Integrated magnetron sputtering equipment

Abstract

The utility model relates to integrated magnetron sputtering equipment. The integrated magnetron sputtering equipment comprises a workbench, a sputtering assembly and a coating assembly, a reaction bin is arranged on the workbench; the sputtering assembly is arranged in the reaction bin; the sputtering assembly comprises a sputtering target material, an adjusting frame and a first flexible pipe; the adjusting frames are arranged on the two sides of the bottom of the sputtering target and arranged at the bottom of the reaction bin, and the two ends of the first flexible pipe are connected with the sputtering target and the outside of the reaction bin. The film coating assembly comprises a linear module, a driving source, a central shaft and a material disc, the linear module is arranged at the top of the outer side of the reaction bin, the driving source is connected with a sliding seat of the linear module, the driving source is connected with the central shaft, the central shaft is connected with the material disc, sliding grooves are formed in the two sides of the bottom of the material disc, and a substrate is clamped between the sliding grooves. The sputtering component and the coating component are integrated in the reaction bin, so that the device is simple in structure and convenient to operate, the integration level of the device is greatly improved, the size and the weight of the device are reduced, and the device is more portable.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to an integrated magnetron sputtering device. Background Art

[0002] In the field of semiconductor manufacturing equipment, magnetron sputtering is a widely used thin film deposition technology, which sputters atoms or molecules from the target material through a physical process and deposits them on the substrate to form a thin film. This technology has important application value in the preparation of various functional films, such as insulating layers, conductive layers, reflective layers, etc., as well as the preparation of multi-layer composite films.

[0003] In the prior art, magnetron sputtering equipment is usually large in size, complex in structure, inconvenient to operate and maintain, and high in cost, which to a certain extent limits its application in large-scale production. Utility Model Content

[0004] Therefore, the technical problem to be solved by the utility model is to overcome the defects of the magnetron sputtering equipment in the prior art, such as complex structure and inconvenient operation.

[0005] In order to solve the above technical problems, the utility model provides an integrated magnetron sputtering device, comprising:

[0006] A workbench, wherein a reaction chamber is disposed on the workbench, and a vacuum generator is connected to one side of the reaction chamber;

[0007] A sputtering assembly, wherein the sputtering assembly is arranged in the reaction chamber; the sputtering assembly comprises a sputtering target, an adjustment frame and a first flexible tube; the adjustment frame is arranged on both sides of the bottom of the sputtering target, the adjustment frame is arranged at the bottom of the reaction chamber, and the two ends of the first flexible tube are connected to the sputtering target and the outside of the reaction chamber;

[0008] A coating component, wherein the coating component is arranged opposite to the sputtering component; the coating component comprises a linear module, a driving source, a central axis and a material tray, wherein the linear module is arranged at the top of the outer side of the reaction chamber, the driving source is connected to the slide seat of the linear module, the central axis penetrates into the reaction chamber from the top, the output end of the driving source is connected to the central axis, one end of the central axis inside the reaction chamber is connected to the material tray, and slide grooves are arranged on both sides of the bottom of the material tray, and a substrate is clamped between the slide grooves.

[0009] In one embodiment of the utility model, the sputtering assembly also includes a first baffle and a guide portion, the first baffle is arranged at the end of the sputtering target, the guide portion is arranged on one side of the sputtering target, the guide portion includes a guide rod, a universal joint and a swing cylinder, the swing cylinder is arranged at the bottom of the outer side of the reaction chamber, the output end of the swing cylinder is connected to the universal joint, the universal joint is arranged at the bottom inside the reaction chamber, the other end of the universal joint is connected to the guide rod, and the guide rod is connected to the first baffle.

[0010] In one embodiment of the utility model, a limit block is sleeved on the guide rod, and the limit block abuts against the sputtering target.

[0011] In one embodiment of the utility model, the adjustment frame includes a first adjustment plate and a second adjustment plate, the first adjustment plate and the second adjustment plate are hinged, and the other end of the first adjustment plate is connected to the sputtering target, and one end of the second adjustment plate is connected to the reaction chamber.

[0012] In one embodiment of the utility model, a second baffle is arranged between the sputtering assembly and the coating assembly, the second baffle is connected to a rotating shaft, and the other end of the rotating shaft passes through the reaction chamber and is connected to a rotating cylinder.

[0013] In one embodiment of the present invention, a second flexible tube is sleeved on the outer side of the central axis, and the second flexible tube is arranged between the driving source and the reaction chamber.

[0014] In one embodiment of the utility model, a heating cover is provided on the outer side of one end of the central axis close to the material tray, and a mercury lamp is arranged inside the heating cover.

