Semiconductor packaging structure

Abstract

The utility model discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a packaging body, a heat dissipation piece, a pin and a base pin, the packaging body is used for packaging a chip, the heat dissipation piece is arranged on one side of the packaging body, at least one side of the heat dissipation piece protrudes out of the edge of the packaging body in the first direction, the pins are led out of the packaging body, and the pins and the heat dissipation piece are separately arranged outside the packaging body. The pins are led out of the packaging body and are located on the opposite sides of the pins. The parts, located outside the packaging body, of the heat dissipation piece and the pins are not connected, the heat dissipation piece and the pins can dissipate heat independently in different areas, and heat concentration is avoided. At least part of the heat dissipation piece extends to the area away from the packaging body, and the heat dissipation efficiency of the heat dissipation piece on the packaging body is improved. The pins are led out from the packaging body, so that the heights of the pins are reduced, and the reliability and stability of the semiconductor packaging structure are enhanced. After the heat dissipation piece is separated from the pins, the pins cannot transmit acting force to the heat dissipation piece after being stressed, and the influence on the heat dissipation piece after the pins are stressed is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a semiconductor packaging structure. Background Art

[0002] The existing semiconductor packaging structure includes a package body for wrapping the chip, a heat sink mounted on the surface of the package body, pins connected to the heat sink, and pins led out of the package body. After the semiconductor package structure is connected to the substrate, the pins will transfer their own heat to the heat sink when the semiconductor is working, affecting the heat dissipation effect of the heat sink. In addition, after the pins are connected to the substrate, the semiconductor package structure needs to be supported. Since the pins are connected to the heat sink, the height of the pins is relatively high, resulting in poor stability of the semiconductor package structure after being connected to the substrate. In addition, after the pins are subjected to force, the force will be transferred to the heat sink, causing the heat sink to deform or even separate from the package body.

[0003] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0004] The utility model aims to provide a semiconductor packaging structure, which is used to solve the problem that the pin affects the heat dissipation of the heat sink and the pin has poor stability.

[0005] In order to achieve the above-mentioned purpose, a specific embodiment of the utility model provides a semiconductor packaging structure, which includes a packaging body, a heat sink, pins and tube pins. The packaging body is used to package the chip, the heat sink is arranged on one side of the packaging body, and at least one side protrudes from the edge of the packaging body along a first direction, the pins are led out of the packaging body, and the pins and the heat sink are separately arranged outside the packaging body. The tube pins are led out of the packaging body and are located on the opposite side of the pins.

[0006] In one or more embodiments of the present invention, the heat sink includes a main body and a first extension portion that are integrally connected, the main body is disposed on the package body, and the first extension portion extends from an edge of the main body along a first direction and protrudes from the package body.

[0007] In one or more embodiments of the present invention, a length of the main body in the first direction is greater than a length of the first extending portion in the first direction.

[0008] In one or more embodiments of the present invention, a length of the main body portion in the second direction is greater than a length of the first extending portion in the second direction.

[0009] In one or more embodiments of the present invention, the heat sink includes a main body and a second extending portion that are integrally connected, the main body is disposed on the packaging body, and the second extending portion extends from an edge of the main body along a second direction.

[0010] In one or more embodiments of the present invention, the heat dissipation element includes a plurality of second extension portions.

[0011] In one or more embodiments of the present invention, the second extension portions are disposed on two opposite sides of the main body portion.

[0012] In one or more embodiments of the present invention, a length of the main body portion in the first direction is greater than a length of the second extending portion in the first direction.

[0013] In one or more embodiments of the present invention, a length of the main body in the second direction is greater than a length of the second extending portion in the second direction.

[0014] In one or more embodiments of the present invention, the semiconductor package structure includes two pins, and the two pins are arranged on two sides of the first extending portion along the second direction.

[0015] In one or more embodiments of the present invention, the pins are bent in a direction away from the heat sink.

[0016] In one or more embodiments of the present invention, the pins are bent in a direction away from the heat sink.

[0017] In one or more embodiments of the present invention, the pin includes a first segment, a second segment, and a third segment that are integrally connected, the first segment is led out from the package body along a first direction, the second segment is bent from an end of the first segment away from the package body toward a direction away from the heat sink, and the third segment extends from an end of the second segment away from the first segment along a second direction.

[0018] In one or more embodiments of the present invention, a creepage groove is provided on the package body, and the length of the creepage groove in the second direction is equal to the maximum length of the heat sink in the second direction.

[0019] In one or more embodiments of the present utility model, a glue locking hole is provided on the heat sink, and a coupling portion inserted into the glue locking hole is provided on the packaging body.

[0020] Compared with the prior art, the heat sink of the utility model is not connected to the part of the pin outside the package body, and the heat sink and the pin can dissipate heat separately in different areas to avoid heat concentration. The heat sink at least partially extends to an area far away from the package body, which improves the heat transfer efficiency between the heat sink and the surrounding air and the contact area between the heat sink and the package body, and improves the heat dissipation efficiency of the heat sink to the package body.

