the standardized packaging device, and a circuit board arranged in the installation box. The present application arranges a cover plate on the top of the circuit board to modulate the radio frequency module RFID tag interaction signal through the pressure of the cover plate on the pressure sensor device on the circuit board, thereby feeding back the real-time weight of the cargo inside the packaging device to the radio frequency interaction terminal in real time, thereby sensing the wireless signal of the radio frequency interaction terminal to detect the weight information of the cargo, thereby realizing the calibration and update of the actual quantity of cargo in the standardized packaging device.

[0015] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or may be understood by practicing the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings:

[0017] Figure 1 It is a schematic diagram of the assembly method of the radio frequency interaction structure according to the present application;

[0018] Figure 2 A schematic diagram of an RFID tag in a radio frequency interaction structure of the present application;

[0019] Figure 3 It is a schematic diagram of installing the radio frequency interaction structure according to the present application in a standardized packaging device;

[0020] Figure 4 This is a cross-sectional view of the RF interaction structure when it is installed.

[0021] In the figure, 1 represents a radio frequency module; 2 represents a circuit board; 3 represents a pressure sensor device; 4 represents a mounting box; 5 represents a supporting member; 6 represents a stopper; 7 represents a standardized packaging device; 71 represents a base; 72 represents an entry frame; and 73 represents a protective net. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application.

[0023] The meaning of "inside" and "outside" in this application refers to the direction pointing to the center of the circuit board inside the packaging box relative to the packaging box itself, and the opposite direction is outside; it is not a specific limitation on the device mechanism of this application.

[0024] The meaning of "left and right" in this application refers to that when a user is facing a standardized packaging device, the user's left side is left and the user's right side is right, rather than a specific limitation on the device mechanism of this application.

[0025] The term “connection” as used in this application may mean a direct connection between components or an indirect connection between components via other components.

[0026] The meaning of "up" and "down" mentioned in this application refers to that when the user is facing the goods in the standardized packaging device, the direction from the fork frame of the standardized packaging device to the top of the protective net is up, and the opposite direction is down, rather than a specific limitation on the device mechanism of this application.

[0027] This application provides Figure 3 The radio frequency interaction structure of the standardized packaging device shown includes Figure 1 Shown:

[0028] The installation box 4 is fixed at the cargo supporting position of the standardized packaging device and is hollow inside for accommodating the circuit board;

[0029] A circuit board 2 is arranged in the installation box, the top of the circuit board 2 is fixedly connected to the cover plate 10 of the installation box 4, and the length and width of the cover plate 10 and the circuit board 2 are smaller than the length and width of the internal accommodation space of the installation box 4, so that the circuit board 2 can move up and down in the installation box 4 according to the weight of the goods to realize the detection of the weight of the goods;

[0030] A radio frequency module 1 is arranged on one side of a circuit board 2 and has an RFID tag and a tag chip electrically connected to the RFID tag;

[0031] The pressure sensing device 3 is electrically connected to the RF module 1 and is disposed on the other side of the circuit board 2. A buffer gasket is attached to the surface of the pressure sensing device 3. The pressure sensing device 3 abuts against the mounting box 4 or its cover plate 10 via the buffer gasket.

[0032] Thus, the RF modulation chip can receive the interactive signals sent to the tags along the way by the RF interactive terminal in the storage system during operation through the RF signal wireless interaction, and the current excited by the wireless induction signal drives the pressure sensor, so that the pressure sensor device 3 senses the wireless signal of the RF interactive terminal to detect the pressure of the cargo support position in the standardized packaging device, and then encodes the pressure sensing information into the identification information of the RFID tag to feed back the RF echo signal to the RF interactive terminal through the RFID tag. Thus, by superimposing the sensing signal fed back by the pressure sensor device 3 on the RF echo signal, the echo signal fed back by the RFID tag to the RF interactive terminal is modulated according to the sensing signal, so that the RF interactive terminal can parse the actual weight of the cargo in the standardized packaging device, thereby estimating the actual quantity of cargo stored in the warehouse according to the unit weight of the cargo of this type, and timely verifying and updating the material information inside the storage system.

