High-speed optical detector

Abstract

The utility model discloses a high-speed optical detector, which comprises a shell and a partition plate arranged in the shell, the partition plate divides the shell into an optical path cavity and a circuit cavity, the optical path cavity and the circuit cavity are communicated through a coupling channel, the optical path cavity is externally connected with an optical fiber, and the optical fiber outputs an optical signal to the coupling channel. According to the utility model, by arranging the optical path cavity and the circuit cavity, the optical path and the circuit are respectively designed in the two independent cavities and are interconnected through the coupling channel, so that optical signals and electric signals are ensured to be transmitted and processed in relatively independent spaces, and the best signal integrity is realized; and the whole module can obtain the maximum signal transmission bandwidth.

Description

Technical Field

[0001] The utility model belongs to the technical field of photoelectric detectors, and in particular relates to a high-speed photodetector. Background Art

[0002] The existing high-speed photodetector includes a shell, a reflector arranged in the shell, a co-package structure and a photoelectric conversion chip. After the light signal enters the high-speed photodetector, it is reflected by the reflector to the co-package module for photoelectric conversion, and the converted electrical signal is led out of the device through the photoelectric conversion chip. Among them, the co-package module includes a lens and a photoelectric conversion chip stacked from top to bottom, and the lens is used to convert the received light beam into a parallel light beam. In this device, the circuit design and the optical path design are in the same cavity, and the co-package structure used is difficult to design and has a high cost. In addition, the coupling distance between the co-package structure and the substrate is large, and the signal bandwidth of the photoelectric module is limited.

[0003] Therefore, how to solve the deficiencies in the above-mentioned prior art has become a topic to be studied and solved in this application. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a high-speed optical detector.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A high-speed optical detector comprises a housing and a partition disposed in the housing, wherein the partition cooperates with the housing to form an optical path cavity and a circuit cavity that are independently disposed, and the optical path cavity is connected to an optical fiber;

[0007] A photoelectric conversion component, the photoelectric conversion component includes an optical lens, a photoelectric conversion chip and an electrical signal lead-out chip, at least part of the optical lens is embedded in the partition, the photoelectric conversion chip and the electrical signal lead-out chip are arranged in the circuit cavity, at least part of the projection of the optical lens along its thickness direction is located on the optical conversion chip, the optical signal transmitted by the optical fiber passes through the optical path cavity and the optical lens and is projected onto the photoelectric conversion chip to perform photoelectric conversion to obtain an electrical signal, and the input end of the electrical signal lead-out chip is electrically connected to the output end of the photoelectric conversion chip to output the received electrical signal to the outside.

[0008] Furthermore, the photoelectric conversion component includes a reflector, which is arranged in the optical path cavity, and the reflector projects the received light signal to the optical lens.

[0009] Furthermore, it also includes a coupling channel, wherein the optical lens is embedded in the coupling channel;

[0010] The coupling channel includes a first coupling channel and a second coupling channel, the first coupling channel is opened on the partition; a circuit board is arranged in the circuit cavity and is fitted with the partition, the second coupling channel is opened on the circuit board, the first coupling channel is connected to the second coupling channel, and the end of the second coupling channel away from the first coupling channel is connected to the photoelectric conversion chip.

[0011] Furthermore, the cross-sections of the first coupling channel and the second coupling channel are both waist-shaped cross-sections; and the cross-section size of the second coupling channel is smaller than the cross-section size of the first coupling channel.

[0012] Furthermore, the photoelectric conversion chip and the electrical signal lead-out chip are both arranged on a surface of the circuit board on a side away from the partition.

[0013] Furthermore, a fixing piece is provided in the optical path cavity, the reflector is mounted on the fixing piece, a light channel is opened in the fixing piece in the horizontal direction, one end of the light channel faces the reflector, and the other end is connected to the optical fiber.

[0014] Furthermore, an optical path interface is provided on the optical path cavity, and the optical fiber extends into the optical path cavity from the optical path interface;

[0015] The circuit cavity is provided with a circuit interface, and the electrical signal lead-out chip is electrically connected to an external electrical signal receiving device via the circuit interface.

[0016] Furthermore, a plurality of wires extend from the circuit cavity, and each of the wires is externally connected to a low-frequency connector.

[0017] Furthermore, the optical path cavity is located at an upper portion of the circuit cavity, and the first coupling channel and the second coupling channel are opened in a vertical direction.

[0018] Furthermore, a sealing metal cover plate is installed at the bottom of the shell, and the circuit board is not in contact with the sealing metal cover plate.