[0021] Furthermore, the pins are led out from the package body, which can reduce the height of the pins and enhance the reliability and stability of the semiconductor package structure after being mounted on the substrate.

[0022] In addition, after the heat sink and the pins are separated outside the package, the pins will not transfer the force to the heat sink after being subjected to force, thereby avoiding the influence of the heat sink on the pins after being subjected to force. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A three-dimensional structural diagram of a semiconductor packaging structure in an embodiment of the utility model;

[0025] Figure 2 for Figure 1 A partial enlarged view of part A.

[0026] Explanation of main figure marks: 1. Package body, 11. Creepage groove, 12. Joint, 2. Heat sink, 21. Main body, 22. First extension portion, 23. Second extension portion, 24. Glue locking hole, 3. Pin, 31. First segment, 32. Second segment, 33. Third segment, 4. Pin. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0028] In one embodiment, referring to Figure 1 and Figure 2 As shown, the utility model provides a semiconductor packaging structure, which includes a packaging body 1, a heat sink 2, a lead 3 and a pin 4. The packaging body 1 is used to package a chip, and the heat sink 2 is arranged on one side of the packaging body 1, and at least one side protrudes from the edge of the packaging body 1 along a first direction. The first direction is Figure 1The pin 3 and the pin 4 are led out from the package body 1 in opposite directions, that is, the pin 3 and the pin 4 are located at opposite sides of the package body 1, and the pin 3 and the heat sink 1 are separately arranged outside the package body 1, that is, the pin 3 is not connected to the heat sink 1.

[0029] Compared with the traditional semiconductor packaging structure, the heat sink 2 in the above structure is not connected to the portion of the pin 3 located outside the package body 1, and the heat sink 2 and the pin 3 can dissipate heat separately in different areas to avoid heat concentration. Secondly, the heat sink 2 in the above structure at least partially extends to an area far away from the package body 1, which improves the heat transfer efficiency between the heat sink 2 and the surrounding air and the contact area between the heat sink 2 and the package body 1, and further improves the heat dissipation efficiency of the heat sink 2 to the package body 1.

[0030] Furthermore, the pins 3 in the above structure are led out from the package body 1, which can reduce the height of the pins 3 and enhance the reliability and stability of the semiconductor package structure after being mounted on the substrate.

[0031] In addition, the heat sink 2 and the pin 3 in the above structure are separated outside the package 1. After the pin 3 is connected to the substrate, the pin 3 will not transfer the stress state to the heat sink 2, thereby avoiding the influence of the pin 3 on the heat sink 2 after being stressed.

[0032] In one embodiment, referring to Figure 1 As shown, the heat sink 2 is configured as a plate-shaped structure, and the heat sink 2 is at least partially embedded in the package body 1, and a side of the heat sink 2 away from the package body 1 is exposed.

[0033] Furthermore, the heat sink 2 includes a main body 21 and a first extension 22 that are integrally connected. The main body 21 is disposed on the package body 1 , and the first extension 22 extends from an edge of the main body 21 along a first direction and protrudes from the package body 1 .

[0034] The main body 21 is embedded in the package body 1 , the portion of the first extension portion 22 covering the package body 1 is also embedded in the package body 1 , and the portion of the first extension portion 22 away from the package body 1 is exposed outside the package body 1 .

[0035] Furthermore, the size of the main body 21 is greater than the size of the first extension 22, which is specifically embodied in that: the length of the main body 21 in the first direction is greater than the length of the first extension 22 in the first direction, the length of the main body 21 in the second direction is greater than the length of the first extension 22 in the second direction, the first direction is perpendicular to the second direction, and the plane where the first direction and the second direction are located is parallel to the plane where the heat sink 2 is located, and the second direction is Figure 1 The Y-axis direction.

[0036] In one embodiment, referring to Figure 1As shown, the heat sink 2 further includes a second extending portion 23 integrally connected to the main body 21 , and the second extending portion 23 extends from an edge of the main body 21 along a second direction.

[0037] Furthermore, the size of the second extension portion 23 is smaller than the size of the main body 21, which is specifically reflected in: the length of the main body 21 in the first direction is greater than the length of the second extension portion 23 in the first direction, and the length of the main body 21 in the second direction is greater than the length of the second extension portion 23 in the second direction.

[0038] In one embodiment, referring to Figure 1 As shown, a plurality of second extension portions 23 are provided on both sides of the main body portion 21 that are relatively arranged, so that a sawtooth-like structure is formed at the edge of the heat sink 2 in the second direction, which can increase the bonding area between the package body 1 and the heat sink 2, thereby increasing the bonding force between the package body 1 and the heat sink 2, improving the stability of the connection between the package body 1 and the heat sink 2, and avoiding separation of the package body 1 and the heat sink 2.

[0039] Those skilled in the art should understand that the second extension portion 23 is also at least partially embedded in the package body 1 , and a side of the second extension portion 23 away from the package body 1 is exposed.

[0040] In one embodiment, referring to Figure 1 As shown, the second extension portion 23 is symmetrically arranged along the central axis of the main body portion 21 in the first direction.

[0041] Preferably, four second extending portions 23 are provided on one side of the main body portion 21 .