[0033] Specific reference Figure 3 As shown, in this application, the standardized packaging device 7 includes:

[0034] The base 71 is generally configured as a flat steel plate or a wooden board or a hard plastic bottom box. The bottom of the base 71 is provided with a fork frame 72 extending downward to a certain height. The fork frame 72 raises the base to a certain height so that the fork can be inserted into the bottom of the base to lift or lower the standardized packaging device 7. The surface of the base 71 itself is generally configured as a flat structure;

[0035] The protective net 73 is arranged around the base 71 and extends upward from the surface of the base 71 to at least 1 / 2 of the height of the goods to limit the movement of the goods in the base and provide certain protection for the goods.

[0036] The surface of the base 71 is also provided with a supporting member 5 in the area where the goods are placed. The supporting member 5 is generally provided with a plurality of parallel long strip structures. A supporting groove is provided on the top of the long strip structure to accommodate the bottom of the goods. A stopper 6 is embedded in the supporting groove and is vertically provided with the long strip structure. The stopper 6 is generally provided with a Figure 4 The method spans between the openings of the supporting groove to support the goods and prevent the goods from rolling in the groove.

[0037] The installation box 4 generally has its bottom fixed in the supporting groove of the supporting member 5, and is preferably installed directly below the stopper 6, so that the cover plate 10 of the installation box 4 can just abut against the lower surface of the stopper 6, making it convenient for the pressure sensing device 3 to detect the cargo pressure borne by the stopper 6.

[0038] A support screw is connected between the circuit board 2 and the cover plate 10 in the installation box 4, and a support gasket is sleeved on the support screw. The support gasket is fixed between the circuit board 2 and the cover plate 10 to keep the top plane of the circuit board 2 from directly contacting the bottom plane of the cover plate 10, so as to avoid deformation of the circuit structure due to the pressure of the goods. In the circuit board 2, the radio frequency module 1 and the pressure sensing device 3 can be optionally arranged on the upper and lower surfaces thereof. The pressure sensing device 3 can be abutted against the cover plate 10 or the bottom plate of the installation box 4 through the buffering of the support gasket, so as to detect the pressure of the goods borne by the stopper 6 on it. The radio frequency module 1 is preferably arranged directly below the cover plate 10 through the support gasket. Therefore, the device can be provided with a thickness of the support gasket greater than the thickness of the radio frequency module 1, or, when the radio frequency module 1 is reversely installed at the bottom, the thickness of the support gasket is set to be not greater than the thickness of the buffer gasket, so as to utilize the toughness of the cover plate, and while protecting the pressure sensing device 3, the pressure borne by the goods and the stopper 6 can be transmitted to the pressure sensing device 3 through the cover plate 10, so as to detect the weight of the goods.

[0039] Reference Figure 2 As shown, the radio frequency module 1 of the present application includes: an RFID tag with two symmetrically arranged comb-shaped radiation structures, which is wirelessly connected to the radio frequency interaction terminal and electrically connected to the pressure sensing device 3; the tag chip is arranged at the center position of the RFID tag, generally connected between the connecting parts 11 of the two pairs of comb-shaped radiation structures, so as to realize the feeding of the long strip-shaped connecting parts 11 in the two comb-shaped radiation structures and a plurality of comb-shaped radiation structures 12 arranged perpendicular to the connecting parts 11, thereby realizing the external transmission of radio frequency signals through the comb-shaped structure.