[0015] In one embodiment of the utility model, an air inlet valve is provided at the bottom of the reaction chamber, and the other end of the air inlet valve is connected to an inert gas.

[0016] In one embodiment of the utility model, guide rails are provided on both sides of the opening of the reaction bin, connecting plates are provided between the guide rails, a door panel is provided on the side of the connecting plate close to the opening of the reaction bin, a sealing cylinder is provided on the connecting plate, and the sealing cylinder is connected to the door panel.

[0017] In one embodiment of the present invention, a window is provided on the surface of the door panel.

[0018] The above technical solution of the utility model has the following advantages compared with the prior art:

[0019] The utility model discloses an integrated magnetron sputtering device, which integrates a sputtering component and a coating component in a reaction chamber, has a simple structure and is easy to operate, thus greatly improving the integration of the device, reducing the size and weight of the device, and making the device more portable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 for Figure 1 Schematic diagram of the structure of the middle reaction chamber;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure of the sputtering assembly;

[0024] Figure 4 for Figure 1 Schematic diagram of the structure of the coating assembly;

[0025] Figure 5 for Figure 4 Schematic diagram of the structure of the middle material tray;

[0026] Explanation of the reference numerals in the specification: 1. workbench; 2. sputtering assembly; 3. coating assembly; 11. reaction chamber; 12. vacuum generator; 13. guide rail; 14. connecting plate; 15. door panel; 16. sealing cylinder; 17. window; 18. air inlet valve; 21. sputtering target; 22. adjustment frame; 23. first flexible tube; 24. first baffle; 25. guide rod; 26. universal joint; 27. swing cylinder; 28. limit block; 31. linear module; 32. driving source; 33. center axis; 34. tray; 35. second flexible tube; 36. rotating cylinder; 37. rotating shaft; 38. second baffle; 39. heating hood; 341. slide; 342. substrate; 391. mercury lamp. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0028] Reference Figure 1-Figure 5 As shown, the utility model discloses an integrated magnetron sputtering device, comprising:

[0029] A workbench 1, wherein a reaction chamber 11 is disposed on the workbench 1, and a vacuum generator 12 is connected to one side of the reaction chamber 11;

[0030] A sputtering assembly 2, wherein the sputtering assembly 2 is arranged in the reaction chamber 11; the sputtering assembly 2 comprises a sputtering target 21, an adjustment frame 22 and a first flexible tube 23; the adjustment frame 22 is arranged on both sides of the bottom of the sputtering target 21, the adjustment frame 22 is arranged at the bottom of the reaction chamber 11, and the two ends of the first flexible tube 23 are connected to the sputtering target 21 and the outside of the reaction chamber 11;

[0031] The coating component 3 is arranged opposite to the sputtering component 2; the coating component 3 includes a linear module 31, a driving source 32, a central axis 33 and a material tray 34, the linear module 31 is arranged at the top of the outer side of the reaction chamber 11, the driving source 32 is connected to the slide seat of the linear module 31, the central axis 33 penetrates into the reaction chamber 11 from the top, the output end of the driving source 32 is connected to the central axis 33, one end of the central axis 33 inside the reaction chamber 11 is connected to the material tray 34, and slide grooves 341 are arranged on both sides of the bottom of the material tray 34, and a substrate 342 is clamped between the slide grooves 341.

[0032] Specifically, the entire reaction chamber 11 is arranged on the workbench 1, and a vacuum generator 12 is arranged on one side of the reaction chamber 11. The vacuum generator 12 is connected to the inside of the reaction chamber 11 to ensure that the inside is in a vacuum environment during use. The entire sputtering assembly 2 is arranged at a position close to the bottom of the reaction chamber 11. As a preferred embodiment of the present invention, the sputtering assembly 2 is provided with three groups. The three groups of sputtering targets 21 can be sputtered from multiple directions through the adjustment assembly at the bottom, thereby improving the coating rate and coating quality. The first flexible tube 23 is arranged at the bottom of the sputtering target 21 to facilitate the adjustment of the angle of the sputtering target 21. Secondly, the inside of the first flexible tube 23 is used to install the anode. The coating assembly 3 is arranged at the top of the reaction chamber 11, wherein the material tray 34 is used to install the substrate 342. Specifically, the two sides of the material tray 34 are provided with slide grooves 341, which can facilitate the substrate 342 to be inserted into the material tray 34 so that the substrate 342 faces the sputtering target 21 at the bottom. As a preferred solution of the utility model, the central axis 33 is connected to the material tray 34, the output axis of the driving source 32 is connected to the central axis 33, the driving source 32 rotates to drive the material tray 34 to rotate, and in the actual operation process, the uniformity of the coating can be ensured by rotating the material tray 34, and the rotation speed of the driving source 32 can also be controlled, further improving the uniformity of the film formed on the substrate 342. In addition, the linear module 31 drives the driving source 32 to rise and fall, and then drives the material tray 34 to rise and fall, and the coating distance can be adjusted in the actual use process, and different coating distances can obtain films with different properties.