[0019] Compared with the prior art, the utility model has the advantage that, by setting the optical path cavity and the circuit cavity, the optical path and the circuit are designed in two independent cavities respectively, and are interconnected through the coupling channel, which not only ensures that the optical signal and the electrical signal are transmitted and processed in relatively independent spaces, but also achieves the best signal integrity, so that the entire module can obtain the maximum signal transmission bandwidth. At the same time, the utility model is not limited to differential high-speed optical detectors, but is also applicable to single-end, multi-end high-speed optical detectors and optical detectors of different rates. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the structure of an embodiment of the utility model;

[0022] Figure 2 It is a schematic diagram of an exploded view of an embodiment of the utility model;

[0023] Figure 3 This is a light path diagram of an embodiment of the utility model;

[0024] Figure 4 This is a schematic diagram of a cross-sectional view of the optical path cavity of the utility model;

[0025] Figure 5 This is a schematic diagram of a cross-sectional view of a circuit cavity of the utility model;

[0026] Figure 6 This is a schematic diagram of the structure of the photoelectric conversion chip of the utility model;

[0027] Figure 7 for Figure 6 Enlarged view of point A in the middle.

[0028] Description of reference numerals and components in the drawings:

[0029] 1. Shell; 2. Optical path cavity; 21. Fixing piece; 22. Light channel; 23. Reflector; 24. Optical path interface; 3. Circuit cavity; 31. Circuit interface; 32. Wire; 4. Partition; 5. Coupling channel; 51. First coupling channel; 52. Second coupling channel; 7. Photoelectric conversion chip; 8. Electrical signal lead-out chip; 9. Circuit board. DETAILED DESCRIPTION

[0030] The technical solution of the utility model will be clearly and completely described below through specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] See attached Figures 1 to 7As shown, a high-speed optical detector of the present application includes a shell 1 with a certain thickness and a hollow structure inside. The shell 1 is rectangular, and a partition 4 is arranged inside the shell 1. The partition 4 divides the shell 1 into two parts, namely, an optical path cavity 2 and a circuit cavity 3. The optical path cavity 2 is arranged above the circuit cavity 3. Both are independently arranged, so that the optical signal is processed in the optical path cavity 2, and the electrical signal is processed in the circuit cavity 3. At the same time, the optical path cavity 2 and the circuit cavity 3 are connected through a coupling channel 5. The optical path cavity 2 is externally connected to the optical fiber, and the optical fiber outputs the optical signal to the coupling channel 5, which not only ensures that the optical signal and the electrical signal are transmitted and processed in a relatively independent space, but also achieves the best signal integrity, so that the entire module can obtain the maximum signal transmission bandwidth. A photoelectric conversion component is provided in the housing 1, and the photoelectric conversion component includes an optical lens (not shown in the figure), a photoelectric conversion chip 7, an electrical signal lead-out chip 8 and a reflector 23. The optical lens is arranged in the coupling channel 5, and at least part of the optical lens is embedded in the partition 4. The photoelectric conversion chip 7 and the electrical signal lead-out chip 8 are arranged in the circuit cavity 3. The photoelectric conversion chip 7 faces the coupling channel 5. The optical signal is projected onto the photoelectric conversion chip 7 through the optical lens. The photoelectric conversion chip 7 converts the optical signal into an electrical signal. The input end of the electrical signal lead-out chip 8 is electrically connected to the output end of the photoelectric conversion chip 7 for outputting the received electrical signal to the outside.

[0032] Among them, a fixing part 21 is arranged inside the optical path cavity 2, and the fixing part 21 is fixed on the cavity bottom plate of the optical path cavity 2. A light channel 22 is opened inside the fixing part 21 along the horizontal direction. One end of the light channel 22 is externally connected to the optical fiber, and a reflector 23 is arranged on the other end along the light propagation path. The optical signal output by the optical fiber is projected onto the reflector 23 through the light channel 22, and the optical signal is reflected into the coupling channel 5 through the reflector 23. The coupling channel 5 includes a first coupling channel 51 and a second coupling channel 52. The first coupling channel 51 is opened on the partition 4 along the vertical direction. A circuit board 9 is arranged in the circuit cavity 3 and is fitted with the partition 4. The second coupling channel 51 is opened on the circuit board 9. The first coupling channel 51 is connected with the second coupling channel 52, and one end of the second coupling channel 52 away from the first coupling channel 51 is connected to the photoelectric conversion chip 7. And the optical lens is embedded in at least one of the first coupling channel 51 and the second coupling channel 52. The photoelectric conversion chip 7 preferably adopts a back-illuminated photodetector (PD) chip, with its light-receiving surface facing the second coupling channel 52 and its electrical signal surface facing the electrical signal lead-out chip 8. The electrical signal lead-out chip 8 is provided with a cross-group amplifier, which realizes signal amplification. The transimpedance amplifier can amplify the weak input current signal to a higher voltage level to increase the amplitude and sensitivity of the signal. By appropriately selecting the value of the feedback resistor, different multiples of signal amplification can be achieved.

[0033] As an practicable manner, the positional relationship between the projecting and projected reflector 23, the first coupling channel 51, the second coupling channel 52 and the optical lens satisfies the object-image relationship of the optical system.