[0040] The circuit board 2 is generally also provided with a radio frequency modulation chip, which is electrically connected to the pressure sensor for receiving the sensing signal of the weight of the goods. The radio frequency modulation chip is also electrically connected to the RFID tag at the same time, and is used to modulate the radio frequency echo signal after superimposing the sensing signal on the identification information of the RFID tag chip. Therefore, after sensing the wireless signal of the radio frequency interaction terminal, the RFID tag can drive the pressure sensing device 3 through its induced current to detect the pressure on the supporting member, and use the sensing signal obtained by the pressure sensor to modulate the radio frequency echo signal fed back by the RFID to the identification terminal, thereby adding the weight data of the goods inside the packaging structure to the tag identification signal technology, and then through the radio frequency interaction, dynamically monitor the actual goods status of each storage position during the internal inspection or transportation of the storage system, so as to correct the real-time material situation in the storage system, dynamically monitor the materials in the storage unit in real time, and reduce the inventory error of the warehouse.

[0041] Those skilled in the art can understand that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A radio frequency interaction structure for a standardized packaging device, characterized in that: include: A mounting box (4) fixed to a cargo supporting position of a standardized packaging device; A circuit board (2) is arranged in the installation box, the top of the circuit board (2) is fixedly connected to the cover plate (10) of the installation box (4), and the length and width of the cover plate (10) and the circuit board (2) are both smaller than the length and width of the internal accommodation space of the installation box (4); A radio frequency module (1), which is arranged on one side of the circuit board (2) and has an RFID tag; A pressure sensing device (3) is arranged on the other side of the circuit board (2) and has a buffer gasket attached to its surface. The pressure sensing device (3) abuts against the installation box (4) or its cover plate (10) via the buffer gasket.

2. The radio frequency interaction structure for a standardized packaging device according to claim 1, characterized in that: A supporting screw is connected between the circuit board (2) and the cover plate (10), a supporting gasket is sleeved on the supporting screw, and the supporting gasket is fixed between the circuit board (2) and the cover plate (10) to ensure that the top plane of the circuit board (2) and the bottom plane of the cover plate (10) are not in direct contact.

3. The radio frequency interaction structure for a standardized packaging device according to claim 2, characterized in that: The thickness of the supporting gasket is greater than the thickness of the radio frequency module (1), or the thickness of the supporting gasket is not greater than the thickness of the buffer gasket.

4. The radio frequency interaction structure for a standardized packaging device according to claim 1, characterized in that: The radio frequency module (1) comprises: An RFID tag, which is wirelessly connected to the radio frequency interactive terminal and electrically connected to the pressure sensing device (3); The tag chip is electrically connected to the RFID tag and is arranged at the center of the RFID tag.

5. The radio frequency interaction structure for a standardized packaging device according to claim 4, characterized in that: The RFID tag has two symmetrically arranged comb-shaped radiation structures, each of which has a long strip-shaped connecting portion (11) and a plurality of comb-shaped radiation structures (12) arranged at intervals perpendicular to the connecting portion (11), and the tag chip is connected between the connecting portions (11) of the two pairs of comb-shaped radiation structures.

6. The radio frequency interaction structure for a standardized packaging device according to claim 4, characterized in that: The circuit board (2) is also provided with a radio frequency modulation chip, which is electrically connected to the pressure sensor and is also electrically connected to the RFID tag.

7. The radio frequency interaction structure for a standardized packaging device according to claim 1, characterized in that: The standardized packaging device (7) comprises: A base (71) having a fork frame (72) disposed at its bottom and a surface thereof configured as a planar structure; The protective net (73) is arranged around the base (71) and extends upward from the surface of the base (71) to at least 1 / 2 of the height of the cargo.

8. The radio frequency interaction structure for a standardized packaging device according to claim 7, characterized in that: A supporting member (5) is also provided on the surface of the base (71) at the position where the goods are placed. The supporting member (5) is a long strip structure with a supporting groove provided on the top. A stopper (6) is embedded in the supporting groove. The stopper (6) is connected between the supporting grooves to support the goods.

9. The radio frequency interaction structure for a standardized packaging device according to claim 8, characterized in that: The installation box (4) is fixedly arranged in a supporting groove of the supporting member (5) and is installed directly below the stopper (6), and the cover plate (10) abuts against the lower surface of the stopper (6).

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