Semiconductor packaging module

Abstract

The utility model discloses a semiconductor packaging module which comprises a substrate, one side of the top of the substrate is fixedly connected with a clamping plate, when the semiconductor packaging module is used, when a user carries out semiconductor packaging, the positions of an air cylinder and a moving plate are adjusted through a ruler, then the moving plate is fixed through a screw rod, and the clamping plate is fixedly connected with the clamping plate. Then the semiconductor is placed in an inner groove of a clamping plate, an air cylinder is started, a fixing plate and a clamping block are pushed forwards, the top end of the clamping block makes contact with one side of the semiconductor, the semiconductor is fixed in the inner groove of the clamping plate, and a buffer spring can effectively prevent the semiconductor from being damaged due to the fact that the clamping force of the clamping block is too large; when different semiconductors need to be replaced for packaging, the screw rod is screwed out in a threaded mode, the positions of the air cylinder and the movable plate are adjusted again, then the semiconductors are packaged, the different semiconductors are effectively and conveniently clamped, operation of a user is facilitated, the adjusting time is saved, and the packaging efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a semiconductor packaging module. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the front-end process of the wafer are cut into small chips through the dicing process, and then the cut chips are glued to the small islands of the corresponding substrate (lead frame) frame, and then ultra-fine metal (gold, tin, copper, and aluminum) wires or conductive resins are used to connect the bonding pads of the chips to the corresponding pins of the substrate to form the required circuit, and then the independent chips are packaged and protected with a plastic shell. After the plastic packaging, a series of operations are required. After the packaging is completed, the finished product is tested, usually after inspection, testing, and packaging, and finally put into storage for shipment.

[0003] Some existing semiconductor packaging modules cannot clamp semiconductors of different sizes for fixed packaging during packaging. When users fix and package semiconductors of different sizes, they need to adjust the clamps one by one, which is inconvenient for users to package and also increases the packaging time of users, reducing work efficiency. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the existing defects and provide a semiconductor packaging module to solve the problem that some existing semiconductor packaging modules mentioned in the above background technology cannot clamp semiconductors of different sizes for fixed packaging during packaging. When users fix the packaging of semiconductors of different sizes, the users need to adjust the clamps one by one, which is inconvenient for the users to package and also increases the packaging time of the users, reducing the work efficiency.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor packaging module, comprising a substrate, a clamping plate fixedly connected to one side of the top of the substrate, a clamping block slidably connected to the inner side of the clamping plate, a plurality of clamping blocks symmetrically arranged, a fixed plate fixedly connected to one side of the clamping block, a cylinder fixedly connected to one side of the fixed plate, a substrate slidably connected to the bottom of the cylinder, a movable plate fixedly connected to one side of the cylinder, two movable plates symmetrically arranged, a screw movably connected to the inner side of the movable plate, and the outer side of the bottom of the screw threadedly connected to the substrate.

[0006] Preferably, a ruler is movably connected to one side of the movable plate, a base plate is fixedly connected to the outer side of the ruler, and a fixed plate is movably connected to the top of the ruler.

[0007] Preferably, a fixed block is fixedly connected to one side of the top of the base plate, and two fixed blocks are symmetrically arranged. A sliding column is fixedly connected to one side of each fixed block, a fixed plate is movably connected to the outer side of the sliding column, a buffer spring is movably connected to one side of the fixed plate, a sliding column is movably connected to the inner side of the buffer spring, and a clamping plate is fixedly connected to one side of the sliding column.

[0008] Preferably, a gasket is movably connected to the outer side of one end of the screw rod, and a movable plate is movably connected to the bottom of the gasket.

[0009] Preferably, a protection pad is fixedly connected to one side of the clamping block, and a plurality of the protection pads are symmetrically arranged, and one side of a part of the protection pads is fixedly connected to a clamping plate.

[0010] Preferably, a slider is fixedly connected to the bottom of the fixed plate, two sliders are symmetrically arranged, and the outer sides of the sliders are slidably connected to a base plate.

[0011] Preferably, the outer surface of the screw is provided with an anti-oxidation coating.