[0034] For better, see the attached Figures 1 to 7 As shown, the coupling channel 5 is provided with a photoelectric conversion chip 7 along the light propagation path, and the optical signal is projected onto the photoelectric conversion chip 7. The photoelectric conversion chip 7 and the electrical signal lead-out chip 8 are located in the circuit board 9. A circuit interface 31 is provided on the circuit cavity 3, and the electrical signal lead-out chip 8 is electrically connected to the external electrical signal receiving device through the circuit interface 31. As an implementable method, the present application makes full use of the characteristics that the light-receiving surface and the electrical signal surface of the back-illuminated photodetector (PD) chip are respectively located on the top and bottom surfaces of the photoelectric conversion chip 7, and couples the light-receiving surface of the PD chip located in the circuit cavity 3 with the optical path cavity 2 through the micro-coupling channel 5 on the cavity structure for optical signal, so that the sealing requirements of the optical path cavity 2 can be ensured, and the requirements of the circuit cavity 3 for the compact spacing between the PD and the transimpedance amplifier (TIA) to reduce parasitic parameters can be met. At the same time, the design of the micro-coupling channel 5 between the optical path cavity 2 and the circuit cavity 3 not only meets the requirements of optical signal coupling, but also avoids the problem that the coupling channel may be blocked due to processing errors.

[0035] For better, see the attached Figure 3 As shown, in this embodiment, the cross-sections of the first coupling channel 51 and the second coupling channel 52 are both waist-shaped cross-sections, and the cross-section size of the second coupling channel 52 is smaller than that of the first coupling channel 51, so as to adapt to photoelectric conversion chips of different sizes.

[0036] For better, see the attached Figures 1 to 5 As shown, in this embodiment, a plurality of wires 32 extend from the circuit cavity 3, and each wire 32 is externally connected to a low-frequency connector for power supply and control signals.

[0037] For better, see the attached Figures 1-2 As shown, in this embodiment, a sealed metal cover is installed at the bottom of the housing 1 to prevent moisture and dust, and the circuit board 9 does not contact the sealed metal cover.

[0038] The above description of the disclosed embodiments enables professionals in the field to implement or use the utility model. Various modifications to these embodiments will be apparent to professionals in the field, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features disclosed herein.

Claims

1. A high-speed optical detector, characterized in that: It comprises a shell and a partition plate arranged in the shell, wherein the partition plate cooperates with the shell to form an independently arranged optical path cavity and circuit cavity, and the optical path cavity is connected to the optical fiber; A photoelectric conversion component, the photoelectric conversion component includes an optical lens, a photoelectric conversion chip and an electrical signal lead-out chip, at least part of the optical lens is embedded in the partition, the photoelectric conversion chip and the electrical signal lead-out chip are arranged in the circuit cavity, at least part of the projection of the optical lens along its thickness direction is located on the photoelectric conversion chip, the optical signal transmitted by the optical fiber passes through the optical path cavity and the optical lens and is projected onto the photoelectric conversion chip to perform photoelectric conversion to obtain an electrical signal, and the input end of the electrical signal lead-out chip is electrically connected to the output end of the photoelectric conversion chip to output the received electrical signal to the outside.

2. A high-speed optical detector according to claim 1, characterized in that: The photoelectric conversion component includes a reflector, which is arranged in the optical path cavity and projects the received optical signal to the optical lens.

3. A high-speed optical detector according to claim 1, characterized in that: It also includes a coupling channel, wherein the optical lens is embedded in the coupling channel; The coupling channel includes a first coupling channel and a second coupling channel, the first coupling channel is opened on the partition; a circuit board is arranged in the circuit cavity and is fitted with the partition, the second coupling channel is opened on the circuit board, the first coupling channel is connected to the second coupling channel, and the end of the second coupling channel away from the first coupling channel is connected to the photoelectric conversion chip.

4. A high-speed optical detector according to claim 3, characterized in that: The cross sections of the first coupling channel and the second coupling channel are both waist-shaped cross sections; the cross section size of the second coupling channel is smaller than the cross section size of the first coupling channel.

5. A high-speed optical detector according to claim 3, characterized in that: The photoelectric conversion chip and the electrical signal lead-out chip are both arranged on a surface of the circuit board on one side away from the partition.

6. A high-speed optical detector according to claim 2, characterized in that: A fixing piece is arranged in the optical path cavity, the reflecting mirror is mounted on the fixing piece, a light channel is opened in the fixing piece along the horizontal direction, one end of the light channel faces the reflecting mirror, and the other end is connected to the optical fiber.

7. A high-speed optical detector according to claim 1, characterized in that: An optical path interface is provided on the optical path cavity, and the optical fiber extends into the optical path cavity from the optical path interface; The circuit cavity is provided with a circuit interface, and the electrical signal lead-out chip is electrically connected to an external electrical signal receiving device via the circuit interface.

8. A high-speed optical detector according to claim 1, characterized in that: A plurality of conducting wires extend from the circuit cavity, and each of the conducting wires is externally connected to a low-frequency connector.

9. A high-speed optical detector according to claim 3, characterized in that: The optical path cavity is located at the upper part of the circuit cavity, and the first coupling channel and the second coupling channel are opened along the vertical direction.

10. A high-speed optical detector according to claim 3, characterized in that: A sealing metal cover plate is installed at the bottom of the shell, and the circuit board is not in contact with the sealing metal cover plate.

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