[0042] Preferably, the plurality of second extension portions 23 on one side of the main body portion 21 are distributed at equal intervals.

[0043] In one embodiment, referring to Figure 1 and Figure 2 As shown, the semiconductor package structure includes two pins 3 led out from the package body 1 , and the two pins 3 are arranged on both sides of the first extension portion 22 along the second direction.

[0044] Furthermore, the two pins 3 are bent in a direction away from the heat sink 2, and the two pins 3 are both configured to have a structure similar to a bull's horn, and the specific structure thereof includes a first segment 31, a second segment 32, and a third segment 33 that are integrally connected, and the first segment 31, the second segment 32, and the third segment 33 are connected end to end in sequence.

[0045] Specifically, the first segment 31 is led out from the package body 1 along the first direction, the second segment 32 is bent from the end of the first segment 31 away from the package body 1 toward the direction away from the heat sink 2, and the third segment 33 extends from the end of the second segment 32 away from the first segment 31 along the second direction to form a pin 3 similar to a bull horn structure.

[0046] Preferably, the two pins 3 are symmetrically arranged on two sides of the first extending portion 22 .

[0047] Preferably, the third segments 33 of the two pins 3 both extend in a direction away from the first extending portion 22 .

[0048] In one embodiment, referring to Figure 1 As shown, a plurality of pins 4 are provided, and the plurality of pins 4 are bent in a direction away from the heat sink 2. Moreover, the length of the pin 4 in the second direction is smaller than the length of the lead 3 in the second direction.

[0049] In one embodiment, referring to Figure 1 As shown, a creepage groove 11 is opened on the package body 1, and the length of the creepage groove 11 in the second direction is substantially equal to the maximum length of the heat sink 2 in the second direction, so as to increase the length of the creepage groove 11 in the second direction, increase the creepage distance of the semiconductor package structure, and reduce the risk of the creepage area being disturbed by small voltages.

[0050] In one embodiment, referring to Figure 1 As shown, a locking glue hole 24 is opened on the heat sink 2. When the heat sink 2 is embedded in the package body 1, a bonding portion 12 inserted into the locking glue hole 24 is formed in the area of ​​the package body 1 facing the locking glue hole 24, so as to increase the bonding strength between the heat sink 2 and the package body 1 and prevent the heat sink 2 and the package body 1 from being easily separated after being subjected to external force.

[0051] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0052] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor packaging structure, characterized in that: The semiconductor packaging structure comprises: A package (1) for packaging a chip; A heat sink (2) disposed on one side of the package body (1), with at least one side protruding from an edge of the package body (1) along a first direction; A pin (3) is led out from the package (1), and the pin (3) and the heat sink (2) are separately arranged outside the package (1); A pin (4) is led out from the package body (1) and is located on the opposite side of the lead (3).

2. The semiconductor package structure according to claim 1, wherein: The heat sink (2) comprises a main body (21) and a first extension (22) which are integrally connected, the main body (21) being arranged on the packaging body (1), and the first extension (22) extending from the edge of the main body (21) along a first direction and protruding from the packaging body (1).

3. The semiconductor package structure according to claim 2, characterized in that: The length of the main body portion (21) in the first direction is greater than the length of the first extension portion (22) in the first direction; and / or, The length of the main body portion (21) in the second direction is greater than the length of the first extension portion (22) in the second direction.

4. The semiconductor package structure according to claim 1, wherein: The heat sink (2) comprises a main body (21) and a second extension (23) which are integrally connected; the main body (21) is arranged on the packaging body (1); and the second extension (23) extends from the edge of the main body (21) along a second direction.

5. The semiconductor package structure according to claim 4, characterized in that: The heat sink (2) comprises a plurality of second extension portions (23); and / or, The second extension portion (23) is arranged on two opposite sides of the main body portion (21).

6. The semiconductor package structure according to claim 4, characterized in that: The length of the main body (21) in the first direction is greater than the length of the second extension portion (23) in the first direction; and / or, The length of the main body portion (21) in the second direction is greater than the length of the second extension portion (23) in the second direction.

7. The semiconductor package structure according to claim 2, wherein: The semiconductor packaging structure comprises two pins (3), and the two pins (3) are arranged on both sides of the first extension portion (22) along the second direction.

8. The semiconductor package structure according to claim 1, wherein: The pin (3) is bent in a direction away from the heat sink (2); and / or, The pin (4) is bent in a direction away from the heat sink (2).

9. The semiconductor package structure according to claim 1, wherein: The pin (3) comprises a first segment (31), a second segment (32) and a third segment (33) which are integrally connected; the first segment (31) is led out from the package body (1) along a first direction; the second segment (32) is bent from an end of the first segment (31) away from the package body (1) in a direction away from the heat sink (2); and the third segment (33) extends from an end of the second segment (32) away from the first segment (31) in a second direction.

10. The semiconductor package structure according to claim 1, wherein: The package body (1) is provided with a creepage groove (11); and / or, The heat sink (2) is provided with a glue locking hole (24), and the packaging body (1) is provided with a coupling portion (12) inserted into the glue locking hole (24).

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