[0012] Compared with the prior art, the present invention provides a semiconductor packaging module, which has the following beneficial effects:

[0013] 1. The utility model is provided with a clamping block, a fixing plate and a cylinder. The outer side of the clamping block is slidably connected with the clamping plate, one side of the clamping block is fixedly connected with the fixing plate, and one side of the fixing plate is fixedly connected with the cylinder. When the user is packaging the semiconductor, the semiconductor is placed in the inner groove of the clamping plate, and then the cylinder is started to push the fixing plate and the clamping block forward, so that the top of the clamping block contacts one side of the semiconductor, and the semiconductor is fixed in the inner groove of the clamping plate. When it is necessary to replace a different semiconductor for packaging, the screw thread is rotated out, and by adjusting the position of the moving plate and the cylinder, different semiconductors can be clamped effectively and conveniently, which is convenient for the user to operate, saves the adjustment time, and increases the packaging efficiency.

[0014] 2. The utility model provides a protective pad, one side of the clamping block is fixedly connected with the protective pad, and one side of a part of the protective pad is fixedly connected with the clamping plate, which effectively prevents the semiconductor from being worn during packaging;

[0015] 3. The utility model provides a slider, and a base plate is slidably connected to the outer side of the slider, which effectively prevents the position of the fixed plate from moving when the cylinder pushes the fixed plate.

[0016] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The utility model has a scientific and reasonable structure, is safe and convenient to use, and provides great help to people. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 This is a schematic diagram of the isometric structure of a semiconductor packaging module proposed by the utility model;

[0019] Figure 2 This is a schematic diagram of the exploded structure of a semiconductor packaging module proposed by the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of one side of a semiconductor packaging module proposed by the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the other side of a semiconductor packaging module proposed by the utility model;

[0022] In the figure: base plate 1, clamping plate 2, clamping block 3, fixed plate 4, cylinder 5, movable plate 6, screw 7, gasket 8, ruler 9, fixed block 10, sliding column 11, buffer spring 12, slider 13, protection pad 14. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-4The utility model provides a technical solution: a semiconductor packaging module, including a substrate 1, a clamping plate 2 is fixedly connected to one side of the top of the substrate 1, a clamping block 3 is slidably connected to the inner side of the clamping plate 2, a plurality of clamping blocks 3 are symmetrically arranged, a fixed plate 4 is fixedly connected to one side of the clamping block 3, a cylinder 5 is fixedly connected to one side of the fixed plate 4, the substrate 1 is slidably connected to the bottom of the cylinder 5, a moving plate 6 is fixedly connected to one side of the cylinder 5, two moving plates 6 are symmetrically arranged, a screw rod 7 is movably connected to the inner side of the moving plate 6, and the outer side of the bottom of the screw rod 7 is threadedly connected to the bottom of the screw rod 7. A substrate 1 is connected. When the user is packaging the semiconductor, the semiconductor is placed in the inner groove of the clamping plate 2, and then the cylinder 5 is started to push the fixed plate 4 and the clamping block 3 forward, so that the top of the clamping block 3 contacts one side of the semiconductor and fixes the semiconductor in the inner groove of the clamping plate 2. When a different semiconductor needs to be replaced for packaging, the screw 7 is rotated out. By adjusting the position of the moving plate 6 and the cylinder 5, different semiconductors can be clamped effectively and conveniently, which is convenient for the user to operate, saves adjustment time, and increases packaging efficiency.

[0025] In the utility model, preferably, a ruler 9 is movably connected to one side of the movable plate 6, a substrate 1 is fixedly connected to the outside of the ruler 9, and a fixed plate 4 is movably connected to the top of the ruler 9, which effectively facilitates users to adjust the movable plate 6 through the ruler 9, so that users can adjust the appropriate distance to fix semiconductors of different sizes.

[0026] In the utility model, preferably, one side of the top of the base plate 1 is fixedly connected with a fixed block 10, two fixed blocks 10 are symmetrically arranged, one side of the fixed block 10 is fixedly connected with a sliding column 11, the outer side of the sliding column 11 is movably connected with a fixed plate 4, one side of the fixed plate 4 is movably connected with a buffer spring 12, the inner side of the buffer spring 12 is movably connected with the sliding column 11, and one side of the sliding column 11 is fixedly connected with a clamping plate 2, which effectively prevents the clamping force of the fixed plate 4 from being too large, and at the same time effectively prevents the clamping block 3 from being offset during clamping.