[0033] The utility model can satisfy the coating of substrate 342 at different heights and different rotation speeds through the lifting mechanism and the rotating mechanism, and then the coating is carried out through multiple groups of sputtering targets 21 at different angles at the bottom, so as to ensure the uniformity of the coating and improve the quality of the coating. The utility model integrates the sputtering assembly 2 and the coating assembly 3 in the reaction chamber 11, which greatly improves the integration of the equipment, reduces the volume and weight of the equipment, and makes the equipment more portable.

[0034] Furthermore, the sputtering assembly 2 also includes a first baffle 24 and a guide portion, the first baffle 24 is arranged at the end of the sputtering target 21, the guide portion is arranged on one side of the sputtering target 21, the guide portion includes a guide rod 25, a universal joint 26 and a swing cylinder 27, the swing cylinder 27 is arranged at the bottom of the outer side of the reaction chamber 11, the output end of the swing cylinder 27 is connected to the universal joint 26, the universal joint 26 is arranged at the bottom inside the reaction chamber 11, the other end of the universal joint 26 is connected to the guide rod 25, and the guide rod 25 is connected to the first baffle 24.

[0035] Specifically, the first baffle 24 is arranged at the end of the sputtering target 21 to shield the sputtered ions, and the baffle is removed after all the impurities are sputtered. The swing cylinder 27 at the bottom drives the universal joint 26 to adjust the direction, thereby driving the baffle to move.

[0036] Furthermore, a limit block 28 is sleeved on the guide rod 25 , and the limit block 28 abuts against the sputtering target 21 to limit the movement of the guide rod 25 and stabilize the first baffle 24 at the end of the sputtering target 21 .

[0037] Furthermore, the adjustment frame 22 includes a first adjustment plate and a second adjustment plate, the first adjustment plate and the second adjustment plate are hinged, and the other end of the first adjustment plate is connected to the sputtering target 21 , and one end of the second adjustment plate is connected to the reaction chamber 11 .

[0038] Specifically, the first adjustment plate is fixedly connected to the sputtering target 21 , the second adjustment plate is fixedly connected to the bottom of the reaction chamber 11 , and the first adjustment plate is hinged to the second adjustment plate, thereby achieving adjustment of the angle of the sputtering target 21 .

[0039] Furthermore, a second baffle 38 is disposed between the sputtering assembly 2 and the coating assembly 3 , and the second baffle 38 is connected to a rotating shaft 37 , and the other end of the rotating shaft 37 passes through the reaction chamber 11 and is connected to a rotating cylinder 36 .

[0040] Specifically, the rotating cylinder 36 drives the second baffle 38 to rotate, and the second baffle 38 is used to shield the substrate, reduce the magnetron sputtering space occupied by the substrate 342 when the baffle is opened, reduce the magnetron sputtering radius, and improve the coating efficiency.

[0041] Furthermore, a second flexible tube 35 is sleeved on the outer side of the central shaft 33 , and the second flexible tube 35 is arranged between the driving source 32 and the reaction chamber 11 .

[0042] Specifically, the second flexible tube 35 can facilitate the lifting and lowering of the central axis 33. As a preferred solution of the present utility model, the first flexible tube 23 and the second flexible tube 35 are both corrugated tubes, which facilitate the adjustment of telescopic and rotational movements.

[0043] Furthermore, a heating cover 39 is provided on the outer side of one end of the central axis 33 close to the material tray 34, and a mercury lamp 391 is provided inside the heating cover 39. Specifically, the utility model can meet the regulation of different temperatures, and can adjust the temperature of the substrate 342 according to actual needs, thereby optimizing the performance of the film.

[0044] Furthermore, an air inlet valve 18 is provided at the bottom of the reaction chamber 11, and the other end of the air inlet valve 18 is connected to an inert gas. Specifically, oxygen and nitrogen can be introduced as protective gases to ensure the quality of the coating.

[0045] Furthermore, guide rails 13 are provided on both sides of the opening of the reaction chamber 11, connecting plates 14 are provided between the guide rails 13, a door panel 15 is provided on the side of the connecting plate 14 close to the opening, a sealing cylinder 16 is provided on the connecting plate 14, and the sealing cylinder 16 is connected to the door panel 15.