[0027] In the present invention, preferably, the outer side of one end of the screw rod 7 is movably connected with a gasket 8, and the bottom of the gasket 8 is movably connected with a movable plate 6, which effectively increases the stability of the screw rod 7 and prevents the screw rod 7 from loosening.

[0028] In the utility model, preferably, a protective pad 14 is fixedly connected to one side of the clamping block 3, and a plurality of protective pads 14 are symmetrically arranged, wherein one side of a part of the protective pads 14 is fixedly connected to the clamping plate 2, which effectively prevents the semiconductor from being worn during packaging.

[0029] In the utility model, preferably, a slider 13 is fixedly connected to the bottom of the fixed plate 4, two sliders 13 are symmetrically arranged, and the outer sides of the sliders 13 are slidably connected to the base plate 1, which effectively limits the fixed plate 4 to prevent deviation.

[0030] In the present invention, preferably, the outer surface of the screw 7 is provided with an anti-oxidation coating, which effectively increases the anti-oxidation ability of the screw 7 and prevents the screw 7 from oxidation and rusting.

[0031] The working principle and use process of the utility model are as follows: when using the utility model, when the user is performing semiconductor packaging, first adjust the position of the cylinder 5 and the movable plate 6 by the ruler 9, and then fix the movable plate 6 by the screw 7, and then put the semiconductor into the inner groove of the clamping plate 2, start the cylinder 5, push the fixed plate 4 and the clamping block 3 forward, let the top of the clamping block 3 contact one side of the semiconductor, and fix the semiconductor in the inner groove of the clamping plate 2, wherein the buffer spring 12 can effectively prevent the clamping force of the clamping block 3 from being too large, causing damage to the semiconductor. When it is necessary to replace a different semiconductor for packaging, the screw 7 is threaded out, the position of the cylinder 5 and the movable plate 6 is readjusted, and then the semiconductor packaging is performed, which effectively and conveniently clamps different semiconductors, is convenient for the user to operate, saves adjustment time, and increases the packaging efficiency.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging module, comprising a substrate (1), characterized in that: A clamping plate (2) is fixedly connected to one side of the top of the base plate (1), a clamping block (3) is slidably connected to the inner side of the clamping plate (2), a plurality of the clamping blocks (3) are symmetrically arranged, a fixed plate (4) is fixedly connected to one side of the clamping block (3), a cylinder (5) is fixedly connected to one side of the fixed plate (4), the base plate (1) is slidably connected to the bottom of the cylinder (5), a movable plate (6) is fixedly connected to one side of the cylinder (5), two movable plates (6) are symmetrically arranged, a screw rod (7) is movably connected to the inner side of each movable plate (6), and the outer side of the bottom of the screw rod (7) is threadedly connected to the base plate (1).

2. A semiconductor packaging module according to claim 1, characterized in that: A scale (9) is movably connected to one side of the movable plate (6), a base plate (1) is fixedly connected to the outside of the scale (9), and a fixed plate (4) is movably connected to the top of the scale (9).

3. The semiconductor packaging module according to claim 1, characterized in that: A fixed block (10) is fixedly connected to one side of the top of the base plate (1), and two fixed blocks (10) are symmetrically arranged. A sliding column (11) is fixedly connected to one side of each of the fixed blocks (10). A fixed plate (4) is movably connected to the outside of the sliding column (11), and a buffer spring (12) is movably connected to one side of the fixed plate (4). The sliding column (11) is movably connected to the inside of the buffer spring (12), and a clamping plate (2) is fixedly connected to one side of the sliding column (11).

4. The semiconductor packaging module according to claim 1, characterized in that: The outer side of one end of the screw rod (7) is movably connected to a gasket (8), and the bottom of the gasket (8) is movably connected to a movable plate (6).

5. The semiconductor packaging module according to claim 1, characterized in that: A protection pad (14) is fixedly connected to one side of the clamping block (3), and a plurality of the protection pads (14) are symmetrically arranged, with one side of a portion of the protection pads (14) being fixedly connected to a clamping plate (2).

6. The semiconductor packaging module according to claim 1, characterized in that: The bottom of the fixed plate (4) is fixedly connected to a sliding block (13), two sliding blocks (13) are symmetrically arranged, and the outer sides of the sliding blocks (13) are both slidably connected to a base plate (1).

7. The semiconductor packaging module according to claim 1, characterized in that: The outer surface of the screw (7) is provided with an anti-oxidation coating.

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