[0046] Specifically, the connecting plate 14 slides between the two guide rails 13, driving the door panel 15 to reciprocate at the opening of the reaction chamber 11. After the door panel 15 is closed, the sealing cylinder 16 is actuated to press the door panel 15 against the opening of the reaction chamber 11 to ensure the sealing of the entire chamber interior.

[0047] Furthermore, a viewing window 17 is provided on the surface of the door panel 15 , and during the coating process, the internal conditions of the reaction chamber 11 can be observed through the viewing window 17 .

[0048] In summary, the utility model introduces an integrated magnetron sputtering device. In the utility model, the coating of substrates 342 at different heights and different rotation speeds can be satisfied through the lifting mechanism and the rotating mechanism. Secondly, the coating is carried out through multiple groups of sputtering targets 21 at different angles at the bottom to ensure the uniformity of the coating and improve the quality of the coating. The utility model integrates the sputtering component 2 and the coating component 3 in the reaction chamber 11, which has a simple structure and is easy to operate, greatly improving the integration of the equipment, reducing the volume and weight of the equipment, and making the equipment more portable.

[0049] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. An integrated magnetron sputtering device, characterized in that: include: A workbench, wherein a reaction chamber is disposed on the workbench, and a vacuum generator is connected to one side of the reaction chamber; A sputtering assembly, wherein the sputtering assembly is arranged in the reaction chamber; the sputtering assembly comprises a sputtering target, an adjustment frame and a first flexible tube; the adjustment frame is arranged on both sides of the bottom of the sputtering target, the adjustment frame is arranged at the bottom of the reaction chamber, and the two ends of the first flexible tube are connected to the sputtering target and the outside of the reaction chamber; A coating component, wherein the coating component is arranged opposite to the sputtering component; the coating component comprises a linear module, a driving source, a central axis and a material tray, wherein the linear module is arranged at the top of the outer side of the reaction chamber, the driving source is connected to the slide seat of the linear module, the central axis penetrates into the reaction chamber from the top, the output end of the driving source is connected to the central axis, one end of the central axis inside the reaction chamber is connected to the material tray, and slide grooves are arranged on both sides of the bottom of the material tray, and a substrate is clamped between the slide grooves.

2. The integrated magnetron sputtering device according to claim 1, characterized in that: The sputtering assembly also includes a first baffle and a guide portion, wherein the first baffle is arranged at the end of the sputtering target, the guide portion is arranged on one side of the sputtering target, the guide portion includes a guide rod, a universal joint and a swing cylinder, the swing cylinder is arranged at the bottom outside the reaction chamber, the output end of the swing cylinder is connected to the universal joint, the universal joint is arranged at the bottom inside the reaction chamber, the other end of the universal joint is connected to the guide rod, and the guide rod is connected to the first baffle.

3. The integrated magnetron sputtering device according to claim 2, characterized in that: A limit block is sleeved on the guide rod, and the limit block abuts against the sputtering target.

4. The integrated magnetron sputtering device according to claim 1, characterized in that: The adjustment frame includes a first adjustment plate and a second adjustment plate, the first adjustment plate and the second adjustment plate are hinged, and the other end of the first adjustment plate is connected to the sputtering target, and one end of the second adjustment plate is connected to the reaction chamber.

5. The integrated magnetron sputtering device according to claim 1, characterized in that: A second baffle is arranged between the sputtering assembly and the coating assembly, the second baffle is connected to a rotating shaft, and the other end of the rotating shaft passes through the reaction chamber and is connected to a rotating cylinder.

6. The integrated magnetron sputtering device according to claim 1, characterized in that: A second flexible tube is sleeved on the outer side of the central axis, and the second flexible tube is arranged between the driving source and the reaction chamber.

7. The integrated magnetron sputtering device according to claim 1, characterized in that: A heating cover is sleeved on the outer side of one end of the central axis close to the material tray, and a mercury lamp is arranged inside the heating cover.

8. The integrated magnetron sputtering device according to claim 1, characterized in that: An air inlet valve is arranged at the bottom of the reaction chamber, and the other end of the air inlet valve is connected to an inert gas.

9. The integrated magnetron sputtering device according to claim 1, characterized in that: Guide rails are arranged on both sides of the opening of the reaction chamber, a connecting plate is arranged between the guide rails, a door plate is arranged on the side of the connecting plate close to the opening of the reaction chamber, a sealing cylinder is arranged on the connecting plate, and the sealing cylinder is connected to the door plate.

10. The integrated magnetron sputtering device according to claim 9, characterized in that: A window is arranged on the surface of the door panel.

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